Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant JIG Material Content Compliant LFCSP - Sawn 3 X 3 X 0.75 (1.7 x 2.4 EP) 10 100 Sn Yes Yes Yes Level A & B Compliant Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 1.21E-02 8.40E-04 8.40E-04 2.10E-04 4.20E-05 1.40 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 35.59 2.48 2.48 0.62 0.12 41.29 PPM 355931 24775 24775 6194 1239 412913 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 48.21 1.16 0.06 0.01 49.45 1.63 E-02 3.94 E-04 2.01 E-05 5.03 E-06 1.68 E-02 PPM 482144 11621 593 148 494507 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance Silver CAS# 7440-22-4 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.59 2.02 E-04 PPM 5943 External Leadframe Plating Component Level Homogeneous Material Level Description Tin & its alloys Substance Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.02 5.82 E-06 PPM 172 Bond Wires Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.09 3.17 E-05 PPM 934 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 7.96 2.70 E-03 PPM 79633 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Amine Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Component Level Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.43 0.11 0.02 0.02 0.02 0.59 1.47 E-04 3.67 E-05 5.50 E-06 5.50 E-06 5.50 E-06 2.00 E-04 Weight (g) 3.39 E-02 Percentage (%) 100 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 4330 1082 162 162 162 5899 PPM 1000000 Materials Declaration Package Body Size LeadCount Option Item Silica Fused Epoxy Resin Phenol Resin Carbon Black Subtotal Item Cu Fe Zn P Subtotal LFCSP 3 X 3 X 0.75 mm 10 SnPb Molding Compound % of Compound Weight (g) 93.70 1.03E-02 3.00 3.30E-04 3.00 3.30E-04 0.30 3.30E-05 1.10 E-02 Leadframe % of Leadframe 97.50 2.35 0.12 0.03 Weight (g) 1.02 E-02 2.38 E-04 1.32 E-05 2.53 E-06 1.04 E-02 Ag Internal Leadframe Plating % of Plating Weight (g) 1.05 E-04 100.0 Sn Pb Subtotal External Leadframe Plating Weight (g) % of Plating 85.0 1.19 E-04 15.0 2.10 E-05 1.40 E-04 Item Au Pd Subtotal Si Item Ag Acrylates Bismaleimide Additive Subtotal Bond Wires % of Wire 99.0 1.0 Chip % of Chip 100.0 Die Attach % of Die Attach 85.0 5.0 5.0 5.0 PPM 464326 14866 14866 1487 495546 PPM 459049 10722 594 114 470479 Item Pb Cd Hg Cr+6 PBB PBDE Molding Compound Method PPM Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS Item Pb Cd Hg Cr+6 PBB PBDE Die Attach Paste Method PPM 3.7 US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3052. ICP-OES Not Detected US EPA 3060A & 7196A. UV-VIS. Not Detected Analysis performed by GC/MS Not Detected Analysis performed by GC/MS PPM 4753 PPM 5366 947 6313 Weight (g) 9.90 E-05 1.00 E-06 1.00 E-04 PPM Weight (g) 3.78 E-04 PPM 17049 Weight (g) 2.55 E-05 1.50 E-06 1.50 E-06 1.50 E-06 3.00 E-05 PPM 4464 45 4509 1150 68 68 68 1353 Package Totals Weight (g) PPM 1000000 2.22 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary