pdf

Materials Declaration
Package
Body Size
LeadCount
Option
TSSOP_EP
4.4 mm
28
Sn/Pb
Item
SiO2 Filler
Biphenyl Resin
Sb2O3
Br
Item
Cu
Ni
Si
Mg
Molding Compound
% of Compound
82.00
15.90
1.50
0.60
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Molding Compound
Weight (g)
4.74 E-02
9.20 E-03
8.68 E-04
3.47 E-04
PPM
421280
81687
7710
3082
Weight (g)
4.40 E-02
1.37 E-03
2.97 E-04
6.90 E-05
PPM
391007
12196
2638
613
Internal Leadframe Plating
% of Plating
100.0
Weight (g)
7.20 E-04
PPM
Ag
Sn
Pb
External Leadframe Plating
% of Plating
85.0
15.0
Weight (g)
2.51 E-03
4.42 E-04
PPM
22261
3926
Bond Wires
% of Wire
99.99
Weight (g)
4.90 E-04
PPM
Au
Chip
% of Chip
100.0
Weight (g)
3.88 E-03
PPM
34474
Die Attach
% of Die Attach
70.0
10.0
7.0
5.0
5.0
3.0
Weight (g)
6.61 E-04
9.40 E-05
6.60 E-05
4.70 E-05
4.70 E-05
2.80 E-05
PPM
Item
Si
Item
Ag
Diglycidylether of bisphenol-F
Resin
Amine
Gamma Butyrolactone
Mixed aryl allyl glycidyl compounds
6396
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Method
EPA3050B. ICP-AES
EPA3050B. ICP-AES
EPA3052B. Mercury Analyzer.
EPA3060A & 7196A. UV-VIS
EPA1614. Analysis was performed by GC/MS.
EPA1614. Analysis was performed by GC/MS.
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Method
US EPA 3050B. Analysis was performed by ICP-AES
EN 1122 Method B. Analysis was performed by ICP-AES
US EPA 3052. Analysis was performed by ICP-AES
EPA 3060A & 7196A
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or
US EPA 3540 or 3550. Analysis by HPLC/DAD, LC/MS or
4353
5872
835
586
417
417
249
Package Totals
Weight (g)
PPM
1000000
1.13 E-01
AMK-RE-A
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
11/2/06
Materials Declaration
Package
Body Size
LeadCount
Option
Item
SiO2 Filler
Multiaromatic Resin
Item
Cu
Ni
Si
Mg
Ag
Item
Sn
TSSOP_EP
4.4 mm
28
Pb-free
Molding Compound
% of Compound
Weight (g)
84.00
4.88 E-02
15.90
9.30 E-03
Leadframe
% of Leadframe
96.20
3.00
0.65
0.15
Weight (g)
4.40 E-02
1.37 E-03
2.97 E-04
6.90 E-05
Molding Compound
PPM
433060
82490
PPM
390352
12176
2634
612
Internal Leadframe Plating
% of Plating
Weight (g)
7.20 E-04
100.0
PPM
6385
External Leadframe Plating
% of Plating
Weight (g)
100.0
2.72 E-03
PPM
24156
Au
Bond Wires
% of Wire
99.99
Weight (g)
4.90 E-04
PPM
4345
Si
Chip
% of Chip
100.0
Weight (g)
3.88 E-03
PPM
34417
Die Attach
% of Die Attach
70.0
21.0
3.0
3.0
3.0
Weight (g)
7.39 E-04
2.22 E-04
3.20 E-05
3.20 E-05
3.20 E-05
PPM
6553
1969
284
284
284
Item
Ag
Resin
Metal Oxide
Amine
Gamma Butyrolactone
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Item
Pb
Cd
Hg
Cr+6
PBB
PBDE
PPM
None Detected
None Detected
None Detected
None Detected
None Detected
None Detected
Die Attach Paste
Package Totals
PPM
Weight (g)
1000000
1.13 E-01
Method
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
US EPA 3052. ICP-OES
EPA 3060A & 7196A. UV-VIS
Analysis performed by GC/MS
Analysis performed by GC/MS
AMK-RE-B
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Method
EPA3050B. ICP-AES
EPA3050B. ICP-AES
EPA3052B. Mercury Analyzer.
EPA3060A & 7196A. UV-VIS
EPA1614. Analysis was performed by GC/MS.
EPA1614. Analysis was performed by GC/MS.
11/2/06