NCV8667 D

NCV8667
150 mA LDO Regulator with
Enable, Reset and Early
Warning
The NCV8667 is 150 mA LDO regulator with integrated enable,
reset and early warning functions dedicated for microprocessor
applications. Its robustness allows NCV8667 to be used in severe
automotive environments. The NCV8667 utilizes precise 1 MW
internal resistor divider for Early Warning function which
significantly reduces overall application quiescent current and number
of external components. Very low quiescent current as low as 28 mA
(Adjustable Early Warning Thresholds) or 42 mA (Preset Early
Warning Thresholds) typical for NCV8667 makes it suitable for
applications permanently connected to battery requiring very low
quiescent current with or without load. The Enable function can be
used for further decrease of quiescent current down to 1 mA. The
NCV8667 contains protection functions as current limit, thermal
shutdown and reverse output current protection.
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MARKING
DIAGRAMS
8
8
1
1
•
•
•
•
•
•
•
Output Voltage Options: 5 V
Output Voltage Accuracy: $2%
Output Current up to 150 mA
Very Low Quiescent Current:
− typ 28 mA for Adjustable Early Warning Threshold Option
− typ 42 mA for Preset Early Warning Threshold Option
Very Low Dropout Voltage
Early Warning Threshold Accuracy: ±10% Over Temperature Range
(using RSI_ext external resistor with ±1%, 100 ppm/°C)
Enable Function (1 mA Max Quiescent Current when Disabled)
Microprocessor Compatible Control Functions:
− Reset with Adjustable Power−on Delay
− Early Warning
Wide Input Voltage Operation Range: up to 40 V
Protection Features:
− Current Limitation
− Thermal Shutdown
− Reverse Output Current
These are Pb−Free Devices
667YZX
ALYWX
G
14
14
1
Features
•
•
•
•
SO−8
D SUFFIX
CASE 751
SO−14
D SUFFIX
CASE 751A
V8667YZXXG
AWLYWWG
1
Y
Z
XX, X
= Timing and Reset Threshold Option*
= Early Warning Option*
= Voltage Option
5.0 V (XX = 50, X = 5)
A
= Assembly Location
WL, L = Wafer Lot
Y
= Year
WW, W = Work Week
G or G = Pb−Free Package
*See Application Information Section.
(Note: Microdot may be in either location)
ORDERING INFORMATION
See detailed ordering and shipping information in the
dimensions section on page 18 of this data sheet.
Typical Applications
•
•
•
•
Body Control Module
Instruments and Clusters
Occupant Protection and Comfort
Powertrain
© Semiconductor Components Industries, LLC, 2011
May, 2011 − Rev. 2
1
Publication Order Number:
NCV8667/D
NCV8667
VBAT
Cin
0.1 mF
Vout
Vin
SI
RSI_ext NCV8667yz**
VDD
Cout
2.2 mF
Microprocessor
DT
OFF
EN
ON
GND
SO
I/O
RO
RESET
*RST_ext is optional
** z is 1, 2, 3, …, n
Figure 1. Application Circuit (Preset Early Warning Thresholds)
VBAT
Cin
0.1 mF
RSI2
RSI1
Vout
Vin
SI
NCV8667y0
VDD
Cout
2.2 mF
Microprocessor
DT
OFF
ON
EN
GND
SO
I/O
RO
RESET
Figure 2. Application Circuit (Adjustable Early Warning Thresholds)
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2
NCV8667
Vin
Vout
**
**
Driver with
Current
Limit
RO
RSI1
RSI2
EN
Thermal
Shutdown
Vref
Enable
TIMING
CIRCUIT
and
RESET
OUTPUT
DRIVER
and
SENSE
OUTPUT
DRIVER
SO
SI
DT
V ref
*
GND
*Pull−down Resistor (~150 kW) active only in Reset State.
** 5 V option only.
Figure 3. Simplified Block Diagram of NCV8667yz (z is 1, 2, 3, … , n)
(Preset Early Warning Threshold options)
Vin
Vout
**
**
Driver with
Current
Limit
RO
Thermal
Shutdown
EN
Vref
Enable
TIMING
CIRCUIT
and
RESET
OUTPUT
DRIVER
and
SENSE
OUTPUT
DRIVER
SO
SI
DT
V ref
*
GND
*Pull−down Resistor (~150 kW) active only in Reset State.
** 5 V option only.
Figure 4. Simplified Block Diagram of NCV8667y0
(Adjustable Early Warning Threshold options)
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3
NCV8667
EN
1
8
1
14
SI
Vin
DT
Vout
GND
GND
SI
SO
GND
GND
EN
RO
GND
GND
GND
Vout
Vin
DT
GND
SO
RO
SO−8
SO−14
Figure 5. Pin Connections
(Top View)
PIN FUNCTION DESCRIPTION
Pin No.
SO−8
Pin No.
SO−14
Pin Name
3
1
EN
Enable Input; low level disables the IC.
4
2
DT
Reset Delay Time Select. Short to GND or connect to Vout to select time.
5
3, 4, 5, 6,
10, 11, 12
GND
6
7
RO
Reset Output. 30 kW internal Pull−Up resistor connected to Vout. RO goes Low when Vout
drops by more than 7% (typ.) from its nominal value
7
8
SO
Early Warning Output. 30 kW internal Pull−Up resistor connected to Vout. It can be used to
provide early warning of an impending reset condition. Leave open if not used.
8
9
Vout
Regulated Output Voltage. Connect 2.2 mF capacitor with ESR < 100 W to ground.
1
13
Vin
Positive Power Supply Input. Connect 0.1 mF capacitor to ground.
2
14
SI
Adjustable Early Warning Threshold: Sense Input; If not used, connect to Vout.
Preset Early Warning Threshold: Early Warning Adjust Input; connect RSI_ext against GND
to adjust Input Voltage Early Warning Threshold or leave unconnected. See Electrical
Characteristics Table and Application Information sections for more information.
Description
Power Supply Ground.
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4
NCV8667
ABSOLUTE MAXIMUM RATINGS
Symbol
Min
Max
Unit
Input Voltage DC (Note 1)
Rating
Vin
−0.3
40
V
Input Voltage Transient (Note 1)
Vin
−
45
V
Input Current
Iin
−5
−
mA
Output Voltage (Note 2)
Vout
−0.3
5.5
V
Output Current
Iout
−3
Current
Limited
mA
Enable Input Voltage DC
VEN
−0.3
40
V
Enable Input Voltage Transient
VEN
−
45
V
Enable Input Current Range
IEN
−1
1
mA
DT (Reset Delay Time Select) Voltage
VDT
−0.3
5.5
V
DT (Reset Delay Time Select) Current
IDT
−1
1
mA
Reset Output Voltage
VRO
−0.3
5.5
V
Reset Output Current
IRO
−3
3
mA
Sense Input Voltage DC
VSI
−0.3
40
V
Sense Input Voltage Transient
VSI
−
45
V
Sense Input Current
ISI
−1
1
mA
Sense Output Voltage
VSO
−0.3
5.5
V
Sense Output Current
ISO
−3
3
mA
TJ(max)
−40
150
°C
TSTG
−55
150
°C
ESD Capability, Human Body Model (Note 3)
ESDHBM
−2
2
kV
ESD Capability, Machine Model (Note 3)
ESDMM
−200
200
V
TSLD
−
265 peak
°C
Maximum Junction Temperature
Storage Temperature
Lead Temperature Soldering
Reflow (SMD Styles Only) (Note 4)
Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the
Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect
device reliability.
1. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
2. 5.5 or (Vin + 0.3 V), whichever is lower
3. This device series incorporates ESD protection and is tested by the following methods:
ESD Human Body Model tested per AEC−Q100−002 (EIA/JESD22−A114)
ESD Machine Model tested per AEC−Q100−003 (EIA/JESD22−A115)
4. For information, please refer to our Soldering and Mounting Techniques Reference Manual, SOLDERRM/D
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5
NCV8667
THERMAL CHARACTERISTICS
Rating
Symbol
Value
Thermal Characteristics, SO−8 (Note 5)
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Pin4 (Note 6)
RθJA
YψJP4
132
49
Thermal Characteristics, SO−14 (Note 5)
Thermal Resistance, Junction−to−Air (Note 6)
Thermal Reference, Junction−to−Pin4 (Note 6)
RθJA
YψJP4
94
18
Unit
°C/W
°C/W
5. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
6. Values based on copper area of 645 mm2 (or 1 in2) of 1 oz copper thickness and FR4 PCB substrate.
OPERATING RANGES (Note 7)
Rating
Symbol
Min
Max
Unit
Input Voltage (Note 8)
Vin
5.5
40
V
Junction Temperature
TJ
−40
150
°C
7. Refer to ELECTRICAL CHARACTERISTIS and APPLICATION INFORMATION for Safe Operating Area.
8. Minimum Vin = 5.5 V or (Vout + VDO), whichever is higher.
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VEN = 3 V, VDT = GND, VSI = Vout (NCV8667y0 only), RSI1, RSI2, RSI_ext not used,
Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40 °C to 150°C; unless otherwise noted. (Notes 9
and 10)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
4.9
4.9
(−2 %)
5.0
5.0
5.1
5.1
(+2%)
V
4.9
(−2 %)
5.0
5.1
(+2%)
REGULATOR OUTPUT
Output Voltage (Accuracy %)
Vin = 5.6 V to 40 V, Iout = 0.1 mA to 100 mA
Vin = 5.8 V to 16 V, Iout = 0.1 mA to 150 mA
Vout
Output Voltage (Accuracy %)
TJ = −40°C to 125°C
Vin = 5.8 V to 28 V, Iout = 0 mA to 150 mA
Vout
Line Regulation
Vin = 6 V to 28 V, Iout = 5 mA
Regline
−20
0
20
mV
Load Regulation
Iout = 0.1 mA to 150 mA
Regload
−40
10
40
mV
−
−
225
300
450
600
Cout
ESR
2.2
0.01
−
−
100
100
μF
W
IDIS
−
−
1
μA
Dropout Voltage (Note 11)
VDO
5.0 V Iout = 100 mA
Iout = 150 mA
Output Capacitor for Stability
(Note 12)
Iout = 0 mA to 150 mA
V
mV
DISABLE AND QUIESCENT CURRENTS
Disable Current
VEN = 0 V,TJ < 85°C
Quiescent Current, Iq = Iin − Iout
(Note 13)
Adjustable EW Threshold Option: Iout = 0.1 mA, TJ = 25°C
Iout = 0.1 mA to 150 mA, TJ ≤ 125°C
Preset EW Threshold Options: Iout = 0.1 mA, TJ = 25°C
Iout = 0.1 mA to 150 mA, TJ ≤ 125°C
Iq
μA
−
−
−
−
28
−
42
35
37
49
50
CURRENT LIMIT PROTECTION
Current Limit
Vout = 0.96 x Vout_nom
ILIM
205
−
525
mA
Short Circuit Current Limit
Vout = 0 V
ISC
205
−
525
mA
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
13. Iq for Preset EW Threshold Options is measured when RSI_ext is not used. For typical values of Iq vs RSI_ext see Figure 27.
14. See APPLICATION INFORMATION section for Reset Threshold and Reset Delay Time Options
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NCV8667
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VEN = 3 V, VDT = GND, VSI = Vout (NCV8667y0 only), RSI1, RSI2, RSI_ext not used,
Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40 °C to 150°C; unless otherwise noted. (Notes 9
and 10)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
VEN = 0 V, Iout = −1 mA
Vout_rev
−
2
5.5
V
f = 100 Hz, 0.5 Vpp
PSRR
−
60
−
dB
−
2.5
−
−
0.8
−
−
−
3
0.5
5
1
−
2
−
−
0.8
−
−
−
1
90
93
96
VRH
−
2.0
−
%Vout
IROmax
1.75
−
−
mA
REVERSE OUTPUT CURRENT PROTECTION
Reverse Output Current Protection
PSRR
Power Supply Ripple Rejection
(Note 12)
ENABLE
Vth(EN)
Enable Input Threshold Voltage
Logic Low
Logic High
Enable Input Current
Logic High VEN = 5 V
Logic Low VEN = 0 V, TJ < 85 °C
IEN_ON
IEN_OFF
V
μA
DT (Reset Delay Time Select)
DT Threshold Voltage
Vth(DT)
Logic Low
Logic High
DT Input Current
VDT = 5 V
IDT
Vout decreasing
Vin > 5.5 V
VRT
V
μA
RESET OUTPUT RO
Output Voltage Reset Threshold
(Note 14)
Reset Hysteresis
Maximum Reset Sink Current
Vout = 4.5 V, VRO = 0.25 V
Reset Output Low Voltage
Vout > 1 V, IRO < 200 mA
%Vout
VROL
−
0.15
0.25
V
Reset Output High Voltage
VROH
4.5
−
−
V
Integrated Reset Pull Up Resistor
RRO
15
30
50
kW
6.4
102.4
(−20 %)
8
128
9.6
153.6
(+20 %)
16
25
38
Reset Delay Time (Note 14)
Min time available, DT connected to GND
Max time available, DT connected to Vout
Reset Reaction Time (see Figure
29)
tRD
tRR
ms
μs
EARLY WARNING (SI and SO)
VSI(th)
Sense Input Threshold
(NCV8667y0)
(Adjustable EW Threshold Option)
High
Low
Early Warning Input Voltage
Threshold (Preset EW Threshold
Values) NCV8667y2
High
Low
Sense Input Current (NCV8667y0)
(Adjustable EW Threshold Option)
V
1.25
1.20
RSI1 = 480 kW, RSI2 = 520 kW
(internal resistor divider values, see Figure 3)
RSI_ext = 150 kW (±1%, ±100 ppm/°C)
(external resistor value, see Figure 26)
1.40
1.33
Vin_EW(th)
ISI
VSI = 5 V
1.33
1.25
V
5.67
5.30
6.30
5.89
6.92
6.47
−1
0.1
1
μA
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
13. Iq for Preset EW Threshold Options is measured when RSI_ext is not used. For typical values of Iq vs RSI_ext see Figure 27.
14. See APPLICATION INFORMATION section for Reset Threshold and Reset Delay Time Options
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NCV8667
ELECTRICAL CHARACTERISTICS Vin = 13.2 V, VEN = 3 V, VDT = GND, VSI = Vout (NCV8667y0 only), RSI1, RSI2, RSI_ext not used,
Cin = 0.1 mF, Cout = 2.2 mF, for typical values TJ = 25°C, for min/max values TJ = −40 °C to 150°C; unless otherwise noted. (Notes 9
and 10)
Parameter
Test Conditions
Symbol
Min
Typ
Max
Unit
RSO
15
30
50
kW
VSOL
−
0.15
0.25
V
VSOH
4.5
−
−
V
1.75
−
−
EARLY WARNING (SI and SO)
Integrated Sense Output Pull Up
Resistor
Sense Output Low Voltage
VSI < 1.2 V, ISO < 200 mA, Vout > 1 V
Sense Output High Voltage
Maximum Sense Output Sink
Current
SI High to SO High Reaction Time
(Adjustable EW Threshold Option
NCV8667y0)
SI Low to SO Low Reaction Time
(Adjustable EW Threshold Option
NCV8667y0)
Vout = 4.5 V, VSI < 1.2 V, VSO = 0.25 V
ISOmax
tPSOLH
VSI increasing
μs
−
7
12
tPSOHL
VSI decreasing
mA
μs
−
3.8
5.0
THERMAL SHUTDOWN
Thermal Shutdown Temperature
(Note 11)
TSD
150
175
195
°C
Thermal Shutdown Hysteresis
(Note 11)
TSH
−
25
−
°C
9. Refer to ABSOLUTE MAXIMUM RATINGS and APPLICATION INFORMATION for Safe Operating Area.
10. Performance guaranteed over the indicated operating temperature range by design and/or characterization tested at TA [TJ. Low duty
cycle pulse techniques are used during testing to maintain the junction temperature as close to ambient as possible.
11. Measured when output voltage falls 100 mV below the regulated voltage at Vin = 13.2 V.
12. Values based on design and/or characterization.
13. Iq for Preset EW Threshold Options is measured when RSI_ext is not used. For typical values of Iq vs RSI_ext see Figure 27.
14. See APPLICATION INFORMATION section for Reset Threshold and Reset Delay Time Options
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NCV8667
TYPICAL CHARACTERISTICS
300
31
Iq, QUIESCENT CURRENT (mA)
Iq, QUIESCENT CURRENT (mA)
32
30
29
28
27
26
25
Vin = 13.2 V
Iout = 100 mA
24
23
22
−40 −20
0
20
40
60
80
100
50
5
10
15
20
25
30
35
Figure 6. Quiescent Current vs. Temperature
(NCV8667y0)
Figure 7. Quiescent Current vs. Input Voltage
(NCV8667y0)
5.10
32
31
30
Vout, OUTPUT VOLTAGE (V)
TJ = 150°C
TJ = −40°C
29
28
TJ = 25°C
27
26
25
24
23
Vin = 13.2 V
25
50
75
100
125
5.05
5.00
4.95
0
20
40
60
80
100 120 140 160
Iout, OUTPUT CURRENT (mA)
TJ, JUNCTION TEMPERATURE (°C)
Figure 8. Quiescent Current vs. Output Current
(NCV8667y0)
Figure 9. Output Voltage vs. Temperature
6
500
Iout = 1.0 mA
5
4
3
TJ = 25°C
2
1
TJ = −40°C
TJ = 150°C
0
1
2
3
4
5
6
7
40
Vin = 13.2 V
Iout = 100 mA
4.90
−40 −20
150
VDO, DROPOUT VOLTAGE (mV)
Iq, QUIESCENT CURRENT (mA)
150
Vin, INPUT VOLTAGE (V)
22
0
Vout, OUTPUT VOLTAGE (V)
200
TJ, JUNCTION TEMPERATURE (°C)
33
0
250
0
0
100 120 140 160
Iout = 0 mA
TJ = 25°C
400
TJ = 25°C
200
100
0
0
8
TJ = 150°C
300
TJ = −40°C
25
50
75
100
125
Vin, INPUT VOLTAGE (V)
Iout, OUTPUT CURRENT (mA)
Figure 10. Output Voltage vs. Input Voltage
Figure 11. Dropout vs. Output Current
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150
NCV8667
TYPICAL CHARACTERISTICS
400
400
ILIM, ISC, CURRENT LIMIT (mA)
VDO, DROPOUT VOLTAGE (mV)
500
Iout = 150 mA
300
Iout = 100 mA
200
100
0
−40 −20
0
20
40
60
80
ILIM @ Vout = 4.8 V
200
100
0
5
10
15
20
25
30
35
TJ, JUNCTION TEMPERATURE (°C)
Vin, INPUT VOLTAGE (V)
Figure 12. Dropout vs. Temperature
Figure 13. Output Current Limit vs. Input
Voltage
400
100
Vin = 13.2 V
ESR, STABILITY REGION (W)
ILIM, ISC, CURRENT LIMIT (mA)
300
0
100 120 140 160
TJ = 25°C
ISC @ Vout = 0 V
350
ISC @ Vout = 0 V
300
ILIM @ Vout = 4.8 V
250
200
−40 −20
0
20
40
60
80
Vin = 13.2 V
TJ = −40°C to 150°C
Cout = 2.2 mF − 100 mF
10
STABLE REGION
1
0.1
0.01
100 120 140 160
40
0
50
100
150
200
250
300
350
TJ, JUNCTION TEMPERATURE (°C)
Iout, OUTPUT CURRENT (mA)
Figure 14. Output Current Limit vs. Temperature
Figure 15. Cout ESR Stability vs. Output Current
14.2 V
Vin
(1 V/div)
TJ = 25°C
I Iout = 1 mA
Cout = 10 mF
trise/fall = 1 ms (Vin)
13 V
Iout
(100 mA/div)
TJ = 25°C
Vin = 13.2 V
Cout = 10 mF
trise/fall = 1 ms (Iout)
150 mA
12.2 V
0.1 mA
5.16 V
5.09 V
5V
Vout
(50 mV/div)
5V
Vout
(200 mV/div)
4.97 V
4.77 V
TIME (100 ms/div)
TIME (20 ms/div)
Figure 16. Line Transients
Figure 17. Load Transients
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NCV8667
TYPICAL CHARACTERISTICS
100
TJ = 25°C
RSI_ext = 150 kW
Rout = 5 kW
Vin
(5 V/div)
TJ = 25°C
Vin = 13.2 V $0.5 VPP
Cout = 2.2 mF
Iout = 1 mA
90
80
PSRR (dB)
70
Vout
(5 V/div)
60
50
40
VRO
(5 V/div)
30
VSO
(5 V/div)
10
20
0
TIME (100 ms/div)
10
100
1
IDIS, DISABLE CURRENT (mA)
IDIS, DISABLE CURRENT (mA)
Vin = 13.2 V
VEN = 0 V
1.6
1.4
1.2
1
0.8
0.6
0.4
0.2
0
−40 −20
TJ = 150°C
0.6
0.4
0.2
Figure 20. Disable Current vs. Temperature
TJ = 125°C
TJ = 85°C
5
VRT, RESET THRESHOLD (V)
4.80
40
TJ = 150°C
TJ = 25°C
20
TJ = −40°C
10
Vin = 13.2 V
0
5
10
15
20
25
30
35
10
15
20
25
30
VIN, INPUT VOLTAGE (V)
35
40
Figure 21. Disable Current vs. Input Voltage
50
IEN, ENABLE CURRENT (mA)
VEN = 0 V
0.8
0
0
0
20 40 60 80 100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
30
100000
Figure 19. PSRR vs. Frequency
2
1.8
10000
f, FREQUENCY (Hz)
Figure 18. Power Up and Down Transient
0
1000
40
Vin = 13.2 V
4.75
4.70
4.65
4.60
−40 −20
VEN, ENABLE VOLTAGE (V)
0
20 40 60 80 100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
Figure 23. Reset Threshold vs. Temperature
Figure 22. Enable Current vs. Enable Voltage
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NCV8667
TYPICAL CHARACTERISTICS
1.36
120
SENSE INPUT VOLTAGE (V)
VDT = Vout
Vin = 13.2 V
100
80
60
40
20
VDT = GND
0
−40 −20
0
20
40
60
80
100 120 140 160
INPUT VOLTAGE EW THRESHOLD
LOW (V)
1.32
1.3
1.28
1.26
VSI_(th),L (VSI Decreasing)
1.24
1.22
−40 −20
0
20
40
60
80
100 120 140 160
TJ, JUNCTION TEMPERATURE (°C)
TJ, JUNCTION TEMPERATURE (°C)
Figure 24. Reset Time vs. Temperature
(NCV86671z)
Figure 25. SI Threshold vs. Temperature
(NCV8667y0)
12
TJ = 25°C
11
10
9
8
7
Vin_EW(th),L (Vin decreasing)
6
5
4
50
VSI_(th),H (VSI Increasing)
1.34
Iq&RSI_ext, QUIESCENT CURRENT (mA)
tRD, RESET DELAY TIME (ms)
140
75
100
125 150
175 200
RSI_ext, (kW) (E24 Series)
225
250
55
Vin = 13.2 V
TJ = 25°C
54
53
52
51
50
49
48
47
46
45
50
75
125
175
100
150
200
RSI_ext, (kW) (E24 Series)
225
250
Figure 27. Quiescent Current vs. RSI_ext
(Including IRSI_ext, Calculated Using E24 Series)
Figure 26. Input Voltage EW Threshold Low vs.
RSI_ext (Calculated Using E24 Series)
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NCV8667
Vin
t
Vout
<tRR
VRT+VRH
VRT
VRO
t
tRR
tRD
VROH
VROL
t
Figure 28. Reset Function and Timing Diagram
Vin
Vin_EW(th)_L
t
V out
V RT
t
V RO
t
VSO
tWarning
Figure 29. Input Voltage Early Warning Function Diagram
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13
t
NCV8667
DEFINITIONS
General
All measurements are performed using short pulse low
duty cycle techniques to maintain junction temperature as
close as possible to ambient temperature.
the device is capable to supply minimum 200 mA without
sending Reset signal to microprocessor.
Short Circuit Current Limit is output current value
measured with output of the regulator shorted to ground.
Output Voltage
PSRR
The output voltage parameter is defined for specific
temperature, input voltage and output current values or
specified over Line, Load and Temperature ranges.
Power Supply Rejection Ratio is defined as ratio of output
voltage and input voltage ripple. It is measured in decibels
(dB).
Line Regulation
Line Transient Response
The change in output voltage for a change in input voltage
measured for specific output current over operating ambient
temperature range.
Typical output voltage overshoot and undershoot
response when the input voltage is excited with a given
slope.
Load Regulation
Load Transient Response
The change in output voltage for a change in output
current measured for specific input voltage over operating
ambient temperature range.
Typical output voltage overshoot and undershoot
response when the output current is excited with a given
slope between low−load and high−load conditions.
Dropout Voltage
Thermal Protection
The input to output differential at which the regulator
output no longer maintains regulation against further
reductions in input voltage. It is measured when the output
drops 100 mV below its nominal value. The junction
temperature, load current, and minimum input supply
requirements affect the dropout level.
Internal thermal shutdown circuitry is provided to protect
the integrated circuit in the event that the maximum junction
temperature is exceeded. When activated at typically 175°C,
the regulator turns off. This feature is provided to prevent
failures from accidental overheating.
Quiescent Current
The power dissipation level is maximum allowed power
dissipation for particular package or power dissipation at
which the junction temperature reaches its maximum
operating value, whichever is lower.
Maximum Package Power Dissipation
Quiescent Current (Iq) is the difference between the input
current (measured through the LDO input pin) and the
output load current.
Current Limit and Short Circuit Current Limit
Current Limit is value of output current by which output
voltage drops below 96% of its nominal value. It means that
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14
NCV8667
APPLICATIONS INFORMATION
The NCV8667 regulator is self−protected with internal
thermal shutdown and internal current limit. Typical
characteristics are shown in Figures 6 to 29.
RESET DELAY AND RESET THRESHOLD OPTIONS
Input Decoupling (Cin)
A ceramic or tantalum 0.1 mF capacitor is recommended
and should be connected close to the NCV8667 package.
Higher capacitance and lower ESR will improve the overall
line and load transient response.
If extremely fast input voltage transients are expected then
appropriate input filter must be used in order to decrease
rising and/or falling edges below 50 V/ms for proper
operation. The filter can be composed of several capacitors
in parallel.
Part Number
DT = GND
Reset Time
DT = Vout
Reset Time
Reset
Threshold
NCV86671z
8 ms
128 ms
93%
NCV86675z
16 ms
32 ms
93%
NOTE:
The timing values can be selected from following list: 8,
16, 32, 64, 128 ms. The reset threshold values can be
selected from the following list: 90% and 93%. Contact
factory for other timing combinations not included in the
table.
Sense Input (SI) / Sense Output (SO) Voltage Monitor
An on−chip comparator is available to provide early
warning to the microprocessor of a possible reset signal
(Figure 29). The Sense Output is from an open drain driver
with an internal 30 kW pull up resistor to output Vout. The
reset signal typically turns the microprocessor off
instantaneously. This can cause unpredictable results with
the microprocessor. The signal received from the SO pin will
allow the microprocessor time (tWarning) to complete its
present task before shutting down. This function is
performed by a comparator referenced to the band gap
voltage. The actual trip point of input voltage is programmed
by internal resistor divider and external resistor RSI_ext. If
RSI_ext is not used following Preset Early Warning
Threshold would apply:
Output Decoupling (Cout)
The NCV8667 is a stable component and does not require
a minimum Equivalent Series Resistance (ESR) for the
output capacitor. Stability region of ESR vs. Output Current
is shown in Figure 15. The minimum output decoupling
value is 2.2 mF and can be augmented to fulfill stringent load
transient requirements. The regulator works with ceramic
chip capacitors as well as tantalum devices. Larger values
improve noise rejection and load transient response.
Enable Operation
The Enable pin will turn the regulator on or off. The
threshold limits are covered in the electrical characteristics
table in this data sheet.
EARLY WARNING PRESET OPTIONS
Reset Delay Time Select
Selection of the NCV8667yz devices and the state of the
DT pin determines the available Reset Delay times. The part
is designed for use with DT tied to ground or OUT, but may
be controlled by any logic signal which provides a threshold
between 0.8 V and 2 V. The default condition for an open DT
pin is the slower Reset time (DT = GND condition). Times
are in pairs and are highlighted in the chart below. Consult
factory for availability. The Delay Time select (DT) pin is
logic level controlled and provides Reset Delay time per the
chart. Note the DT pin is sampled only when RO is low, and
changes to the DT pin when RO is high will not effect the
reset delay time.
Part Number
RSI1
(internal)
RSI2
(internal)
Input Voltage
Early Warning
Threshold Low
(Typ)
(RSI_ext not
used)
NCV8667y2
480 kW
520 kW
2.37 V
Practically only preset options above 4.5 V can be used
without RSI_ext due to minimum operating input voltage
value limitation. For other preset options the trip point has
to be adjusted externally using RSI_ext resistor connected
between input monitor SI and GND (see Figure 1). For other
preset options RSI_ext has to be used to achieve Vin_EW(th) >
5.5 V (minimum operating input voltage value) . The value
for RSI_ext is recommended to be selected in range from
50 kW to 250 kW and the trip point can be shifted according
to Figure 26. In case of RSI_ext values higher than 200 kW
two resistors in series could be used in order to eliminate
leakage current of the resistor and hence ensure precision of
its resistance value. The higher is RSI_ext the lower is overall
Quiescent Current of the application (see Figure 27).
General formulas for calculation of Vin_EW(th)Low or RSI_ext
Reset Operation
A reset signal is provided on the Reset Output (RO) pin to
provide feedback to the microprocessor of an out of
regulation condition. The timing diagram of reset function
is shown in Figure 28. This is in the form of a logic signal on
RO. Output voltage conditions below the RESET threshold
cause RO to go low. The RO integrity is maintained down
to Vout = 1.0 V. The Reset Output (RO) circuitry includes
internal pull−up connected to the output (Vout) No external
pull−up is necessary.
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15
NCV8667
ǒ
for selected preset Early Warning options are described by
Equations 1 and 2.
ȡ
ȧ
Ȣ
V in_EW(th)_Low + 1.1 1 )
ȡ
ȧR
Ȣ
ǒRSI2 ) RSI_extǓȣ
R SI1
R SI2
R SI1
R SI_ext + 1.1
SI2
R SI1 + R SI2
ǒVin_EW(th)_Low
ȧ) 0.25
Ȥ (eq. 1)
R
ȣ
ȧ
* 0.25Ǔ * 1.1 10 Ȥ
SI2
6
Where:
RSI1,RSI2 − internal EW divider resistors (see Figure 3)
(select values from Early Warning Preset Options table)
RSI−ext − external resistor connected between SI and GND
(recommended to be selected from 50 kW to 250 W)
If Adjustable Early Warning Threshold option
(NCV8667y0) is used EW threshold is adjusted by external
resistor divider. (See Figure 2) The values for RSI1 and RSI2
are selected for a typical threshold of 1.2 V on the SI pin
according to Equations 3 and 4, where Vin_EW(th) is
demanded value of input voltage at which Early Warning
signal has to be generated. RSI2 is recommended to be
selected in range of 100 kW to 1 MW. The higher are values
of resistors RSI1 and RSI2 the lower is current flowing
through the resistor divider, however this also increases a
delay between Input voltage and SI input voltage caused by
charging SI input capacitance with higher RC constant. The
delay can be lowered by decreasing the resistors values with
consequence of resistor divider current is increased.
ǒ
Ǔ
R SI2
(eq. 4)
V out
V SI
V SI,Low
V RO
V SO
T WARNING
(eq. 3)
Figure 30. SO Warning Timing Diagram
Sense
Input
V SI,High
V SI,Low
Sense
Output
Ǔ
*1
The Sense Output is from an open drain driver with an
internal 30 kW pull up resistor to Vout. Figure 26 shows the
SO Monitor timing waveforms as a result of the circuit
depicted in Figure 1. If the input voltage decreases the output
voltage decreases as well. If the SI input low threshold
voltage is crossed it causes the voltage on the SO output goes
low sending a warning signal to the microprocessor that a
reset signal may occur in a short period of time. TWARNING
is the time the microprocessor has to complete the function
it is currently working on and get ready for the reset
shutdown signal.
(eq. 2)
V in_EW(th) + 1.25 1 )
1.2
Sense Output
R SI_ext
R SI1
V in_EW(th)
t
t PSOLH
t PSOHL
High
Low
t
Figure 31. Sense Input to Sense Output Timing Diagram
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16
NCV8667
Thermal Considerations
170
P D(MAX) +
ƪTJ(MAX) * TAƫ
RqJA, THERMAL RESISTANCE (°C/W)
As power in the NCV8667 increases, it might become
necessary to provide some thermal relief. The maximum
power dissipation supported by the device is dependent
upon board design and layout. Mounting pad configuration
on the PCB, the board material, and the ambient temperature
affect the rate of junction temperature rise for the part. When
the NCV8667 has good thermal conductivity through the
PCB, the junction temperature will be relatively low with
high power applications. The maximum dissipation the
NCV8667 can handle is given by:
160
150
(eq. 5)
I out ) I q
I outǓ
100
SO−14 1 oz
90
SO−14 2 oz
80
70
0
100
200
300
400
500
600
COPPER HEAT SPREADER AREA (mm2)
700
Figure 32. Thermal Resistance vs. PCB Copper Area
Hints
Vin and GND printed circuit board traces should be as
wide as possible. When the impedance of these traces is
high, there is a chance to pick up noise or cause the regulator
to malfunction. Place external components, especially the
output capacitor, as close as possible to the NCV8667 and
make traces as short as possible.
(eq. 6)
or
P D(MAX) ) ǒV out
SO−8 2 oz
110
Since TJ is not recommended to exceed 150°C, then the
NCV8667 soldered on 645 mm2, 1 oz copper area, FR4 can
dissipate up to 1.33 W when the ambient temperature (TA)
is 25°C. See Figure 29 for RthJA versus PCB area. The power
dissipated by the NCV8667 can be calculated from the
following equations:
V in(MAX) [
SO−8 1 oz
130
120
R qJA
P D [ V inǒI q@I outǓ ) I outǒV in * V outǓ
140
(eq. 7)
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17
NCV8667
ORDERING INFORMATION
Output
Voltage
Reset Delay Time
DT = GND/Vout
Reset
Threshold
(Typ)
Input Voltage Early
Warning Threshold
Low (Typ)
RSI_ext = 150 kW
Marking
Package
Shipping†
NCV866710D150R2G
5.0 V
8/128 ms
93 %
N/A
667105
SO−8
(Pb−Free)
2500 / Tape & Reel
NCV866710D250R2G
5.0 V
8/128 ms
93 %
N/A
V86671050G
SO−14
(Pb−Free)
2500 / Tape & Reel
NCV866752D250R2G
5.0 V
16/32 ms
93 %
5.89 V
V86675250G
SO−14
(Pb−Free)
2500 / Tape & Reel
Device
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging
Specifications Brochure, BRD8011/D.
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18
NCV8667
PACKAGE DIMENSIONS
SOIC−8 NB
CASE 751−07
ISSUE AK
−X−
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
6. 751−01 THRU 751−06 ARE OBSOLETE. NEW
STANDARD IS 751−07.
A
8
5
S
B
0.25 (0.010)
M
Y
M
1
4
−Y−
K
G
C
N
DIM
A
B
C
D
G
H
J
K
M
N
S
X 45 _
SEATING
PLANE
−Z−
0.10 (0.004)
H
D
0.25 (0.010)
M
Z Y
S
X
M
J
S
SOLDERING FOOTPRINT*
1.52
0.060
7.0
0.275
4.0
0.155
0.6
0.024
1.270
0.050
SCALE 6:1
mm Ǔ
ǒinches
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
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19
MILLIMETERS
MIN
MAX
4.80
5.00
3.80
4.00
1.35
1.75
0.33
0.51
1.27 BSC
0.10
0.25
0.19
0.25
0.40
1.27
0_
8_
0.25
0.50
5.80
6.20
INCHES
MIN
MAX
0.189
0.197
0.150
0.157
0.053
0.069
0.013
0.020
0.050 BSC
0.004
0.010
0.007
0.010
0.016
0.050
0 _
8 _
0.010
0.020
0.228
0.244
NCV8667
PACKAGE DIMENSIONS
SOIC−14
CASE 751A−03
ISSUE J
−A−
14
8
−B−
P 7 PL
0.25 (0.010)
M
B
M
7
1
G
−T−
0.25 (0.010)
M
T B
S
A
DIM
A
B
C
D
F
G
J
K
M
P
R
J
M
K
D 14 PL
F
R X 45 _
C
SEATING
PLANE
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE
DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.127
(0.005) TOTAL IN EXCESS OF THE D
DIMENSION AT MAXIMUM MATERIAL
CONDITION.
S
MILLIMETERS
MIN
MAX
8.55
8.75
3.80
4.00
1.35
1.75
0.35
0.49
0.40
1.25
1.27 BSC
0.19
0.25
0.10
0.25
0_
7_
5.80
6.20
0.25
0.50
INCHES
MIN
MAX
0.337 0.344
0.150 0.157
0.054 0.068
0.014 0.019
0.016 0.049
0.050 BSC
0.008 0.009
0.004 0.009
0_
7_
0.228 0.244
0.010 0.019
SOLDERING FOOTPRINT
7X
7.04
14X
1.52
1
14X
0.58
1.27
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications
intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should
Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates,
and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death
associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal
Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner.
PUBLICATION ORDERING INFORMATION
LITERATURE FULFILLMENT:
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Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada
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ON Semiconductor Website: www.onsemi.com
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For additional information, please contact your local
Sales Representative
NCV8667/D