Product / Package Information Package Body Size (mm) Lead Count Terminal Finish Environmental Information LFCSP - Sawn 5 X 5 X 0.75 (3.5 EP) 32 100 Sn RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 Component Level Weight (g) Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 38.13 2.65 2.65 0.66 0.13 44.23 4.03E-02 2.80E-03 2.80E-03 7.01E-04 1.40E-04 4.67 E-02 PPM 381258 26538 26538 6634 1327 442294 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus CAS# 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Weight (g) Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 46.89 1.13 0.06 0.01 48.09 4.95 E-02 1.19 E-03 6.10 E-05 1.52 E-05 5.08 E-02 PPM 468896 11302 577 144 480919 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.48 5.08 E-04 PPM 4809 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 2.81 2.96 E-03 PPM 28061 Bond Wires Component Level Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.54 5.65 E-04 PPM 5352 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 3.38 3.57 E-03 PPM 33823 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Amine Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.35 0.09 0.01 0.01 0.01 0.47 3.68 E-04 9.19 E-05 1.38 E-05 1.38 E-05 1.38 E-05 5.01 E-04 Weight (g) 1.06 E-01 Note: The information provided in this declaration are true to the best of ADI's knowledge ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100 PPM 3480 870 130 130 130 4741 PPM 1000000