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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
3 X 3 X 0.75 (1.6EP)
16
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Carbon Black
CAS#
60676-86-0
Proprietary
Proprietary
1333-86-4
Component Level
Weight (g)
9.50E-03
3.04E-04
3.04E-04
3.04E-05
1.01E-02
Percentage (%)
PPM
Percentage (%)
93.7
3.0
3.0
0.3
100.00
937000
30000
30000
3000
1000000
45.90
1.47
1.47
0.15
48.99
PPM
458995
14696
14696
1470
489856
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Weight (g)
9.47 E-03
2.28 E-04
1.17 E-05
2.91 E-06
9.71 E-03
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
45.74
1.10
0.06
0.01
46.92
PPM
457445
11026
563
141
469174
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
9.81 E-05
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.47
PPM
4739
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
1.10 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.53
PPM
5314
Bond Wires
Component Level
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Weight (g)
1.98 E-04
2.00 E-06
2.00 E-04
Percentage (%)
PPM
Percentage (%)
99.00
1.0
100.0
990000
10000
1000000
0.96
0.010
0.97
PPM
9564
97
9661
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
4.10 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.98
PPM
19807
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Component Level
Weight (g)
2.33 E-05
9.33 E-07
9.33 E-07
9.33 E-07
9.33 E-07
9.33 E-07
9.33 E-07
9.33 E-07
1.56 E-07
3.00 E-05
Weight (g)
2.07 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.11
0.00
0.005
0.005
0.005
0.005
0.005
0.005
0.001
0.14
Percentage (%)
100
PPM
1126
45
45
45
45
45
45
45
8
1449
PPM
1000000