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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
4 X 4 X 0.75 (2.5 EP)
24
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
3.35E-02
4.92E-03
1.19E-04
3.85E-02
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
45.31
6.66
0.16
52.14
PPM
453115
66630
1616
521361
Leadframe
Component Level
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Weight (g)
2.84 E-02
6.84 E-04
3.49 E-05
8.73 E-06
2.91 E-02
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
38.39
0.93
0.05
0.01
39.38
PPM
383928
9254
473
118
393772
Internal Leadframe Plating
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Silver
CAS#
7440-22-4
Weight (g)
1.18 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.60
PPM
15981
External Leadframe Plating
Component Level
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
7440-31-5
Weight (g)
1.96 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.65
PPM
26461
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
Component Level
Weight (g)
7440-57-5
7440-05-3
1.34 E-04
1.36 E-06
1.36 E-04
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
99.0
1.0
100.0
990000
10000
1000000
0.18
0.00
0.18
PPM
1816
18
1834
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
7440-21-3
2.30 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.12
PPM
31177
Die Attach
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Weight (g)
5.42 E-04
2.17 E-05
2.17 E-05
2.17 E-05
2.17 E-05
2.17 E-05
2.17 E-05
2.17 E-05
3.62 E-06
6.97 E-04
Weight (g)
7.39 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.73
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.005
0.94
Percentage (%)
100
PPM
7329
293
293
293
293
293
293
293
49
9432
PPM
1000000
Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Sawn
4 X 4 X 0.75 (2.5 EP)
24
NiPdAu
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Substance
Description
Other inorganic materials
Thermosets
Thermosets
Other inorganic materials
Others
Subtotal
Silica
Epoxy resin
Phenol resin
Metal Hydroxide
Others
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
Proprietary
Proprietary
Proprietary
3.48E-02
2.27E-03
1.44E-03
2.27E-03
1.03E-03
4.18E-02
CAS#
Weight (g)
Percentage (%)
PPM
Percentage (%)
83.25
5.42
3.45
5.42
2.46
100.00
832500
54200
34500
54200
24600
1000000
47.09
3.07
1.95
3.07
1.39
56.57
PPM
470913
30659
19515
30659
13915
565661
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Zinc
Phosphorus
7440-50-8
7439-89-6
7440-66-6
7723-14-0
Component Level
Percentage (%)
PPM
Percentage (%)
97.50
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
38.89
0.94
0.05
0.01
39.89
2.87 E-02
6.93 E-04
3.54 E-05
8.84 E-06
2.95 E-02
PPM
388942
9375
479
120
398915
Internal / External Leadframe Plating
Component Level
Homogeneous Material Level
Substance
Description
Nickel & its alloys
Precious metals
Precious metals
Subtotal
Nickel
Palladium
Gold
CAS#
7440-02-0
7440-05-3
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
97.3
2.2
0.5
100.00
973000
22000
5000
1000000
0.96
0.02
0.00
0.99
7.11 E-04
1.61 E-05
3.66 E-06
7.31 E-04
PPM
9626
218
49
9893
Bond Wires
Component Level
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
7440-57-5
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.21
1.57 E-04
PPM
2128
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.76
1.30 E-03
PPM
17552
Die Attach
Homogeneous Material Level
Description
Precious metals
Other organic materials
Other organic materials
Other organic materials
Thermoset
Other organic materials
Others
Others
Subtotal
Package Totals
Substance
Silver
Acrylic resin
Acrylate
Polybutadiene derivative
Epoxy resin
Butadiene Copolymer
Additive
Peroxide
CAS#
7440-22-4
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Proprietary
Component Level
Weight (g)
Percentage (%)
PPM
Percentage (%)
77.00
7.00
5.50
4.50
2.50
1.50
1.50
0.50
100.0
770000
70000
55000
45000
25000
15000
15000
5000
1000000
0.45
0.04
0.03
0.03
0.01
0.009
0.009
0.003
0.59
3.33 E-04
3.03 E-05
2.38 E-05
1.95 E-05
1.08 E-05
6.49 E-06
6.49 E-06
2.16 E-06
4.32 E-04
Weight (g)
7.39 E-02
Percentage (%)
100.00
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
PPM
4505
410
322
263
146
88
88
29
5851
PPM
1000000