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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
TSSOP_4.4
4.4
14
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Component Level
Weight (g)
60676-86-0
Proprietary
1333-86-4
2.46E-02
3.62E-03
8.77E-05
2.83 E-02
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
41.46
6.10
0.15
47.71
PPM
414618
60969
1479
477066
Leadframe
Homogeneous Material Level
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Nickel
Silicon
Magnesium
CAS#
Component Level
Weight (g)
7440-50-8
7440-02-0
7440-21-3
7439-95-4
2.55 E-02
7.94 E-04
1.72 E-04
3.97 E-05
2.65 E-02
Percentage (%)
PPM
Percentage (%)
96.20
3.00
0.65
0.15
100.00
962000
30000
6500
1500
1000000
42.96
1.34
0.29
0.07
44.65
PPM
429574
13396
2903
670
446543
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
Component Level
Weight (g)
6.60 E-04
7440-22-4
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.11
PPM
11130
External Leadframe Plating
Homogeneous Material Level
Description
Tin & its alloys
Substance
Tin
CAS#
Component Level
Weight (g)
1.36 E-03
7440-31-5
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.29
PPM
22934
Bond Wires
Homogeneous Material Level
Description
Precious metals
Substance
Gold
CAS#
Component Level
Weight (g)
3.10 E-04
7440-57-5
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.52
PPM
5228
Chip
Component Level
Homogeneous Material Level
Description
Other inorganic materials
Substance
Doped Silicon
CAS#
7440-21-3
Weight (g)
1.63 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.75
PPM
27487
Die Attach
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Component Level
Weight (g)
4.43 E-04
1.77 E-05
1.77 E-05
1.77 E-05
1.77 E-05
1.77 E-05
1.77 E-05
1.77 E-05
2.96 E-06
5.70 E-04
Weight (g)
5.93 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.75
0.03
0.03
0.03
0.03
0.03
0.03
0.03
0.00
0.96
Percentage (%)
100
PPM
7470
299
299
299
299
299
299
299
50
9612
PPM
1000000