Pressure Freescale Semiconductor MP3H6115A Rev 4, 10/2009 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip Signal Conditioned, Temperature Compensated and Calibrated Freescale's MP3H6115A series sensor integrates on-chip, bipolar op amp circuitry and thin film resistor networks to provide a high output signal and temperature compensation. The small form factor and high reliability of onchip integration make the Freescale pressure sensor a logical and economical choice for the system designer. The MP3H6115A series piezoresistive transducer is a state-of-the-art, monolithic, signal conditioned, silicon pressure sensor. This sensor combines advanced micromachining techniques, thin film metallization, and bipolar semiconductor processing to provide an accurate, high level analog output signal that is proportional to applied pressure. MP3H6115A Series 15 to 115 kPa (2.2 to 16.7 psi) 0.12 to 2.8 V Output Application Examples • Aviation Altimeters • Industrial Controls • Engine Control/Manifold Absolute Pressure (MAP) • Weather Station and Weather Reporting Device Barometers Features • • • • • • Improved Accuracy at High Temperature Available in Super Small Outline Package 1.5% Maximum Error over 0° to 85°C Ideally suited for Microprocessor or Microcontroller-Based Systems Temperature Compensated from -40° to +125°C Durable Thermoplastic (PPS) Surface Mount Package ORDERING INFORMATION Packaging Device Name Case No. Options None Super Small Outline Package (MP3H6115A Series) MP3H6115A6U • Rail 1317 MP3H6115A6T1 Tape & Reel 1317 • MP3H6115AC6U Rail 1317A MP3H6115AC6T1 Tape & Reel 1317A # of Ports Single Dual Gauge Pressure Type Differential • • SUPER SMALL OUTLINE PACKAGES MP3H6115A6U/T1 CASE 1317-04 © Freescale Semiconductor, Inc., 2006-2009. All rights reserved. MP3H6115AC6U/T1 CASE 1317A-04 Absolute Device Marking • • • • MP3H6115A MP3H6115A MP3H6115A MP3H6115A Pressure Operating Characteristics Table 1. Operating Characteristics (VS = 3.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2.) Characteristic Symbol Min Typ Max Unit Pressure Range POP 15 — 115 kPa Supply Voltage(1) VS 2.7 3.0 3.3 Vdc Io — 4.0 8.0 mAdc (0 to 85°C) Voff 0.079 0.12 0.161 Vdc Full Scale Output(3) @ VS = 3.0 Volts (0 to 85°C) VFSO 2.780 2.82 2.861 Vdc Full Scale Span(4) @ VS = 3.0 Volts (0 to 85°C) VFSS 2.660 2.70 2.741 Vdc Accuracy (0 to 85°C) Supply Current Minimum Pressure Offset @ VS = 3.0 Volts (2) — — — ±1.5 %VFSS V/P — 27 — mV/kPa Response Time(5) tR — 1.0 — ms (6) — — 20 — ms — — ±0.25 — %VFSS Sensitivity Warm-Up Time Offset Stability(7) 1. Device is ratiometric within this specified excitation range. 2. Offset (Voff) is defined as the output voltage at the minimum rated pressure. 3. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure. 4. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the minimum rated pressure. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test. MP3H6115A 2 Sensors Freescale Semiconductor Pressure Maximum Ratings Table 2. Maximum Ratings(1) Parametrics Symbol Value Units Maximum Pressure (P1 > P2) Pmax 400 kPa Storage Temperature Tstg -40° to +125° °C Operating Temperature TA -40° to +125° °C I o+ 0.5 mAdc Io - -0.5 mAdc (2) Output Source Current @ Full Scale Output Output Sink Current @ Minimum Pressure Offset (2) 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. 2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. VS 2 Thin Film Temperature Compensation and Gain Stage #1 Sensing Element 3 GND Gain Stage #2 and Ground Reference Shift Circuitry 4 VOUT Pins 1, 5, 6, 7, and 8 are No Connects Figure 1. Fully Integrated Pressure Sensor Schematic MP3H6115A Sensors Freescale Semiconductor 3 Pressure On-chip Temperature Compensation and Calibration Figure 2 illustrates the absolute sensing chip in the basic Super Small Outline chip carrier (Case 1317). Figure 3 shows a typical application circuit (output source current operation). Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves are shown for operation over 0 to 85°C temperature range. The output will saturate outside of the rated pressure range. A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MP3H6115A series pressure sensor operating characteristics, internal reliability and qualification tests are based on use of dry air as the pressure media. Media other than dry air may have adverse effects on sensor performance and long-term reliability. Contact the factory for information regarding media compatibility in your application. Fluoro Silicone Gel Die Coat P1 Stainless Steel Cap Die Thermoplastic Case Wire Bond Lead frame Die Bond Absolute Element Sealed Vacuum Reference Figure 2. Cross Sectional Diagram SSOP (not to scale) +3 V VS Pin 2 MP3H6115A VOUT Pin 4 100 nF to ADC 47 pF GND Pin 3 51 K GND Output (Volts) Figure 3. Typical Application Circuit (Output Source Current Operation) 3.0 2.75 Transfer Function: 2.5 VOUT = VS x (.009xP–.095) ± Error V = 3.0 VDC 2.25 S Temp = 0 to 85°C 2.0 Max Typ 1.75 1.5 1.25 1.0 0.75 0.5 Min 5 10 15 20 25 30 35 40 45 50 55 60 65 70 75 80 85 90 95 100 105 110 115 120 0.25 0 Pressure (Reference to Sealed Vacuum) in kPa Figure 4. Output versus Absolute Pressure MP3H6115A 4 Sensors Freescale Semiconductor Pressure Transfer Function (MP3H6115A) Normal Transfer Value: VOUT = VS x (0.009 x P – 0.095) ± (Pressure Error x Temp. Factor x 0.009 x VS) VS = 3.0 ± 0.3 VDC Temperature Error Band MP3H6115A Series 4.0 Break Points 3.0 Temperature Error Factor 2.0 Temp Multiplier -40 0 to 85 125 3 1 1.75 1.0 0.0 -40 -20 0 20 40 60 80 100 120 140 Temperature in C° NOTE: The Temperature Multiplier is a linear response from 0°C to -40°C and from 85°C to 125°C Pressure Error Band Error Limits for Pressure 3.0 Pressure Error (kPa) 2.0 1.0 0.0 20 40 60 80 100 120 Pressure (in kPa) -1.0 -2.0 - 3.0 Pressure Error (Max) 15 to 115 (kPa) ±1.5 (kPa) MP3H6115A Sensors Freescale Semiconductor 5 Pressure MINIMUM RECOMMENDED FOOTPRINT FOR SMALL AND SUPER SMALL PACKAGES Surface mount board layout is a critical portion of the total design. The footprint for the semiconductor package must be the correct size to ensure proper solder connection interface between the board and the package. With the correct pad geometry, the packages will self-align when subjected to a 0.050 1.27 TYP solder reflow process. It is always recommended to fabricate boards with a solder mask layer to avoid bridging and/or shorting between solder pads, especially on tight tolerances and/or tight layouts. 0.387 9.83 0.150 3.81 0.027 TYP 8X 0.69 0.053 TYP 8X 1.35 inch mm Figure 5. SSOP Footprint (Case 1317 and 1317A) MP3H6115A 6 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 1 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 7 Pressure PACKAGE DIMENSIONS PAGE 2 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A 8 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 3 OF 3 CASE 1317-04 ISSUE F SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 9 Pressure PACKAGE DIMENSIONS PAGE 1 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MP3H6115A 10 Sensors Freescale Semiconductor Pressure PACKAGE DIMENSIONS PAGE 2 OF 2 CASE 1317A-04 ISSUE D SUPER SMALL OUTLINE PACKAGE MP3H6115A Sensors Freescale Semiconductor 11 How to Reach Us: Home Page: www.freescale.com Web Support: http://www.freescale.com/support USA/Europe or Locations Not Listed: Freescale Semiconductor, Inc. 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