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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
6 X 6 X 0.75 (4.6 EP)
40
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Other inorganic materials
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
1333-86-4
5.12E-02
3.56E-03
3.56E-03
8.90E-04
1.78E-04
5.94 E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
86.2
6.0
6.0
1.5
0.3
100.00
862000
60000
60000
15000
3000
1000000
40.44
2.82
2.82
0.70
0.14
46.92
PPM
404439
28151
28151
7038
1408
469187
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
44.74
1.08
0.06
0.01
45.89
5.66 E-02
1.36 E-03
6.97 E-05
1.74 E-05
5.81 E-02
PPM
447422
10784
551
138
458895
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
CAS#
7440-22-4
Silver
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.06
7.94 E-05
PPM
627
External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.39
3.02 E-03
PPM
23902
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.65
8.20 E-04
PPM
6483
Chip
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.32
4.20 E-03
PPM
33198
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Metal oxide
Amine
Gamma Butyrolactone
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Weight (g)
Percentage (%)
PPM
Percentage (%)
73.40
18.35
2.75
2.75
2.75
100.0
734000
183500
27500
27500
27500
1000000
0.57
0.14
0.02
0.02
0.02
0.77
7.16 E-04
1.79 E-04
2.68 E-05
2.68 E-05
2.68 E-05
9.75 E-04
Weight (g)
1.27 E-01
Percentage (%)
100
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
5658
1414
212
212
212
7708
PPM
1000000