Materials Declaration Package Body Size LeadCount Option Item Epoxy Resin SiO2 Filler Phenol Resin Item Cu Fe P Zn Ag Item Sn LFCSP 5X5 28 Pb Free Molding Compound % of Compound Weight (g) 10 2.47 E-03 85 2.10 E-02 5 1.24 E-03 PPM 41143 349712 20571 Leadframe % of Leadframe 97.5 2.35 0.03 0.12 Weight (g) 2.94 E-02 7.10 E-04 9.06 E-06 3.62 E-05 PPM 489964 11809 151 603 Internal Leadframe Plating Weight (g) % of Plating 5.80 E-04 100 PPM 9651 External Leadframe Plating % of Plating Weight (g) 100 2.38 E-04 PPM 3966 Au Bond Wires % of Wire 99.99 Weight (g) 1.00 E-03 PPM 16655 Si Chip % of Chip 100 Weight (g) 2.87 E-03 PPM 47676 Die Attach % of Die Attach 25 75 Weight (g) 1.22 E-04 3.65 E-04 PPM 2025 6074 Item Resin Ag Filler Item Pb Cd Hg Cr+6 Item Pb Cd Hg Cr+6 PPM 4 <2 <2 <2 Molding Compound Method EPA3050B (ICPAES) BSEN 1122:2001B (ICP AES) Mercury Analyser EPA3060A (UV) Die Attach Paste Method PPM <5 ICP AES <5 ICP AES <5 ICP AES Not Detected ICP AES Package Totals PPM Weight (g) 1000000 6.01 E-02 AMK-CP-C Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/23/04 Materials Declaration Package Body Size LeadCount Option LFCSP 5X5 28 Sn/Pb Molding Compound % of Compound Weight (g) 10 2.47 E-03 85 2.10 E-02 5 1.24 E-03 PPM 41143 349712 20571 Cu Fe P Zn Leadframe % of Leadframe 97.5 2.35 0.03 0.12 PPM 489964 11809 151 603 Ag Internal Leadframe Plating Weight (g) % of Plating 5.80 E-04 100 Sn Pb External Leadframe Plating % of Plating Weight (g) 85 2.03 E-04 15 3.58 E-05 Item Epoxy Resin SiO2 Filler Phenol Resin Item Item Bond Wires % of Wire 99.99 Au Item Resin Ag Filler PPM 4 <2 <2 <2 Item Pb Cd Hg Cr+6 PPM <5 <5 <5 Not Detected Die Attach Paste Method ICP AES ICP AES ICP AES ICP AES PPM 9651 PPM 3371 595 Weight (g) 1.00 E-03 PPM 16655 100 Weight (g) 2.87 E-03 PPM 47676 Die Attach % of Die Attach 25 75 Weight (g) 1.22 E-04 3.65 E-04 PPM Chip % of Chip Si Weight (g) 2.94 E-02 7.10 E-04 9.06 E-06 3.62 E-05 Molding Compound Method EPA3050B (ICPAES) BSEN 1122:2001B (ICP AES) Mercury Analyser EPA3060A (UV) Item Pb Cd Hg Cr+6 2025 6074 Package Totals PPM Weight (g) 1000000 6.01 E-02 AMK-CP-A Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 6/23/04