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6-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-6-3)
Dimensions shown in millimeters
a
0.420
0.390
0.340
1.035
0.985
0.935
BALL A1
IDENTIFIER
SEATING
PLANE
0.190
0.170
0.150
1.500
1.450
1.400
2
1
A
0.80
REF
B
0.40
REF
C
TOP VIEW
0.40 REF
0.115 TYP
BOTTOM VIEW
(BALL SIDE UP)
022309-C
(BALL SIDE DOWN)