Materials Declaration Package Body Size LeadCount Option TSSOP_EP 4.4 mm 28 Sn/Pb Item SiO2 Filler Biphenyl Resin Sb2O3 Br Item Cu Ni Si Mg Molding Compound % of Compound 82.00 15.90 1.50 0.60 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Molding Compound Weight (g) 4.74 E-02 9.20 E-03 8.68 E-04 3.47 E-04 PPM 421280 81687 7710 3082 Weight (g) 4.40 E-02 1.37 E-03 2.97 E-04 6.90 E-05 PPM 391007 12196 2638 613 Internal Leadframe Plating % of Plating 100.0 Weight (g) 7.20 E-04 PPM Ag Sn Pb External Leadframe Plating % of Plating 85.0 15.0 Weight (g) 2.51 E-03 4.42 E-04 PPM 22261 3926 Bond Wires % of Wire 99.99 Weight (g) 4.90 E-04 PPM Au Chip % of Chip 100.0 Weight (g) 3.88 E-03 PPM 34474 Die Attach % of Die Attach 70.0 10.0 7.0 5.0 5.0 3.0 Weight (g) 6.61 E-04 9.40 E-05 6.60 E-05 4.70 E-05 4.70 E-05 2.80 E-05 PPM Item Si Item Ag Diglycidylether of bisphenol-F Resin Amine Gamma Butyrolactone Mixed aryl allyl glycidyl compounds 6396 Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Method EPA3050B. ICP-AES EPA3050B. ICP-AES EPA3052B. Mercury Analyzer. EPA3060A & 7196A. UV-VIS EPA1614. Analysis was performed by GC/MS. EPA1614. Analysis was performed by GC/MS. Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Method US EPA 3050B. Analysis was performed by ICP-AES EN 1122 Method B. Analysis was performed by ICP-AES US EPA 3052. Analysis was performed by ICP-AES EPA 3060A & 7196A US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or 4353 5872 835 586 417 417 249 Package Totals Weight (g) PPM 1000000 1.13 E-01 AMK-RE-A ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary 11/2/06 Materials Declaration Package Body Size LeadCount Option Item SiO2 Filler Multiaromatic Resin Item Cu Ni Si Mg Ag Item Sn TSSOP_EP 4.4 mm 28 Pb-free Molding Compound % of Compound Weight (g) 84.00 4.88 E-02 15.90 9.30 E-03 Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Weight (g) 4.40 E-02 1.37 E-03 2.97 E-04 6.90 E-05 Molding Compound PPM 433060 82490 PPM 390352 12176 2634 612 Internal Leadframe Plating % of Plating Weight (g) 7.20 E-04 100.0 PPM 6385 External Leadframe Plating % of Plating Weight (g) 100.0 2.72 E-03 PPM 24156 Au Bond Wires % of Wire 99.99 Weight (g) 4.90 E-04 PPM 4345 Si Chip % of Chip 100.0 Weight (g) 3.88 E-03 PPM 34417 Die Attach % of Die Attach 70.0 21.0 3.0 3.0 3.0 Weight (g) 7.39 E-04 2.22 E-04 3.20 E-05 3.20 E-05 3.20 E-05 PPM 6553 1969 284 284 284 Item Ag Resin Metal Oxide Amine Gamma Butyrolactone Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Item Pb Cd Hg Cr+6 PBB PBDE PPM None Detected None Detected None Detected None Detected None Detected None Detected Die Attach Paste Package Totals PPM Weight (g) 1000000 1.13 E-01 Method US EPA 3052. ICP-OES US EPA 3052. ICP-OES US EPA 3052. ICP-OES EPA 3060A & 7196A. UV-VIS Analysis performed by GC/MS Analysis performed by GC/MS AMK-RE-B ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Method EPA3050B. ICP-AES EPA3050B. ICP-AES EPA3052B. Mercury Analyzer. EPA3060A & 7196A. UV-VIS EPA1614. Analysis was performed by GC/MS. EPA1614. Analysis was performed by GC/MS. 11/2/06