Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Sawn 6 X 6 X 0.75 (4.6 EP) 40 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Substance Description Other inorganic materials Thermosets Thermosets Other inorganic materials Other inorganic materials Subtotal Silica Epoxy resin Phenol resin Metal Hydroxide Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary Proprietary Proprietary 1333-86-4 5.12E-02 3.56E-03 3.56E-03 8.90E-04 1.78E-04 5.94 E-02 CAS# Weight (g) Percentage (%) PPM Percentage (%) 86.2 6.0 6.0 1.5 0.3 100.00 862000 60000 60000 15000 3000 1000000 40.44 2.82 2.82 0.70 0.14 46.92 PPM 404439 28151 28151 7038 1408 469187 Leadframe Homogeneous Material Level Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Zinc Phosphorus 7440-50-8 7439-89-6 7440-66-6 7723-14-0 Component Level Percentage (%) PPM Percentage (%) 97.50 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 44.74 1.08 0.06 0.01 45.89 5.66 E-02 1.36 E-03 6.97 E-05 1.74 E-05 5.81 E-02 PPM 447422 10784 551 138 458895 Internal Leadframe Plating Component Level Homogeneous Material Level Description Precious metals Substance CAS# 7440-22-4 Silver Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.06 7.94 E-05 PPM 627 External Leadframe Plating Component Level Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 2.39 3.02 E-03 PPM 23902 Bond Wires Component Level Homogeneous Material Level Description Precious metals Substance Gold CAS# 7440-57-5 Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 0.65 8.20 E-04 PPM 6483 Chip Homogeneous Material Level Description Other inorganic materials Substance Doped Silicon CAS# 7440-21-3 Component Level Weight (g) Percentage (%) PPM Percentage (%) 100.0 1000000 3.32 4.20 E-03 PPM 33198 Die Attach Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Silver Epoxy Resin Metal oxide Amine Gamma Butyrolactone CAS# 7440-22-4 Proprietary Proprietary Proprietary Proprietary Weight (g) Percentage (%) PPM Percentage (%) 73.40 18.35 2.75 2.75 2.75 100.0 734000 183500 27500 27500 27500 1000000 0.57 0.14 0.02 0.02 0.02 0.77 7.16 E-04 1.79 E-04 2.68 E-05 2.68 E-05 2.68 E-05 9.75 E-04 Weight (g) 1.27 E-01 Percentage (%) 100 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary PPM 5658 1414 212 212 212 7708 PPM 1000000