Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Wafer Level Chip Scale Package (WLCSP)
W3x2.6C
3x2 ARRAY 6 BALL WAFER LEVEL CHIP SCALE PACKAGE
E
D
PIN 1 ID
TOP VIEW
A2
A
A1
SYMBOL
MILLIMETERS
A
0.51 Min, 0.55 Max
A1
0.225 ±0.015
A2
0.305 ±0.013
b
Φ0.323 ±0.025
D
0.955 ±0.020
D1
0.50 BASIC
E
1.455 ±0.020
E1
1.00 BASIC
e
0.50 BASIC
SD
0.25 BASIC
SE
0.00 BASIC
Rev. 3 03/08
b
NOTES:
SIDE VIEW
1. All dimensions are in millimeters.
E1
e
SE
D1
2
SD
1
b
C
B
A
BOTTOM VIEW
1