Plastic Packages for Integrated Circuits Wafer Level Chip Scale Package (WLCSP) W3x2.6C 3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE E D PIN 1 ID TOP VIEW A2 A A1 SYMBOL MILLIMETERS A 0.51 Min, 0.55 Max A1 0.225 ±0.015 A2 0.305 ±0.013 b Φ0.323 ±0.025 D 0.955 ±0.020 D1 0.50 BASIC E 1.455 ±0.020 E1 1.00 BASIC e 0.50 BASIC SD 0.25 BASIC SE 0.00 BASIC Rev. 3 03/08 b NOTES: SIDE VIEW 1. All dimensions are in millimeters. E1 e SE D1 2 SD 1 b C B A BOTTOM VIEW 1