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Product / Package Information
Package
Body Size (mm)
Lead Count
Terminal Finish
MS Number
Environmental Information
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Punched
6 X 6 X 0.8 (2.9 EP)
40
100 Sn
MS000522D
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
Weight (g)
60676-86-0
Proprietary
1333-86-4
4.40E-02
6.47E-03
1.57E-04
5.06 E-02
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
86.9
12.8
0.3
100.00
869100
127800
3100
1000000
48.42
7.12
0.17
55.71
PPM
484218
71204
1727
557148
Leadframe
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Iron
Zinc
Phosphorus
CAS#
Weight (g)
7440-50-8
7439-89-6
7440-66-6
7723-14-0
3.28 E-02
7.91 E-04
4.04 E-05
1.01 E-05
3.37 E-02
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
97.5
2.35
0.12
0.03
100.00
975000
23500
1200
300
1000000
36.13
0.87
0.04
0.01
37.05
PPM
361251
8707
445
111
370514
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
3.37 E-05
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
100.0
1000000
0.04
PPM
371
External Leadframe Plating
Substance
Description
Tin & its alloys
Tin
CAS#
Weight (g)
7440-31-5
2.15 E-03
Component Level
Homogeneous Material Level
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.37
PPM
23653
Bond Wires
Substance
Description
Precious metals
Gold
CAS#
Weight (g)
7440-57-5
1.06 E-03
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.16
PPM
11636
Chip
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
Weight (g)
7440-21-3
2.86 E-03
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
100.0
1000000
3.15
PPM
31491
Die Attach
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Package Totals
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
Weight (g)
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
3.66 E-04
1.47 E-05
1.47 E-05
1.47 E-05
1.47 E-05
1.47 E-05
1.47 E-05
1.47 E-05
2.45 E-06
4.72 E-04
Weight (g)
9.09 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Homogeneous Material Level
Component Level
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
0.40
0.02
0.02
0.02
0.02
0.02
0.02
0.02
0.00
0.52
Percentage (%)
100
PPM
4031
161
161
161
161
161
161
161
27
5187
PPM
1000000