SiP12501 Datasheet

Product is End of Life 3/2014
SiP12501
Vishay Siliconix
Boost Converter for Single/Double AA Cell or NiMH Battery for
White LED Applications
DESCRIPTION
FEATURES
SiP12501 is a boost converter IC for single or double cell
NiMH or Alkaline battery pack, which can drive white LEDs
connected in parallel to provide backlight in hand-held
devices. Designed with an internal low threshold power
MOSFET, it is capable of starting up with a low battery
voltage of 0.65 V. For best efficiency performance, the
SiP12501 is designed to operate in PWM mode with 600 kHz
switching. The voltage-mode PWM design is internally
compensated, reducing the external parts count. It accepts
input voltages from 0.65 V to 3.3 V, regulates output current
of up to 60 mA from a 0.9 V input. The LED current can be
adjusted externally for its brightness control. SiP12501
features low shutdown current of under 1 µA, internal power
MOS, thermal shutdown protection and antiringing control.
• Voltage mode control with internal frequency
compensation
• 0.65 V to 3.3 V input voltage range
• Low startup voltage: 0.65 V
• PWM control with 600 kHz fixed switching frequency
• Analog control of LED intensity
• Power supply from output voltage
• Regulated output current
• Integrated UVLO and soft-start
• Logic controlled shutdown (< 1 µA)
• High efficiency: typical 75 %
• Internal power MOS
• Antiringing switch to minimize EMI
• Thermal shutdown
• Minimum external components
• PowerPAK® MLP33-6 package
SiP12501 is available in a lead (Pb)-free 6 pin, PowerPAK
MLP33 package and is specified to operate over the
industrial temperature range of - 40 °C to 85 °C.
APPLICATIONS
•
•
•
•
•
White LED backlighting
Handheld devices
Digital cameras
Portable applications
LCD bias supplies
TYPICAL APPLICATION CIRCUIT
VIN
10 µH
2
10 µF
VIN
XSHD
1
MBR0520
XSHD
LX
6
4.7 µF
SiP12501
5
GND
FB
4
VOUT
3
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
15 Ω
15 Ω
15 Ω
15 Ω
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Product is End of Life 3/2014
SiP12501
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
Unit
- 0.3 to 6
- 0.3 to VOUT + 0.5
LX Voltage
Output Voltage, VOUT
V
- 0.3 to 6
- 0.3 to VIN + 0.5
XSHD Voltage
FB Voltage
- 0.3 to 6
Maximum Junction Temperature
150
Storage Temperature
- 55 to 150
Operating Junction Temperature
°C
125
Power Dissipationa
PowerPAK MLP33-6 (TA = 70 °C)a
PowerPAK MLP33-6
Thermal Resistanceb
1100
mW
50
°C/W
Notes:
a. Derate 20 mW/°C above 70 °C.
b. Device mounted with all leads soldered or welded to PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
Unit
0.65 to 3.3
Output Voltage, VOUT
3.5 to 5
XSHD Voltage
0 to VIN
V
0 to VOUT + 0.5 V
LX Voltage
FB Voltage
0 to 5
Operating Temperature Range
- 40 to 85
°C
SPECIFICATIONSa
Parameter
Symbol
Test Conditions Unless Specified
VIN = 1.2 V, VOUT = 3.9 V, TA = 25 °C
Minimum Start-Up Voltage
VSTART
ILOAD = 1 mA
Minimum Operating Voltaged
VHOLD
XSHD = VIN
Feedback Voltage
VFB
Feedback Input Current
IFB
Maximum PWM Duty Cycle
MAXDTY
PWM Switching Frequency
fOSC
Limits
Typ.c
Max.b
Full
0.65
0.85
Full
0.55
Temp.
Full
IQ
VFB = 0.4 V
Full
ISTB
XSHD = 0 V, not including switch leakage
Full
LX = 5 V
RDS(on)
VOUT = 3.3 V
0.8 V ≤ VIN ≤ 0.9 V
XSHD Input High Level
XSHD Input Low Level
VXSHDH
VXSHDL
0.309
V
nA
80
87
425
600
775
%
200
300
1
1
2
Full
kHz
µA
10
Ω
0.24
Full
Unit
0.318
1
Full
ILEAK
0.3
0.282
VFB = 0.3 V
Quiescent Current
NMOS Switch On Resistance
Min.
b
0.291
Stand-By Current
NMOS Switch Leakage
a
0.55
0.9 V< VIN ≤ 2 V
Full
0.8
2 V < VIN ≤ 5 V
Full
1.2
V
Full
0.2
Thermal Shutdown
TSHD
160
Thermal Shutdown Hysteresis
THYST
20
°C
Notes:
a. Full = - 40 °C to 85 °C.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (- 40 °C to 85 °C).
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
d. Minimum Operating Voltage is determined by the battery’s capability to provide energy as it is deeply discharged.
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Product is End of Life 3/2014
SiP12501
Vishay Siliconix
PIN CONFIGURATION AND TRUTH TABLE
PowerPAK MLP33-6
XSHD
1
6
LX
VIN
2
5
GND
VOUT
3
4
FB
Top View
ORDERING INFORMATION
Part Number
Temperature Range
Marking
SiP12501DMP-T1-E3
- 40 °C to 85 °C
2501
PIN DESCRIPTION
Pin Number
Name
1
XSDH
2
VIN
3
VOUT
4
FB
5
GND
6
LX
Function
Logic controlled shutdown input, XSHD = high: normal operation, XSHD = low: shutdown
Battery input voltage
Output of the boost converter and power source for the IC
Feedback pin
Signal and power ground
Switch pin
PIN FUNCTIONS
XSHD (Pin 1)
FB (Pin 4)
XSHD is the logic controlled shutdown input pin. When
XSHD is low, the IC is shutdown and an antiringing switch is
connected between LX and VIN. When XSHD is high, the IC
is working in normal operation.
FB is the feedback voltage pin, it senses the LED current
through the ballast resistor, the difference between it and the
internal 0.3 V reference is amplified by the error amplifier.
GND (Pin 5)
VIN (Pin 2)
VIN is the pin connected to battery input voltage. The IC gets
its start-up bias from VIN at the beginning. Once VOUT
exceeds VIN, bias will come from VOUT. Thus, once started,
operation is completely independent from VIN. Operation is
only limited by the output voltage level and the battery’s
internal series resistance.
GND is the pin for signal and power ground.
LX (Pin 6)
LX is the pin of the drain for internal power MOS. LX is also
connected to inductor and Schottky diode. If the inductor
current falls to zero, or XSHD is low, an internal antiringing
switch is connected from LX to VIN to minimize EMI.
VOUT (Pin 3)
VOUT is the output of the boost converter and also the power
source for the IC.
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
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Product is End of Life 3/2014
SiP12501
Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
VOUT
VIN
GND
Thermal Shutdown
Compensation
Antiringing SW
Start-Up
LX
FB
E/A
+
+
PWM
-
Reference and Soft-Start
XSHD
Driver
Oscillator
DETAILED OPERATION
SiP12501 is a 600 kHz boost converter IC, packaged in 6 pin
MLP33, for white LED applications. With start-up from low
battery input voltage of 0.65 V, this device features fixed
frequency voltage mode PWM control with internal frequency
compensation. With its low rDS(on) internal power MOSFET,
this device maintains high efficiency over a wide range of
load current.
Low Voltage Start-Up
SiP12501 is designed to start-up at input voltage of typically
0.65 V. In the beginning, VOUT is lower than VIN because of
the voltage drop of the Schottky diode, the device uses VIN
as the power source for the start-up circuit and uses current
limit with fixed off-time to control the increase of the output
voltage. Once VOUT exceeds VIN, the device uses VOUT as
the power source. When VOUT exceeds 1.89 V, the device
switches to soft-start.
Soft-Start
During soft-start, the loop compensation guarantees the slow
increase of the output voltage and inrush current, so that no
large voltage overshoot and inrush current occur when the
soft-start is ended.
PWM operation
After soft-start, the device works in PWM operation with a
fixed frequency of 600 kHz.
VIN
10 µF
1
Antiringing Control
The antiringing control circuitry prevents high frequency
ringing of the LX pin as the inductor current goes to zero by
damping the resonant circuit formed by L and CLX
(capacitance on LX pin). When the IC is shutdown, this
antiringing switch is also turned on.
APPLICATION INFORMATION
White LED Brightness Control
The current of white LED can be adjusted by a PWM signal
on XSHD or by a variable dc voltage to control its brightness.
(see Figure 1.) As control voltage VCTRL increases, the
voltage drop on R2 increases and the voltage drop on R1
decreases. Thus, the LED current decreases. The selection
of R2 and R3 will make the current from VCTRL much smaller
than LED current and much larger than the FB pin bias
current.
10 µH
2
VIN
XSHD
Thermal Shutdown Protection
If the temperature of the device is above 160 °C, the device
will turn off the internal power MOSFET and wait until the
temperature drops below 140 °C, then the device goes into
the soft-start process again and finally the system recovers.
During thermal shutdown, the output voltage drops below
1.89 V minus UVLO hysteresis, start-up will be triggered to
keep the output voltage above 1.89 V.
LX 6
XSHD
ILED
0.3 V
15 Ω
0.3 - V CTRL
15 Ω
R2
R3
MBR0520
4.7 µF
SiP12501
5
R2
1 kΩ
FB 4
XSHD
VOUT
3
R3
3.9 kΩ
R1
15 Ω
15 Ω
15 Ω
15 Ω
VCTRL
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Product is End of Life 3/2014
SiP12501
Vishay Siliconix
90
0.160
89
0.158
88
0.156
Supply Curremt (mA)
% Duty Cycle
TYPICAL CHARACTERISTICS
87
86
85
84
0.154
0.152
0.150
0.148
83
0.146
82
0.144
81
0.142
80
- 50
- 30
- 10
10
30
50
70
0.140
- 50
90
- 30
- 10
10
50
70
90
70
90
Temperature (°C)
Temperature (°C)
Maximum PWM Duty Cycle vs. Temperature
Supply Current vs. Temperature
4
1.2
VIN = 5 V
3
Shutdown Threshold (V)
1.0
Feedback Voltage Accuracy (%)
30
2
1
VOUT = 3.9 V
0
-1
0.8
VIN = 2 V
0.6
VIN = 0.8 V
0.4
-2
0.2
-3
-4
- 50
- 30
- 10
10
30
50
70
Temperature (°C)
Feedback Voltage vs. Temperature
Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
90
0.0
- 50
- 30
- 10
10
30
50
Temperature (°C)
Shutdown Threshold vs. Temperature
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Product is End of Life 3/2014
SiP12501
Vishay Siliconix
TYPICAL WAVEFORMS
VXSHD
0.5 V/div
VIN
0.5 V/div
VOUT
1 V/div
VFB
0.2 V/div
VIN = 0.8 V
1 ms/div
VOUT
2 V/div
100 ms/div
Four LEDs in series
Figure 3. Startup
VIN = VXSHD = 0 V to 0.8 V
Figure 2. PWM Dimming Control
200 Hz 50 % Duty Cycle PWM Signal on XSHD Pin
VLX
2 V/div
VOUT
50 mV/div
ac coupled
VFB
20 mV/div
ac coupled
0.5 µs/div
Figure 4. Switching Waveforms: VLX, VOUT and VFB
VIN = 0.8 V, L = 10 µH, COUT = 4.7 µF, Four LEDs in Parallel
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see www.vishay.com/ppg?73192.
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Document Number: 73192
S09-1455-Rev. B, 03-Aug-09
Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8 and 10 (POWER IC ONLY)
4xQ
//
ccc
A
NX
8
Detail D
TopView
C
A2
A1
A3
0.08 C
Side View
Detail C
NX b
bbb M C A A
e
1
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
Detail C
A1
Seating
Plane
C
5
ddd M C
2
Exposed
Pad
(Optional)
L
7
R2
R
11
D
E2
L2
E2/2
Detail D
A
B
NxK
See Detail A
7
N
8
N-1
6
See Detail B
D2/2
(ND-1) x
Pin 1
Mark
4
e
9
D2
aaa C
9
Bottom View
2X
2X
Datum A or B
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
aaa C
1
E
L2
Datum A or B
NX R1
NX R1
L
e/2
e
Even pin/Side
L2
pin Tip
e
pin Tip
5
Odd pin/Side
5
Detail B
0.17 min
L1
Exposed Slug/Heat Sink
L2
This Feature Applies To
Both Ends of The Package
0.17
0.30
B
Exposed Metalized Feature
Detail A
Document Number: 72820
28-Jan-04
10
Edge of Plastic Body
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Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8, 10
N = 6 PITCH: 0.95 mm
N = 8 PITCH: 0.65 mm
N = 10 PITCH: 0.50 mm
MILLIMETERS*
Dim
A
A1
A2
A3
aaa
b-6
b-8
b-10
bbb
ccc
D
D2
ddd
E
E2
e-6
e-8
e-10
K
L
L1-6
L1-8
L1-10
L2
R Ref
R1 Ref-6
R1 Ref-8
R1 Ref-10
Q
INCHES
Basic
Min
Nom
Max
Basic
Min
Nom
Max
Notes
−
0.80
0.90
1.00
−
0.031
0.035
0.039
1, 2
−
0.00
0.025
0.05
−
0.000
0.001
0.002
1, 2
−
0.65
0.70
0.75
−
0.026
0.028
0.030
1, 2
−
0.15
0.20
0.25
−
0.006
0.008
0.010
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
−
0.33
0.35
0.43
−
0.013
0.014
0.017
1, 2, 8
−
0.285
0.305
0.385
−
0.011
0.012
0.015
1, 2, 8
−
0.18
0.20
0.28
−
0.007
0.008
0.011
1, 2, 8
−
−
0.10
−
−
−
0.004
−
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.92
2.02
2.12
−
0.076
0.080
0.083
1, 2, 8
−
−
0.05
−
−
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.10
1.20
1.30
−
0.043
0.047
0.051
1, 2, 8
−
−
0.95
−
−
−
0.037
−
1, 2
−
−
0.65
−
−
−
0.026
−
1, 2
−
−
0.50
−
−
−
0.020
−
1, 2
−
0.20
−
−
−
0.008
−
−
5, 11
−
0.20
0.29
0.45
−
0.008
0.011
0.018
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
−
−
−
−
−
−
−
1, 2, 8
−
−
−
0.125
−
−
−
0.005
5, 11
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.127
−
−
−
0.005
−
1, 2, 8
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.075
−
−
−
0.003
−
1, 2, 8
−
0_
10_
12_
−
0_
10_
12_
1, 2
0.002
1, 2
* Use millimeters as the primary measurement.
ECN: S-40082—Rev. A, 02-Feb-04
DWG: 5925
NOTES:
1.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2.
All dimensions are in millimeters. All angels are in degrees.
3.
N is the total number of pins.
4.
The pin #1 identifier and pin numbering convention shall conform to JESD 95-1 SPP-012. Details of pin #1 identifier is located within the
zone indicated. The pin #1 identifier is marked.
5.
Dimension b applies to metallized pin and is measured between 0.15 mm and 0.20 mm from the pin tip.
6.
ND refers to the maximum number of pins on the D side.
7.
Depopulation of pins is allowed and will be called out on the individual variation.
8.
Coplanarity applies to the exposed heat sink slug as well as the pins.
9.
Profile tolerance (aaa) will be applicable only to the plastic body and not to the metallized features (such as the pin tips and tie bars.)
Metallized features may protrude a maximum of L2 from the plastic body profile.
10.
L1 max is not called out, the metallized feature will extend to the exposed pad. Thus, the 0.17-mm gap does not apply.
11.
The corner will be sharp unless otherwise specified with radius dimensions.
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Document Number: 72820
28-Jan-04
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Revision: 02-Oct-12
1
Document Number: 91000