dm00257177

AN4803
Application note
High-speed SI simulations using IBIS and board-level simulations
using HyperLynx SI on STM32 32-bit ARM® Cortex® MCUs
Introduction
This application note serves as a guide on how to use the IBIS (I/O Buffer Information
Specification) models of STMicroelectronics STM32 32-bit ARM® Cortex® MCUs and it is
also a guide in how to use the external peripherals to perform board-level simulations with
the HyperLynx® SI (Signal Integrity) software to address SI issues.
In order to use a concrete case, this application uses STM32F7xx Series as an example
due to its complexity. All the information and conclusions can be extrapolated to all the
STM32 32-bit ARM® Cortex® MCUs.
The STM32F7xx Series is based on ARM® Cortex®-M7 with FPU (floating point unit)
processor. It is the latest generation of ARM® processors for embedded systems. It was
developed to provide a low-cost platform that meets the needs of a MCU implementation.
They have a reduced pin count and perform a low-power consumption while delivering an
outstanding computational performance and a low-interrupt latency.
The STM32F7xx has a frequency of up to 216 MHz and a system speed of up to 100 MHz
when interfacing with a high-speed interface such as SDRAM (Synchronous Dynamic
Random-Access Memory).
As the signal speed increases it creates SI and EMC (Electro Magnetic Compliance) issues.
It could be detected via test equipments as a signal degradation: overshooting,
undershooting, ringing, crosstalk or timing delay. The signal degradation could be caused by
a board design failure on certification (CE/FCC) or by timing violation issues between the IC
(Integrated Circuit) drivers and the receiver. The accent should be put on getting the designs
right the first time, avoiding costly over design, and saving recurrent layouts and prototypes.
Therefore, performing a SI simulation is very important before doing any prototype.
April 2016
DocID028793 Rev 1
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www.st.com
1
List of tables
AN4803
List of tables
Table 1.
Table 2.
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I/Os in/output buffer for "io8p_arsudq_ft" selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
DocID028793 Rev 1
AN4803
Contents
Contents
1
SI fundamentals and STM32 signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1
1.2
2
3
Signal integrity fundamentals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.1
Signal integrity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.2
Transmission line . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.3
Transmission line model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
1.1.4
Characteristic impedance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
IBIS model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2.1
IC modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
1.2.2
Basic structure of an IBIS file . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
STM32 IBIS model selection/selector . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.1
GPIO structure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.2
Model selector . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10
2.3
Example of model selector on STM32F7xx MCU . . . . . . . . . . . . . . . . . . 10
Application example with HyperLynx simulator . . . . . . . . . . . . . . . . . 12
3.1
3.2
HyperLynx simulation with SDRAM . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.1
SDRAM signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
3.1.2
SDRAM simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
HyperLynx simulation with Quad-SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2.1
Quad-SPI signals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
3.2.2
Quad-SPI simulation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4
References . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
5
Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
6
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
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3
List of figures
AN4803
List of figures
Figure 1.
Figure 2.
Figure 3.
Figure 4.
Figure 5.
Figure 6.
Figure 7.
Figure 8.
Figure 9.
Figure 10.
Figure 11.
Figure 12.
Figure 13.
Figure 14.
Figure 15.
Figure 16.
Figure 17.
Figure 18.
Figure 19.
Figure 20.
Figure 21.
4/25
Transmission line at high frequency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Transmission line with IC modeling . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
IBIS editor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8
IBIS data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
SDRAM schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Discovery PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Discovery PCB . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Signal selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Assign IBIS model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Free-form schematic . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Waveform with IO speed of 0x00 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Waveform with IO speed of 0x10 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Waveform with IO speed of 0x11 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Quad-SPI schematic NOR memory interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Quad-SPI schematic STM32 interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Signal selection. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Free-form schematic QSPI_CLK . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Waveform with R44=0 Ohm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Waveform with R44=33 Ohm . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Terminator wizard menu . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
Waveform with R44=40.6 Ohm. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
DocID028793 Rev 1
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SI fundamentals and STM32 signals
1
SI fundamentals and STM32 signals
1.1
Signal integrity fundamentals
When the board traces carry signals containing high frequencies, special attention should
be given to the design traces that match the impedance of the driver and the receiver
devices.
The longer the trace, or the greater the frequencies involved, then the greater the need to
control the trace impedance. The PCB (printed circuit board) manufacturer controls the
impedance by varying the dimensions and the spacing of a particular trace or laminate. Any
impedance mismatch can be extremely difficult to analyze once a PCB is loaded with any
components.
1.1.1
Signal integrity
“Signal integrity” refers to the process of understanding and controlling behaviors of an ideal
digital signal. It has recently became a critical element for any new digital PCB design as the
clock speeds have increased by more than hundreds of megahertz. At high speeds, we can
find signal and clock distortion, rise and fall time-edge distortion, setup timing violations and
propagation delay times.
1.1.2
Transmission line
A transmission line can be defined as the conductive connection between a driver and a
receiver. At low frequencies a wire or a PCB trace can be considered to be an ideal circuit
(resistive), but at high frequencies, AC (alternated current) circuit characteristics are
dominated with inductances, and capacitances.
1.1.3
Transmission line model
Figure 1. Transmission line at high frequency
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SI fundamentals and STM32 signals
AN4803
The signals on a transmission line will travel at a speed that depends on the surrounding
medium. The propagation delay is the inverse of propagation velocity.
Equation1:
c
v = -------εr
Equation 2:
ε
TD = --------r
c
Where:
•
v: propagation velocity, in meters/second
•
c: speed of light in a vacuum (3 × 108 m/s)
•
εr: dielectric constant
•
TD: time delay for a signal to propagate down a transmission line of length x
The propagation delay can also be determined from the equivalent circuit model of the
transmission line:
Equation 3:
TD =
LC
Where:
•
TD: is the time delay for a signal to propagate down a transmission line of length x
•
L: is the total series inductance for the length of the line
•
C: is the total shunt capacitance for the length of the line.
The propagation delay is about 3.5 ps/mm in air where the dielectric constant is 1.0. In FR4 PCBs, the propagation delay is about 7 to 7.5 ps/mm and the dielectric constant is 3.9 to
4.5.
The PCB traces act as transmission lines when the line delay is equal to or greater than 1/6
the rise (or fall) time.
The critical length equals 1/6 of the transition electrical length, and the transition
electrical length equals to the rise (or fall) times x1/(propagation delay).
Example: For a 2 nanosecond rise time the critical length is 47.6 mm.
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1.1.4
SI fundamentals and STM32 signals
Characteristic impedance
The characteristic impedance (Zo) of the transmission line is defined by:
Equation 4:
Zo =
L
---C
Where:
•
L: is in henries per unit length
•
C: is in farads per unit length.
At very high frequency or with very lossy lines, the resistive loss become significant.
1.2
IBIS model
The IBIS is a behavioral model that describes the electrical characteristics of the digital
inputs and outputs of a device through V/I (voltage versus current) and V/T (voltage versus
time) data without disclosing any proprietary information.
The IBIS models are intended to be used for signal integrity analysis on systems boards.
These models allow system designers to simulate and therefore foresee fundamental signal
integrity concerns in the transmission line that connects different devices.
The potential problems that can be analyzed by means of the simulations include among
others:
1.2.1
•
The degree of energy reflected back to the driver from the wave that reaches the
receiver due to mismatched impedance in the line
•
Crosstalk
•
Ground and power bounce
•
Overshoot or undershoot
•
Line termination analysis
IC modeling
The Figure 2 below shows an example of two ICs modeling:
Figure 2. Transmission line with IC modeling
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SI fundamentals and STM32 signals
1.2.2
AN4803
Basic structure of an IBIS file
•
Header
–
•
•
File name, date, version, source, notes, copyright, etc.
Component model data
–
Default package data (L_pkg, R_pkg, C_pkg)
–
Complete pin list (pin name, signal name, buffer name, and optional L_pin, R_pin,
C_pin)
–
Differential pin pairs, on-die terminators, buffer selector, etc.
IO model data
–
All buffer models for the component must be defined in the file
–
Each flavor of a programmable buffer is separate model
As shown in Figure 3 and Figure 4 below, the HyperLynx visual IBIS editor is used to open
the STM32F746 and the SDRAM (MT48LC4M32B2B5-6A) and to view their characteristics
such as the rising and the falling waveforms.
Figure 3. IBIS editor
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SI fundamentals and STM32 signals
Figure 4. IBIS data
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STM32 IBIS model selection/selector
2
AN4803
STM32 IBIS model selection/selector
This section presents the IBIS model selector of the available GPIO (General-Purpose
Input/Output) pin in STM32 MCUs.
2.1
2.2
GPIO structure
•
The GPIO includes below features:
•
Output driver
•
Input buffer
•
Pull-up and pull-down
•
Electrostatic discharge (ESD) protection
•
Input hysteresis
•
Level shifter
•
Control logic.
Model selector
The GPIO pins can be selected following below parameters and depending on the
application needs:
•
•
Two operating voltage ranges:
–
V33(3.3V): refer to 2.7 V to 3.6 V external voltage range VDDx
–
V18 (1.8V or lv): refer to 1.7 V (see note below) to 2.7 V external voltage range
VDDx
Four or less output buffer speed control depending on the required frequency:
–
00(Low Speed)
–
01(Medium Speed)
–
10(Fast Speed)
–
11(High Speed)
•
Controllable internal pull-up and pull-down resistor (enabled/disabled): PD/PU
•
Specific IO pins are used to cover special functions: USB and I2C. The same IO is also
available as GPIO pin.
Note:
For more details, refer to the specific STM32xxx datasheet on the section I/O port
characteristics and also to STM32xx Reference Manual on the section General Purpose I/O
(GPIO) for software configuration and selection.
2.3
Example of model selector on STM32F7xx MCU
In the example below we keep the same selected IO/Pin as in Section 1.2.2. The pin is H14
port PG8. This pin belongs to the family "io8p_arsudq_ft" of IO buffer.
In Table 1 below, the pin H14 with selected GPIO configurations is highlighted in different
colors as per table footnote legend.
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STM32 IBIS model selection/selector
Table 1. I/Os in/output buffer for "io8p_arsudq_ft" selector
IO Parameters
IO Model Name Selection (io8p_ar3wsudq_ft)
Voltage
Range
io8p00(1)_ar3wsudq_ft_pd(2)_lv (3) "SPEED00 1P8V,
PD=40kOhm"
Buffer
Speed
Pull-Up/
Pull-Down
Pull Down 40K(2)
1.7Vto
2.7V(3)
io8p00_ar3wsudq_ft_pu_lv "SPEED00 1P8V, PU=40kOhm"
Low
Speed(1)
io8p00_ar3wsudq_ft_lv "SPEED00 1P8V"
Pull Up 40K
Disabled
io8p01_ar3wsudq_ft_pd_lv "SPEED01 1P8V, PD=40kOhm"
io8p01_ar3wsudq_ft_pu_lv "SPEED01 1P8V, PU=40kOhm"
Pull Down 40K
1.7V to 2.7V
Medium
Speed
Pull Up 40K
io8p01_ar3wsudq_ft_lv "SPEED01 1P8V"
Disabled
io8p10_ar3wsudq_ft_pd_lv "SPEED10 1P8V, PD=40kOhm"
Pull Down 40K
io8p10_ar3wsudq_ft_pu_lv "SPEED10 1P8V, PU=40kOhm"
1.7V to 2.7V Fast Speed Pull Up 40K
io8p10_ar3wsudq_ft_lv "SPEED10 1P8V"
Disabled
io8p11_ar3wsudq_ft_pd_lv "SPEED11 1P8V, PD=40kOhm"
io8p11_ar3wsudq_ft_pu_lv "SPEED11 1P8V, PU=40kOhm"
Pull Down 40K
1.7V to 2.7V
High
Speed
Pull Up 40K
io8p11_ar3wsudq_ft_lv "SPEED11 1P8V"
Disabled
io8p00_ar3wsudq_ft_pd "SPEED00, PD=40kOhm"
Pull Down 40K
io8p00_ar3wsudq_ft_pu "SPEED00, PU=40kOhm"
2.7V to 3.6V Low Speed Pull Up 40K
io8p00_ar3wsudq_ft "SPEED00"
Disabled
io8p01_ar3wsudq_ft_pd "SPEED01, PD=40kOhm"
io8p01_ar3wsudq_ft_pu "SPEED01, PU=40kOhm"
Pull Down 40K
2.7V to 3.6V
Medium
Speed
Pull Up 40K
io8p01_ar3wsudq_ft "SPEED01"
Disabled
io8p10_ar3wsudq_ft_pd "SPEED10, PD=40kOhm"
Pull Down 40K
io8p10_ar3wsudq_ft_pu "SPEED10, PU=40kOhm"
2.7Vto 3.6V
Fast Speed Pull Up 40K
io8p10_ar3wsudq_ft "SPEED10"
Disabled
io8p11_ar3wsudq_ft_pd "SPEED11, PD=40kOhm"
io8p11_ar3wsudq_ft_pu "SPEED11, PU=40kOhm"
Pull Down 40K
2.7V to 3.6V
io8p11_ar3wsudq_ft "SPEED11"
High
Speed
Pull Up 40K
Disabled
1. Green color highlights low buffer speed configuration (00) for pin H14.
2. Blue color highlights pull-down configuration for pin H14.
3. Orange color highlights low voltage range (1.8 V) for pin H14.
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Application example with HyperLynx simulator
3
Application example with HyperLynx simulator
3.1
HyperLynx simulation with SDRAM
AN4803
This design example shows how to perform a simulation with HyperLynx on MCU Discovery
board with STM32F746. The SDRAM data bus are the critical signals on this PCB board to
be analyzed.
3.1.1
SDRAM signals
The FMC controller, and in particular the SDRAM memory controller, has many signals,
most of them have similar functionalities and work together. The controller I/O signals could
be split in four groups as follows:
•
Address group: consists of row and column address and bank address
•
Command group: includes the row address strobe (NRAS), the column address strobe
(NCAS), and write enable (SDWE)
•
Control group: includes chip select bank1 and bank2 (SDNE0/1), clock enable bank1
and bank2 (SDCKE0/1), and output byte mask for write access (DQM)
•
Data group/lane contains x8/x16/x32 signals and the data mask (DQM)
In this Discovery board the memory used is an SDRAM with x16 bus widths and have two
data group lanes from Micron (part number: MT48LC4M32B2B5-6A) as shown in Figure 5
below:
Figure 5. SDRAM schematic
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3.1.2
Application example with HyperLynx simulator
SDRAM simulation
The following sequence describes the steps for design and simulation:
•
Step 1: schematic design
The schematic shown in Figure 5 is the connected signal between the SDRAM and the
STM32F746 (FMC_xx).
•
Step 2: PCB design
Use the gerber viewer Gerbv 2.6.1 to see the PCB design. Figure 6 shows the PCB design
of the CPU board with STM32F746 and SDRAM chips are placed close to each other,
where SDRAM is on the left side.
Figure 6. Discovery PCB
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Application example with HyperLynx simulator
•
AN4803
Step 3: translate PCB board file to simulation file
Using the HyperLynx simulation tool from Mentor Graphics® to do PCB board simulation.
Run HyperLynx and open the MB1191B-V14.paf file, and then translate it to MB1191BV14.hpy file for simulation as shown in Figure 7.
Note:
Discovery board layout was designed with Zuken CADStar, so to do simulation with
HyperLynx, use .PAF file with the same file name.
•
Step 4: select the signal to simulate.
–
Step 4.1: open the MB1191B-V14.hpy file.
Figure 7. Discovery PCB
–
Step 4.2: select the signal to simulate (e.g., SDRAM FMC_D10). Go to Select in
upper menu and choose Net by Name for SI Analysis (see Figure 8).
Figure 8. Signal selection
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Application example with HyperLynx simulator
•
Step 5: assign IBIS model for STM32F746 and MT48LC4M32B2B5.
The IBIS model is usually available on the manufacturer’s website. The IBIS Model file
associated with STM32F746 can be downloaded from the STMicroelectronics web site at
www.st.com and for MT48LC4M32B2B5 can be downloaded from Micron website.
After downloading the model for each IC and add it to the HyperLynx lib path. Assign the
IBIS model for each signal vs IC Figure 9:
Figure 9. Assign IBIS model
•
Step 6: export the selected signal to the free-form schematic and configure the stackup information.
Figure 10. Free-form schematic
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Application example with HyperLynx simulator
•
AN4803
Step 7: configure and start the simulation.
Set the frequency to 108 MHz and the Duty to 50% (see Figure 11).
Figure 11. Waveform with IO speed of 0x00
•
Step 8: compare and analyze the results by changing IO speed selection for
STM32F746 (in red FMC_SDRAM coming out of STM32F7 and in green waveform at
SDRAM input)
In the previous steps, the IO speed was set to 0x00, we can see data signal in red coming
out of the STM32F746 is already distorted: square shape with reduced swing and straight
slope due to IO speed limitation. The maximum IO frequency with this setting is 8MHz and
rise time of 100ns. This is can be explained by output signal transitions under the loading
conditions Cref and Rref for IO buffer model at lower speed 0x00.
In order to improve the shape of the waveform at the output of STM32F476, we need to
change the IO speed to handle more signal frequency content to 0x10 (IO max freq. of
100MHz) and 0x11 (IO max freq. of 180 MHz) (see Figure 12 below):
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Application example with HyperLynx simulator
Figure 12. Waveform with IO speed of 0x10
Figure 13. Waveform with IO speed of 0x11
Use the right configuration of IOs speed to match frequency content of target signal is a
must for a good SI without any distortion.
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Application example with HyperLynx simulator
3.2
HyperLynx simulation with Quad-SPI
3.2.1
Quad-SPI signals
Figure 14. Quad-SPI schematic NOR memory interface
Figure 15. Quad-SPI schematic STM32 interface
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3.2.2
Application example with HyperLynx simulator
Quad-SPI simulation
The following sequence describes the steps for design and simulation of clock signal for
Quad-SPI interface:
•
Step 1: schematic design
The schematic shown in Figure 14 and Figure 15 is the connected signal between the Serial
NOR Flash Memory and the STM32F746 (QSPI_xx).
•
Step 2: open PCB board file to simulation Quad-SPI
Run HyperLynx and open the MB1191B-V14.hpy file for simulation.
•
Step 3: select the signal to simulate
Select the clock signal we want to simulate (e.g., QSPI_CLK/ PB2). Go to Select in upper
menu and choose Net by Name for SI Analysis (see Figure 16).
Figure 16. Signal selection
•
Step 4: assign IBIS model for STM32F746 and N25Q128A13EF840E
The IBIS model is usually available on the manufacturer’s website. The IBIS Model file
associated with STM32F746 can be downloaded from the STMicroelectronics web site at;
www.st.com and for N25Q128A13EF840E can be downloaded from Micron web site.
After downloading the model for each IC and add it to the HyperLynx lib path. Assign the
IBIS model for each signal vs IC Figure 16.
•
Step 5: export the selected signal to the free-form schematic and configure the stackup information.
Figure 17. Free-form schematic QSPI_CLK
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Application example with HyperLynx simulator
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Step 6: configure and start the simulation.
Set the frequency to 108 MHz and the Duty to 50% (see Figure 18).
Figure 18. Waveform with R44=0 Ohm
•
Step 7: compare and analyze the results by changing R44 serial resistor
In the previous steps, the Series source termination resistor was 0 Ohm, the green
waveform (at input of QSPI memory) is showing an overshooting and undershooting due to
mismatching of the characteristic impedance. This type of termination requires that the sum
of the buffer impedance and the value of the resistor be equal to the characteristic
impedance of the line.
Double click on the R44 and change its value to 33 Ohm, see Figure 19 below.
Figure 19. Waveform with R44=33 Ohm
We can see a better improvement of shape of clock output from STM32. Or we can run the
Terminator Wizard to analyzes the selected net and suggest the optimum termination values
for R44.
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Application example with HyperLynx simulator
Figure 20. Terminator wizard menu
When we select Apply values, the serial resistor R44 will take this value in this schematic,
which is 40.6 Ohm. See the shape of the wave with simulation in Figure 21 below:
Figure 21. Waveform with R44=40.6 Ohm
The Termination Wizard analyzes the selected net, presents a list of trace statistics and
makes suggestions for the optimum value of R. It takes account of capacitive loading of
receiver ICs, total line length, and driver impedance.
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References
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References
•
HyperLynx® LineSim User Guide Software Version 9.1, Mentor Graphics, March 2014
•
HyperLynx® BoardSim User Guide Software Version 9.2, Mentor Graphics, December
2014
•
High-Speed Digital System Design, Hall, Stephen, Hall Garrett, and McCall, James,
John Wiley and Sons, Inc., 2000
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Terminology
Terminology
SI: Signal Integrity, denotes the correct timing and quality of the signal.
EMC: Electro Magnetic Compatibility, refers to the ability of an electrical device to work
satisfactorily in its electromagnetic environment without adversely influencing the
surrounding devices, or being influenced by them.
IBIS: Input/output Buffer Information Specification is a behavioral-modeling specification. It
is a standard for describing the analog behavior of the buffers of a digital device using plain
ASCII text formatted data.
IO: Input and Output words.
FR4: is an abbreviation for Flame Resistant 4, is a type of material used for making a printed
circuit board (PCB). It describes the board itself with no copper covering.
SDRAM: Synchronous Dynamic Random Access Memory.
Quad-SPI (QSPI): is a specialized communication interface targeting single, dual or quad
SPI flash memories.
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Revision history
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Revision history
Table 2. Document revision history
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Revision
01-Apr-2016
1
Changes
Initial release.
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