Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Part Type: Plastic Encapsulated Package Family: SOT26 HMC197AE HMC221AE HMC285E HMC286E HMC290E HMC291E HMC308E HMC313E HMC332E HMC333E HMC432E HMC433E HMC434E HMC446E HMC544E HMC545E HMC550E HMC195E HMC197E HMC221E HMC226E HMC314E HMC315E HMC323E QTR: 02017 Rev: 01 Switch, SPDT Reflective Switch, SPDT Reflective Mixer, Single-Balanced Amplifier, Low Noise Attenuator, 2-Bit Digital Attenuator, 2-Bit Digital Amplifier, Driver Amplifier, HBT Gain Block Mixer, Single-Balanced Mixer, Single-Balanced Frequency Divider, ÷2 Frequency Divider, ÷4 Frequency Divider, ÷8 Switch, SPDT T/R 10W Switch, SPDT T/R Switch, SPDT Reflective Switch, Failsafe Obsolete Products Switch, SPDT T/R Switch, SPDT Reflective Switch, SPDT Reflective Switch, SPDT T/R Amplifier, Driver Amplifier, HBT Gain Block Amplifier, Driver Hittite Microwave Corporation is committed to: Hittite’s employees recognize the responsibility to: • Supplying products of the highest quality • Advance in state-of-the-art technology that supports our products • Enhance our competitive position with superior product standards • Take the initiate to ensure product quality • Create an environment where the highest standards are maintained • Continue to improve quality practices 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] QTR: 02017 Rev: 01 1.0 Introduction This qualification procedure was designed to satisfy the package reliability requirements for a plastic SOT surface mount package. The testing was designed to simulate the worst-case environments the product may experience during assembly, test and life in the end user application. The device was electrically tested to the appropriate catalog specifications. The HMC197 was selected to qualify the SOT package family. 1.1 General Description The SOT package uses a copper lead frame. The lead frame is spot plated with silver to enable gold wire bonding. The MMIC device is epoxy attached to the paddle. The MMIC contains gold bond pads. The interconnection is performed using 1 mil gold ball bonds. The part is encapsulated using Sumitomo EME 6300 or equivalent encapsulating compound. The leads are finished with 85/15 SnPb or Matte Sn. The HMC197 is a low-cost SPDT switch in a 6-lead SOT26 plastic package for use in general switching applications which require very low insertion loss and very small size. The device can control signals from DC to 3 GHz and is especially suited for 900 MHz, 1.8 - 2.2 GHz, and 2.4 GHz ISM applications with less than 1 dB loss. The design provides exceptional insertion loss performance, ideal for filter and receiver switching. RF1 and RF2 are reflective shorts when “Off”. The two control voltages require a minimal amount of DC current and offer compatibility with most CMOS & TTL logic families. See HMC221 for same performance in an alternate SOT26 pin-out. Photo 1 Typical SOT26 Package 2.0 Summary of Results PARA TEST QTY IN QTY OUT PASS / FAIL 3.1.1 Initial Electrical Test 196 196 Pass 3.1.2 Temperature Cycle 116 116 Complete 3.1.3 Final Electrical Test 116 116 Pass 3.1.4 Autoclave 80 80 Complete 3.1.5 Final Electrical Test 80 80 Pass 3.2.1 Lead Co-Planarity 80 80 Pass 3.2.2 Physical Dimensions 15 15 Pass 3.2.3 Resistance to Solvents N/A N/A Pass 3.2.4 Solderability 15 15 Pass NOTES Laser Marked All testing has been completed. There were no relevant failures. 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 2 QTR: 02017 Rev: 01 Package Dimensions NOTES: 1. LEADFRAME MATERIAL: COPPER ALLOY 2. DIMENSIONS ARE IN INCHES [MILLIMETERS] 3. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.15mm PER SIDE. 4. DIMENSION DOES NOT INCLUDE MOLDFLASH OF 0.25mm PER SIDE. 5. ALL GROUND LEADS MUST BE SOLDERED TO PCB RF GROUND. Suggested Land Pattern Package Information Part Number Suffix E Package Body Material Lead Finish RoHS Compliant Mold Compound Sn/Pb Solder MSL1 RoHS Compliant Mold Compound 100% matte Sn MSL1 [1] Max peak reflow temperature of 235 °C [2] Max peak reflow temperature of 260 °C MSL Rating Package Marking [3][4] [1] HNNN XXXX [2] NNNE XXXX [3] 4-Digit lot number XXXX [4] 3-Digit part number NNN 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 3 QTR: 02017 Rev: 01 3.0 Test Procedures 3.1 Package Environmental Tests - These tests are designed to demonstrate that the SOT family of packages are capable of maintaining the specified parameters throughout their useful life under rated operating conditions. The HMC197 was chosen to qualify the SOT package family. The results of these tests qualify by similarity all other product using the same package. 3.1.1 Initial Characteristics - 196 HMC197 devices were electrically tested for DC and critical RF parameters. These tests are performed at ambient temperature (+25°C). This test was performed at Hittite. There were no failures in this test. 3.1.2 Temperature Cycle - 116 devices from 3.1.1 were subjected to 200 cycles of non-operating temperature cycling from -65°C to 150°C. This test was performed Hittite. 3.1.3 Final Electrical Test - 116 devices from 3.1.2 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter was considered a failure. This test was performed at Hittite. There were no failures in this test. 3.1.4 Autoclave - 80 devices from 3.1.1 were subjected to 96 hours of humidity (100%), temperature (121°C) and pressure (15 PSIG). This test was performed at Qualified Parts Lab in Santa Clara, CA. 3.1.5 Final Electrical Test - 80 devices from 3.1.4 were electrically tested at ambient temperature to DC and critical RF parameters. Any out of specification parameter was considered a failure. This test was performed at Hittite within 48 hours after removal from the chamber. There were no failures in this test. 3.2 Package Mechanical Tests 3.2.1 Coplanarity - 80 devices were measured for lead coplanarity. Coplanarity in excess of .004” (0.1 mm) was considered a reject. These devices need not be electrically functional. Any out of specification parameter was considered a failure. This test was performed at Source Electronics Corp. in Hollis, NH. There were no failures. 3.2.2 Physical Dimensions - 15 devices were measured to the requirement of the data sheet. These devices need not be electrically functional. Any out of specification parameter was considered a failure. This test was performed at Hittite. There were no failures. 3.2.4 Solderability - 45 devices were subjected to the steam aging and solderability test in accordance with MIL-STD-883 Method 2003. These devices need not be electrically functional. This test was performed at Hittite. There were no failures. 20 Alpha Road, Chelmsford, MA 01824 978-250-3343 tel • 978-250-3373 fax • www.hittite.com • [email protected] Page - 4