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30-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-30-2)
Dimensions shown in millimeters
a
0.650
0.595
0.540
3.44
3.40
3.36
SEATING
PLANE
6
5
4
3
2
1
A
BALL A1
IDENTIFIER
B
0.34
0.32
0.30
2.00
REF
C
D
E
0.50
BALL PITCH
TOP VIEW
(BALL SIDE DOWN)
0.27
0.24
0.21
BOTTOM VIEW
(BALL SIDE UP)
2.50 REF
082808-A
2.68
2.64
2.60