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25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-3)
Dimensions shown in millimeters
a
0.600
0.555
0.510
2.295
2.245
2.195
SEATING
PLANE
5
4
3
2
1
A
BALL 1
IDENTIFIER
B
0.287
0.267
0.247
0.23
0.20
0.17
C
D
0.40
REF
TOP VIEW
(BALL SIDE DOWN)
1.60
REF
E
BOTTOM VIEW
(BALL SIDE UP)
1.60 REF
081908-A
2.100
2.050
2.000