25-Ball Wafer Level Chip Scale Package [WLCSP] (CB-25-4) Dimensions shown in millimeters a 2.010 1.970 SQ 1.930 0.022 REF 0.645 0.600 0.555 SEATING PLANE 5 4 3 2 1 A BALL A1 IDENTIFIER 0.287 0.267 0.247 B 1.60 REF SQ C 0.40 REF D E 0.395 0.375 0.355 COPLANARITY 0.05 0.230 0.200 0.170 BOTTOM VIEW (BALL SIDE UP) 092209-B TOP VIEW (BALL SIDE DOWN)