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Materials Declaration
Package
Body Size
LeadCount
Option
Item
Epoxy Resin
SiO2 Filler
Phenol Resin
Item
Cu
Fe
P
Zn
Ag
Item
Sn
LFCSP
5X5
28
Pb Free
Molding Compound
% of Compound
Weight (g)
10
2.47 E-03
85
2.10 E-02
5
1.24 E-03
PPM
41143
349712
20571
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
Weight (g)
2.94 E-02
7.10 E-04
9.06 E-06
3.62 E-05
PPM
489964
11809
151
603
Internal Leadframe Plating
Weight (g)
% of Plating
5.80 E-04
100
PPM
9651
External Leadframe Plating
% of Plating
Weight (g)
100
2.38 E-04
PPM
3966
Au
Bond Wires
% of Wire
99.99
Weight (g)
1.00 E-03
PPM
16655
Si
Chip
% of Chip
100
Weight (g)
2.87 E-03
PPM
47676
Die Attach
% of Die Attach
25
75
Weight (g)
1.22 E-04
3.65 E-04
PPM
2025
6074
Item
Resin
Ag Filler
Item
Pb
Cd
Hg
Cr+6
Item
Pb
Cd
Hg
Cr+6
PPM
4
<2
<2
<2
Molding Compound
Method
EPA3050B (ICPAES)
BSEN 1122:2001B (ICP AES)
Mercury Analyser
EPA3060A (UV)
Die Attach Paste
Method
PPM
<5
ICP AES
<5
ICP AES
<5
ICP AES
Not Detected ICP AES
Package Totals
PPM
Weight (g)
1000000
6.01 E-02
AMK-CP-C
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/23/04
Materials Declaration
Package
Body Size
LeadCount
Option
LFCSP
5X5
28
Sn/Pb
Molding Compound
% of Compound
Weight (g)
10
2.47 E-03
85
2.10 E-02
5
1.24 E-03
PPM
41143
349712
20571
Cu
Fe
P
Zn
Leadframe
% of Leadframe
97.5
2.35
0.03
0.12
PPM
489964
11809
151
603
Ag
Internal Leadframe Plating
Weight (g)
% of Plating
5.80 E-04
100
Sn
Pb
External Leadframe Plating
% of Plating
Weight (g)
85
2.03 E-04
15
3.58 E-05
Item
Epoxy Resin
SiO2 Filler
Phenol Resin
Item
Item
Bond Wires
% of Wire
99.99
Au
Item
Resin
Ag Filler
PPM
4
<2
<2
<2
Item
Pb
Cd
Hg
Cr+6
PPM
<5
<5
<5
Not Detected
Die Attach Paste
Method
ICP AES
ICP AES
ICP AES
ICP AES
PPM
9651
PPM
3371
595
Weight (g)
1.00 E-03
PPM
16655
100
Weight (g)
2.87 E-03
PPM
47676
Die Attach
% of Die Attach
25
75
Weight (g)
1.22 E-04
3.65 E-04
PPM
Chip
% of Chip
Si
Weight (g)
2.94 E-02
7.10 E-04
9.06 E-06
3.62 E-05
Molding Compound
Method
EPA3050B (ICPAES)
BSEN 1122:2001B (ICP AES)
Mercury Analyser
EPA3060A (UV)
Item
Pb
Cd
Hg
Cr+6
2025
6074
Package Totals
PPM
Weight (g)
1000000
6.01 E-02
AMK-CP-A
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
6/23/04