Materials Declaration Package Body Size LeadCount Option TQFP_EP 4.4 mm 20 Halide-free, Pb-free Item SiO2 Filler Epoxy & Phenol Resin Carbon black Subtotal Molding Compound % of Compound 86.9 12.8 0.3 Weight (g) 3.24 E-02 4.77 E-03 1.16 E-04 3.73 E-02 PPM 405557 59637 1447 466640 Weight (g) 3.44 E-02 1.07 E-03 2.32 E-04 5.40 E-05 3.58 E-02 PPM 430633 13429 2904 676 447641 Internal Leadframe Plating % of Plating 100.0 Weight (g) 8.32 E-04 PPM 10413 Sn External Leadframe Plating % of Plating 100.0 Weight (g) 3.00 E-03 PPM 37509 Bond Wires % of Wire 99.99 Weight (g) 4.22 E-04 PPM Au Si Chip % of Chip 100.0 Weight (g) 1.94 E-03 PPM 24268 Weight (g) 4.84 E-04 1.21 E-04 1.81 E-05 1.81 E-05 1.81 E-05 6.59 E-04 PPM Item Cu Ni Si Mg Subtotal Ag Item Item Ag Epoxy Resin Metal oxide Curing and hardening agent Gamma Butyrolactone Subtotal Leadframe % of Leadframe 96.20 3.00 0.65 0.15 Die Attach % of Die Attach 73.40 18.35 2.75 2.75 2.75 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected EPA3050B. ICP-AES. Not Detected EPA3050B. ICP-AES. Not Detected EPA 3052B. Mercury Analyser Not Detected EPA 7196A. UV-VIS. Not Detected EPA 1614. GC-MS. Not Detected EPA 1614. GC-MS. Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. ICP-OES. Not Detected Draft IEC 62321. UV-VIS. Not Detected Draft IEC 62321. GC-MSD. Not Detected Draft IEC 62321. GC-MSD. 5282 6054 1513 227 227 227 8248 Package Totals PPM Weight (g) 1000000 7.99 E-02 AMK-RE-B Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary