MPXV5050VC6T1 High Temperature Accuracy Integrated Silicon Pressure Sensor for Measuring Absolute Pressure, On-Chip...

Pressure
Freescale Semiconductor
MPXV5050VC6T1
Rev 2, 11/2009
High Temperature Accuracy
Integrated Silicon Pressure Sensor
for Measuring Absolute Pressure,
On-Chip Signal Conditioned,
Temperature Compensated and
Calibrated
MPXV5050V
Series
-50 to 0 kPa (-7.25 to 0 psi)
0.1 to 4.6 V Output
The MPXV5050V series sensor integrates on-chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature
compensation. The small form factor and high reliability of on-chip integration
make the Freescale Semiconductor, Inc. pressure sensor a logical and
economical choice for the system designer.
The MPXV5050V series piezoresistive transducer is a state-of-the-art,
monolithic, signal conditioned, silicon pressure sensor. This sensor combines
advanced micromachining techniques, thin film metallization, and bipolar
semiconductor processing to provide an accurate, high level analog output signal
that is proportional to applied pressure.
Application Examples
• Vacuum Pump Monitoring
Features
•
•
•
•
•
•
•
2.5% Maximum Error over 0° to 85°C
Ideally suited for Microprocessor or Microcontroller-Based Systems
Temperature Compensated from Over -40° to +125°C
Patented Silicon Shear Stress Strain Gauge
Durable Thermoplastic (PPS) Surface Mount Package
Easy-to-Use Chip Carrier Option
Ideal for Automotive and Non-Automotive Applications
ORDERING INFORMATION
Device Name
Case
No.
# of Ports
None
Single
Pressure Type
Dual
Gauge
Differential
Absolute
Device
Marking
Small Outline Package
MPXV5050VC6T1
482A
•
• Vacuum/Gauge
SMALL OUTLINE PACKAGE
MPXV5050VC6T1
CASE 482A-01
© Freescale Semiconductor, Inc., 2005, 2009. All rights reserved.
MPXV5050V
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 > P2)
Characteristic
Symbol
Min
Typ
Max
Unit
Pressure Range
POP
-50
—
0
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
7.0
10
mAdc
Full Scale Output(2)
@ VS = 5.0 Volts
(0 to 85°C)
VFSO
4.488
4.6
4.713
Vdc
Full Scale Span(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
—
4.5
—
Vdc
Accuracy(4)
(0 to 85°C)
—
—
—
±2.5
%VFSS
Sensitivity
V/P
—
90
—
mV/kPa
(5)
tR
—
1.0
—
ms
Warm-Up Time(6)
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Voff
0
0.100
0.213
Vdc
Response Time
Pressure Offset(8)
(0 to 85°C)
1. Device is ratiometric within this specified excitation range.
2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range.
Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and
from the minimum or maximum operating temperature points, with zero differential pressure applied.
Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or
maximum rated pressure at 25°C.
TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
7. Offset Stability is the product's output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
8. Offset (Voff) is defined as the output voltage at the minimum rated pressure.
MPXV5050VC6T1
2
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Pressure
Maximum Ratings
Table 2. Maximum Ratings(1)
Rating
Symbol
Value
Units
Maximum Pressure (P1 > P2)
Pmax
200
kPa
Storage Temperature
Tstg
-40 to +125
°C
Operating Temperature
TA
-40 to +125
°C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
And
Gain Stage #1
Sensing
Element
GND
3
Gain Stage #2
And
Ground
Reference
Shift Circuitry
4
Vout
Pins 1, 5, 6, 7, and 8 are no connects
Figure 1. Fully Integrated Pressure Sensor Schematic
MPXV5050VC6T1
Sensors
Freescale Semiconductor
3
Pressure
On-chip Temperature Compensation and Calibration
Figure 2 illustrates the absolute sensing chip in the basic
Super Small Outline chip carrier (Case 482A).
Figure 3 shows a typical application circuit (output source
current operation).
Figure 4 shows the sensor output signal relative to
pressure input. Typical minimum and maximum output
curves are shown for operation over 0° to 85°C temperature
range. The output will saturate outside of the rated pressure
range.
Fluorosilicone
Gel Die Coat
Die
A fluorosilicone gel isolates the die surface and wire bonds
from the environment, while allowing the pressure signal to
be transmitted to the silicon diaphragm. The MPXV5050
series pressure sensor operating characteristics, internal
reliability and qualification tests are based on use of dry air as
the pressure media. Media other than dry air may have
adverse effects on sensor performance and long-term
reliability. Contact the factory for information regarding media
compatibility in your application.
+5 V
Stainless
Steel Cap
P1
Wire
Bond
OUTPUT
Vout
Thermoplastic
Case
Vs
IPS
Lead
Frame
1.0 μF
P2
0.01 μF
GND
470 pF
Die Bond
Differential Sensing
Element
Figure 2. Cross Sectional Diagram SSOP (not to scale)
Figure 3. Typical Application Circuit
(Output Source Current Operation)
Transfer Function MPXV5050VC Series
5
3
Span Range (Typ)
Output Voltage (V)
4
TYPICAL
MAX
2
Output Range (Typ)
Transfer Function:
Vout = VS x (0.018 x P + 0.92) ± (PE x TM x 0.018 x Vs)
Vs = 5.0 ± 0.25 vdc
PE = 1.25
TM = 1
Temperature = 0 to 85°C
MIN
1
0
–50
–40
–30
–20
–10
Pressure (kPa)
0
Offset
(Typ)
Figure 4. Output vs. Absolute Pressure
MPXV5050VC6T1
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Sensors
Freescale Semiconductor
Pressure
Transfer Function (MPXV5050V)
Nominal Transfer Value: VOUT = VS x (0.018 x P + 0.92)
± (Pressure Error x Temp Multi x 0.018 x VS)
VS = 5.0 ± 0.25 V
Temperature Error Band
MPXV5050V
4.0
Break Points
Temp
3.0
Temperature
Error
Factor
Multiplier
–40
0 to 85
+125
2.0
3
1
3
1.0
0.0
–40
–20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C.
Pressure Error Band
MPXV5050V
Error Limits for Pressure
Pressure Error (kPa)
1.25
1.00
0.75
0
–50
–40
–30
–20
–10
0
Pressure (in kPa)
–0.75
–1.00
–1.25
Pressure
Error (Max)
–50 to 0 kPa
±1.25 kPa
MPXV5050VC6T1
Sensors
Freescale Semiconductor
5
Pressure
SURFACE MOUNTING INFORMATION
MINIMUM RECOMMENDED FOOTPRINT FOR SMALL OUTLINE PACKAGE
Surface mount board layout is a critical portion of the total
design. The footprint for the semiconductor package must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct pad
geometry, the packages will self-align when subjected to a
solder reflow process. It is always recommended to fabricate
boards with a solder mask layer to avoid bridging and/or
shorting between solder pads, especially on tight tolerances
and/or tight layouts.
0.100 TYP
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
Figure 5. SOP Footprint (Case 482A)
MPXV5050VC6T1
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Freescale Semiconductor
Pressure
PACKAGE DIMENSIONS
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV5050VC6T1
Sensors
Freescale Semiconductor
7
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MPXV5050VC6T1
Rev. 2
11/2009
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