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Product / Package Information
Package
Body Size (mm)
Lead Count
Terminal Finish
Environmental Information
LFCSP - Sawn
5 X 5 X 0.75 (3.5 EP)
32
100 Sn
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
38.13
2.65
2.65
0.66
0.13
44.23
4.03E-02
2.80E-03
2.80E-03
7.01E-04
1.40E-04
4.67 E-02
PPM
381258
26538
26538
6634
1327
442294
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
46.89
1.13
0.06
0.01
48.09
4.95 E-02
1.19 E-03
6.10 E-05
1.52 E-05
5.08 E-02
PPM
468896
11302
577
144
480919
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.48
5.08 E-04
PPM
4809
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.81
2.96 E-03
PPM
28061
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.54
5.65 E-04
PPM
5352
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.38
3.57 E-03
PPM
33823
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Amine
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
1000000
0.35
0.09
0.01
0.01
0.01
0.47
3.68 E-04
9.19 E-05
1.38 E-05
1.38 E-05
1.38 E-05
5.01 E-04
Weight (g)
1.06 E-01
Note: The information provided in this declaration are true to the best of ADI's knowledge
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100
PPM
3480
870
130
130
130
4741
PPM
1000000