SiP12502 Datasheet

Product is End of Life 3/2014
SiP12502
Vishay Siliconix
500 mA - Fixed Output Boost Converter for Single or Dual Cell
DESCRIPTION
FEATURES
SiP12502 is a boost converter IC with fixed output voltage for
single or double cell NiMH or Alkaline battery pack. Featuring
with an internal low resistance power MOSFET, it is capable
of starting up with a low battery voltage of 0.85 V. It only
needs four external components (an inductor, a diode and
two capacitors) to construct a step-up converter. For best
efficiency performance, it is designed to operate in PWM
mode with a 300 kHZ switching frequency under normal load
and in PFM mode under light load. The voltage-mode control
loop is internally compensated, simplifying converter design
and reducing external parts count. It accepts input voltages
from 0.85 V to 5 V, providing fixed output voltages of 2.0 V,
3.3 V, and 5.0 V. It also features low shutdown current of
under 1 µA, over voltage protection, thermal shutdown
protection, a power good output and antiringing control to
minimize EMI.
• Voltage mode control with internal frequency
compensation
• 0.85 V to 5.0 V input voltage range
• Fixed output voltage options - 2.0 V, 3.3 V, and 5.0 V
• Other voltages available upon request
• PWM control with 300 kHz fixed switching frequency
• PFM control for light load
• Powered from the output voltage supply
• Integrated UVLO and soft-start
• Logic controlled shutdown (< 1 µA)
• 85 % typical efficiency
• Internal power MOS switch: 0.2 Ω at 3.3 V output
• Antiringing switch to minimize EMI
• Power good output
• Shutdown input
• Minimum external components
• PowerPAK® MLP33-6 package, (DFN-6, 3 x 3)
• Over voltage protection
SiP12502 is available in a lead (Pb)-free 6-pin, PowerPAK
MLP33 package and is specified to operate over the
industrial temperature range of - 40 °C to 85 °C.
APPLICATIONS
•
•
•
•
•
•
Portable applications
Battery-powered equipment
Handheld devices
Digital cameras
Wireless handsets
LCD and OLED bias
TYPICAL APPLICATION CIRCUIT
VIN
10 µH
2
10 µF
VIN
XSHD
1
XSHD
LX
6
MBR0520
VOUT
47 µF
SiP12502
3
PGOOD
VOUT
GND
4
PGOOD
330 KΩ
5
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
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Product is End of Life 3/2014
SiP12502
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
- 0.3 to VOUT + 0.5
LX Voltage
Output Voltage, VOUT
V
- 0.3 to 6
- 0.3 to VIN + 0.5
XSHD Voltage
PGOOD Voltage
- 0.3 to 6
Maximum Junction Temperature
150
Storage Temperature
- 55 to 150
Operating Junction Temperature
°C
125
PowerPAK MLP33-6 (TA = 70 °C)a
Power Dissipationa
Thermal Resistance
Unit
- 0.3 to 6
b
1100
mW
50
°C/W
PowerPAK MLP33-6
Notes:
a. Derate 20 mW/°C above 70 °C.
b. Device mounted with all leads soldered or welded to PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
Unit
0.85 to 5.0
Output Voltage, VOUT
2.0 to 5
V
0 to VIN
XSHD Voltage
0 to VOUT + 0.5
LX Voltage
PGOOD Voltage
0 to 5
Operating Temperature Range
- 40 to 85
°C
SPECIFICATIONS
Limits
Test Conditions Unless Specified
Parameter
Symbol
VIN = 1.2 V, VOUT = Vnome, TA = 25 °C
Minimum Start-Up Voltage
VSTART
ILOAD = 1 mA
Minimum Operating Voltaged
VHOLD
XSHD = VIN
Output Voltage Accuracy
VOUT
UVLO
VUVLO
Rising VOUT
a
Temp.
Full
Min.
b
Typ.c
Max.b
0.65
0.85
0.55
- 1.5
+ 1.5
- 25 °C
to 85 °C
- 3.0
+ 3.0
Full
- 3.5
1.8
VUVLOHYST
Full
0.100
Maximum PWM Duty Cycle
MAXDTY
Full
80
87
PWM Switching Frequency
fOSC
Full
225
300
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2
V
%
+ 3.5
Full
UVLO Hysteresis
Unit
2
V
%
375
kHz
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
Product is End of Life 3/2014
SiP12502
Vishay Siliconix
SPECIFICATIONS
Limits
Test Conditions Unless Specified
Symbol
VIN = 1.2 V, VOUT = Vnome, TA = 25 °C
Temp.
IOUT1
VOUT = Vnom X 0.95
Full
Supply Current 2
IOUT2
VOUT = 6 V, Vnom + 0.6 V, VLX > VIN
Supply Current 3
IOUT3
VOUT = Vnom + 0.5 V, VLX < VIN
Stand-By Current
ISTB
XSHD = 0 V, not including switch leakage
NMOS Switch Leakage
ILEAK
LX = 5 V
RDS(on)
VOUT = 3.3 V
Parameter
Supply Current 1
NMOS Switch On Resistance
a
Min.
b
Typ.c
Max.b
330
620
150
75
1
1
Full
3
IFTOF
22
VXSHDL
Softstart Time
tSTART
0.8 V ≤ VIN ≤ 0.9 V
Full
0.55
0.9 V < VIN ≤ 2 V
Full
0.8
2 V < VIN ≤ 5 V
Full
1.2
Full
0.2
ViN = 1.8 V
1.6
VOV
110
Over Voltage Hysteresis
VOVHYST
10
Thermal Shutdown
TSHD
160
Thermal Shutdown Hysteresis
THYST
20
PGOOD Threshold
VPGOOD
VPGOODHYST
mA
V
Over Voltage Threshold
PGOOD Hysteresis
Ω
0.2
IWTOF
XSHD Input Low Level
2
10
PFM to PWM Current Threshold
VXSHDH
µA
Full
PWM to PFM Current Threshold
XSHD Input High Level
Unit
85
90
ms
%
°C
95
2
%
PGOOD Output Voltage Low
PGGOODL
VOUT = 3.3 V, IPGOOD = 1 mA
Full
0.15
0.2
V
PGOOD Output Leakage Current
PGGOOD
VPGOOD = 5 V
Full
0.01
1
µA
Notes:
a. Full = - 40 °C to 85 °C.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (- 40 °C to 85 °C).
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Minimum operating voltage is determined by the battery’s capability to provide energy as it is deeply discharged.
e. Vnom equals voltage output for part selected.
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
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Product is End of Life 3/2014
SiP12502
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PIN CONFIGURATION AND TRUTH TABLE
PowerPAK MLP33-6
XSHD
1
6
LX
VIN
2
5
GND
VOUT
3
4
PGOOD
Top View
ORDERING INFORMATION
Part Number
Voltage Output
SiP12502DMP-20-E3
2.0 V
SiP12502DMP-33-E3
3.3 V
SiP12502DMP-50-E3
5.0 V
Temperature Range
Marking
502A
- 40 °C to 85 °C
502E
502G
PIN DESCRIPTION
Pin Number
Name
1
XSDH
2
VIN
3
VOUT
4
PGOOD
5
GND
6
LX
Function
Logic controlled shutdown input, XSHD = high: normal operation, XSHD = low: shutdown
Input voltage
Output of the boost converter and power source for the IC battery
Power good comparator output
Signal and power ground
Switch pin
PIN FUNCTIONS
XSHD (Pin 1)
PGOOD (Pin 4)
XSHD is a logic-level shutdown control pin. When XSHD is
low, the IC’s switching is disabled and an antiringing switch
is connected between LX and VIN. When XSHD is high, the
IC is working in normal operation.
PGOOD is the open-drain output pin of the power good
comparator. It is low when VOUT is 10 % lower than its
regulation voltage. After the soft start is finished and VOUT is
higher than 90 % of its regulation voltage, PGOOD will go
high. Its hysteresis is 2 %.
VIN (Pin 2)
VIN is the pin connected to the battery input voltage. At startup, SIP12502 is powered from the voltage at the VIN pin.
Once VOUT exceeds VIN, the SIP12502 is powered from
VOUT. This increases the drive to the gate of the internal
power switch, to allow higher maximum output currents and
higher converter efficiency.
VOUT (Pin 3)
VOUT is the output of the boost converter and also the power
source for the IC.
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GND (Pin 5)
GND is the ground pin for signal and power ground.
LX (Pin 6)
LX is connects to the drain of the internal power MOSFET
(boost switch). Externally, the LX pin should be connected to
the boost inductor and Schottky diode. If the inductor current
falls to zero, or XSHD is low, an internal antiringing switch is
connected from LX to VIN to minimize EMI.
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
Product is End of Life 3/2014
SiP12502
Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
DETAILED OPERATION
SiP12502 is a 300 kHz boost converter IC, packaged in 6-pin
MLP33 PowerPAKTM package. With start-up from input
voltages as low as 0.65 V, this device features fixed
frequency voltage mode PWM control with internal frequency
compensation. With its low rDS(on) internal power MOSFET,
this device maintains high efficiency over a wide range of
load currents. Under light load conditions, it switches to PFM
mode to maintain high efficiency. A power good signal is
available to monitor the output voltage.
PWM operation
After the soft-start interval is over, the device works in PWM
operation with a fixed frequency of 300 kHz, with automatic
switch-over to PFM operation during light load conditions.
PFM Operation
When operating into light loads, the SiP12502 automatically
switches to PFM operation. This reduces gate charge losses
in the boost switch, hence raising converter efficiency.
Low Voltage Start-Up
SiP12502 is designed to start-up at input voltage of typically
0.65 V. At start-up, VOUT is lower than VIN due to the voltage
drop of the Schottky diode. Therefore, the device uses VIN as
the power source for its control logic and internal gate drive,
until VOUT exceeds VIN. During the start-up interval, the
boost switch’s conduction interval during each cycle is
determined by the time taken for the inductor current to reach
internal current limit, followed by a fixed off time before the
switch is allowed to turn on again. Once VOUT exceeds VIN,
the device uses VOUT as the IC’s power source. When VOUT
exceeds 1.89 V, the device engages its built-in soft-start
circuitry.
Over Voltage Protection
If the output voltage is above 10 % of the regulation voltage,
the device will turn off the internal power MOSFET and wait
until the output voltage falls below the regulation voltage,
then the PWM operation is enabled again.
Thermal Shutdown Protection
If the internal device temperature rises above 160 °C, the
device will turn off the internal power MOSFET. Once the die
temperature falls below 140 °C, the device performs a new
soft-start cycle, the converter resumes normal operation.
Antiringing Control
Soft-Start
During soft-start, the loop compensation guarantees the slow
increase of output voltage, so that no large voltage overshoot
or inrush current transients occur when the soft-start period
ends.
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
The antiringing control circuitry prevents high frequency
ringing at the LX pin as the inductor current goes to zero by
damping the resonant circuit formed by L and CLX
(capacitance on LX pin). When the IC is shutdown, this
antiringing switch is also turned on.
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Product is End of Life 3/2014
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TYPICAL CHARACTERISTICS
0.180
0.40
0.175
Supply Current 2 (mA)
Supply Current 1 (mA)
0.35
0.30
0.170
0.165
0.160
0.155
0.150
0.25
0.145
0.20
- 50
0.140
- 30
- 10
10
30
50
70
- 50
90
- 30
- 10
10
30
50
70
90
Temperature (°C)
Temperature (°C)
Supply Current 2 vs. Temperature
Supply Current 1 vs. Temperature
93
320
92
310
91
90
% Duty Cycle
Frequency (kHz)
300
290
280
89
88
87
86
270
85
260
84
250
- 50
- 30
- 10
10
30
50
70
83
- 60
90
- 40
- 20
0
20
40
60
80
100
Temperature (°C)
Temperature (°C)
Maximum PWM Duty Cycle vs. Temperature
Frequency vs. Temperature
1.0
0.20
0.9
Shutdown Input Voltage
Threshold (V)
RDS(on) Ω
0.15
0.10
0.8
0.7
0.6
0.5
0.4
0.05
0.3
0.00
0
1
2
3
4
VOUT (V)
RDS(on) vs. Output Voltage
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6
5
6
0.2
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
VIN (V)
Shutdown Input Voltage Threshold vs. VIN
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
Product is End of Life 3/2014
SiP12502
Vishay Siliconix
TYPICAL CHARACTERISTICS
4
1.2
VIN = 5.0 V
3
VOUT Voltage Accuracy (%)
Shutdown Threshold (V)
1.0
0.8
VIN = 2.0 V
0.6
VIN = 0.8 V
0.4
0.2
0.0
- 50
1
0
-1
-2
-3
- 30
- 10
10
30
50
70
-4
- 50
90
- 10
10
30
50
Temperature (°C)
Temperature (°C)
VOUT Voltage vs. Temperature
90
100
80
90
70
80
70
90
70
Efficiency (%)
50
40
30
60
50
40
30
20
20
10
10
0
0.1
- 30
Shutdown Threshold vs. Temperature
60
Efficiency (%)
2
1
10
100
1000
Load Current (mA)
0
0.1
1
10
100
1000
Load Current (mA)
VIN = 2.4 V, VOUT = 3.3 V
VIN = 1.2 V, VOUT = 2 V
100
90
80
Efficiency (%)
70
60
50
40
30
20
10
0
0.1
1
10
100
1000
Load Current (mA)
VIN = 2.4 V, VOUT = 5 V
Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
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Product is End of Life 3/2014
SiP12502
Vishay Siliconix
TYPICAL WAVEFORMS
VOUT
50 mV/div
VOUT
20 mV/div
LX
2 V/div
LX
2 V/div
1 µs/div
100 µs/div
Typical Switching Waveform PWM Mode
VIN = 1.2 V, VOUT = 3.3 V, Load Current = 150 mA,
L = 10 µH; COUT = 47 µF
Typical Switching Waveform PFM Mode
VIN = 1.2 V, VOUT = 3.3 V, Load Current = 10 mA,
L = 10 µH; COUT = 47 µF
VOUT
1 V/div
PGOOD
1 V/div
5 ms/div
Soft Start and PGOOD
VIN = 1.2 V, VOUT = 3.3 V, Load Current = 50 mA,
L = 10 µH; COUT = 47 µF
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73578.
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Document Number: 73578
S09-1456-Rev. B, 03-Aug-09
Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8 and 10 (POWER IC ONLY)
4xQ
//
ccc
A
NX
8
Detail D
TopView
C
A2
A1
A3
0.08 C
Side View
Detail C
NX b
bbb M C A A
e
1
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
Detail C
A1
Seating
Plane
C
5
ddd M C
2
Exposed
Pad
(Optional)
L
7
R2
R
11
D
E2
L2
E2/2
Detail D
A
B
NxK
See Detail A
7
N
8
N-1
6
See Detail B
D2/2
(ND-1) x
Pin 1
Mark
4
e
9
D2
aaa C
9
Bottom View
2X
2X
Datum A or B
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
aaa C
1
E
L2
Datum A or B
NX R1
NX R1
L
e/2
e
Even pin/Side
L2
pin Tip
e
pin Tip
5
Odd pin/Side
5
Detail B
0.17 min
L1
Exposed Slug/Heat Sink
L2
This Feature Applies To
Both Ends of The Package
0.17
0.30
B
Exposed Metalized Feature
Detail A
Document Number: 72820
28-Jan-04
10
Edge of Plastic Body
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Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8, 10
N = 6 PITCH: 0.95 mm
N = 8 PITCH: 0.65 mm
N = 10 PITCH: 0.50 mm
MILLIMETERS*
Dim
A
A1
A2
A3
aaa
b-6
b-8
b-10
bbb
ccc
D
D2
ddd
E
E2
e-6
e-8
e-10
K
L
L1-6
L1-8
L1-10
L2
R Ref
R1 Ref-6
R1 Ref-8
R1 Ref-10
Q
INCHES
Basic
Min
Nom
Max
Basic
Min
Nom
Max
Notes
−
0.80
0.90
1.00
−
0.031
0.035
0.039
1, 2
−
0.00
0.025
0.05
−
0.000
0.001
0.002
1, 2
−
0.65
0.70
0.75
−
0.026
0.028
0.030
1, 2
−
0.15
0.20
0.25
−
0.006
0.008
0.010
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
−
0.33
0.35
0.43
−
0.013
0.014
0.017
1, 2, 8
−
0.285
0.305
0.385
−
0.011
0.012
0.015
1, 2, 8
−
0.18
0.20
0.28
−
0.007
0.008
0.011
1, 2, 8
−
−
0.10
−
−
−
0.004
−
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.92
2.02
2.12
−
0.076
0.080
0.083
1, 2, 8
−
−
0.05
−
−
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.10
1.20
1.30
−
0.043
0.047
0.051
1, 2, 8
−
−
0.95
−
−
−
0.037
−
1, 2
−
−
0.65
−
−
−
0.026
−
1, 2
−
−
0.50
−
−
−
0.020
−
1, 2
−
0.20
−
−
−
0.008
−
−
5, 11
−
0.20
0.29
0.45
−
0.008
0.011
0.018
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
−
−
−
−
−
−
−
1, 2, 8
−
−
−
0.125
−
−
−
0.005
5, 11
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.127
−
−
−
0.005
−
1, 2, 8
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.075
−
−
−
0.003
−
1, 2, 8
−
0_
10_
12_
−
0_
10_
12_
1, 2
0.002
1, 2
* Use millimeters as the primary measurement.
ECN: S-40082—Rev. A, 02-Feb-04
DWG: 5925
NOTES:
1.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2.
All dimensions are in millimeters. All angels are in degrees.
3.
N is the total number of pins.
4.
The pin #1 identifier and pin numbering convention shall conform to JESD 95-1 SPP-012. Details of pin #1 identifier is located within the
zone indicated. The pin #1 identifier is marked.
5.
Dimension b applies to metallized pin and is measured between 0.15 mm and 0.20 mm from the pin tip.
6.
ND refers to the maximum number of pins on the D side.
7.
Depopulation of pins is allowed and will be called out on the individual variation.
8.
Coplanarity applies to the exposed heat sink slug as well as the pins.
9.
Profile tolerance (aaa) will be applicable only to the plastic body and not to the metallized features (such as the pin tips and tie bars.)
Metallized features may protrude a maximum of L2 from the plastic body profile.
10.
L1 max is not called out, the metallized feature will extend to the exposed pad. Thus, the 0.17-mm gap does not apply.
11.
The corner will be sharp unless otherwise specified with radius dimensions.
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Document Number: 72820
28-Jan-04
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
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Document Number: 91000