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25-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-25-4)
Dimensions shown in millimeters
a
2.010
1.970 SQ
1.930
0.022
REF
0.645
0.600
0.555
SEATING
PLANE
5
4
3
2
1
A
BALL A1
IDENTIFIER
0.287
0.267
0.247
B
1.60
REF SQ
C
0.40
REF
D
E
0.395
0.375
0.355
COPLANARITY
0.05
0.230
0.200
0.170
BOTTOM VIEW
(BALL SIDE UP)
092209-B
TOP VIEW
(BALL SIDE DOWN)