Freescale Semiconductor Data Sheet: Technical Data Document Number: MPXV6115V Rev. 4.0, 09/2015 MPXV6115V, -115 to 0 kPa, Gauge, and Absolute Pressure Sensor MPXV6115V The MPXV6115V series sensor integrates on-chip, bipolar op-amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make this pressure sensor a logical and economical choice for the system designer. Small outline package The MPXV6115V series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MPXV6115V6U/6T1 MPXV6115VC6U Case 98ASB17756C Case 98ASB17757C Features • Improved accuracy at high temperature • 1.5% maximum error from 0 to 85 °C • Ideally suited for microprocessor- or microcontroller-based systems • Temperature compensated from -40 to +125 °C • Durable thermoplastic surface mount package Typical applications Top view DNC 5 4 VOUT DNC 6 3 GND • Vacuum pump monitoring DNC 7 2 VS • Brake booster monitoring DNC 8 1 DNC Pin 1 identification, notch on first pin or chamfered corner. Pinout Ordering information Device name Shipping Package Rail 98ASB17756C • Tape and Reel 98ASB17756C • None # of Ports Single Dual Gauge Pressure Type Differential Absolute Device Marking Small Outline Package MPXV6115V6U MPXV6115V6T1 MPXV6115VC6U Rail 98ASB17757C • Vacuum/ Gauge Vacuum/ Gauge Vacuum/ Gauge Freescale reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. © 2009-2013, 2015 Freescale Semiconductor, Inc. All rights reserved. MPXV6115V MPXV6115V MPXV6115V Contents 1 2 3 4 5 General Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Pinout . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Mechanical and Electrical Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.1 Maximum ratings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2.2 Operating characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 On-chip Temperature Compensation and Calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 Package Information. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.1 Minimum recommended footprint for surface mounted applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 4.2 Package Dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Related Documentation The MPXV6115V device features and operations are described in a variety of reference manuals, user guides, and application notes. To find the most-current versions of these documents: 1. Go to the Freescale homepage at: http://www.freescale.com/ 2. 3. In the Keyword search box at the top of the page, enter the device number MPXV6115V. In the Refine Your Result pane on the left, click on the Documentation link. MPXV6115V 2 Sensors Freescale Semiconductor, Inc. 1 General Description 1.1 Block diagram Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS Thin Film Temperature Compensation and Calibration Circuitry Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Figure 1. Integrated pressure sensor block diagram 1.2 Pinout DNC 5 4 VOUT DNC 6 3 GND DNC 7 2 VS DNC 8 1 DNC Pin 1 identification, notch on first pin or chamfered corner. Figure 2. Device pinout (top view) Table 1. Pin functions Pin Name Function 1 DNC Do not connect to external circuitry or ground. Pin 1 is notated by the notch in the lead or chamfered corner. Voltage supply 2 VS 3 GND Ground 4 VOUT Output voltage 5 DNC Do not connect to external circuitry or ground. 6 DNC Do not connect to external circuitry or ground. 7 DNC Do not connect to external circuitry or ground. 8 DNC Do not connect to external circuitry or ground. MPXV6115V Sensors Freescale Semiconductor, Inc. 3 2 Mechanical and Electrical Specifications 2.1 Maximum ratings Table 2. Maximum ratings(1) Symbol Value Units Maximum pressure (P1 > P2) Parametrics Pmax 400 kPa Storage temperature Tstg -40 to +125 °C Operating temperature TA -40 to +125 °C Output source current @ full-scale output(2) I o+ 0.5 mAdc Io - -0.5 mAdc Output sink current @ minimum pressure offset(2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum output current is controlled by effective impedance from VOUT to GND or VOUT to VS in the application circuit. 2.2 Operating characteristics Table 3. Operating characteristics (VS = 5.0 VDC, TA = 25 °C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max POP –115 — 0 kPa Supply voltage(1) VS 4.75 5.0 5.25 VDC Supply current Io — 6.0 10 mAdc VFSO 4.534 4.6 4.665 VDC VFSS — 4.4 — VDC — — — ±1.5 %VFSS V/P — 38.26 — mV/kPa Pressure range Full-scale output(2) (0 to 85 °C), @ VS = 5.0 Volts Full-scale span(3) (0 to 85 °C), @ VS = 5.0 Volts Accuracy(4) (0 to 85 °C) Sensitivity (5) Unit tR — 1.0 — ms Warm-up time(6) — — 20 — ms Offset stability(7) — — ±0.5 — %VFSS Response time 1. Device is ratiometric within this specified excitation range. 2. Full-scale output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 3. Full-scale span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25 °C due to all sources of error including the following: Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. Temperature hysteresis:Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. Pressure hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25 °C TcSpan: Output deviation over the temperature range of 0 to 85 °C, relative to 25 °C. TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0 to 85 °C, relative to 25 °C. 5. Response time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV6115V 4 Sensors Freescale Semiconductor, Inc. 3 On-chip Temperature Compensation and Calibration Figure 3 illustrates the absolute sensing chip in the basic small outline chip carrier (). Figure 4 shows a typical application circuit (output source current operation). Figure 5 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85 °C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV6115V series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. The MPXV6115V is optimized to perform in vacuum pressures applied to port P1. The sensor is calibrated and temperature compensated to give a positive electrical output upon measuring a vacuum pressure up to the rated pressure of up to -115 kPa where the output will be the full-scale voltage listed in Table 3. Fluorosilicone Gel Die Coat Die Stainless Steel Cap P1 Thermoplastic Case Wire Bond Lead Frame P2 Differential Sensing Element Die Bond Figure 3. Cross-sectional diagram (not-to-scale) +5.1 V VS VOUT 100 nF To ADC 1 μF GND 47 pF 51 K Figure 4. Typical application circuit (output source current operation) MPXV6115V Sensors Freescale Semiconductor, Inc. 5 5 4.5 4 Output (Volts) 3.5 3 Transfer Function: VOUT = VS*[(0.007652*P) + 0.92] ± (Pressure error) *Temp Factor*0.007652*VS) VS = 5.0 V ± 0.25 VDC TEMP = 0°-85° C 2.5 Max 2 Min 1.5 1 0.5 0 –115 –95 –75 –55 VOUT vs. Vacuum –35 -15 0 Figure 5. Output vs. Absolute Pressure Nominal Transfer Value: VOUT = VS x (0.007652 x P + 0.92) ± (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5.0 ± 0.25 VDC Figure 6. Transfer function 4.0 3.0 Temp. Multiplier –40 0 to 85 125 3 1 2 2.0 1.0 0.0 -40 -20 0 20 40 60 80 100 120 130 140 Temperature in °C NOTE: The temperature multiplier is a linear response from 0 to –40 °C and from 85 to 125 °C. Figure 7. Temperature error band Error Limits for Pressure 1.950 Pressure Error (kPa) 1.725 Pressure in kPa (below atmospheric) 1.500 0 -115 -100 -85 -45 -30 -15 -1.500 -1.500 -1.725 0 Pressure -115 to 0 kPa Error (max) ± 1.725 kPa -1.950 Figure 8. Pressure error band MPXV6115V 6 Sensors Freescale Semiconductor, Inc. 4 Package Information 4.1 Minimum recommended footprint for surface mounted applications Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 6X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 9. SOP footprint (case 98ASB17756C) MPXV6115V Sensors Freescale Semiconductor, Inc. 7 4.2 Package Dimensions This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17756C.pdf. Case 98ASB17756C, small outline package, surface mount MPXV6115V 8 Sensors Freescale Semiconductor, Inc. This drawing is located at http://cache.freescale.com/files/shared/doc/package_info/98ASB17757C.pdf. –A– D 8 PL 4 0.25 (0.010) 5 M T B S A NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5 TYPICAL DRAFT. S N –B– G 8 1 S DIM A B C D G H J K M N S V W W V C H J INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0 7 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0 7 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 –T– M K PIN 1 IDENTIFIER SEATING PLANE Case 98ASB17757C, small outline package, through-hole MPXV6115V Sensors Freescale Semiconductor, Inc. 9 5 Revision History Table 4. Revision history Revision number Revision date Description of changes 2 10/2012 • Added devices MPXB611V6U and MPX6115V6T1 and corresponding package, 482. 3 01/2013 • Corrected psi range on page 1, device description box 09/2015 • • • • • 4.0 Updated format. Corrected figure 4. Added vacuum pressure information to section 3. Updated case outline 98ASB17756C with current version. Deleted obsolete device MPXV6115VC6T1. 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U.S. Pat. & Tm. Off. All other product or service names are the property of their respective owners. © 2009-2013, 2015 Freescale Semiconductor, Inc. Document Number: MPXV6115V Rev. 4.0 09/2015