6-Ball Wafer Level Chip Scale Package [WLCSP] (CB-6-3) Dimensions shown in millimeters a 0.420 0.390 0.340 1.035 0.985 0.935 BALL A1 IDENTIFIER SEATING PLANE 0.190 0.170 0.150 1.500 1.450 1.400 2 1 A 0.80 REF B 0.40 REF C TOP VIEW 0.40 REF 0.115 TYP BOTTOM VIEW (BALL SIDE UP) 022309-C (BALL SIDE DOWN)