Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal TSSOP - EP 4.4 16 Pb-free, Halide-free Molding Compound % of Compound 86.9 12.8 0.3 Weight (g) 9.60 E-03 1.41 E-03 3.42 E-05 1.10 E-02 PPM 150421 22119 537 173077 Weight (g) 3.52 E-02 1.10 E-03 2.38 E-04 5.49 E-05 3.66 E-02 PPM 552126 17218 3731 861 573936 Internal Leadframe Plating % of Plating 100 Weight (g) 5.00 E-04 PPM 7837 Sn External Leadframe Plating % of Plating 100 Weight (g) 1.51 E-03 PPM 23647 Au Bond Wires % of Wire 99.99 Weight (g) 3.13 E-04 PPM 4908 Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 212850 Weight (g) 1.75 E-04 4.38 E-05 6.57 E-06 6.57 E-06 6.57 E-06 2.39 E-04 PPM 2748 687 103 103 103 3744 Item Cu Ni Si Mg Subtotal Ag Item Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Leadframe % of Leadframe 96.2 3 0.65 0.15 Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA3050B. ICP-AES. Not Detected EPA3050B. ICP-AES. Not Detected EPA 3052B. Mercury Analyser Not Detected EPA 7196A. UV-VIS. Not Detected EPA 1614. GC-MS. Not Detected EPA 1614. GC-MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. Package Totals Weight (g) PPM 1000000 6.38 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-RE-B Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Resin Sb2O3 Brominated Resin Subtotal Item Cu Ni Si Mg Subtotal TSSOP-EP 4.4 16 with Pb Molding Compound % of Compound 82 16 1.4 0.6 Leadframe % of Leadframe 96.2 3 0.65 0.15 Weight (g) 9.05 E-03 1.77 E-03 1.55 E-04 6.62 E-05 1.10 E-02 PPM 141923 27692 2423 1038 173077 Weight (g) 3.52 E-02 1.10 E-03 2.38 E-04 5.49 E-05 3.66 E-02 PPM 552126 17218 3731 861 573936 Ag Internal Leadframe Plating % of Plating Weight (g) 5.00 E-04 100 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 85 1.28 E-03 15 2.26 E-04 1.51 E-03 Item Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. 7837 PPM 20100 3547 23647 Bond Wires % of Wire 99.99 Weight (g) 3.13 E-04 PPM Si Chip % of Chip 100 Weight (g) 1.36 E-02 PPM 212850 Weight (g) 1.80 E-04 4.51 E-05 6.76 E-06 6.76 E-06 2.39 E-04 PPM Die Attach % of Die Attach 75.47 18.87 2.83 2.83 Molding Compound Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. PPM Au Item Ag Epoxy resin Gamma Butyrolactone Curing agent & hardener Subtotal Item Pb Cd Hg Cr+6 PBB PBDE 4908 2826 707 106 106 3744 Package Totals Weight (g) PPM 1000000 6.38 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary AMK-RE-A