INTEGRATED CIRCUITS DATA SHEET TEA1541 SMPS control IC with synchronization function Product specification 2003 Aug 11 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 CONTENTS 7 LIMITING VALUES 8 THERMAL CHARACTERISTICS 9 QUALITY SPECIFICATION 10 CHARACTERISTICS 1 FEATURES 1.1 1.2 1.3 Distinctive features Green features Protection features 11 APPLICATION INFORMATION 2 GENERAL DESCRIPTION 12 PACKAGE OUTLINE 3 ORDERING INFORMATION 13 SOLDERING 4 BLOCK DIAGRAM 13.1 5 PINNING 6 FUNCTIONAL DESCRIPTION 6.1 Start-up, mains voltage-dependent operation-enabling level and undervoltage lock-out Supply management Primary current regulation Oscillator Demagnetization Minimum and maximum ‘on-time’ Overvoltage protection Overcurrent protection and overpower protection Soft start Winding short-circuit protection Overtemperature protection Burst standby mode Driver Introduction to soldering through-hole mount packages Soldering by dipping or by solder wave Manual soldering Suitability of through-hole mount IC packages for dipping and wave soldering methods 6.2 6.3 6.4 6.5 6.6 6.7 6.8 6.9 6.10 6.11 6.12 6.13 2003 Aug 11 13.2 13.3 13.4 2 14 DATA SHEET STATUS 15 DEFINITIONS 16 DISCLAIMERS Philips Semiconductors Product specification SMPS control IC with synchronization function 1 1.1 TEA1541 2 FEATURES The TEA1541 is a second generation GreenChipTM(1) Switched Mode Power Supply (SMPS) controller IC that operates directly from the rectified universal mains. A high-level of integration provides a cost-effective power supply requiring only a few external components. Distinctive features • Universal mains supply operation (70 to 276 V AC) • High-level of integration requiring few external components • Synchronization with internal frequency divider The TEA1541 controller enables easy design of highly efficient, reliable switched mode power supplies. Its internal oscillator can be synchronized to pulses from an external signal source. External synchronizing pulses whose frequency is above the SMPS switching frequency range are divided by an internal divider. • Frequency independent over-power protection. 1.2 Green features • Frequency reduction at low power standby for improved system efficiency (<3 W) • Burst mode operation for very low power standby levels (<1 W) Special built-in green functions ensure optimum efficiency at all power levels. At low power (standby) levels, the SMPS supply operates at a lower frequency. In burst standby mode, power consumption can be reduced to less than 1 W. • On-chip start-up current source. 1.3 GENERAL DESCRIPTION Protection features The proprietary EZ-HV SOI process allows start-up directly from the rectified mains voltage, avoiding the need for bleeder circuits, and also saves energy. • Safe restart mode for system fault conditions • Continuous mode protection using demagnetization detection (zero switch-on current) A low voltage BICMOS implements accurate control and high speed protection functions. • Accurate and adjustable overvoltage protection • Winding short-circuit protection • Undervoltage protection (foldback during overload) • Overtemperature protection • Adjustable low overcurrent protection (OCP) trip level • Soft (re)start (1) GreenChip is a trademark of Koninklijke Philips Electronics N.V. • Mains voltage-dependent operation-enabling level. 3 ORDERING INFORMATION TYPE NUMBER TEA1541P 2003 Aug 11 PACKAGE NAME DIP8 DESCRIPTION plastic dual-in-line package; 8 leads (300 mil) 3 VERSION SOT97-1 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 handbook, full pagewidth Vmains CVIN CVCC Sync pulses 1 8 2 7 n.c. TEA1541P 3 6 4 5 RDEM MDB082 Fig.1 Basic application. 2003 Aug 11 4 This text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here in _white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader.This text is here inThis text is here in white to force landscape pages to be rotated correctly when browsing through the pdf in the Acrobat reader. white to force landscape pages to be ... 700 mV 8 mains ok internal UVLO supply S1 GND DEM SHORT-CIRCUIT PROTECTION 2 PRIMARY CURRENT SIMULATION PCS start OCP (internal control) 7 ICTRL Clamp CONTINUOUS MODE PROTECTION DEM 100 mV (frequency information) SYNC. DETECTOR HVS IDEM −50 mV 4 VOLTAGE CONTROLLED OSCILLATOR VIN SMPS control IC with synchronization function SUPPLY MANAGEMENT BLOCK DIAGRAM START-UP CURRENT SOURCE 1 Philips Semiconductors 4 2003 Aug 11 VCC OVERVOLTAGE PROTECTION FREQUENCY CONTROL 5 (internal control) 3.5 V PCS 6 DRIVER LOGIC OVERTEMPERATURE PROTECTION DRIVER OCP ISS LEB Q UVLO S2 blank S POWER-ON RESET R soft start 5 OCP Isense BURST CONTROL burst detect MAXIMUM ON-TIME PROTECTION winding shortcircuit (frequency information) OVERPOWER PROTECTION MDB083 TEA1541 Fig.2 Block diagram. 880 mV Product specification TEA1541 (frequency information) handbook, full pagewidth CTRL SAMPLEAND-HOLD 3 (internal control) Philips Semiconductors Product specification SMPS control IC with synchronization function 5 PINNING SYMBOL PIN DESCRIPTION VCC 1 supply voltage GND 2 ground CTRL 3 control input DEM 4 input from auxiliary winding for demagnetization timing, OVP and overpower protection (OPP) Isense 5 programmable current sense input DRIVER 6 gate driver output HVS 7 high voltage safety spacer, not connected VIN 8 input for start-up current and mains voltage recognition 6 TEA1541 handbook, halfpage VCC 1 VIN 7 HVS CTRL 3 6 DRIVER DEM 4 5 Isense GND 2 TEA1541P MDB084 Fig.3 Pin configuration. The IC has an internal frequency divider which allows it to operate in synchronized mode at a lower frequency than the synchronizing pulses supplied to pin CTRL by the application. The limited frequency range allows an economical design of the transformer. FUNCTIONAL DESCRIPTION The TEA1541 is intended as the controller for a compact flyback converter for CRT monitor applications. The IC is situated on the primary side of the output transformer. Output power is determined by the current in the primary winding. The voltage across an auxiliary winding in the transformer is converted to a current by resistor RDEM and used by the IC to derive the current in the primary winding. This winding is also used for continuous mode protection, overvoltage protection, and to power the IC after start-up. In unsynchronized mode, when the power that is drawn from the converter decreases, the converter switching frequency also decreases. At very low power (standby) levels, the frequency of the VCO decreases from 25 kHz to the minimum value of approximately 6 kHz as shown by the slope of Fig.4. In a typical application it is possible to obtain an input power of less than 3 W with an output power of 100 mW. The IC can operate in either synchronized or unsynchronized mode. In synchronized mode, the IC synchronizes the converter switching frequency to the monitor line frequency to prevent interference. Line synchronizing pulses are applied to pin CTRL. Each operating cycle of the converter comprises a primary stroke followed by a secondary stroke. During the primary stroke, current flows in the primary winding. The secondary stroke transfers the energy stored in the transformer core to the secondary winding. In either synchronized or unsynchronized mode, the primary stroke only starts at the end of the secondary stroke when the transformer is demagnetized to ensure zero switching primary current. If no synchronizing pulses are present (unsynchronized mode), the IC will operate at its minimum switching frequency. 2003 Aug 11 8 6 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 handbook, halfpage f handbook, halfpage M-level (kHz) 50 synchronized operation VIN VCC(start) 25 VCC(trip)(VIN) unsynchronized operation 6 VCC VCO variable VCO fixed P(W) IVIN(max) MDB085 IVIN(min) IVIN Fig.4 Multi mode operation. ICC MDB087 6.1 Start-up, mains voltage-dependent operation-enabling level and undervoltage lock-out Fig.5 Start-up sequence. Initially, the IC is supplied by the rectified mains voltage at pin VIN. When the voltage at pin VCC is below the VCC voltage for VIN current trip level VCC(trip)(VIN), the supply current drawn from pin VIN, (IVIN) is at the low value IVIN(min). When VCC rises to the VCC(trip)(VIN) level, the current at pin VIN changes to the high value IVIN(max). When the voltage at pin VIN is below the mains voltage-dependent operation-enabling level (M-level), the IC supply capacitor CVCC is charged by the internal start-up current source to approximately 5 V. When the voltage at pin VIN exceeds the M-level, the start-up current source continues to charge CVCC (switch S1 open; see Fig.2). Inhibiting the auxiliary supply by external means causes the converter to operate in a stable, well-defined burst mode. This is a burst standby mode that is less efficient than the normal burst standby mode described in section 6.12. If the voltage at pin VIN falls below the mains undervoltage lock-out level MUVLO, a safe restart mode is activated, and the IC stops switching. During normal operation (non-burst standby mode), the duty cycle of the IC, and thus the output power of the supply, is regulated by a control voltage at pin CTRL. When VCC reaches the start-up voltage level VCC(start), the IC switches to high efficiency (green function) operation by no longer drawing current from pin VIN (see Fig.5). If pin VCC is connected to ground, the IC switches to low power standby operation and the start-up current drawn via pin VIN reduces to 400 µA (typical). When the voltage on pin VCC rises above 700 mV (typical), the start-up current increases to 1 mA (typical). At VCC(start) the IC activates the external MOSFET. When the voltage across the auxiliary winding rises above the voltage across CVCC, the IC supply current will be supplied by the auxiliary winding via pin VCC. 6.2 If the voltage on pin VCC falls below the VCC undervoltage lock-out level VCC(UVLO), the IC stops switching and enters a safe restart mode in which current to the IC is supplied by the rectified mains voltage via pin VIN, and CVCC is re-charged by the internal start-up current source to VCC(start). 2003 Aug 11 Supply management All internal reference voltages are derived from a temperature compensated, on-chip bandgap. 7 Philips Semiconductors Product specification SMPS control IC with synchronization function 6.3 TEA1541 Primary current regulation The IC uses current mode control for its good line regulation behaviour. The primary current is sensed indirectly via the voltage at pin DEM. f handbook, halfpage (kHz) fsmps(max) The ‘on-time’ of the external MOSFET is controlled by the voltage on pin CTRL which is compared with the internal simulated primary current information. For pin CTRL voltages (VCTRL) between 1 and 1.6 V, the on-time is calculated by the equation: 1.6 – V CTRL t on = α PCS × ------------------------------- [ ns ] I DEM fosc fsync (min) fsync (max) 2 × fsync (max) f (kHz) MDB086 where: • ton: the on-time • αPCS: an internal constant which is approximately 0.9. • VCTRL: the voltage on pin CTRL Fig.6 • IDEM: the current drawn from pin DEM during the primary cycle. 6.4 Switching frequency as a function of the synchronizing frequency. Oscillator 6.5 In synchronized mode, the switching frequency of the SMPS fsmps is controlled by the synchronizing pulses fsync at pin CTRL. Synchronized mode prevents noise disturbance on the CRT monitor screen. Synchronizing pulses whose frequency is outside of the fosc and fsmps(max) window of 26 to 54 kHz are divided by an internal frequency divider. A small frequency hysteresis exists to ensure a stable frequency switch-over. In unsynchronized mode, the system runs at fosc (26 kHz). In unsynchronized mode, at very low power (standby) levels, the frequency of the VCO and consequently the SMPS switching frequency is reduced linearly to its low value of approximately 6 kHz (see Figs 4 and 6). Demagnetization The system always operates in discontinuous conduction mode to ensure demagnetization of the output transformer core. A primary cycle only starts when the secondary cycle has ended. Pin DEM protects against an output short-circuit on a cycle-by-cycle basis, by immediately lowering the switching frequency to give a longer off-time and a lower operating power. Demagnetization detection is suppressed automatically at the start of each secondary cycle for a period tsuppr. Suppression of demagnetization detection is necessary for applications where the transformer has a large leakage inductance, at low output voltages and at start-up. If, due to a fault condition, pin DEM is left open circuit, operation of the flyback converter supply immediately stops, and restarts when the fault situation is removed and pin DEM is reconnected. If, during start-up, a fault condition causes pin DEM to be shorted to ground, operation of the flyback converter supply stops after the first cycle, and the IC then begins a restart cycle. This situation continues until the short-circuit is removed. Short-circuit protection is also active at full power to ensure limitation of peak current. 2003 Aug 11 8 Philips Semiconductors Product specification SMPS control IC with synchronization function 6.6 TEA1541 prematurely due to the false sensing of an overcurrent condition caused by current spikes produced by the discharge of primary-side snubber and parasitic capacitances. Minimum and maximum ‘on-time’ The minimum on-time of the converter is not limited by the leading edge blanking time, and therefore can be zero. 1 The IC limits the maximum on-time to ------------f smps The OCP level is adjusted proportionally to the switching frequency such that the product of (Ipeak)2 × frequency stays constant. This arrangement also implements OPP, ensuring that the maximum output power is independent of the switching frequency, otherwise the output power would increase in direct proportion to the switching frequency. where fsmps is the converter switching frequency in either synchronized or unsynchronized mode. If the system requires a longer on-time, a fault condition is assumed, for example, if CVIN is removed, the IC will stop switching and enter the safe restart mode. 6.7 6.9 Overvoltage protection The soft start function allows the transformer peak current to slowly increase at every start-up and restart, to prevent transformer rattle. The TEA1541 allows OVP to be set accurately. The flyback converter output voltage is accurately represented by the voltage across the auxiliary winding. The auxiliary winding voltage is monitored by the current flowing into pin DEM during the demagnetizing cycle of the transformer. The inevitable voltage spikes at pin DEM are reduced using an internal filter. The soft start function requires a resistor RSS and capacitor CSS to be connected between pin Isense and the sense resistor Rsense (see Fig.7). CSS is charged by an internal current source ISS to V = ISS × RSS, to a maximum of approximately 0.5 V. If the output voltage causes the current into pin DEM to exceed the OVP level lOVP(DEM), the OVP circuit turns off the power MOSFET. The controller then waits until the VCC(UVLO) condition is reached. This is followed by a safe restart cycle, before switching recommences. This process is repeated until the OVP condition ends. handbook, halfpage ISS The output voltage at which OVP activates, Vo(ovp) is set by the value of resistor, RDEM, (see Fig.8) using the equation: V o(ovp) Soft start 0.5 V Ns = ----------- × ( I OVP ( DEM ) × R DEM + V clamp ( DEM ) ( pos ) ) N aux start-up RSS 5 Isense where N is the number of turns on the transformer windings; Vclamp(DEM)(pos) is the positive clamp voltage on pin DEM; reference current IOVP(DEM) is set internally. Vocp CSS Rsense MBL503 6.8 Overcurrent protection and overpower protection The current in the transformer primary is measured accurately by the internal cycle-by-cycle source current limit circuit using the external sense resistor Rsense. The accuracy of the current limit circuit allows the transformer core to have a minimum specification for the output power required. The OCP circuit limits the ‘sense’ voltage to an internal level, and is activated after the leading edge blanking period, tleb generated by the Leading Edge Blanking circuit (LEB shown in Fig.2). Leading edge blanking is required to inhibit OCP for a short period when the power MOSFET turns on. This ensures that the MOSFET is not turned off 2003 Aug 11 Fig.7 Soft start. The rate at which the primary current increases can be adjusted by changing the values of RSS and CSS to change the circuit time constant: τ = R SS × C SS The maximum primary current is calculated by the V sense ( max ) – ( I SS × R SS ) equation: I primary ( max ) = ----------------------------------------------------------------R sense 9 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 period that is longer than the burst standby mode blanking period tblank(burst). where Vsense(max) is the maximum source voltage for OCP. ISS flows when the voltage on pin Isense is less than approximately 0.5 V. If this voltage exceeds 0.5 V, the soft-start current source starts to limit ISS and completely switches ISS off at VCC(start). During a burst standby mode cycle, the soft-start capacitor CSS, (see Fig.8) is charged to 1.25 V and then discharged via the soft-start resistor RSS. When CSS is discharged to 0.5 V, a soft-restart is initiated. The frequency of a typical 1 burst standby mode cycle is approximately: ---------------------------R SS × C SS Note that ISS is derived from the internal current source supplying charging current to pin VCC. During soft-start, the charging current to pin VCC will be reduced by up to 60 µA depending on the value of RSS. 6.10 If, during a burst standby mode cycle, the voltage at pin VCC falls below the trip level voltage VCC(burst), the IC will be supplied again from pin VIN. If VCC(UVLO) is reached within the burst cycle period due to an external load on pin VCC, a restart cycle begins. If during a burst standby mode cycle, the voltage on pin VCC stays above the trip level voltage VCC(burst), a maximum burst efficiency is obtained because the IC is being consistently powered by the auxiliary winding. Winding short-circuit protection The winding short-circuit protection circuit is activated after the leading edge blanking period. A short-circuit in the transformer winding is detected when the voltage at pin Isense exceeds the winding short-circuit protection voltage Vswp. When a short-circuit is detected, the flyback converter supply will stop switching. When the voltage at pin VCC falls below VCC(UVLO), the IC enters safe restart mode, and capacitor CVCC will recharge via the internal start-up current source supplied from pin VIN until the flyback converter supply restarts at VCC(start). The fault detection and restart cycle will be repeated until the short-circuit is removed. The winding short-circuit protection circuit also provides protection if a diode in the transformer secondary circuit goes short-circuit. 6.11 6.13 The Gate of the external power MOSFET is driven from a driver circuit having a current sourcing capability of typically 100 mA, and a current sink capability of typically 500 mA. This permits fast turn-on and turn-off of the power MOSFET for efficient operation. A low driver source current has been chosen in order to limit the ∆V/∆t at switch-on. This reduces Electro Magnetic Interference (EMI) and also limits the voltage spikes across the current sense resistor Rsense. Overtemperature protection An accurate temperature protection circuit stops the converter from switching if the IC junction temperature exceeds the maximum temperature protection level Tprot(max). When the voltage at pin VCC falls below VCC(UVLO), the IC enters safe restart mode, and capacitor CVCC will recharge to VCC(start) via the internal start-up current source derived from pin VIN. If the temperature is still too high, the voltage at pin VCC will fall again to VCC(UVLO). This cycle is repeated until the junction temperature falls 8 degrees (typical) below Tprot(max). 6.12 Burst standby mode Pin CTRL and pin Isense are also used to implement the burst standby mode feature. In burst standby mode, the converter consumes less than 1 W (typical) of input power at a maximum output power of 100 mW. This power is sufficient to supply a low power device such as a microcontroller. Burst standby mode is entered when a current larger than the burst standby mode active current Iburst is forced into pin CTRL, via the opto-coupler, for a 2003 Aug 11 Driver 10 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 7 LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). All voltages are measured with respect to ground (pin 2); positive currents flow into the chip; pin 1 is not allowed to be current driven. The voltage ratings are valid provided other ratings are not being violated; current ratings are valid provided the maximum power rating is not violated. SYMBOL PARAMETER CONDITIONS continuous MIN. MAX. UNIT −0.4 +40 V −0.4 +5 V VCC voltage on pin VCC VCTRL voltage on pin CTRL VDEM voltage on pin DEM current limited −0.4 − V Vsense voltage on pin Isense current limited −0.4 − V VVIN voltage on pin VIN −0.4 +550 V ICTRL current on pin CTRL − 50 mA IDEM current on pin DEM −250 +250 µA Isense current on pin Isense −1 +10 mA IDRIVER current on pin DRIVER −0.8 +2 A IVIN current pin VIN − +5 mA Ptot total power dissipation − 0.75 W δ < 10% δ < 10% Tamb < 70 °C Tstg storage temperature −55 +150 °C Tj junction temperature −20 +145 °C Vesd electrostatic discharge; pins 1 to 6 (class II) − 2000 V pin 8 (Vin) (class I) − 1250 V − 200 V human body model; note 1 machine model; note 2 Notes 1. Equivalent to discharging a 100 pF capacitor through a 1.5 kΩ series resistor. 2. Equivalent to discharging a 200 pF capacitor through a 0.75 µH coil and a 10 Ω resistor. 8 THERMAL CHARACTERISTICS SYMBOL Rth(j-a) 9 PARAMETER CONDITIONS thermal resistance from junction to ambient QUALITY SPECIFICATION In accordance with “SNW-FQ-611 part D”. 2003 Aug 11 11 in free air VALUE UNIT 100 K/W Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 10 CHARACTERISTICS Tamb = 25 °C; VCC = 15 V; all voltages are measured with respect to ground (pin 2); currents are positive when flowing into the IC. SYMBOL PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Start-up current source (pin VIN) 300 400 500 µA supply voltage for pin VIN current trip VVIN > 100 V level 0.5 0.75 1.0 V IVIN(max) maximum supply current drawn from pin VIN VCC = 10 V; VVIN > 100 V 1.25 1.6 1.95 mA IVIN supply current drawn from pin VIN after start-up; VCC > VCC(start); VVIN > 100 V − 100 300 µA Vbd breakdown voltage 550 − − V M-level mains-dependent operation-enabling level 33 37 40 V MUVLO mains undervoltage lock-out level 25 28.5 33 V IVIN(min) minimum supply current drawn from pin VIN VCC(VIN)trip VCC < VCC(trip)(VIN), VVIN > 100 V VCC management (pin VCC) VCC(start) start-up voltage 10.8 11.4 12 V VCC(UVLO) undervoltage lock-out 8.5 9.0 9.5 V VCC(hys) hysteresis voltage VCC(start) − VCC(UVLO) 2.1 2.4 2.7 V ICC(h) charging current (high) VVIN > 100 V; VCC < VCC(trip)(VIN) − −0.25 − mA ICC(l) charging current (low) VVIN > 100 V; VCC(trip)(VIN) < VCC < VCC(UVLO) −1.6 −1.2 −0.75 mA ICC(restart) restart current VVIN > 100 V; VCC(UVLO) −1.25 < VCC < VCC(start) −1.0 −0.75 mA ICC(oper) supply current under normal operation no load on pin DRIVER − 1.6 − mA − 0.9 − A.s/V Primary current simulation αPCS primary current simulation factor Demagnetization management (pin DEM) Vth(DEM) demagnetization comparator threshold voltage 70 100 130 mV Iprot(DEM) demagnetization current −50 − −10 nA Vclamp(DEM)(neg) negative clamp voltage I(DEM) = −150 µA −0.5 −0.25 −0.05 V I(DEM) = 250 µA Vclamp(DEM)(pos) positive clamp voltage 0.55 0.7 0.85 V tsuppr suppression time of transformer ringing at start of secondary stroke 1.1 1.5 1.9 µs Vsc(prot)(DEM) short-circuit protection voltage −90 −50 −10 mV 2003 Aug 11 12 Philips Semiconductors Product specification SMPS control IC with synchronization function SYMBOL TEA1541 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Pulse width modulator ton(min) minimum on-time − 0 − ton(max) maximum on-time latched − 1/fsmps − s fosc(min) minimum oscillator frequency VCTRL > 1.5 V; no sync − 6 − kHz fosc oscillator frequency VCTRL < 1.5 V; no sync; note 2 24 26 28 kHz fsmps(max) maximum SMPS switching frequency before frequency division sync. on; note 3 − 54 − kHz fsmps(hys) frequency hysteresis for division sync. on − 4 − kHz Vvco(start) voltage on pin CTRL where frequency reduction starts sync off 1.38 1.46 1.54 V Vvco(max) peak voltage on pin CTRL where frequency is equal to fosc(min) sync off − 1.58 − V Oscillator Duty cycle control (pin CTRL) VCTRL(min) minimum voltage on pin CTRL for maximum duty cycle − 1.0 − V VCTRL(max) maximum voltage on pin CTRL for minimum duty cycle − 1.6 − V Iprot(CTRL) current on pin CTRL −0.6 −0.8 −1.0 µA − 3.6 − V 4 7 11 mA Burst standby mode (pin CTRL) Vth(burst)(on) burst standby mode active threshold voltage Iburst = 4 mA Iburst burst standby mode active current tblank(burst) burst standby mode blanking time 25 32 40 µs Vch(sense)(burst) charge voltage on pin Isense in burst standby mode − 1.25 − V Vdis(sense)(burst) discharge voltage level on pin Isense in burst standby mode − 0.5 − V Ich(sense)(burst) charging current into pin Isense in burst standby mode − 100 − µA VCC(burst) supply voltage trip level for supply from pin VIN during burst standby mode − 11.2 − V ICC(burst) supply current during burst standby mode − 600 − µA synchronization recognition voltage 0.37 0.52 0.65 V synchronization recognition − 0.5(1) − V/µs Synchronization (pin CTRL) Vsync ∆V/∆tsync 2003 Aug 11 13 Philips Semiconductors Product specification SMPS control IC with synchronization function SYMBOL TEA1541 PARAMETER CONDITIONS MIN. TYP. MAX. UNIT Overcurrent and winding short-circuit protection (pin Isense) Vsense(max) maximum source voltage for OCP fsmps(min); ∆V/∆t = 0.1 V/µs 0.48 0.52 0.56 V fsmps(max); ∆V/∆t = 0.1 V/µs 0.33 0.37 0.41 V tPD propagation delay from detecting Vsense(max) to switch-off ∆V/∆t = 0.5 V/µs − 140 185 ns Vswp winding short-circuit protection voltage ∆V/∆t = 0.5 V/µs 0.83 0.88 0.96 V tleb blanking time for current and winding short-circuit protection 320 380 480 ns Iss soft start current 45 60 75 µA Vss(max) soft start maximum sense voltage 0.45 0.50 0.55 V 60 66 µA Vsense < 0.5 V Overvoltage protection (pin DEM) IOVP(DEM) OVP trigger current see Section 54 “Overvoltage protection” Driver (pin DRIVER) Isource source current capability of driver VCC = 9.5 V; VDRIVER = 5 V − −100 −75 mA Isink sink current capability of driver VCC = 9.5 V; VDRIVER = 5 V − 500 − mA VCC = 9.5 V; VDRIVER = 9.5 V 400 700 − mA VCC > 12 V − 11.5 12 V Vo(driver)(max) maximum output voltage of driver Temperature protection Tprot(max) maximum temperature protection level 130 140 150 °C Tprot(hys) hysteresis for the temperature protection level − 8 − °C Notes 1. Guaranteed by design. 2. This is also the minimum SMPS switching frequency in synchronized mode. 3. This is also the maximum oscillator frequency in synchronized mode. 2003 Aug 11 14 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 A resistor and a series diode can be placed in parallel with resistor RDEM to control the amount of current flowing into, and out of the IC, allowing the values of the OVP level and primary current simulation to be defined independently. More details are available in Application note AN10205. 11 APPLICATION INFORMATION A typical flyback converter that uses the TEA1541 consists of an input filter, a transformer with a third (auxiliary) winding, and an output stage with a feedback circuit. Capacitor CVCC connected to pin VCC buffers the IC supply voltage from the rectified high voltage (AC) mains during start-up, or from the auxiliary winding during operation. Resistor Rsense converts the primary current into a voltage at pin Isense. The resistor value defines the maximum primary peak current. Resistor RSS and capacitor CSS enable soft start and burst standby mode operation. handbook, full pagewidth DOUT Vmains CVIN RSNUB CSNUB COUT CVCC VCC GND CSYNC Sync CTRL DEM RSYNC 1 2 3 4 8 TEA1541P OUTPUT DSNUB VIN 7 HV 6 5 DRIVER Isense RSS power MOSFET CREG CSS Rsense RDEM RREG DVCC OPTO RREG1 RREG2 MDB081 Fig.8 Flyback configuration with synchronization and soft start. 2003 Aug 11 15 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 12 PACKAGE OUTLINE DIP8: plastic dual in-line package; 8 leads (300 mil) SOT97-1 ME seating plane D A2 A A1 L c Z w M b1 e (e 1) b MH b2 5 8 pin 1 index E 1 4 0 5 10 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT A max. A1 min. A2 max. b b1 b2 c D (1) E (1) e e1 L ME MH w Z (1) max. mm 4.2 0.51 3.2 1.73 1.14 0.53 0.38 1.07 0.89 0.36 0.23 9.8 9.2 6.48 6.20 2.54 7.62 3.60 3.05 8.25 7.80 10.0 8.3 0.254 1.15 inches 0.17 0.02 0.13 0.068 0.045 0.021 0.015 0.042 0.035 0.014 0.009 0.39 0.36 0.26 0.24 0.1 0.3 0.14 0.12 0.32 0.31 0.39 0.33 0.01 0.045 Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. REFERENCES OUTLINE VERSION IEC JEDEC JEITA SOT97-1 050G01 MO-001 SC-504-8 2003 Aug 11 16 EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-13 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. 13 SOLDERING 13.1 Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). 13.3 Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. 13.2 Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 °C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 °C, contact may be up to 5 seconds. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 °C or 265 °C, depending on solder material applied, SnPb or Pb-free respectively. The total contact time of successive solder waves must not exceed 5 seconds. 13.4 Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING WAVE DBS, DIP, HDIP, SDIP, SIL suitable suitable(1) PMFP(2) − not suitable Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. 2003 Aug 11 17 Philips Semiconductors Product specification SMPS control IC with synchronization function TEA1541 14 DATA SHEET STATUS LEVEL DATA SHEET STATUS(1) PRODUCT STATUS(2)(3) Development DEFINITION I Objective data II Preliminary data Qualification This data sheet contains data from the preliminary specification. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specification without notice, in order to improve the design and supply the best possible product. III Product data This data sheet contains data from the product specification. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Production This data sheet contains data from the objective specification for product development. Philips Semiconductors reserves the right to change the specification in any manner without notice. Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. 15 DEFINITIONS 16 DISCLAIMERS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status ‘Production’), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 2003 Aug 11 18 Philips Semiconductors – a worldwide company Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales offices addresses send e-mail to: [email protected]. SCA75 © Koninklijke Philips Electronics N.V. 2003 All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights. Printed in The Netherlands 403502/01/pp19 Date of release: 2003 Aug 11 Document order number: 9397 750 10696