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Product / Package Information
Environmental Information
Package
Body Size (mm)
Lead Count
Terminal Finish
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
LFCSP - Stacked Die
4 X 5 X 0.95 (2.6 X 3.6 EP)
24
100 Sn
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Homogeneous Material Level
Description
Other inorganic materials
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy & Phenol Resin
Carbon black
CAS#
60676-86-0
Proprietary
1333-86-4
Component Level
Weight (g)
1.91E-02
2.81E-03
6.83E-05
2.20 E-02
Percentage (%)
PPM
Percentage (%)
86.91
12.78
0.31
100.00
869100
127800
3100
1000000
36.64
5.39
0.13
42.16
PPM
366410
53880
1307
421597
Leadframe
Homogeneous Material Level
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Substance
Copper
Nickel
Silicon
Magnesium
CAS#
7440-50-8
7440-02-0
7440-21-3
7439-95-4
Component Level
Weight (g)
2.16 E-02
6.73 E-04
1.46 E-04
3.36 E-05
2.24 E-02
Percentage (%)
PPM
Percentage (%)
96.20
3.00
0.65
0.15
100.00
962000
30000
6500
1500
1000000
41.31
1.29
0.28
0.06
42.94
PPM
413128
12883
2791
644
429447
Internal Leadframe Plating
Homogeneous Material Level
Substance
Description
Precious metals
Silver
CAS#
7440-22-4
Component Level
Weight (g)
5.40 E-04
Percentage (%)
PPM
Percentage (%)
100.0
1000000
1.03
PPM
10339
External Leadframe Plating
Homogeneous Material Level
Substance
Description
Tin & its alloys
Tin
CAS#
7440-31-5
Component Level
Weight (g)
1.13 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
2.16
PPM
21635
Bond Wires
Homogeneous Material Level
Substance
Description
Precious metals
Precious metals
Subtotal
Gold
Palladium
CAS#
7440-57-5
7440-05-3
Component Level
Weight (g)
8.02 E-04
8.10 E-06
8.10 E-04
Percentage (%)
PPM
Percentage (%)
99.00
1.00
100.0
990000
10000
1000000
1.54
0.02
1.55
PPM
15353
155
15508
Chip
Homogeneous Material Level
Substance
Description
Other inorganic materials
Doped Silicon
CAS#
7440-21-3
Component Level
Weight (g)
4.47 E-03
Percentage (%)
PPM
Percentage (%)
100.0
1000000
8.56
PPM
85583
Die Attach 1
Component Level
Homogeneous Material Level
Description
Precious metals
Thermoset
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other organic materials
Other inorganic materials
Other organic materials
Subtotal
Substance
Silver
Epichlorohydrin-formaldehyde-phenol copolymer
Epoxy resin, epichlorohydrin-dimer fatty acid
Butyrolactone, gammaPoly(oxypropylene)diamine
2,6-Diglycidyl phenyl allyl ether oligomer
Organosilane
Copper(II) oxide
Epoxy resin modifier
CAS#
7440-22-4
9003-36-5
68475-94-5
96-48-0
9046-10-0
Unassigned
TS ref# 10001
1317-38-0
TS ref# 10038
Weight (g)
5.74 E-04
2.30 E-05
2.30 E-05
2.30 E-05
2.30 E-05
2.30 E-05
2.30 E-05
2.30 E-05
3.84 E-06
7.39 E-04
Percentage (%)
PPM
Percentage (%)
77.71
3.11
3.11
3.11
3.11
3.11
3.11
3.11
0.52
100.0
777100
31100
31100
31100
31100
31100
31100
31100
5200
1000000
1.10
0.04
0.04
0.04
0.04
0.04
0.04
0.04
0.01
1.41
PPM
10995
440
440
440
440
440
440
440
74
14149
Die Attach 2
Homogeneous Material Level
Description
Other organic materials
Other organic materials
Other organic materials
Subtotal
Package Totals
Substance
Resin
Ethene, tetrafluoro-,homopolymer
[3-(2,3-Epoxypropoxy)propyl]trimethoxysilane
CAS#
Proprietary
9002-84-0
2530-83-8
Component Level
Weight (g)
4.55 E-05
4.10 E-05
4.55 E-06
9.10 E-05
Weight (g)
5.22 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
PPM
Percentage (%)
50.0
45.0
5.0
100.0
500000
450000
50000
1000000
0.09
0.08
0.01
0.17
Percentage (%)
100
PPM
871
784
87
1742
PPM
1000000