Data Sheet

TEA1552
HV start-up flyback controller for DCM or QR mode; 125 kHz
fosc(h); standby output signal
Rev. 3.1 — 21 June 2012
Product data sheet
1. General description
The GreenChipII is the second generation of green Switched Mode Power
Supply (SMPS) control ICs operating directly from the rectified universal mains. A high
level of integration leads to a cost effective power supply with a very low number of
external components.
The special built-in green functions allow the efficiency to be optimum at all power levels.
This holds for quasi-resonant operation at high power levels, as well as fixed frequency
operation with valley switching at medium power levels. At low power (standby) levels, the
system operates at reduced frequency and with valley detection.
The proprietary high voltage BCD800 process makes direct start-up possible from the
rectified mains voltage in an effective and green way. A second low voltage BICMOS IC is
used for accurate, high speed protection functions and control.
Highly efficient, reliable supplies can easily be designed using the GreenChipII control IC.
2. Features and benefits
 Distinctive features:
 Universal mains supply operation (70 V AC to 276 V AC)
 High level of integration, giving a very low external component count.
 Green features:
 Valley or zero voltage switching for minimum switching losses
 Efficient quasi-resonant operation at high power levels
 Frequency reduction at low power standby for improved system efficiency (<3 W)
 Cycle skipping mode at very low loads. Pi < 300 mW at no-load operation for a
typical adapter application
 On-chip start-up current source
 Standby indication pin to indicate low output power consumption.
 Protection features:
 Safe restart mode for system fault conditions
 Continuous mode protection by means of demagnetization detection (zero
switch-on current)
 Accurate and adjustable overvoltage protection (latched)
 Short winding protection
 Undervoltage protection (foldback during overload)
 Overtemperature protection (latched)
TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
 Low and adjustable overcurrent protection trip level
 Soft (re)start
 Mains voltage-dependent operation-enabling level
 General purpose input for lock protection.
3. Applications
3.1 Typical application
Typical application areas are adapters and chargers (e.g. for laptops, camcorders and
printers) and all applications that demand an efficient and cost-effective solution up to
250 W.
4. Ordering information
Table 1.
Ordering information
Type number
TEA1552T
Package
Name
Description
Version
SO14
plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
© NXP B.V. 2012. All rights reserved.
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SUPPLY
MANAGEMENT
7
START-UP
CURRENT SOURCE
DRAIN
clamp
internal
supply
GND
10
VALLEY
UVLO start
5, 6
M-level
S1
14
VOLTAGE
CONTROLLED
OSCILLATOR
LOGIC
HVS
NXP Semiconductors
8
5. Block diagram
TEA1552
Product data sheet
VCC
DEM
100 mV
VCOadj
3
OVERVOLTAGE
PROTECTION
FREQUENCY
CONTROL
1
LOGIC
4
DRIVER
DRIVER
Iss
CTRL
POWER-ON
RESET
13
LEB
S
soft
start
S2
Q
-1
blank
UVLO
R
0.5 V
Q
2
OCP
MAXIMUM
ON-TIME
PROTECTION
TEA1552
Isense
12 300 Ω
LOCK
2.5 V
5.6 V
lock
detect
OVERTEMPERATURE
PROTECTION
VCC < 4.5 V
S
Q
R
Q
short
winding
0.88 V
11
mbl499
Fig 1.
Block diagram
TEA1552
3 of 26
© NXP B.V. 2012. All rights reserved.
OVER-POWER
PROTECTION
VCC(5V)
5 V/1 mA
(max)
HV start-up flyback controller for DCM or QR mode
Rev. 3.1 — 21 June 2012
All information provided in this document is subject to legal disclaimers.
STDBY
TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
6. Pinning information
6.1 Pinning
VCOadj
1
14 DEM
Isense
2
13 CTRL
STDBY
3
12 LOCK
DRIVER
4
HVS
5
HVS
6
DRAIN
7
TEA1552T
11 VCC(5V)
10 GND
9
n.c.
8
VCC
mbl497
Fig 2.
Pin configuration
6.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
VCOadj
1
VCO adjustment input
Isense
2
programmable current sense input
STDBY
3
standby indication or control output
DRIVER
4
gate driver output
HVS
5
high voltage safety spacer, not connected
HVS
6
high voltage safety spacer, not connected
DRAIN
7
drain of external MOS switch, input for start-up current and valley
sensing
VCC
8
supply voltage
n.c.
9
not connected
GND
10
ground
VCC(5V)
11
5 V output
LOCK
12
lock input
CTRL
13
control input
DEM
14
input from auxiliary winding for demagnetization timing, OVP and OPP
7. Functional description
The TEA1552 is the controller of a compact flyback converter, with the IC situated at the
primary side. An auxiliary winding of the transformer provides demagnetization detection
and powers the IC after start-up.
The TEA1552 operates in multi modes (see Figure 3).
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
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4 of 26
TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
The next converter stroke is started only after demagnetization of the transformer current
(zero current switching), while the drain voltage has reached the lowest voltage to prevent
switching losses (green function). The primary resonant circuit of primary inductance and
drain capacitor ensures this quasi-resonant operation. The design can be optimized in
such a way that zero voltage switching can be reached over almost the complete
universal mains range.
To prevent very high frequency operation at lower loads, the quasi-resonant operation
changes smoothly in fixed frequency PWM control.
At very low power (standby) levels, the frequency is controlled down, via the VCO, to a
minimum frequency of approximately 25 kHz.
7.1 Start-up, mains enabling operation level and undervoltage lock-out
(see Figure 11 and 12)
Initially, the IC is self supplying from the rectified mains voltage via pin DRAIN. Supply
capacitor CVCC is charged by the internal start-up current source to a level of
approximately 4 V or higher, depending on the drain voltage. Once the drain voltage
exceeds the M-level (mains-dependent operation-enabling level), the start-up current
source will continue charging capacitor CVCC (switch S1 will be opened); see Figure 1.
The IC will activate the power converter as soon as the voltage on pin VCC passes the
level VCC(start). The IC supply is taken over by the auxiliary winding as soon as the output
voltage reaches its intended level and the IC supply from the mains voltage is
subsequently stopped for high efficiency operation (green function).
The moment the voltage on pin VCC drops below the undervoltage lock-out level VUVLO,
the IC stops switching and enters a safe restart from the rectified mains voltage. Inhibiting
the auxiliary supply by external means causes the converter to operate in a stable, well
defined burst mode.
7.2 Supply management
All (internal) reference voltages are derived from a temperature compensated, on-chip
band gap circuit.
f
(kHz)
VCO
fixed
quasi resonant
125
25
P (W)
mbl500
Fig 3.
Multi-mode operation
7.3 Current mode control
Current mode control is used for its good line regulation behaviour.
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
The ‘on-time’ is controlled by the internally inverted control pin voltage, which is compared
with the primary current information. The primary current is sensed across an external
resistor. The driver output is latched in the logic, preventing multiple switch-on.
The internal control voltage is inversely proportional to the external control pin voltage,
with an offset of 1.5 V. This means that a voltage range from 1 V to 1.5 V on pin CTRL will
result in an internal control voltage range from 0.5 V to 0 V (a high external control voltage
results in a low duty cycle).
7.4 Oscillator
Vsense(max)
0.52 V
1V
(typ)
1.5 V
(typ)
VCTRL
mgu233
Fig 4.
Vsense(max) as a function of VCTRL
The maximum fixed frequency of the oscillator is set by an internal current source and
capacitor. The maximum frequency is reduced once the control voltage enters the VCO
control window. Then, the maximum frequency changes linearly with the control voltage
until the minimum frequency is reached (see Figure 4 and 5).
f
(kHz)
125 kHz
125
25
VCO2
level
Fig 5.
VCO1
level
Vsense(max) (V)
mbl501
VCO-frequency as a function of Vsense(max)
7.5 VCO adjustment
The VCOadj pin can be used to set the VCO operation point. As soon as the peak voltage
on the sense resistor is controlled below half the voltage on the VCOadj pin (VCO1 level),
frequency reduction will start. The actual peak voltage on sense will be somewhat higher
TEA1552
Product data sheet
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6 of 26
TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
due to switch-off delay (see Figure 6). The frequency reduction will stop approximately
25 mV lower (VCO2 level), when the minimum frequency is reached.
7.6 Cycle skipping
At very low power levels, a cycle skipping mode will be activated. A high control voltage
will reduce the switching frequency to a minimum of 25 kHz. If the voltage on the control
pin has raised even more, switch-on of the external power MOSFET will be inhibited until
the voltage on the control pin has dropped to a lower value again <.Normal_XRef>(see
Fig.6).
For system accuracy, it is not the absolute voltage on the control pin that will trigger the
cycle skipping mode, but a signal derived from the internal VCO will be used.
Remark: If the no-load requirement of the system is such that the output voltage can be
regulated to its intended level at a switching frequency of 25 kHz or above, the cycle
skipping mode will not be activated.
fosc
1.5 V - VCTRL
current
comparator
dV2
CTRL
DRIVER
DRIVER
5V
VCOadj
Isense
X2
VCC(5V)
fmin
VSTDBY
(V)
Vx
V
I
dV1
fmax
dV3
dV4
Vx (mV)
VCOadj
OSCILLATOR
5
0
Vx (mV)
cycle
skipping
1
0
Vx (mV)
mbl502
The voltage levels dV1, dV2, dV3 and dV4 are fixed in the IC to typically 50 mV, 18 mV, 40 mV and 15 mV respectively.
The level at which VCO mode of operation starts or ends can be externally controlled with the VCOadj pin.
Fig 6.
A functional implementation of the standby and cycle skipping circuitry.
7.7 Standby output
The STDBY output pin (VSTDBY = 5 V) can be used to drive an external NPN transistor or
FET in order to e.g. switch-off a PFC circuit. The STDBY output is activated by the internal
VCO: as soon as the VCO has reduced the switching frequency to (almost) the minimum
frequency of 25 kHz, the STDBY output will be activated (see Figure 6). The STDBY output
will go low again as soon as the VCO allows a switching frequency close to the maximum
frequency of 125 kHz.
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
7.8 Demagnetization
The system will be in discontinuous conduction mode all the time. The oscillator will not
start a new primary stroke until the secondary stroke has ended.
Demagnetization features a cycle-by-cycle output short-circuit protection by immediately
lowering the frequency (longer off-time), thereby reducing the power level.
Demagnetization recognition is suppressed during the first time (tsuppr). This suppression
may be necessary in applications where the transformer has a large leakage inductance
and at low output voltages/start-up.
7.9 OverVoltage Protection (OVP)
An OVP mode is implemented in the GreenChip series. For the TEA1552, this works by
sensing the auxiliary voltage via the current flowing into pin DEM during the secondary
stroke. The auxiliary winding voltage is a well-defined replica of the output voltage. Any
voltage spikes are averaged by an internal filter.
If the output voltage exceeds the OVP trip level, the OVP circuit switches off the power
MOSFET. The controller then waits until the UVLO level is reached on pin VCC. When VCC
drops to UVLO, capacitor CVCC will be recharged to the Vstart level, however the IC will not
start switching again. Subsequently, VCC will drop again to the UVLO level, etc.
Operation only recommences when the VCC voltage drops below a level of approximately
4.5 V (practically when the Vmains has been disconnected for a short period).
The output voltage (VOVP) at which the OVP function trips, can be set by the
demagnetization resistor RDEM:
Ns
V OVP = ----------- × [ I OVP ( DEM ) × R DEM + V clamp ( DEM ) ( pos ) ]
N aux
where Ns is the number of secondary turns and Naux is the number of auxiliary turns of the
transformer.
Current IOVP(DEM) is internally trimmed.
The value of the demagnetization resistor (RDEM) can be adjusted to the turns ratio of the
transformer, thus making an accurate OVP possible.
7.10 Valley switching (see Figure 7)
A new cycle starts when the power switch is switched on. After the ‘on-time’ (which is
determined by the ‘sense’ voltage and the internal control voltage), the switch is opened
and the secondary stroke starts.
After the secondary stroke, the drain voltage shows an oscillation with a frequency of
1
approximately --------------------------------------------------( 2 × π × ( Lp × Cd ) )
where Lp is the primary self inductance of the transformer and Cd is the capacitance on
the drain node.
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
primary
stroke
secondary
stroke
secondary
ringing
drain
valley
secondary
stroke
(2)
(1)
oscillator
mgu235
A: Start of new cycle at lowest drain voltage.
B: Start of new cycle in a classical PWM system at high drain voltage.
Fig 7.
Signals for valley switching.
As soon as the oscillator voltage is high again and the secondary stroke has ended, the
circuit waits for the lowest drain voltage before starting a new primary stroke. This method
is called valley detection. Figure 7 shows the drain voltage together with the valley signal,
the signal indicating the secondary stroke and the oscillator signal.
In an optimum design, the reflected secondary voltage on the primary side will force the
drain voltage to zero. Thus, zero voltage switching is very possible, preventing large
capacitive switching losses
 P = 1--- × C × V 2 × f


2
and allowing high frequency operation, which results in small and cost effective inductors.
7.11 OverCurrent Protection (OCP)
The cycle-by-cycle peak drain current limit circuit uses the external source resistor to
measure the current accurately. This allows optimum size determination of the
transformer core (cost issue). The circuit is activated after the leading edge blanking time
tleb. The OCP protection circuit limits the ‘sense’ voltage to an internal level.
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
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TEA1552
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HV start-up flyback controller for DCM or QR mode
7.12 OverPower Protection (OPP)
During the primary stroke, the rectified mains input voltage is measured by sensing the
current drawn from pin DEM. This current is dependent on the mains voltage, according to
the following formula:
V aux N × V mains
I DEM ≈ --------------- ≈ ------------------------R DEM
R DEM
where:
N aux
N = ---------N
P
The current information is used to adjust the peak drain current, which is measured via
pin Isense. The internal compensation is such that an almost mains independent maximum
output power can be realized.
The OPP curve is given in Figure 8.
Vsense(max)
0.52 V
(typ)
0.3 V
(typ)
-100 mA
(typ)
Fig 8.
IDEM
-24 mA
(typ)
mgu236
OPP correction curve
7.13 Minimum and maximum ‘on-time’
The minimum ‘on-time’ of the SMPS is determined by the Leading Edge Blanking (LEB)
time. The IC limits the ‘on-time’ to 50 μs. When the system desires an ‘on-time’ longer
than 50 μs, a fault condition is assumed, and the IC will stop switching and enter the safe
restart mode.
7.14 Short winding protection
After the leading edge blanking time, the short winding protection circuit is also activated.
If the ‘sense’ voltage exceeds the short winding protection voltage Vswp, the converter will
stop switching. Once VCC drops below the UVLO level, capacitor CVCC will be recharged
and the supply will restart again. This cycle will be repeated until the short-circuit is
removed (safe restart mode).
The short winding protection will also protect in case of a secondary diode short-circuit.
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
7.15 Lock input
Pin LOCK is a general purpose (high-impedance) input pin, which can be used to switch
off the IC. As soon as the voltage on this pin is raised above 2.5 V, switching will stop
immediately. The voltage on the VCC pin will cycle between VCC(start) and VCC(UVLO), but
the IC will not start switching again until the latch function is reset. The latch is reset as
soon as the VCC drops below 4.5 V (typical value). The internal OVP and OTP will also
trigger this latch Figure 1.
The detection level of this input is related to the VCC(5V) pin voltage in the following way:
0.5 × VCC(5V) ± 4%. An internal Zener diode clamp of 5.6 V will protect this pin from
excessive voltages. No internal filtering is done on this input.
7.16 Overtemperature Protection (OTP)
An accurate temperature protection is provided in the circuit. When the junction
temperature exceeds the thermal shutdown temperature, the IC will stop switching. When
VCC drops to UVLO, capacitor CVCC will be recharged to the Vstart level, however the IC
will not start switching again. Subsequently, VCC will drop again to the UVLO level, etc.
Operation only recommences when the VCC voltage drops below a level of approximately
4.5 V (practically when the Vmains has been disconnected for a short period).
7.17 Soft start-up
To prevent transformer rattle during hiccup, the transformer peak current is slowly
increased by the soft start function. This can be achieved by inserting a resistor and a
capacitor between pin Isense and the sense resistor (see Figure 9). An internal current
source charges the capacitor to V = ISS × RSS, with a maximum of approximately 0.5 V.
The start level and the time constant of the increasing primary current level can be
adjusted externally by changing the values of RSS and CSS.
V ocp – ( I SS × R SS )
I primary(max) = -------------------------------------------R sense
τ = R SS × C SS
The charging current ISS will flow as long as the voltage on pin Isense is below
approximately 0.5 V. If the voltage on pin Isense exceeds 0.5 V, the soft start current source
will start limiting the current ISS. At the VCC(start) level, the ISS current source is completely
switched off.
Since the soft start current ISS is subtracted from pin VCC charging current, the RSS value
will affect the VCC charging current level by a maximum of 60 μA (typical value).
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
ISS
0.5 V
start-up
R
5 Isense SS
Vocp
CSS
Rsense
mbl503
Fig 9.
Soft start-up
7.18 5 V output
Pin VCC(5V) can be used for supplying external circuitry. The maximum output current must
be limited to 1 mA. If higher peak currents are required, an external RC combination
should limit the current drawn from this pin to 1 mA maximum.
The 5 V output voltage will be available as soon as the start-up voltage is reached. As the
high voltage supply can not supply the 5 V pin during start-up and/or shutdown, during
latched shutdown (via pin LOCK or other latched protection such as OVP or OTP), the
voltage is switched to zero.
7.19 Driver
The driver circuit to the gate of the power MOSFET has a current sourcing capability of
typically 170 mA and a current sink capability of typically 700 mA. This permits fast
turn-on and turn-off of the power MOSFET for efficient operation. A low driver source
current has been chosen to limit the ΔV/Δt at switch-on. This reduces Electro Magnetic
Interference (EMI) and also limits the current spikes across Rsense.
TEA1552
Product data sheet
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TEA1552
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HV start-up flyback controller for DCM or QR mode
8. Limiting values
Table 3.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).[1]
Symbol
Parameter
Conditions
Min
Max
Unit
Voltages
VVCOadj
voltage on pin VCOadj
continuous
−0.4
+5
V
Vsense
voltage on pin Isense
current limited
−0.4
−
V
VDRAIN
voltage on pin DRAIN
−0.4
+650
V
VCC
supply voltage
continuous
−0.4
+20
V
continuous
−0.4
+7
V
−0.4
+5
V
−0.4
−
V
VLOCK
voltage on pin LOCK
VCTRL
voltage on pin CTRL
VDEM
voltage on pin DEM
current limited
Currents
Isense
current on pin Isense
−1
+10
mA
ISTDBY
current on pin STDBY
−1
-
mA
IDRIVER
current on pin DRIVER
−0.8
+2
A
IDRAIN
current on pin DRAIN
-
+5
mA
ICC(5V)
current on pin VCC(5V)
−1
0
mA
ICTRL
current on pin CTRL
-
+5
mA
IDEM
current on pin DEM
−250
+250
μΑ
d < 10 %
General
Ptot
total power dissipation
-
0.75
W
Tstg
storage temperature
−55
+150
°C
Tj
junction temperature
−20
+145
°C
Tamb < 70 °C
ESD
Vesd
electrostatic discharge voltage
pins 1 to 6 and pins 9 to 14
pin 7
on any other pin
HBM class 1
[2]
-
2000
V
HBM class 1
[2]
-
1500
V
MM
[3]
-
400
V
[1]
All voltages are measured with respect to ground; positive currents flow into the chip; pin VCC may not be current driven. The voltage
ratings are valid provided other ratings are not violated; current ratings are valid provided the maximum power rating is not violated.
[2]
Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ serie resistor.
[3]
Equivalent to discharging a 200 pF capacitor through a 0.75 μH coil and a 10 Ω resistor.
9. Thermal characteristics
Table 4.
Thermal characteristics
Symbol
Parameter
Rth(j-a)
[1]
TEA1552
Product data sheet
Conditions
thermal resistance from junction to ambient in free air
[1]
Typ
Unit
100
K/W
With pin GND connected to sufficient copper area on the printed-circuit board.
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
10. Characteristics
Table 5.
Characteristics
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
VCC = 0 V; VDRAIN > 100 V
1.0
1.2
1.4
mA
with auxiliary supply;
VDRAIN > 100 V
-
100
300
μA
Start-up current source (pin DRAIN)
IDRAIN
supply current from pin DRAIN
BVDSS
breakdown voltage
650
-
-
V
M-level
mains-dependent
operation-enabling level
60
-
100
V
Supply voltage management (pin VCC)
VCC(start)
start-up voltage on VCC
10.3
11
11.7
V
VCC(UVLO)
undervoltage lock-out on VCC
8.1
8.7
9.3
V
VCC(hys)
hysteresis voltage on VCC
VCC(start) − VCC(UVLO)
2.0
2.3
2.6
V
ICC(h)
pin VCC charging current (high)
VDRAIN > 100 V; VCC < 3V
−1.2
−1
−0.8
mA
ICC(l)
pin VCC charging current (low)
VDRAIN > 100 V;
3 V < VCC < VCC(UVLO)
−1.2
−0.75
−0.45 mA
ICC(restart)
pin VCC restart current
VDRAIN > 100 V;
VCC(UVLO) < VCC < VCC(start)
−650
−550
−450
μA
ICC(oper)
supply current under normal
operation
no load on pin DRIVER
1.1
1.3
1.5
mA
50
100
150
mV
−50[1] -
−10
nA
−0.5
−0.25
−0.05 V
0.5
0.7
0.9
V
1.1
1.5
1.9
μs
-
tleb
-
ns
Demagnetization management (pin DEM)
Vth(DEM)
demagnetization comparator
threshold voltage on pin DEM
Iprot(DEM)
protection current on pin DEM
Vclamp(DEM)(neg)
negative clamp voltage on pin DEM IDEM = −150 μA
Vclamp(DEM)(pos)
positive clamp voltage on pin DEM
tsuppr
suppression of transformer ringing
at start of secondary stroke
VDEM = 50 mV
IDEM = 250 μA
Pulse width modulator
ton(min)
minimum on-time
ton(max)
maximum on-time
latched
40
50
60
μs
fosc(l)
oscillator low fixed frequency
VCTRL > 1.5 V
20
25
30
kHz
fosc(h)
oscillator high fixed frequency
VCTRL < 1 V
100
125
150
kHz
-
VCO[1]
−
mV
-
VCO[1] − 25 −
mV
Oscillator
Vvco(start)
peak voltage on pin Isense, where
frequency reduction starts
Vvco(max)
peak voltage on pin Isense, where
the frequency is equal to fosc(l)
TEA1552
Product data sheet
see Figure 5 and Figure 6
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HV start-up flyback controller for DCM or QR mode
Table 5.
Characteristics …continued
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Duty cycle control (pin CTRL)
VCTRL(min)
minimum voltage on pin CTRL for
maximum duty cycle
-
1.0
-
V
VCTRL(max)
maximum voltage on pin CTRL for
minimum duty cycle
-
1.5
-
V
4.75
5.0
5.25
V
−1.0
-
-
mA
2.37
2.5
2.63
V
5 V output (pin VCC(5V))
VCC(5V)
output voltage
IO = 1 mA
ICC(5V)
current capability of pin VCC(5V)
LOCK input (pin LOCK)
VLOCK
LOCK trip level
VCC(reset)
voltage level on pin VCC which
resets the latch
VLOCK < 2.3 V
-
4.5
-
V
RELLOCK,5V
relation to 5 V output (pin VCC(5V))
VLOCK = 0.5 × VCC(5V)
−4
-
+4
%
−85
-
+85
V/μs
-
150[1]
-
ns
Valley switch (pin DRAIN)
ΔV/Δtvalley
tvalley-swon
valley recognition voltage change
delay from valley recognition to
switch-on
Overcurrent and short winding protection (pin Isense)
Vsense(max)
maximum source voltage OCP
ΔV/Δt = 0.1 V/μs
0.48
0.52
0.56
V
tPD
propagation delay from detecting
Vsense(max) to switch-off
ΔV/Δt = 0.5 V/μs
−
140
185
ns
Vswp
short winding protection voltage
0.83
0.88
0.96
V
tleb
blanking time for current and short
winding protection
300
370
440
ns
ISS
soft start current
Vsense < 0.5 V
45
60
75
μA
set by resistor RDEM;
see Section 7.9
54
60
66
μA
set by resistor RDEM;
see Section 7.12
−
−24
−
μA
−
−100
−
μA
Overvoltage protection (pin DEM)
IOVP(DEM)
OVP level on pin DEM
Overpower protection (pin DEM)
IOPP(DEM)
OPP current on pin DEM to start
OPP correction
IOPP50%(DEM)
OPP current on pin DEM, where
maximum source voltage is limited
to 0.3 V
Standby output (pin STDBY)
VSTDBY
standby output voltage
4.75
5.0
5.25
V
Isource
source current capability
VSTDBY = 1 V
20
22
24
μA
Isink
sink current capability
VSTDBY = 1.2 V
2
-
TEA1552
Product data sheet
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mA
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
Table 5.
Characteristics …continued
Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground; currents are positive when flowing into the IC;
unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Driver (pin Driver)
Isource
source current capability of driver
VCC = 9.5 V; VDRIVER = 2 V
-
−170
−88
mA
Isink
sink current capability of driver
VCC = 9.5 V; VDRIVER = 2 V
-
300
-
mA
VCC = 9.5 V;
VDRIVER = 9.5 V
400
700
-
mA
VCC > 12 V
-
11.5
12
V
130
140
150
°C
-
8
-
°C
Vo(driver)(max)
maximum output voltage of driver
Temperature protection
Tprot(max)
maximum temperature protection
level
Tprot(hys)
hysteresis for the temperature
protection level
[1]
[1]
Guaranteed by design.
TEA1552
Product data sheet
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HV start-up flyback controller for DCM or QR mode
11. Application information
VCOadj
Isense
STDBY
DRIVER
HVS
HVS
DRAIN
1
14 DEM
2
13 CTRL
3
12 LOCK
VCC(5V)
11
4
5
6
7
TEA1552T
10 GND
9 n.c.
VCC
8
mbl498
Fig 10. Basic application
A converter with the TEA1552 consists of an input filter, a transformer with a third winding
(auxiliary), and an output stage with a feedback circuit.
Capacitor CVCC (at pin VCC) buffers the supply voltage of the IC, which is powered via the
high voltage rectified mains during start-up and via the auxiliary winding during operation.
A sense resistor converts the primary current into a voltage at pin Isense. The value of this
sense resistor defines the maximum primary peak current.
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
Vmains
Vi
PFC
VCC
CVCC
n.c.
GND
VCC(5V)
-t
LOCK
CTRL
8
7
9
6
10
5
TEA1552T
11
4
12
3
13
2
14
1
CCTRL
DEM
RCTRL
Np
DRAIN
Do
Vo
Ns
Co
HVS
power
MOSFET
HVS
DRIVER
STDBY
Isense
CSS
Rs2
VCOadj
RSS
Rsense
RDEM
Naux
Rreg1
Rreg2
mbl504
Pin LOCK is used in this example for an additional external overtemperature protection.
If pin LOCK is not used, it must be tied to ground.
Fig 11. Configuration with controlled PFC.
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
Vi
VD
(power
MOSFET)
Vo
VCC
Vgate
M-level
VmC
start-up
sequence
normal
operation
overvoltage
protection
normal
operation
output
short-circuit
mbl505
Fig 12. Typical waveforms.
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
12. Package outline
SO14: plastic small outline package; 14 leads; body width 3.9 mm
SOT108-1
D
E
A
X
c
y
HE
v M A
Z
8
14
Q
A2
A
(A 3)
A1
pin 1 index
θ
Lp
1
L
7
e
detail X
w M
bp
0
2.5
5 mm
scale
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
mm
1.75
0.25
0.10
1.45
1.25
0.25
0.49
0.36
0.25
0.19
8.75
8.55
4.0
3.8
1.27
6.2
5.8
1.05
1.0
0.4
0.7
0.6
0.25
0.25
0.1
0.7
0.3
0.01
0.019 0.0100 0.35
0.014 0.0075 0.34
0.16
0.15
0.010 0.057
inches 0.069
0.004 0.049
0.05
0.244
0.039
0.041
0.228
0.016
0.028
0.024
0.01
0.01
0.028
0.004
0.012
θ
8o
o
0
Note
1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included.
REFERENCES
OUTLINE
VERSION
IEC
JEDEC
SOT108-1
076E06
MS-012
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 13. Package outline SOT108-1 (SO14)
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
13. Soldering of SMD packages
This text provides a very brief insight into a complex technology. A more in-depth account
of soldering ICs can be found in Application Note AN10365 “Surface mount reflow
soldering description”.
13.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to
Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both
the mechanical and the electrical connection. There is no single soldering method that is
ideal for all IC packages. Wave soldering is often preferred when through-hole and
Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not
suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high
densities that come with increased miniaturization.
13.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from
a standing wave of liquid solder. The wave soldering process is suitable for the following:
• Through-hole components
• Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless
packages which have solder lands underneath the body, cannot be wave soldered. Also,
leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered,
due to an increased probability of bridging.
The reflow soldering process involves applying solder paste to a board, followed by
component placement and exposure to a temperature profile. Leaded packages,
packages with solder balls, and leadless packages are all reflow solderable.
Key characteristics in both wave and reflow soldering are:
•
•
•
•
•
•
Board specifications, including the board finish, solder masks and vias
Package footprints, including solder thieves and orientation
The moisture sensitivity level of the packages
Package placement
Inspection and repair
Lead-free soldering versus SnPb soldering
13.3 Wave soldering
Key characteristics in wave soldering are:
• Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are
exposed to the wave
• Solder bath specifications, including temperature and impurities
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
13.4 Reflow soldering
Key characteristics in reflow soldering are:
• Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 14) than a SnPb process, thus
reducing the process window
• Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
• Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak
temperature is high enough for the solder to make reliable solder joints (a solder paste
characteristic). In addition, the peak temperature must be low enough that the
packages and/or boards are not damaged. The peak temperature of the package
depends on package thickness and volume and is classified in accordance with
Table 6 and 7
Table 6.
SnPb eutectic process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
≥ 350
< 2.5
235
220
≥ 2.5
220
220
Table 7.
Lead-free process (from J-STD-020C)
Package thickness (mm)
Package reflow temperature (°C)
Volume (mm3)
< 350
350 to 2000
> 2000
< 1.6
260
260
260
1.6 to 2.5
260
250
245
> 2.5
250
245
245
Moisture sensitivity precautions, as indicated on the packing, must be respected at all
times.
Studies have shown that small packages reach higher temperatures during reflow
soldering, see Figure 14.
TEA1552
Product data sheet
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TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
maximum peak temperature
= MSL limit, damage level
temperature
minimum peak temperature
= minimum soldering temperature
peak
temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 14. Temperature profiles for large and small components
For further information on temperature profiles, refer to Application Note AN10365
“Surface mount reflow soldering description”.
14. Abbreviations
Table 8.
Abbreviations
Acronym
Description
BiCMOS
Bipolar Complementary Metal-Oxide Semiconductor
DMOS
Diffusion Metal-Oxide Semiconductor
ESR
Equivalent Series Resistance
EZ-HV SOI
Easy High Voltage Silicon-On-Insulator
FET
Field-Effect Transistor
PWM
Pulse Width Modulation
SMPS
Switched Mode Power Supply
SOPS
Self-Oscillating Power Supply
15. Revision history
Table 9.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
TEA1552 v.3.1
20120621
Product data sheet
-
TEA1552 v.3
Modifications:
•
•
Data sheet title changed.
Table 1 “Ordering information” on page 2 updated.
TEA1552 v.3
20120418
Product data sheet
-
TEA1552 v.2
TEA1552 v.2
20020827
Product specification
-
TEA1552 v.1
TEA1552 v.1
20020703
Product specification
-
-
TEA1552
Product data sheet
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HV start-up flyback controller for DCM or QR mode
16. Legal information
16.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
16.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
16.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
TEA1552
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 3.1 — 21 June 2012
© NXP B.V. 2012. All rights reserved.
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NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
16.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
GreenChip — is a trademark of NXP B.V.
17. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
TEA1552
Product data sheet
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Rev. 3.1 — 21 June 2012
© NXP B.V. 2012. All rights reserved.
25 of 26
TEA1552
NXP Semiconductors
HV start-up flyback controller for DCM or QR mode
18. Contents
1
2
3
3.1
4
5
6
6.1
6.2
7
7.1
7.2
7.3
7.4
7.5
7.6
7.7
7.8
7.9
7.10
7.11
7.12
7.13
7.14
7.15
7.16
7.17
7.18
7.19
8
9
10
11
12
13
13.1
13.2
13.3
13.4
14
15
16
16.1
16.2
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Typical application . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 4
Start-up, mains enabling operation level and
undervoltage lock-out (see Figure 11 and 12) . 5
Supply management. . . . . . . . . . . . . . . . . . . . . 5
Current mode control . . . . . . . . . . . . . . . . . . . . 5
Oscillator. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
VCO adjustment . . . . . . . . . . . . . . . . . . . . . . . . 6
Cycle skipping . . . . . . . . . . . . . . . . . . . . . . . . . 7
Standby output . . . . . . . . . . . . . . . . . . . . . . . . . 7
Demagnetization. . . . . . . . . . . . . . . . . . . . . . . . 8
OverVoltage Protection (OVP) . . . . . . . . . . . . . 8
Valley switching (see Figure 7) . . . . . . . . . . . . . 8
OverCurrent Protection (OCP) . . . . . . . . . . . . . 9
OverPower Protection (OPP) . . . . . . . . . . . . . 10
Minimum and maximum ‘on-time’ . . . . . . . . . . 10
Short winding protection . . . . . . . . . . . . . . . . . 10
Lock input . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Overtemperature Protection (OTP). . . . . . . . . 11
Soft start-up . . . . . . . . . . . . . . . . . . . . . . . . . . 11
5 V output . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Driver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 13
Thermal characteristics . . . . . . . . . . . . . . . . . 13
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 14
Application information. . . . . . . . . . . . . . . . . . 17
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 20
Soldering of SMD packages . . . . . . . . . . . . . . 21
Introduction to soldering . . . . . . . . . . . . . . . . . 21
Wave and reflow soldering . . . . . . . . . . . . . . . 21
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 21
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 22
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
16.3
16.4
17
18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
25
25
26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2012.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 21 June 2012
Document identifier: TEA1552