11-Ball, Backside-Coated, Wafer Level Chip Scale Package [WLCSP] (CB-11-1) Dimensions shown in millimeters a 0.657 0.602 0.546 1.61 1.57 1.53 0.020 REF SEATING PLANE 0.348 0.328 0.308 3 2 1 A BALL A1 IDENTIFIER 2.08 2.04 2.00 0.330 0.310 0.290 1.50 REF B 0.50 REF C D 0.355 0.330 0.304 0.04 MAX COPLANARITY 0.280 0.250 0.220 BOTTOM VIEW (BALL SIDE UP) 1.00 REF 060409-A TOP VIEW (BALL SIDE DOWN) 0.230 0.212 0.192