NCV4263 2C D

NCV4263-2C
200 mA LDO Regulator with
Enable, Reset & Watchdog
The NCV4263−2C is a 200 mA LDO regulator with integrated reset
watchdog functions dedicated for microprocessor applications. Its
robustness allows NCV4263−2C to be used in severe automotive
environments. The Enable function can be used for decrease of
quiescent current down to max 10 mA. The NCV4263−2C contains
protection functions as current limit, thermal shutdown and reverse
output current protection. The regulator provides also Watchdog,
Reset function with adjustable Threshold and adjustable Power−on
Reset Delay Time.
•
•
•
•
MARKING
DIAGRAMS
8
8
Features
•
•
•
•
•
•
www.onsemi.com
Output Voltage Option: 5 V
Output Voltage Accuracy: ±2%
Output Current up to 200 mA
Very Low Dropout Voltage
Enable Function (10 mA Max Quiescent Current when Disabled)
Microprocessor Compatible Control Functions:
− Reset with Adjustable Threshold and Adjustable Power−on Delay
− Watchdog Function
Wide Input Voltage Operation Range: up to 40 V
Protection Features:
− Current Limitation
− Thermal Shutdown
− Reverse Output Current
AEC−Q100 Grade 1 Qualified and PPAP Capable
These are Pb−Free Devices
1
V632C5
ALYWX
SOIC−8 EP
PD SUFFIX
CASE 751AC
1
14
14
1
SOIC−14
D SUFFIX
CASE 751A
NCV4263−2C50G
AWLYWWG
1
A
L, WL
Y
W, WW
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information on page 12 of
this data sheet.
Typical Applications
•
•
•
•
Body Control Module
Instruments and Clusters
Occupant Protection and Comfort
Powertrain
Vin
Vout
Vin
Cin
100 nF NCV4263−2C
VDD
Cout
22 mF
RADJ
OFF
ON
EN
GND
RO
WDI
D
Microprocessor
RRO*
5.6 kW
RESET
I/O
CD
100 nF
*−optional if Reset function is needed
Figure 1. Application Schematic
© Semiconductor Components Industries, LLC, 2015
March, 2015 − Rev. 1
1
Publication Order Number:
NCV4263−2C/D
NCV4263−2C
Vin
Vout
VOLTAGE
VREF
REFERENCE
RO
SP
ENABLE
EN
WDI
SATURATION
VREF
SP
PROTECTION
RESET
GENERATOR
and
WATCHDOG
TSD
THERMAL
D
TSD
SHUTDOWN
RADJ
GND
Figure 2. Simplified Block Diagram
1
1
8
Vout
Vin
EN
WDI
RO
RADJ
GND
D
SOIC−8 EP
14
RO
EN
NC
Vin
GND
GND
GND
GND
GND
GND
D
Vout
RADJ
WDI
SOIC−14
Figure 3. Pin Connections
(Top View)
PIN FUNCTION DESCRIPTION
Pin No.
SO−8 EP
Pin No.
SO−14
Pin Name
1
13
Vin
Positive Power Supply. Connect ceramic capacitor to ground.
2
14
EN
Enable Input. Low level disables the chip. Connect to Vin if this function is not needed.
3
1
RO
Reset Output; Open Collector connected to the Vout via an internal 30 kW pull−up resistor;
leave open if the function is not needed
4
3, 4, 5,
10, 11, 12
GND
5
6
D
6
7
RADJ
7
8
WDI
Watchdog Input. Rising edge triggered Input for watchdog pulses. Connect to GND if this
function is not needed.
8
9
Vout
Regulated Output Voltage. Connect a Cout ≥ 22 mF capacitor to ground.
EPAD
−
Exposed
Pad
−
2
NC
Description
Power Supply Ground. Connect pins to heat sink area with GND potential.
DelayTiming. Connect to GND via ceramic capacitor for adjusting reset delay timing and
watchdog trigger time or leave open if this function is not needed.
Reset Adjust Threshold. Connect to GND (VRT = 93% of Vout) or to output voltage divider to
adjust the reset threshold.
Connect to ground potential or leave unconnected.
Not connected. No internally bonded.
www.onsemi.com
2
NCV4263−2C
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
Input Voltage (Note 1)
Rating
Vin
−42
45
V
Enable Input
VEN
−42
45
V
Output Voltage
Vout
−1
7
V
Reset Output Voltage
VRO
−0.3
7
V
Watchdog Input Voltage
VWDI
−0.3
7
V
Reset Adjust Threshold
VRADJ
−0.3
7
V
Delay Timing Output Voltage
VD
−0.3
7
V
Maximum Junction Temperature
TJ
−40
150
°C
TSTG
−55
150
°C
Storage Temperature
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality
should not be assumed, damage may occur and reliability may be affected.
1. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
ESD CAPABILITY (Note 2)
Rating
Symbol
Min
Max
Unit
ESD Capability, Human Body Model
ESDHBM
−
2
kV
ESD Capability, Charged Device Model
ESDCDM
−
1
kV
Min
Max
Unit
2. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (JS−001−2010)
ESD Charged Device Model tested per AEC−Q100−011 (EIA/JESD22−C101)
LEAD SOLDERING TEMPERATURE AND MSL (Note 3)
Rating
Symbol
Moisture Sensitivity Level
SOIC−14
SOIC−8 EP
MSL
−
1
2
°C
Lead Temperature Soldering
Reflow (SMD Styles Only), Pb−Free Versions
TSLD
−
265 peak
3. For more information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Thermal Characteristics, SOIC−8 Exposed Pad (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Pad (Note 5)
RθJA
YψJPad
65.1
8.7
Thermal Characteristics, SOIC−14 (Note 4)
Thermal Resistance, Junction−to−Air (Note 5)
Thermal Reference, Junction−to−Pin4 (Note 5)
RθJA
YψJP4
94.8
18.3
Unit
°C/W
°C/W
4. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
5. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
OPERATING RANGES (Note 6)
Rating
Symbol
Min
Max
Unit
Input Voltage
Vin
5.5
40
V
Junction Temperature
TJ
−40
150
°C
6. Refer to ELECTRICAL CHARACTERISTICS and APPLICATION INFORMATION for Safe Operating Area.
www.onsemi.com
3
NCV4263−2C
ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VEN = 5 V, Cin = 100 nF, Cout = 22 mF, ESR = 1.5 W, WDI = 5 V pulses,
fWDI = 1 kHz. Min and Max values are valid for temperature range *40°C v TJ v 150°C unless otherwise noted and are guaranteed by
test design or statistical correlation. Typical values are referenced to TJ = 25°C. (Notes 7 and 8)
Test Conditions
Parameter
Symbol
Min
Typ
Max
Unit
Vout
4.90
5.0
5.10
V
REGULATOR OUTPUT
Output Voltage Accuracy
Vin = 6 V to 40 V, Iout = 5 to 150 mA
Line Regulation
Iout = 150 mA, Vin = 6 V to 28 V
Regline
−25
3
25
mV
Load Regulation
Iout = 5 mA to 150 mA
Regload
−25
−
25
mV
Dropout Voltage (Note 9)
Iout = 150 mA
VDO
−
300
500
mV
IDIS
−
0.066
10
mA
−
−
−
0.275
3
11.3
1.3
18
23
ILIM
200
418
500
mA
PSRR
−
80
−
dB
−
0.8
2.0
1.74
3.5
−
DISABLE AND QUIESCENT CURRENTS
Disable Current
VEN = 0 V,TJ < 125°C
Quiescent Current, Iq = Iin − Iout
Iq
Iout = 0 mA
Iout = 150 mA
Iout = 150 mA, Vin = 4.5 V
mA
CURRENT LIMIT PROTECTION
Current Limit
Vout = 0.96 x Vout_nom
PSRR
Power Supply Ripple Rejection
(Note 10)
f = 100 Hz, 0.5 Vp−p
ENABLE
Vth(EN)
V
Enable Input Threshold Voltage
Logic High
Logic Low
Vout w 0.9 x Vout_nom
Vout v 0.1 V
Enable Input Current
VEN = 5 V
IEN
5
10
25
mA
Watchdog Input Low Time
CD = 100 nF, Vout > VRT, no WDI signal
tWL
1
2
3.5
ms
Watchdog Trigger Time
CD = 100 nF, Vout > VRT, no WDI signal
tWTT
16
20.8
27
ms
WATCHDOG INPUT
DELAY TIMING
Charge Current
VD = 1 V, no WDI signal
ID_charge
40
66.8
95
mA
Discharge Current
VD = 1 V, no WDI signal
ID_disch
4.40
6.54
9.40
mA
Saturation Voltage
Vout < VRT, no WDI signal
VD_sat
−
6
100
mV
VthH(D)
VthL(D)
1.45
0.2
1.70
0.34
2.05
0.55
VRT
90
93
96
% Vout
Vth(RADJ)
1.26
1.36
1.44
V
VRT_range
70
−
93
% Vout
Switching Threshold
Upper
Lower
V
RESET OUTPUT
Output Voltage Reset Threshold
(Note 11)
Vout decreasing, VRADJ = 0 V
Reset Adjust Threshold
(70% of Vout_nom) v Vout < (VRT)
Reset Adjustment Range (Note 12)
Reset Output Low Voltage
IRO = 1 mA
VROL
−
0.01
0.4
V
Reset Delay Time
CD = 100 nF
tRD
1.3
2.6
4.1
ms
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.5 V.
10. Values based on design and/or characterization.
11. See APPLICATION INFORMATION section for Reset Threshold Adjustment
12. VRT_range limits are guaranteed by VRT and Vth(RADJ) parameters.
www.onsemi.com
4
NCV4263−2C
ELECTRICAL CHARACTERISTICS Vin = 13.5 V, VEN = 5 V, Cin = 100 nF, Cout = 22 mF, ESR = 1.5 W, WDI = 5 V pulses,
fWDI = 1 kHz. Min and Max values are valid for temperature range *40°C v TJ v 150°C unless otherwise noted and are guaranteed by
test design or statistical correlation. Typical values are referenced to TJ = 25°C. (Notes 7 and 8)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
CD = 100 nF
tRR
0.5
1.2
4
ms
Iout = 1 mA
TSD
150
177
195
°C
RESET OUTPUT
Reset Reaction Time
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 10)
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
7. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
8. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
9. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.5 V.
10. Values based on design and/or characterization.
11. See APPLICATION INFORMATION section for Reset Threshold Adjustment
12. VRT_range limits are guaranteed by VRT and Vth(RADJ) parameters.
www.onsemi.com
5
NCV4263−2C
TYPICAL CHARACTERISTICS
16
Vin = 13.5 V
Iout = 0 mA
0.30
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
0.32
0.28
0.26
0.24
0.22
0.20
−40 −20
20
40
60
80
10
8
6
4
2
100 120 140 160
0
5
10
15
20
25
30
35
40
TJ, TEMPERATURE (°C)
Vin, INPUT VOLTAGE (V)
Figure 4. Quiescent Current vs. Temperature
Figure 5. Quiescent Current vs. Input Voltage
5.10
9
8
Vin = 13.5 V
Iout = 5 mA
5.08
Vin = 13.5 V
TJ = 25°C
Vout, OUTPUT VOLTAGE (V)
Iq, QUIESCENT CURRENT (mA)
12
0
0
10
7
6
5
4
3
2
5.06
5.04
5.02
5.00
4.98
4.96
4.94
4.92
1
0
0
50
100
150
200
4.90
−40 −20
250
0
20
40
60
80
100 120 140 160
Iout, OUTPUT CURRENT (mA)
TJ, TEMPERATURE (°C)
Figure 6. Quiescent Current vs. Output
Current
Figure 7. Output Voltage Accuracy
6
600
VDO, DROPOUT VOLTAGE (mV)
Vout, OUTPUT VOLTAGE (V)
TJ = 25°C
Rout = 25 W
14
TJ = 25°C
Rout = 25 W
5
4
3
2
1
0
TJ = 150°C
500
TJ = 125°C
400
300
TJ = 25°C
200
TJ = −40°C
100
0
0
1
2
3
4
5
6
0
50
100
150
200
250
Vin, INPUT VOLTAGE (V)
Iout, OUTPUT CURRENT (mA)
Figure 8. Output Voltage vs. Input Voltage
Figure 9. Dropout Voltage vs. Output Current
www.onsemi.com
6
NCV4263−2C
TYPICAL CHARACTERISTICS
500
400
300
200
100
0
−40 −20
ILIM, OUTPUT CURRENT LIMIT (mA)
ILIM, OUTPUT CURRENT LIMIT (mA)
Iout = 150 mA
0
20
40
60
80
Vout = 0.96 x Vout_nom
550
TJ = 25°C
500
TJ = 125°C
450
TJ = −40°C
TJ = 150°C
400
350
300
0
5
10
15
20
25
30
35
TJ, TEMPERATURE (°C)
Vin, INPUT VOLTAGE (V)
Figure 10. Dropout Voltage vs. Temperature
Figure 11. Output Current Limit vs. Input
Voltage
550
500
450
400
350
300
Vin = 13.5 V
Vout = 0.96 x Vout_nom
250
200
150
−40 −20
0
20
40
60
80
40
100
Unstable Region
10
1
Stable Region
Vin = 13.5 V
Cout = 22 mF
TJ = 25°C
0.1
0.01
0
100 120 140 160
50
100
150
200
TJ, TEMPERATURE (°C)
Iout, OUTPUT CURRENT (mA)
Figure 12. Output Current Limit vs.
Temperature
Figure 13. Output Capacitor ESR Stability
Region vs. Output Current
250
50
IEN, ENABLE INPUT CURRENT (mA)
120
Vin = 13.5 V DC + 0.5 Vpp AC
Cout = 22 mF, TA = 25°C
110
100
PSRR (dB)
600
100 120 140 160
ESR, OUTPUT CAPACITOR ESR (W)
VDO, DROPOUT VOLTAGE (mV)
600
90
80
70
Iout = 1 mA
60
50
40
Iout = 100 mA
30
10
100
1000
10,000
100,000
45
40
35
VEN = 13.5 V
30
Vin = 13.5 V
Iout = 0 mA
25
20
15
10
VEN = 5 V
5
VEN = 3.3 V
0
−40 −20
0
20
40
60
80
100 120 140 160
FREQUENCY (Hz)
TJ, TEMPERATURE (°C)
Figure 14. PSRR vs. Frequency
Figure 15. Enable Input Current vs.
Temperature
www.onsemi.com
7
NCV4263−2C
Vth(RADJ), RESET ADJUST THRESHOLD (V)
1.44
1.42
1.40
1.38
1.36
1.34
1.32
Vin = 13.5 V
Vout = 0.7 x Vout_nom
1.30
1.28
1.26
−40 −20
0
20
40
60
80
100 120 140 160
1.44
1.42
1.40
1.38
1.36
1.34
1.32
Vin = 13.5 V
TJ = 25°C
1.30
1.28
1.26
2.0
2.5
3.0
3.5
4.0
4.5
5.0
TJ, TEMPERATURE (°C)
Vout, OUTPUT VOLTAGE (V)
Figure 16. Reset Adjust Threshold vs.
Temperature
Figure 17. Reset Adjust Threshold vs. Output
Voltage
ID(charge), (disch), RESET DELAY
CHARGE / DISCHARGE CURRENT (mA)
1.8
Upper Threshold
1.6
1.4
1.2
1.0
Vin = 13.5 V
0.8
0.6
Lower Threshold
0.4
0.2
0
−40 −20
0
20
40
60
80
80
Charge Current
70
60
50
Vin = 13.5 V
VD = 1 V
40
30
20
Discharge Current
10
100 120 140 160
0
−40 −20
0
20
40
60
80
100 120 140 160
TJ, TEMPERATURE (°C)
TJ, TEMPERATURE (°C)
Figure 18. Delay Timing Switching Thresholds
vs. Temperature
Figure 19. Reset Delay Charge / Discharge
Current vs. Temperature
tWTT, WATCHDOG TRIGGER TIME (ms)
Vth(D), RESET DELAY THRESHOLDS (V)
Vth(RADJ), RESET ADJUST THRESHOLD (V)
TYPICAL CHARACTERISTICS
27
Vin = 13.5 V
Vout > VRT
CD = 100 nF
no WDI signal
26
25
24
23
22
21
20
19
18
17
16
−40 −20
0
20
40
60
80
100 120 140 160
TJ, TEMPERATURE (°C)
Figure 20. Watchdog Trigger Time vs.
Temperature
www.onsemi.com
8
NCV4263−2C
Vin
t
Vout
V RT
1V
t < t RR
VD
t
VthH(D)
VthL(D)
t
V RO
1V
V ROL
t RD
t RD
t RR
Input
Voltage Dip
Thermal
Shutdown
Under
Voltage
t
Output
Voltage Spike
Overload
Figure 21. Reset Operation Timing Diagram
VWDI
t
VD
VthH( D)
VthL( D)
t
V RO
VROL
tWTT
t WL
t
tWP
Figure 22. Watchdog Operation Timing Diagram
www.onsemi.com
9
NCV4263−2C
DEFINITIONS
General
Current Limit and Short Circuit Current Limit
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. It means that
the device is capable to supply minimum 200 mA without
sending Reset signal to microprocessor.
Short Circuit Current Limit is output current value
measured with output of the regulator shorted to ground.
Output Voltage
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
PSRR
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Regulation
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Line Transient Response
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Regulation
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Load Transient Response
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Dropout Voltage
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Thermal Protection
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 177°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Quiescent and Disable Currents
Quiescent Current (Iq) is the difference between the input
current (measured through the LDO input pin) and the
output load current. If Enable pin is set to LOW the regulator
reduces its internal bias and shuts off the output, this term is
called the disable current (IDIS).
Maximum Package Power Dissipation
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
www.onsemi.com
10
NCV4263−2C
APPLICATIONS INFORMATION
range of Output Voltage 70% ≤ Vout < VRT by external
resistor output voltage divider, see schematic on Figure 23
and specification of Reset Output.
The NCV4263−2C regulator is self−protected with
internal thermal shutdown and internal current limit. Typical
characteristics are shown in Figures 4 to 22.
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV4263−2C
package. Higher capacitance and lower ESR will improve
the overall line and load transient response. If extremely fast
input voltage transients are expected then appropriate input
filter is recommended to use in order to decrease rising
and/or falling edges below 50 V/ms for proper operation.
The filter can be composed of several capacitors in parallel.
Vout
Vin
Cin
VDD
Cout
RRADJ1
22 mF
100 nF
NCV4263−2C
RRADJ2
RADJ
OFF ON
EN
RRO
5.6 kW
Microprocessor
RESET
RO
WDI
I/O
D
CD
GND
100 nF
Output Decoupling (Cout)
Figure 23. Application Schematic with Adjustable
Reset Threshold
The NCV4263−2C is a stable component and requires a
minimum Equivalent Series Resistance (ESR) for the output
capacitor. Stability region of ESR versus Output Current is
shown in Figure 13. The minimum output decoupling value
is 22 mF and can be augmented to fulfill stringent load
transient requirements. Larger values improve noise
rejection and load transient response.
Desired Reset Threshold is given by Equation 2.
V RT_des +
The Enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet.
Delay Timing
The Delay Timing pin is current source. Current from
Delay Timing pin charges connected capacitor. The value of
this capacitor determines the Reset Delay Time by
Equation 1 and Watchdog Trigger Time by Equation 4.
where:
CD
tRD_des
tRD
ǒ
t RD_des
t RD
Ǔ
100 nF
Ǔ
R RADJ1 ) R RADJ2
R RADJ2
V th(RADJ) (eq. 2)
where:
VRT_des
is desired Reset Threshold
RRADJ1, RRADJ2 are resistance of resistor divider
Vth(RADJ)
is Reset Adjust Threshold specified in
datasheet
Use RRADJ2 ≤ 50 kW to avoid significant Reset Threshold
error due to RADJ bias current.
Enable Operation
CD +
ǒ
Watchdog Operation
Watchdog Input monitors a signal from microprocessor.
This input is positive edge sensitive. The timing diagram of
watchdog function is shown in Figure 22. When watchdog
signal is not received during Watchdog Trigger Time, Reset
Output goes low for a Watchdog Input Low Time and is
periodically generated with period given by Equation 3.
Capacitance of Delay capacitor for setting the desired
Watchdog Trigger Time is given by Equation 4.
(eq. 1)
is capacitance of Delay capacitor
is desired Reset Delay Time
is Reset Delay Time specified in
datasheet
t WP + t WL ) t WTT
Reset Operation
CD +
A reset signal is provided on the Reset Output pin to
provide feedback to the microprocessor of an out of
regulation condition. The timing diagram of reset function
is shown in Figure 21. This is in the form of a logic signal on
Reset Output. Output voltage conditions below the Reset
Threshold causes Reset Output to go low. The Reset Output
integrity is maintained down to Vout = 1.0 V. The Reset
Output circuitry is open collector output with internal 30 kW
pull−up resistor. Leave open this output if the Reset function
is not needed else an external pull−up resistor (5.6 kW)
connect to the output (Vout).
Reset Threshold is default set to 93% of nominal Output
Voltage (VRADJ = 0 V). Reset Threshold can be varied in
where:
CD
tWTT_des
tWTT
tWL
tWP
ǒ
t WTT_des
t WTT
Ǔ
100 nF
(eq. 3)
(eq. 4)
is capacitance of Delay capacitor
is desired Watchdog Trigger Time
is Watchdog Trigger Time specified in
datasheet
is Watchdog Input Low Time
is Watchdog Input Period
Thermal Considerations
As power in the NCV4263−2C increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
www.onsemi.com
11
NCV4263−2C
160
P D(MAX) +
ƪTJ(MAX) * TAƫ
RqJA, THERMAL RESISTANCE (°C/W)
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV4263−2C has good thermal conductivity through
the PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV4263−2C can handle is given by:
150
140
130
110
100
(eq. 5)
R qJA
Since TJ is not recommended to exceed 150°C, then the
NCV4263−2C soldered on 645 mm2, 1 oz copper area, FR4
can dissipate up to 1.3 W in SOIC−14 package and 1.9 W in
SOIC−8 EP package, when the ambient temperature (TA) is
25°C. See Figures 24 and 25 for RqJA versus PCB area. The
power dissipated by the NCV4263−2C can be calculated
from the following equations:
90
SOIC−14 − 2 OZ Cu
80
70
60
50
0
100
200
300
400
500
COPPER HEAT SPREADER AREA
600
700
(mm2)
Figure 24. Thermal Resistance vs. PCB Copper Area
for SOIC−14
160
(eq. 6)
RqJA, THERMAL RESISTANCE (°C/W)
P D [ V inǒI q@I outǓ ) I outǒV in * V outǓ
SOIC−14 − 1 OZ Cu
120
150
or
V in(MAX) [
P D(MAX) ) ǒV out
I outǓ
I out ) I q
140
130
(eq. 7)
120
110
SOIC−8 EP − 1 OZ Cu
100
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV4263−2C
and make traces as short as possible.
90
80
70
SOIC−8 EP − 2 OZ Cu
60
50
0
100
200
300
400
500
600
700
COPPER HEAT SPREADER AREA (mm2)
Figure 25. Thermal Resistance vs. PCB Copper Area
for SOIC−8 EP
ORDERING INFORMATION
Output Voltage
Marking
Package
Shipping†
NCV4263−2CD250R2G
5.0 V
NCV4263−2C50G
SOIC−14
(Pb−Free)
2500 / Tape & Reel
NCV4263−2CPD50R2G
5.0 V
V632C5
SOIC−8 EP
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
www.onsemi.com
12
NCV4263−2C
PACKAGE DIMENSIONS
SOIC−8 EP
CASE 751AC
ISSUE B
2X
NOTES:
1. DIMENSIONS AND TOLERANCING PER
ASME Y14.5M, 1994.
2. DIMENSIONS IN MILLIMETERS (ANGLES
IN DEGREES).
3. DIMENSION b DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE
0.08 MM TOTAL IN EXCESS OF THE “b”
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
4. DATUMS A AND B TO BE DETERMINED
AT DATUM PLANE H.
0.10 C A-B
D
8
E1
2X
0.10 C D
1
F
EXPOSED
PAD
5
ÉÉÉ
ÉÉÉ
PIN ONE
LOCATION
DETAIL A
D
A
5
8
G
E
h
2X
4
4
0.20 C
e
BOTTOM VIEW
b
0.25 C A-B D
8X
B
1
A
END VIEW
TOP VIEW
A
0.10 C
A2
0.10 C
b1
GAUGE
PLANE
L
SEATING
PLANE
C
SIDE VIEW
ÉÉ
ÉÉ
ÇÇ
ÉÉ
ÇÇ
ÉÉ
c
H
8X
A
A1
0.25
(L1)
DETAIL A
q
c1
(b)
SECTION A−A
SOLDERING FOOTPRINT*
2.72
0.107
1.52
0.060
7.0
0.275
Exposed
Pad
4.0
0.155
2.03
0.08
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
13
DIM
A
A1
A2
b
b1
c
c1
D
E
E1
e
L
L1
F
G
h
q
MILLIMETERS
MIN
MAX
1.35
1.75
0.00
0.10
1.35
1.65
0.31
0.51
0.28
0.48
0.17
0.25
0.17
0.23
4.90 BSC
6.00 BSC
3.90 BSC
1.27 BSC
0.40
1.27
1.04 REF
2.24
3.20
1.55
2.51
0.25
0.50
0_
8_
NCV4263−2C
PACKAGE DIMENSIONS
D
SOIC−14 NB
CASE 751A−03
ISSUE K
A
B
14
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE PROTRUSION
SHALL BE 0.13 TOTAL IN EXCESS OF AT
MAXIMUM MATERIAL CONDITION.
4. DIMENSIONS D AND E DO NOT INCLUDE
MOLD PROTRUSIONS.
5. MAXIMUM MOLD PROTRUSION 0.15 PER
SIDE.
8
A3
E
H
L
1
0.25
M
DETAIL A
7
B
13X
M
b
0.25
M
C A
S
B
S
X 45 _
M
A1
e
DETAIL A
h
A
C
SEATING
PLANE
DIM
A
A1
A3
b
D
E
e
H
h
L
M
MILLIMETERS
MIN
MAX
1.35
1.75
0.10
0.25
0.19
0.25
0.35
0.49
8.55
8.75
3.80
4.00
1.27 BSC
5.80
6.20
0.25
0.50
0.40
1.25
0_
7_
INCHES
MIN
MAX
0.054 0.068
0.004 0.010
0.008 0.010
0.014 0.019
0.337 0.344
0.150 0.157
0.050 BSC
0.228 0.244
0.010 0.019
0.016 0.049
0_
7_
SOLDERING FOOTPRINT*
6.50
14X
1.18
1
1.27
PITCH
14X
0.58
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and the
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries.
SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed
at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation
or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets
and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each
customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended,
or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which
the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or
unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and
expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable
copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
Literature Distribution Center for ON Semiconductor
P.O. Box 5163, Denver, Colorado 80217 USA
Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada
Email: [email protected]
N. American Technical Support: 800−282−9855 Toll Free
USA/Canada
Europe, Middle East and Africa Technical Support:
Phone: 421 33 790 2910
Japan Customer Focus Center
Phone: 81−3−5817−1050
www.onsemi.com
14
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
NCV4263−2C/D