Product / Package Information Environmental Information Package Body Size (mm) Lead Count Terminal Finish RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant LFCSP - Stacked Die 4 X 5 X 0.95 (2.6 X 3.6 EP) 24 100 Sn Yes Yes Yes Yes Materials Declaration Molding Compound Homogeneous Material Level Description Other inorganic materials Thermosets Other inorganic materials Subtotal Substance Silica Epoxy & Phenol Resin Carbon black CAS# 60676-86-0 Proprietary 1333-86-4 Component Level Weight (g) 1.91E-02 2.81E-03 6.83E-05 2.20 E-02 Percentage (%) PPM Percentage (%) 86.91 12.78 0.31 100.00 869100 127800 3100 1000000 36.64 5.39 0.13 42.16 PPM 366410 53880 1307 421597 Leadframe Homogeneous Material Level Description Copper & its alloys Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Substance Copper Nickel Silicon Magnesium CAS# 7440-50-8 7440-02-0 7440-21-3 7439-95-4 Component Level Weight (g) 2.16 E-02 6.73 E-04 1.46 E-04 3.36 E-05 2.24 E-02 Percentage (%) PPM Percentage (%) 96.20 3.00 0.65 0.15 100.00 962000 30000 6500 1500 1000000 41.31 1.29 0.28 0.06 42.94 PPM 413128 12883 2791 644 429447 Internal Leadframe Plating Homogeneous Material Level Substance Description Precious metals Silver CAS# 7440-22-4 Component Level Weight (g) 5.40 E-04 Percentage (%) PPM Percentage (%) 100.0 1000000 1.03 PPM 10339 External Leadframe Plating Homogeneous Material Level Substance Description Tin & its alloys Tin CAS# 7440-31-5 Component Level Weight (g) 1.13 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 2.16 PPM 21635 Bond Wires Homogeneous Material Level Substance Description Precious metals Precious metals Subtotal Gold Palladium CAS# 7440-57-5 7440-05-3 Component Level Weight (g) 8.02 E-04 8.10 E-06 8.10 E-04 Percentage (%) PPM Percentage (%) 99.00 1.00 100.0 990000 10000 1000000 1.54 0.02 1.55 PPM 15353 155 15508 Chip Homogeneous Material Level Substance Description Other inorganic materials Doped Silicon CAS# 7440-21-3 Component Level Weight (g) 4.47 E-03 Percentage (%) PPM Percentage (%) 100.0 1000000 8.56 PPM 85583 Die Attach 1 Component Level Homogeneous Material Level Description Precious metals Thermoset Other organic materials Other organic materials Other organic materials Other organic materials Other organic materials Other inorganic materials Other organic materials Subtotal Substance Silver Epichlorohydrin-formaldehyde-phenol copolymer Epoxy resin, epichlorohydrin-dimer fatty acid Butyrolactone, gammaPoly(oxypropylene)diamine 2,6-Diglycidyl phenyl allyl ether oligomer Organosilane Copper(II) oxide Epoxy resin modifier CAS# 7440-22-4 9003-36-5 68475-94-5 96-48-0 9046-10-0 Unassigned TS ref# 10001 1317-38-0 TS ref# 10038 Weight (g) 5.74 E-04 2.30 E-05 2.30 E-05 2.30 E-05 2.30 E-05 2.30 E-05 2.30 E-05 2.30 E-05 3.84 E-06 7.39 E-04 Percentage (%) PPM Percentage (%) 77.71 3.11 3.11 3.11 3.11 3.11 3.11 3.11 0.52 100.0 777100 31100 31100 31100 31100 31100 31100 31100 5200 1000000 1.10 0.04 0.04 0.04 0.04 0.04 0.04 0.04 0.01 1.41 PPM 10995 440 440 440 440 440 440 440 74 14149 Die Attach 2 Homogeneous Material Level Description Other organic materials Other organic materials Other organic materials Subtotal Package Totals Substance Resin Ethene, tetrafluoro-,homopolymer [3-(2,3-Epoxypropoxy)propyl]trimethoxysilane CAS# Proprietary 9002-84-0 2530-83-8 Component Level Weight (g) 4.55 E-05 4.10 E-05 4.55 E-06 9.10 E-05 Weight (g) 5.22 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) PPM Percentage (%) 50.0 45.0 5.0 100.0 500000 450000 50000 1000000 0.09 0.08 0.01 0.17 Percentage (%) 100 PPM 871 784 87 1742 PPM 1000000