SiP12401 Datasheet

SiP12401
Vishay Siliconix
Boost Controller For Double AA Cell or Li-Ion Battery
For White LED Application
DESCRIPTION
FEATURES
SiP12401 is a boost controller IC for double cell NiMH or
Alkaline battery and Li Ion battery, which can drive white
LEDs connected in series to provide backlight in hand-held
devices. Series connection of the LEDs provides identical
LED currents resulting in uniform brightness and eliminating
the need for ballast resistors. For best efficiency
performance, the SiP12401 is designed to operate in PWM
mode with 600 kHz switching. The voltage-mode PWM
design is internally compensated, reducing the external
parts count. It accepts input voltages from 1.8 V to 5.0 V. The
LED current can be adjusted externally for its brightness
control. SiP12401 features low shutdown current of under
1 µA.
• Voltage Mode Control with Internal
Frequency Compensation
• 1.8 V to 5.0 V Input Voltage Range
• PWM Control with 600 kHz Fixed
Switching Frequency
• Analog Control of LED Intensity
• Regulated Output Current
• Integrated UVLO and Soft-Start
• Logic Controlled Shutdown (< 1 µA)
• High Efficiency: Typical 80 %
• PowerPAK® MLP33-6 Package
SiP12401 is available in a lead (Pb)-free 6-pin, PowerPAK
MLP33 package and is specified to operate over the
industrial temperature range of - 40 °C to 85 °C.
APPLICATIONS
•
•
•
•
•
RoHS
COMPLIANT
White LED Backlighting
LCD Bias Supplies
Handheld Devices
Digital Cameras
Portable Applications
TYPICAL APPLICATION CIRCUIT
MBR0520
VIN
22 µH
10 µF
4.7 µF
2
VIN
XSHD
1
XSHD
AGND
4
SiP12401
3
EXT
FB
6
Si2302ADS
PGND
5
Document Number: 73193
S-71822-Rev. C, 03-Sep-07
15 Ω
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SiP12401
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
Unit
- 0.3 to 6
EXT Voltage
- 0.3 to VIN + 0.5
XSHD Voltage
- 0.3 to VIN + 0.5
FB Voltage
- 0.3 to VIN + 0.5
Maximum Junction Temperature
150
Storage Temperature
- 55 to 150
Operating Junction Temperature
°C
125
PowerPAK MLP33-6 (TA = 70 °C)a
Power Dissipationa
Thermal Resistance
V
b
1100
mW
50
°C/W
PowerPAK MLP33-6
Notes:
a. Derate 20 mW/°C above 70 °C.
b. Device Mounted with all leads soldered or welded to PC board.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE (all voltages referenced to GND = 0 V)
Parameter
Limit
Input Voltage, VIN
Unit
1.8 to 5
0 V to VIN
XSHD, EXT Voltage
V
0 to VOUT + 0.5
LX Voltage
FB Voltage
0 to 5
Operating Temperature Range
- 40 to 85
°C
SPECIFICATIONSa
Parameter
Input Voltage
UVLO
Symbol
Test Conditions Unless Specified
VIN = 3 V, TA = 25 °C
Limits
a
b
Temp
Min
VIN
Full
1.8
VUVLO
Full
UVLO Hysteresis
VUVLOHYST
Feedback Voltage
VFB
Feedback Input Current
IFB
Maximum PWM Duty Cycle
MAXDTY
PWM Switching Frequency
fOSC
Typc
Maxb
1.65
1.77
V
0.1
0.291
Full
Quiescent Current
IQ
VFB = 0.4 V
ISTB
XSHD = 0 V
0.318
VXSHDH
Full
XSHD Input Low Level
VXSHDL
Full
EXT High On Resistance
REXTH
EXT Low On Resistance
REXTL
nA
77
85
425
600
775
200
300
Full
XSHD Input High Level
IEXT = 10 mA
0.309
1
Full
Stand-By Current
0.3
0.282
VFB = 0.3 V
Unit
5
%
1
1.2
0.2
35
30
kHz
µA
V
Ω
Notes:
a. Full = - 40 to 85 °C.
b. The algebraic convention whereby the most negative value is a minimum and the most positive a maximum (- 40° to 85 °C).
c. Typical values are for DESIGN AID ONLY, not guaranteed nor subject to production testing.
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Document Number: 73193
S-71822-Rev. C, 03-Sep-07
SiP12401
Vishay Siliconix
PIN CONFIGURATION AND TRUTH TABLE
PowerPAK MLP33-6
XSHD
1
6
EXT
VIN
2
5
PGND
FB
3
4
AGND
Top View
ORDERING INFORMATION
Part Number
Temperature Range
Marking
SiP12401DMP-T1-E3
- 40 to 85 °C
2401
PIN DESCRIPTION
Pin Number
Name
1
XSDH
Function
2
VIN
Battery Input Voltage
3
FB
Output Voltage Feedback Pin
4
AGND
5
PGND
6
EXT
Logic Controlled Shutdown Input, XSHD = High: Normal Operation, XSHD = Low: Shutdown
Signal Ground
Power Ground
Drive Pin for External Power MOS
PIN FUNCTIONS
XSHD (Pin 1)
AGND (Pin 4)
XSHD is the logic controlled shutdown input pin. When
XSHD is low, the IC is shutdown and it’s quiescent current is
less than 1 µA. When XSHD is high, the IC is working in
normal operation.
AGND is the pin for ground of controlling circuit.
VIN (Pin 2)
EXT (Pin 6)
VIN is the pin connected to battery input voltage. The IC gets
its power supply from VIN.
EXT is the output pin of internal driver. It’s connected to the
gate of external power MOSFET.
PGND (Pin 5)
PGND is the pin for ground of the internal power MOS driver.
FB (Pin 3)
FB is the feedback pin of the output voltage via resistor
divider. FB is about 0.3 V and its difference from 0.3 V
reference voltage is amplified by the error amplifier.
Document Number: 73193
S-71822-Rev. C, 03-Sep-07
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SiP12401
Vishay Siliconix
FUNCTIONAL BLOCK DIAGRAM
VIN
AGND
Compensation
FB
E/A
+
+
PWM
-
Driver
EXT
PGND
Reference and Soft-Start
XSHD
Oscillator
DETAILED OPERATION
PWM operation
SiP12401 is a 600 kHz boost controller IC, packaged in 6-pin
MLP33, for white LED applications. It features fixed
frequency voltage mode PWM control with internal frequency
compensation. With the low rDS(on) external power MOSFET,
this device maintains high efficiency over a wide range of
load current.
APPLICATION INFORMATION
Soft-Start
White LED Brightness Control
During soft-start, the loop compensation guarantees the slow
increase of the output voltage and inrush current, so that no
large voltage overshoot and inrush current occur when the
soft-start is ended.
The current of white LED can be adjusted by PWM signal on
the XSHD pin or by a variable dc voltage to control its
brightness, (see Figure 1.) As control voltage VCTRL
increases, the voltage drop on R2 increases and the voltage
drop on R1 decreases. Thus, the LED current decreases.
The selection of R2 and R3 will make the current from VCTRL
much smaller than LED current and much larger than the FB
pin bias current.
After soft-start, the device is working in PWM operation with
a fixed frequency of 600 kHz.
MBR0520
VIN
22 µH
4.7 µF
2
10 µF
VIN
XSHD
ILED
0.3 V
15 Ω
0.3 - V CTRL
15 Ω
1
XSHD
AGND
4
SiP12401
R2
R3
3
EXT
FB
PGND
5
6
Si2302ADS
R2
1 kΩ
R3
3.9 kΩ
15 Ω
VCTRL
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Document Number: 73193
S-71822-Rev. C, 03-Sep-07
SiP12401
Vishay Siliconix
TYPICAL CHARACTERISTICS
85
220
215
Supply Curremt (mA)
% Duty Cycle
84
83
82
210
205
200
195
190
81
185
80
- 50
- 30
- 10
10
30
50
70
180
- 50
90
- 30
- 10
Temperature (°C)
10
50
70
90
70
90
Temperature (°C)
Maximum PWM Duty Cycle vs. Temperature
Supply Current vs. Temperature
4
1.2
VIN = 5 V
3
Shutdown Threshold (V)
1.0
Feedback Voltage Accuracy (%)
30
2
1
VIN = 5 V
0
VIN = 2 V
-1
0.8
VIN = 2 V
0.6
0.4
-2
0.2
-3
-4
- 50
- 30
- 10
10
30
50
70
Temperature (°C)
Feedback Voltage vs. Temperature
Document Number: 73193
S-71822-Rev. C, 03-Sep-07
90
0.0
- 50
- 30
- 10
10
30
50
Temperature (°C)
Shutdown Threshold vs. Temperature
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SiP12401
Vishay Siliconix
TYPICAL WAVEFORMS
VXSHD
2 V/div
VIN
20 mV/div
ac coupled
VOUT
50 mV/div
ac coupled
VOUT
2 V/div
VEXT
2 V/div
VFB
0.2 V/div
VIN = 3.6 V
1 ms/div
1 µs/div
Four LEDs in series
Figure 1. PWM Dimming Control
200 Hz 50 % Duty Cycle PWM Signal on XSHD Pin
Figure 3. Switching Waveforms: VIN, VOUT and VEXT
VIN = 3.6 V, L = 22 µH, COUT = 4.7 µF, Four LEDs in Series
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?73193.
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Document Number: 73193
S-71822-Rev. C, 03-Sep-07
Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8 and 10 (POWER IC ONLY)
4xQ
//
ccc
A
NX
8
Detail D
TopView
C
A2
A1
A3
0.08 C
Side View
Detail C
NX b
bbb M C A A
e
1
ÉÉÉ
ÇÇ
ÉÉÉ
ÇÇ
ÉÉÉ
Detail C
A1
Seating
Plane
C
5
ddd M C
2
Exposed
Pad
(Optional)
L
7
R2
R
11
D
E2
L2
E2/2
Detail D
A
B
NxK
See Detail A
7
N
8
N-1
6
See Detail B
D2/2
(ND-1) x
Pin 1
Mark
4
e
9
D2
aaa C
9
Bottom View
2X
2X
Datum A or B
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
ÎÎÎÎ
aaa C
1
E
L2
Datum A or B
NX R1
NX R1
L
e/2
e
Even pin/Side
L2
pin Tip
e
pin Tip
5
Odd pin/Side
5
Detail B
0.17 min
L1
Exposed Slug/Heat Sink
L2
This Feature Applies To
Both Ends of The Package
0.17
0.30
B
Exposed Metalized Feature
Detail A
Document Number: 72820
28-Jan-04
10
Edge of Plastic Body
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Package Information
Vishay Siliconix
PowerPAKr MLP33-6, 8, 10
N = 6 PITCH: 0.95 mm
N = 8 PITCH: 0.65 mm
N = 10 PITCH: 0.50 mm
MILLIMETERS*
Dim
A
A1
A2
A3
aaa
b-6
b-8
b-10
bbb
ccc
D
D2
ddd
E
E2
e-6
e-8
e-10
K
L
L1-6
L1-8
L1-10
L2
R Ref
R1 Ref-6
R1 Ref-8
R1 Ref-10
Q
INCHES
Basic
Min
Nom
Max
Basic
Min
Nom
Max
Notes
−
0.80
0.90
1.00
−
0.031
0.035
0.039
1, 2
−
0.00
0.025
0.05
−
0.000
0.001
0.002
1, 2
−
0.65
0.70
0.75
−
0.026
0.028
0.030
1, 2
−
0.15
0.20
0.25
−
0.006
0.008
0.010
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
−
0.33
0.35
0.43
−
0.013
0.014
0.017
1, 2, 8
−
0.285
0.305
0.385
−
0.011
0.012
0.015
1, 2, 8
−
0.18
0.20
0.28
−
0.007
0.008
0.011
1, 2, 8
−
−
0.10
−
−
−
0.004
−
1, 2
−
−
0.10
−
−
−
0.004
−
1, 2
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.92
2.02
2.12
−
0.076
0.080
0.083
1, 2, 8
−
−
0.05
−
−
3.00
−
−
−
0.118
−
−
−
1, 2, 8
−
1.10
1.20
1.30
−
0.043
0.047
0.051
1, 2, 8
−
−
0.95
−
−
−
0.037
−
1, 2
−
−
0.65
−
−
−
0.026
−
1, 2
−
−
0.50
−
−
−
0.020
−
1, 2
−
0.20
−
−
−
0.008
−
−
5, 11
−
0.20
0.29
0.45
−
0.008
0.011
0.018
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
0.16
0.24
0.40
−
0.006
0.009
0.016
1, 2, 8
−
−
−
−
−
−
−
−
1, 2, 8
−
−
−
0.125
−
−
−
0.005
5, 11
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.127
−
−
−
0.005
−
1, 2, 8
−
−
0.15
−
−
−
0.006
−
1, 2, 8
−
−
0.075
−
−
−
0.003
−
1, 2, 8
−
0_
10_
12_
−
0_
10_
12_
1, 2
0.002
1, 2
* Use millimeters as the primary measurement.
ECN: S-40082—Rev. A, 02-Feb-04
DWG: 5925
NOTES:
1.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2.
All dimensions are in millimeters. All angels are in degrees.
3.
N is the total number of pins.
4.
The pin #1 identifier and pin numbering convention shall conform to JESD 95-1 SPP-012. Details of pin #1 identifier is located within the
zone indicated. The pin #1 identifier is marked.
5.
Dimension b applies to metallized pin and is measured between 0.15 mm and 0.20 mm from the pin tip.
6.
ND refers to the maximum number of pins on the D side.
7.
Depopulation of pins is allowed and will be called out on the individual variation.
8.
Coplanarity applies to the exposed heat sink slug as well as the pins.
9.
Profile tolerance (aaa) will be applicable only to the plastic body and not to the metallized features (such as the pin tips and tie bars.)
Metallized features may protrude a maximum of L2 from the plastic body profile.
10.
L1 max is not called out, the metallized feature will extend to the exposed pad. Thus, the 0.17-mm gap does not apply.
11.
The corner will be sharp unless otherwise specified with radius dimensions.
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Document Number: 72820
28-Jan-04
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Revision: 02-Oct-12
1
Document Number: 91000