Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Punched 3 X 3 X 0.85 (1.74 X 1.45 EP) 8 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# Component Level Weight (g) 60676-86-0 Proprietary 1333-86-4 1.55E-02 2.28E-03 5.52E-05 1.78 E-02 Percentage (%) PPM Percentage (%) 86.9 12.8 0.3 100.00 869100 127800 3100 1000000 37.88 5.57 0.14 43.59 PPM 378808 55703 1351 435862 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Iron Zinc Phosphorus CAS# Component Level Weight (g) 7440-50-8 7439-89-6 7440-66-6 7723-14-0 2.08 E-02 5.01 E-04 2.56 E-05 6.40 E-06 2.13 E-02 Percentage (%) PPM Percentage (%) 97.5 2.35 0.12 0.03 100.00 975000 23500 1200 300 1000000 50.89 1.23 0.06 0.02 52.20 PPM 508942 12267 626 157 521991 Internal Leadframe Plating Homogeneous Material Level Description Precious metals Substance Silver CAS# Component Level Weight (g) 7440-22-4 5.34 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.13 PPM 1308 External Leadframe Plating Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Component Level Weight (g) 1.02 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.49 PPM 24906 Bond Wires Homogeneous Material Level Substance Description Precious metals Gold CAS# 7440-57-5 Component Level Weight (g) 1.27 E-05 Percentage (%) PPM Percentage (%) 100.0 1000000 0.03 PPM 311 Chip Homogeneous Material Level Substance Description Other inorganic materials Gallium Arsenide CAS# 1303-00-0 Component Level Weight (g) 3.84 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 0.94 PPM 9394 Die Attach Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Package Totals Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Component Level Weight (g) 1.98 E-04 7.92 E-06 7.92 E-06 7.92 E-06 7.92 E-06 7.92 E-06 7.92 E-06 7.92 E-06 1.32 E-06 2.55 E-04 Weight (g) 4.09 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 0.48 0.02 0.02 0.02 0.02 0.02 0.02 0.02 0.00 0.62 Percentage (%) 100 PPM 4839 194 194 194 194 194 194 194 32 6227 PPM 1000000