Product / Package Information Environmental Information Package Body Size Lead Count Terminal Finish MS Number RoHS Compliant High Temperature Compliant Halogen Free Compliant REACH SVHC Compliant SOT 89 3 100Sn MS010593B Yes Yes Yes Yes Materials Declaration Molding Compound Description Other inorganic materials Thermosets Thermosets Thermosets Other inorganic materials Subtotal Substance Silica Epoxy Resin Phenol Resin Epoxy Cresol Novolac Carbon Black CAS# Weight (g) 60676-86-0 Proprietary Proprietary 29690-82-2 1333-86-3 2.83 E-02 1.61 E-03 1.61 E-03 6.45 E-04 9.68 E-05 3.23 E-02 CAS# Weight (g) 7440-50-8 7439-89-6 7723-14-0 1.92 E-02 1.92 E-05 5.77 E-06 1.92 E-02 Homogeneous Material Level Percentage (%) PPM 87.7 877000 5.0 50000 5.0 50000 2.0 20000 0.3 3000 100 1000000 Component Level Percentage (%) PPM 48.87 2.79 2.79 1.11 0.17 55.73 488716 27863 27863 11145 1672 557259 Homogeneous Material Level Percentage (%) PPM 99.87 998700 0.10 1000 0.03 300 100.00 1000000 Component Level Percentage (%) PPM 33.16 0.03 0.01 33.21 331645 332 100 332077 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 0.66 6629 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 6.42 64219 Homogeneous Material Level Percentage (%) PPM 99.99 1000000 Component Level Percentage (%) PPM 0.76 7582 Homogeneous Material Level Percentage (%) PPM 100.0 1000000 Component Level Percentage (%) PPM 1.43 14294 Homogeneous Material Level Percentage (%) PPM 80 800000 15 150000 5 50000 100 1000000 Component Level Percentage (%) PPM 1.44 0.27 0.09 1.79 14352 2691 897 17940 Leadframe Substance Description Copper & its alloys Copper & its alloys Copper & its alloys Subtotal Copper Iron Phosphorus Internal Leadframe Plating Description Precious metals Substance Silver CAS# Weight (g) 7440-22-4 3.84 E-04 External Leadframe Plating Description Tin & its alloys Substance Tin CAS# Weight (g) 7440-31-5 3.72 E-03 Bond Wires Description Precious metals Substance Gold CAS# Weight (g) 7440-57-5 4.39 E-04 Chip Description Other inorganic materials Substance Gallium Arsenide CAS# Weight (g) 1303-00-0 8.28 E-04 Die Attach Description Precious metals Thermosets Others Subtotal Package Totals Substance Silver Epoxy Resin Curing agent & hardener CAS# Weight (g) 7440-22-4 Proprietary Proprietary 8.31 E-04 1.56 E-04 5.19 E-05 1.04 E-03 Weight (g) 5.79 E-02 Note: The information provided in this declaration are true to the best of ADI's knowledge. ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to any inaccuracy of such information. ADI Proprietary Percentage (%) 100.00 PPM 1000000