Freescale Semiconductor Data Sheet: Technical Data Document Number: MP3H6115A Rev. 6.1, 06/2015 MP3H6115A, 15 to 115 kPa, Absolute, Integrated Pressure Sensor MP3H6115A Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. Super small outline package The MP3H6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MP3H6115A6U/6T1 Case 98ARH99066A Features MP3H6115AC6T1 Case 98ARH99089A • Improved accuracy at high temperature • Available in super small outline package • 1.5% maximum error over 0 °C to 85 °C • Ideally suited for microprocessor or microcontroller-based systems • Temperature compensated from -40 °C to +125 °C DNC 5 4 VOUT • Durable thermoplastic (PPS) surface mount package DNC 6 3 GND DNC 7 DNC 8 2 VS 1 DNC Top view Typical applications • Aviation altimeters • Industrial controls • Engine control/manifold absolute pressure (MAP) • Weather station and weather reporting device barometers Pin 1 identification, chamfered corner. Pinout Ordering information # of Ports Part number Shipping Pressure type Absolute Device marking • MP3H6115A • MP3H6115A • MP3H6115A Package None Single Dual Gauge Differential Small Outline Package (MP3H6115A series) MP3H6115A6U Rail 98ARH99066A • MP3H6115A6T1 Tape and Reel 98ARH99066A • MP3H6115AC6T1 Tape and Reel 98ARH99089A • Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2006-2015 Freescale Semiconductor, Inc. All rights reserved. Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Related Documentation The MP3H6115A device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MP3H6115A. In the Refine Your Result pane on the left, click on the Documentation link. MP3H6115A 2 Sensors Freescale Semiconductor, Inc. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor schematic 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 DNC 8 2 VS 1 DNC Pin 1 identification, chamfered corner. Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name 1 DNC Function Do not connect to external circuitry or ground. Pin 1 is notated by chamfered corner. 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. Voltage supply MP3H6115A Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Parametrics Symbol Value Units Maximum pressure (P1 > P2) Pmax 400 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C Output source current @ full-scale output(2) Io+ 0.5 mAdc Output sink current @ minimum pressure offset(2) Io - -0.5 mAdc 1.Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2.Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 3.0 Vdc, TA = 25 °C unless otherwise noted, P1 > P2.) Characteristic Pressure range Supply voltage (1) Supply current (2) Symbol Min Typ Max Unit POP 15 — 115 kPa VS 2.7 3.0 3.3 Vdc Io — 4.0 8.0 mAdc Voff 0.079 0.12 0.161 Vdc VFSO 2.780 2.82 2.861 Vdc VFSS 2.660 2.70 2.741 Vdc Accuracy (0 to 85 °C) — — — ±1.5 %VFSS Sensitivity V/P — 27 — mV/kPa tR — 1.0 — ms Warm-up time (6) — — 20 — ms Offset stability (7) — — ±0.25 — %VFSS Minimum pressure offset (0 to 85 °C) @ VS = 3.0 Volts Full-scale output(3) (0 to 85 °C) @ VS = 3.0 Volts Full-scale span (4) (0 to 85 °C) @ VS = 3.0 Volts Response time(5) 1.Device is ratiometric within this specified excitation range. 2.Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3.Full-scale output (VFSO) is defined as the output voltage at the maximum or full-rated pressure. 4.Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum rated pressures 5.Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6.Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7.Offset stability is the product's output deviation when subjected to 1000 cycles of pulsed pressure, temperature cycling with bias test. MP3H6115A 4 Sensors Freescale Semiconductor, Inc. 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the absolute sensing chip in the basic super small outline chip carrier (case 98ARH99066A). Figure 4 shows a typical application circuit (output source current operation). Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3H6115A pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluorosilicone Gel Die Coat P1 Die Stainless Steel Cap Thermoplastic Case Wire Bond Lead frame Absolute Element Die Bond Sealed Vacuum Reference Figure 3. Cross-sectional diagram (not to scale) +3 V VS 100 nF VOUT GND to ADC 47 pF 51 K GND Figure 4. Recommended power supply decoupling and output filtering MP3H6115A Sensors Freescale Semiconductor, Inc. 5 Output (Volts) 3.0 2.75 Transfer Function: 2.5 VOUT = VS x (.009xP–.095) ± Error V = 3.0 VDC 2.25 S Temp = 0 to 85 °C 2.0 Max Typ 1.75 1.5 1.25 1.0 0.75 0.5 Min 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0.25 0 Pressure (reference to sealed vacuum) in kPa Figure 5. Output vs. absolute pressure Normal Transfer Value: VOUT = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 3.0 ± 0.3 VDC Figure 6. Transfer function Temperature Error Factor 4.0 Break Points 3.0 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in °C NOTE: The temperature multiplier is a linear response from 0 °C to -40 °C and from 85 °C to 125 °C Figure 7. Temperature error band 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 - 3.0 Pressure Error (Max) 15 to 115 (kPa) ±1.5 (kPa) Figure 8. Pressure error band MP3H6115A 6 Sensors Freescale Semiconductor, Inc. 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.050 1.27 TYP 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 9. SSOP footprint MP3H6115A Sensors Freescale Semiconductor, Inc. 7 4.2 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99066A.pdf. Case 98ARH99066A, small outline package, surface mount MP3H6115A 8 Sensors Freescale Semiconductor, Inc. Case 98ARH99066A, small outline package, surface mount MP3H6115A Sensors Freescale Semiconductor, Inc. 9 Case 98ARH99066A, small outline package, surface mount MP3H6115A 10 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ARH99089A.pdf. Case 98ARH99089A, small outline package, surface mount MP3H6115A Sensors Freescale Semiconductor, Inc. 11 Case 98ARH99089A, small outline package, surface mount MP3H6115A 12 Sensors Freescale Semiconductor, Inc. 5 Revision History Table 4. Revision history Revision number Revision date 5.1 05/2012 • Updated Package Drawing 98ARH99066A was Rev. F, updated to Rev. H. 6 02/2014 • Removed non-ported part numbers, MP3H6115A6U and MP3H6115A6T1 and any references to the device. Removed package outline. Updated Package Drawing 98ARH99089A was Rev. D, updated to Rev. G. 6.1 06/2015 • Added non-ported option back into document. • Updated format. Description MP3H6115A Sensors Freescale Semiconductor, Inc. 13 How to Reach Us: Information in this document is provided solely to enable system and software Home Page: freescale.com implementers to use Freescale products. There are no express or implied copyright Web Support: freescale.com/support information in this document. licenses granted hereunder to design or fabricate any integrated circuits based on the Freescale reserves the right to make changes without further notice to any products herein. Freescale makes no warranty, representation, or guarantee regarding the suitability of its products for any particular purpose, nor does Freescale assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters that may be provided in Freescale data sheets and/or specifications can and do vary in different applications, and actual performance may vary over time. All operating parameters, including “typicals,” must be validated for each customer application by customer’s technical experts. Freescale does not convey any license under its patent rights nor the rights of others. Freescale sells products pursuant to standard terms and conditions of sale, which can be found at the following address: freescale.com/salestermsandconditions. Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2006-2015 Freescale Semiconductor, Inc. Document Number: MP3H6115A Rev. 6.1 06/2015