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Product / Package Information
Environmental Information
Package
Body Size
Lead Count
Terminal Finish
MS Number
RoHS Compliant
High Temperature Compliant
Halogen Free Compliant
REACH SVHC Compliant
SOT 89
3
100Sn
MS010593B
Yes
Yes
Yes
Yes
Materials Declaration
Molding Compound
Description
Other inorganic materials
Thermosets
Thermosets
Thermosets
Other inorganic materials
Subtotal
Substance
Silica
Epoxy Resin
Phenol Resin
Epoxy Cresol Novolac
Carbon Black
CAS#
Weight (g)
60676-86-0
Proprietary
Proprietary
29690-82-2
1333-86-3
2.83 E-02
1.61 E-03
1.61 E-03
6.45 E-04
9.68 E-05
3.23 E-02
CAS#
Weight (g)
7440-50-8
7439-89-6
7723-14-0
1.92 E-02
1.92 E-05
5.77 E-06
1.92 E-02
Homogeneous Material Level
Percentage (%)
PPM
87.7
877000
5.0
50000
5.0
50000
2.0
20000
0.3
3000
100
1000000
Component Level
Percentage (%)
PPM
48.87
2.79
2.79
1.11
0.17
55.73
488716
27863
27863
11145
1672
557259
Homogeneous Material Level
Percentage (%)
PPM
99.87
998700
0.10
1000
0.03
300
100.00
1000000
Component Level
Percentage (%)
PPM
33.16
0.03
0.01
33.21
331645
332
100
332077
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
0.66
6629
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
6.42
64219
Homogeneous Material Level
Percentage (%)
PPM
99.99
1000000
Component Level
Percentage (%)
PPM
0.76
7582
Homogeneous Material Level
Percentage (%)
PPM
100.0
1000000
Component Level
Percentage (%)
PPM
1.43
14294
Homogeneous Material Level
Percentage (%)
PPM
80
800000
15
150000
5
50000
100
1000000
Component Level
Percentage (%)
PPM
1.44
0.27
0.09
1.79
14352
2691
897
17940
Leadframe
Substance
Description
Copper & its alloys
Copper & its alloys
Copper & its alloys
Subtotal
Copper
Iron
Phosphorus
Internal Leadframe Plating
Description
Precious metals
Substance
Silver
CAS#
Weight (g)
7440-22-4
3.84 E-04
External Leadframe Plating
Description
Tin & its alloys
Substance
Tin
CAS#
Weight (g)
7440-31-5
3.72 E-03
Bond Wires
Description
Precious metals
Substance
Gold
CAS#
Weight (g)
7440-57-5
4.39 E-04
Chip
Description
Other inorganic materials
Substance
Gallium Arsenide
CAS#
Weight (g)
1303-00-0
8.28 E-04
Die Attach
Description
Precious metals
Thermosets
Others
Subtotal
Package Totals
Substance
Silver
Epoxy Resin
Curing agent & hardener
CAS#
Weight (g)
7440-22-4
Proprietary
Proprietary
8.31 E-04
1.56 E-04
5.19 E-05
1.04 E-03
Weight (g)
5.79 E-02
Note: The information provided in this declaration are true to the best of ADI's knowledge.
ADI derived most of the information listed in this declaration from documents provided by third parties, and assumes no liability to
any inaccuracy of such information.
ADI Proprietary
Percentage (%)
100.00
PPM
1000000