Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated and Calibrated

Pressure
MPXV4115V
Rev 4, 10/2012
Freescale Semiconductor
Data Sheet: Technical Data
Integrated Silicon Pressure Sensor
On-Chip Signal Conditioned,
Temperature Compensated, and
Calibrated
MPXV4115V
Series
INTEGRATED
PRESSURE SENSOR
-115 to 0 kPa (-16.7 to 0 psi)
0.2 to 4.6 V Output
The MPXV4115V series piezoresistive transducer is a state-of-the-art
monolithic silicon pressure sensor designed for a wide range of applications,
particularly those employing a microcontroller with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization
and bipolar processing to provide an accurate, high-level analog output signal
that is proportional to the applied pressure/vacuum. The small form factor and
high reliability of on-chip integration make the sensor a logical and economical choice for the automotive system designer. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
Application Examples
• Vacuum Pump Monitoring
• Brake Booster Monitoring
Features
•
•
•
•
1.5% Maximum error over 0 to 85C
Temperature Compensated from –40 + 125C
Ideally Suited for Microprocessor or Microcontroller-Based Systems
Durable Thermoplastic (PPS) Surface Mount Package
ORDERING INFORMATION
Package
Case
Device Name
Options
No.
Small Outline Package (MPXV4115V Series)
MPXV4115V6U
Rails
482
MPXV4115VC6U
Rails
None
# of Ports
Single
Dual
•
Gauge
• Vacuum/
Differential
SMALL OUTLINE PACKAGES
MPXV4115V6U
CASE 482-01
MPXV4115VC6U
CASE 482A-01
© 2005, 2008, 2010, 2012 Freescale Semiconductor, Inc. All rights reserved.
Absolute
Device
Marking
MPXV4115V
• Vacuum/
Gauge
•
482A
Pressure Type
Differential
MPXV4115V
Pressure
Operating Characteristics
Table 1. Operating Characteristics (VS = 5.0 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3
required to meet electrical specifications.)
Characteristic
Symbol
Min
Typ
Max
Unit
POP
–115
—
0
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
6.0
10
mAdc
(0 to 85C)
VFSO
4.535
4.6
4.665
Vdc
Full Scale Span(3)
@ VS = 5.0 V
(0 to 85C)
VFSS
—
4.4
—
Vdc
Accuracy(4)
(0 to 85C)
—
—
—
1.5%
%VFSS
V/P
—
38.26
—
mV/kPa
Response Time(5)
tR
—
1.0
—
ms
Output Source Current at Full Scale Output
Io
—
0.1
—
mAdc
Warm-Up Time(6)
—
—
20
—
ms
Offset Stability(7)
—
—
0.5
—
%VFSS
Pressure Range (Differential mode, Vacuum on metal cap side, Atmospheric
pressure on back side)
Full Scale Output(2)
2
(Pdiff = 0 kPa)
Sensitivity
1. Device is ratiometric within this specified excitation range.
2. Full Scale Output is defined as the output voltage at the maximum or full-rated pressure.
3. Full Scale Span is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the
minimum-rated pressure.
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of errors, including the following:
Linearity:
Temperature Hysteresis:
Pressure Hysteresis:
TcSpan:
TcOffset:
Output deviation from a straight line relationship with pressure over the specified pressure range.
Output deviation at any temperature within the operating temperature range, after the temperature is cycled to
and from the minimum or maximum operating temperature points, with zero differential pressure applied.
Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum
or maximum rated pressure at 25°C.
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a
specified step change in pressure.
6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized.
7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test.
MPXV4115V
2
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Pressure
Maximum Ratings
Table 2. MAXIMUM RATINGS(1)
Rating
Symbol
Value
Unit
Maximum Pressure
Pmax
400
kPa
Storage Temperature
Tstg
–40 to +125
C
Operating Temperature
TA
–40 to +125
C
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip.
VS
2
Thin Film
Temperature
Compensation
and
Gain Stage #1
Sensing
Element
GND
3
Gain Stage #2
and
Ground
Reference
Shift Circuitry
VOUT
4
Pins 1, 5, 6, 7, and 8 are NO CONNECTS
for small outline package devices.
Figure 1. Fully Integrated Pressure Sensor Schematic for Small Outline Package
MPXV4115V
Sensors
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3
Pressure
On-chip Temperature Compensation, Calibration, and Signal Conditioning
The performance over temperature is achieved by
integrating the shear-stress strain gauge, temperature
compensation, calibration and signal conditioning circuitry
onto a single monolithic chip.
Figure 2 illustrates the gauge configuration in the basic
chip carrier (Case 482). A fluorosilicone gel isolates the die
surface and wire bonds from the environment, while allowing
the pressure signal to be transmitted to the silicon diaphragm.
The MPXV4115V series sensor operating characteristics
are based on use of dry air as pressure media. Media, other
than dry air, may have adverse effects on sensor
performance and long-term reliability. Internal reliability and
qualification test for dry air, and other media, are available
from the factory. Contact the factory for information regarding
media tolerance in your application.
Figure 3 shows the recommended decoupling circuit for
interfacing the output of the integrated sensor to the A/D input
of a microprocessor or microcontroller. Proper decoupling of
the power supply is recommended.
Figure 4 shows the sensor output signal relative to
differential pressure input. Typical, minimum and maximum
output curves are shown for operation over a temperature
range of 0C to 85C using the decoupling circuit shown in
Figure 3. The output will saturate outside of the specified
pressure range.
Fluorosilicone
Gel Die Coat
Die
P1
Wire Bond
Stainless
Steel Cap
Thermoplastic
Case
Lead
Frame
P2
Die Bond
Differential Sensing Element
Figure 2. Cross-Sectional Diagram (not to scale)
+5 V
Vout
Output
Vs
IPS
1.0 F
0.01 F
GND
470 pF
Figure 3. Recommended Power Supply Decoupling and Output Filtering
(For output filtering recommendations, refer to Application Note AN1646.)
MPXV4115V
4
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Pressure
TRANSFER FUNCTION MPXV4115V
5
Transfer Function:
Vout = Vs*[(0.007652*P) + 0.92] ± Pressure error
*Temp Factor*0.007652*VS)
VS = 5.0 V ± 0.25 Vdc
TEMP = 0-85°C
4.5
4
Output (V)
3.5
3
2.5
2
MAX
1.5
MIN
1
0.5
0
–115
–95
–75
–55
Vout vs. Vacuum
–35
–15
Figure 4. Applied Vacuum in kPa
(below atmospheric pressure)
Transfer Function (MPXV4115V)
Nominal Transfer Value:
Vout = VS (P x 0.007652 + 0.92)
± (Pressure Error x Temp. Factor x 0.007652 x VS)
VS = 5 V ± 0.25 Vdc
Temperature Error Band
MPXV4115V Series
4.0
3.0
Temperature
Error
Factor
2.0
Temp
Multiplier
- 40
0 to 85
+125
3
1
3
1.0
0.0
-40
-20
0
20
40
60
80
100
120
140
Temperature in °C
NOTE: The Temperature Multiplier is a linear response from 0C to-40C and from 85C to 125C.
MPXV4115V
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5
Pressure
Pressure Error Band
1.950
Pressure Error (kPa)
1.725
1.500
0
–1.500
–115 –100
–85
–60
–45
–30
–15
0
Pressure in kPa
(below atmospheric)
–1.725
–1.950
Pressure
–115 to 0 kPa
Error (Max)
±1.725 kPa
MPXV4115V
6
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Pressure
PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
The two sides of the pressure sensor are designated as
the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing fluorosilicone gel,
which protects the die from harsh media. The MPX pressure
Part Number
sensor is designed to operate with positive differential
pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the
following table:
Case Type
MPXV4115V6U
MPXV4115VC6U
Pressure (P1) Side Identifier
482
Side with Part Marking
482A
Side with Port Attached
INFORMATION FOR USING THE SMALL OUTLINE PACKAGE (CASE 482)
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must be
the correct size to ensure proper solder connection interface
between the board and the package. With the correct
footprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and
shorting between solder pads.
0.100 TYP 8X
2.54
0.660
16.76
0.060 TYP 8X
1.52
0.300
7.62
0.100 TYP 8X
2.54
inch
mm
SCALE 2:1
Figure 5. SOP Footprint (Case 482)
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
7
Pressure
PACKAGE DIMENSIONS
-A-
D 8 PL
0.25 (0.010)
4
5
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
DIM
A
B
C
D
G
H
J
K
M
N
S
N
H
C
J
-TSEATING
PLANE
PIN 1 IDENTIFIER
K
M
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.212 0.230
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.405 0.415
0.709 0.725
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
5.38
5.84
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
10.29
10.54
18.01
18.41
CASE 482-01
ISSUE O
SMALL OUTLINE PACKAGE
-A-
D
4
0.25 (0.010)
5
N
8 PL
M
T B
S
A
S
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION A AND B DO NOT INCLUDE MOLD
PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006).
5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT.
-BG
8
1
S
W
V
C
H
J
-TK
M
PIN 1 IDENTIFIER
DIM
A
B
C
D
G
H
J
K
M
N
S
V
W
INCHES
MIN
MAX
0.415 0.425
0.415 0.425
0.500 0.520
0.038 0.042
0.100 BSC
0.002 0.010
0.009 0.011
0.061 0.071
0˚
7˚
0.444 0.448
0.709 0.725
0.245 0.255
0.115 0.125
MILLIMETERS
MIN
MAX
10.54
10.79
10.54
10.79
12.70
13.21
0.96
1.07
2.54 BSC
0.05
0.25
0.23
0.28
1.55
1.80
0˚
7˚
11.28
11.38
18.01
18.41
6.22
6.48
2.92
3.17
SEATING
PLANE
CASE 482A-01
ISSUE A
SMALL OUTLINE PACKAGE
MPXV4115V
8
Sensors
Freescale Semiconductor, Inc.
Pressure
Table 3. Revision History
Revision
number
Revision
date
4
10/2012
Description of changes
• Deleted references to device number MPXV4115V6T1 throughout the document
MPXV4115V
Sensors
Freescale Semiconductor, Inc.
9
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© 2012 Freescale Semiconductor, Inc.
MPXV4115V
Rev. 4
10/2012