MP3H6115A Rev 2, 09/2006 Freescale Semiconductor Technical Data High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of on-chip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MP3H6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MP3H6115A SERIES INTEGRATED PRESSURE SENSOR 15 TO 115 KPA (2.2 TO 16.7 PSI) 0.12 TO 2.9 VOLTS OUTPUT SUPER SMALL OUTLINE PACKAGE MP3H6115A6U/T1 CASE 1317-04 Features • • • • • • Improved Accuracy at High Temperature Available in Super Small Outline Package 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package Application Examples • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Station and Weather Reporting Device Barometers ORDERING INFORMATION Device Type Options Case No. MPX Series Order No. Packing Options Marking Basic Element Absolute, Element Only 1317 MP3H6115A6U Rails Absolute, Element Only 1317 MP3H6115A6T1 Tape and Reel MP3H6115A Absolute, Axial Port 1317A MP3H6115AC6U Rails MP3H6115A Absolute, Axial Port 1317A MP3H6115AC6T1 Tape and Reel MP3H6115A Ported Element © Freescale Semiconductor, Inc., 2006. All rights reserved. MP3H6115A MP3H6115AC6U/T1 CASE 1317A-03 PIN NUMBER 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is denoted by the chamfered corner of the package. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry VOUT Pins 1, 5, 6, 7, and 8 are No Connects Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Parametrics Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C Io + 0.5 mAdc Io - -0.5 mAdc (2) Output Source Current @ Full Scale Output (2) Output Sink Current @ Minimum Pressure Offset 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. MP3H6115A 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 2.7 3.0 3.3 Vdc Io — 4.0 8.0 mAdc Supply Current Offset(2) Minimum Pressure @ VS = 3.0 Volts (0 to 85°C) Voff 0.079 0.12 0.161 Vdc Full Scale Output(3) @ VS = 3.0 Volts (0 to 85°C) VFSO 2.780 2.82 2.861 Vdc Full Scale Span(4) @ VS = 3.0 Volts (0 to 85°C) VFSS 2.660 2.70 2.741 Vdc Accuracy(5) (0 to 85°C) — — — ±1.5 %VFSS V/P — 27 — mV/kPa Response Time(6) tR — 1.0 — ms Time(7) — — 20 — ms — — ±0.25 — %VFSS Sensitivity Warm-Up Offset Stability (8) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of error including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 6. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 7. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 8. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MP3H6115A Sensors Freescale Semiconductor 3 Fluoro Silicone Gel Die Coat +3 V Die P1 Stainless Steel Cap VS Pin 2 Thermoplastic Case Wire Bond Leadframe MP3H6115A VOUT Pin 4 100 nF GND Pin 3 to 47 pF 51 K Die Bond Absolute Elelment Sealed Vacuum Reference GND Figure 3. Typical Application Circuit (Output Source Current Operation) Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). Output (Volts) Figure 2. Cross Sectional Diagram SSOP (not to scale) 3.0 2.75 Transfer Function: 2.5 VOUT = VS x (.009xP–.095) ± Error V = 3.0 VDC 2.25 S Temp = 0 to 85°C 2.0 Max Typ 1.75 1.5 1.25 1.0 0.75 0.5 Min 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0.25 0 Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output versus Pressure Differential Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3H6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. MP3H6115A 4 Sensors Freescale Semiconductor Transfer Function (MP3H6115A) Normal Transfer Value: VOUT = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 3.0 ± 0.3 VDC Temperature Error Band MP3H6115A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 - 3.0 Pressure Error (Max) 15 to 115 (kPa) ±1.5 (kPa) MP3H6115A Sensors Freescale Semiconductor 5 MINIMUM RECOMMENDED FOOTPRINT FOR SUPER SMALL OUTLINE PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MP3H6115A 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 7 PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A 8 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 9 PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MP3H6115A 10 Sensors Freescale Semiconductor PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-03 ISSUE C SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. Alma School Road Chandler, Arizona 85224 +1-800-521-6274 or +1-480-768-2130 [email protected] Europe, Middle East, and Africa: Freescale Halbleiter Deutschland GmbH Technical Information Center Schatzbogen 7 81829 Muenchen, Germany +44 1296 380 456 (English) +46 8 52200080 (English) +49 89 92103 559 (German) +33 1 69 35 48 48 (French) [email protected] Japan: Freescale Semiconductor Japan Ltd. Headquarters ARCO Tower 15F 1-8-1, Shimo-Meguro, Meguro-ku, Tokyo 153-0064 Japan 0120 191014 or +81 3 5437 9125 [email protected] Asia/Pacific: Freescale Semiconductor Hong Kong Ltd. Technical Information Center 2 Dai King Street Tai Po Industrial Estate Tai Po, N.T., Hong Kong +800 2666 8080 [email protected] For Literature Requests Only: Freescale Semiconductor Literature Distribution Center P.O. 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