Freescale Semiconductor Technical Data MPXV4115V Rev 2, 05/2005 Integrated Silicon Pressure Sensor On-Chip Signal Conditioned, Temperature Compensated, and Calibrated The MPXV4115V series piezoresistive transducer is a state-of-the-art monolithic silicon pressure sensor designed for a wide range of applications, particularly those employing a microcontroller with A/D inputs. This transducer combines advanced micromachining techniques, thin-film metallization and bipolar processing to provide an accurate, high-level analog output signal that is proportional to the applied pressure/vacuum. The small form factor and high reliability of on-chip integration make the sensor a logical and economical choice for the automotive system designer. Figure 1 shows a block diagram of the internal circuitry integrated on a pressure sensor chip. MPXV4115V SERIES INTEGRATED PRESSURE SENSOR –115 to 0 kPa (–16.7 to 2.2 psi) 0.2 to 4.6 V OUTPUT SMALL OUTLINE PACKAGE Features • • • • 1.5% Maximum error over 0° to 85°C Temperature Compensated from –40° + 125°C Ideally Suited for Microprocessor or Microcontroller-Based Systems Durable Thermoplastic (PPS) Surface Mount Package MPXV4115V6U/6T1 CASE 482-01 Typical Applications • • Vacuum Pump Monitoring Brake Booster Monitoring The MPXV4115V series pressure sensors are available in the basic element package or with a pressure port. Two packing options are also offered. MPXV4115VC6U CASE 482A-01 ORDERING INFORMATION Device Type Case No. MPX Series Order No. Packing Options Device Marking PIN NUMBER(1) SMALL OUTLINE PACKAGE (MPXV4115V SERIES) Basic Elements 482 MPXV4115V6U Rails MPXV4115V 482 MPXV4115V6T1 Tape & Reel MPXV4115V Ported Elements 482A MPXV4115VC6U Rails MPXV4115V 1 N/C 5 N/C 2 VS 6 N/C 3 GND 7 N/C 4 VOUT 8 N/C 1. Pins 1, 5, 6, 7, and 8 are internal device connections. Do not connect to external circuitry or ground. Pin 1 is noted by the notch in the lead. © Freescale Semiconductor, Inc., 2005. All rights reserved. VS Thin Film Temperature Compensation and Gain Stage #1 Sensing Element GND Gain Stage #2 and Ground Reference Shift Circuitry Vout Pins 1, 5, 6, 7 and 8 are NO CONNECTS For Small Outline Package Device Figure 1. Fully Integrated Pressure Sensor Schematic Table 1. Maximum Ratings(1) Rating Symbol Value Unit Maximum Pressure Pmax 400 kPa Storage Temperature Tstg –40 to +125 °C Operating Temperature TA –40 to +125 °C 1. Exposure beyond the specified limits may cause permanent damage or degradation to the device. MPXV4115V 2 Sensors Freescale Semiconductor Table 2. Operating Characteristics (VS = 5 Vdc, TA = 25°C unless otherwise noted. Decoupling circuit shown in Figure 3 required to meet electrical specifications.) Characteristic Symbol Min Typ Max Unit POP –115 — 0 kPa Supply Voltage(1) VS 4.75 5.0 5.25 Vdc Supply Current Io — 6.0 10 mAdc (0 to 85°C) VFSO 4.535 4.6 4.665 Vdc Full Scale Span(3) @ VS = 5.0 V (0 to 85°C) VFSS — 4.4 — Vdc Accuracy(4) (0 to 85°C) — — — 1.5% %VFSS V/P — 38.26 — mV/kPa Response Time(5) tR — 1.0 — ms Output Source Current at Full Scale Output Io — 0.1 — mAdc Warm-Up Time(6) — — 20 — ms Offset Stability(7) — — ±0.5 — %VFSS Pressure Range (Differential mode, Vacuum on metal cap side, Atmospheric pressure on back side) Full Scale Output(2) (Pdiff = 0 kPa)2 Sensitivity 1. Device is ratiometric within this specified excitation range. 2. Full Scale Output is defined as the output voltage at the maximum or full-rated pressure. 3. Full Scale Span is defined as the algebraic difference between the output voltage at full-rated pressure and the output voltage at the minimum-rated pressure. 4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span at 25°C due to all sources of errors, including the following: • Linearity: Output deviation from a straight line relationship with pressure over the specified pressure range. • Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. • Pressure Hysteresis: Output deviation at any pressure within the specified range, when this pressure is cycled to and from minimum or maximum rated pressure at 25°C. • TcSpan: Output deviation over the temperature range of 0° to 85°C, relative to 25°C. • TcOffset: Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative to 25°C. 5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to a specified step change in pressure. 6. Warm-up Time is defined as the time required for the product to meet the specified output voltage after the Pressure has been stabilized. 7. Offset Stability is the product's output deviation when subjected to 1000 hours of Pulsed Pressure, Temperature Cycling with Bias Test. MPXV4115V Sensors Freescale Semiconductor 3 ON-CHIP TEMPERATURE COMPENSATION, CALIBRATION, AND SIGNAL CONDITIONING The performance over temperature is achieved by integrating the shear-stress strain gauge, temperature compensation, calibration and signal conditioning circuitry onto a single monolithic chip. Figure 2 illustrates the gauge configuration in the basic chip carrier (Case 482). A fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pressure signal to be transmitted to the silicon diaphragm. The MPXV4115V series sensor operating characteristics are based on use of dry air as pressure media. Media, other than dry air, may have adverse effects on sensor performance and long-term reliability. Internal reliability and qualification test for dry air, and other media, are available Fluorosilicone Gel Die Coat from the factory. Contact the factory for information regarding media tolerance in your application. Figure 3 shows the recommended decoupling circuit for interfacing the output of the integrated sensor to the A/D input of a microprocessor or microcontroller. Proper decoupling of the power supply is recommended. Figure 4 shows the sensor output signal relative to differential pressure input. Typical, minimum and maximum output curves are shown for operation over a temperature range of 0°C to 85°C using the decoupling circuit shown in Figure 3. The output will saturate outside of the specified pressure range. +5 V Stainless Steel Cap Die P1 Wire Bond Vout Thermoplastic Case OUTPUT Vs Lead Frame IPS 1.0 µF P2 0.01 µF GND 470 pF Die Bond Differential Sensing Element Figure 3. Recommended Power Supply Decoupling and Output Filtering (For additional output filtering, please refer to Application Note AN1646.) Figure 2. Cross-Sectional Diagram (not to scale) TRANSFER FUNCTION MPXV4115V 5 4.5 4 Output (V) 3.5 3 Transfer Function: Vout = Vs*[(0.007652*P) + 0.92] ± Pressure error *Temp Factor*0.007652*VS) VS = 5.0 V ± 0.25 Vdc TEMP = 0-85°C 2.5 2 1.5 MAX MIN 1 0.5 0 –115 –95 –75 –55 Vout vs. Vacuum –35 –15 Figure 4. Applied Vacuum in kPa (below atmospheric pressure) MPXV4115V 4 Sensors Freescale Semiconductor MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS Surface mount board layout is a critical portion of the total design. The footprint for the surface mount packages must be the correct size to ensure proper solder connection interface between the board and the package. With the correct footprint, the packages will self align when subjected to a solder reflow process. It is always recommended to design boards with a solder mask layer to avoid bridging and shorting between solder pads. 0.100 TYP 8X 2.54 0.660 16.76 0.060 TYP 8X 1.52 0.300 7.62 0.100 TYP 8X 2.54 inch mm SCALE 2:1 Figure 5. SOP Footprint (Case 482) MPXV4115V Sensors Freescale Semiconductor 5 Transfer Function Nominal Transfer Value: Vout = VS (P x 0.007652) + 0.92) ± (Pressure Error x Temp. Factor x 0.007652 x VS) VS = 5 V ± 0.25 Vdc Temperature Error Band MPXV4115V Series 4.0 Temp 3.0 Temperature Error Factor Multiplier –40 0 to 85 +125 2.0 3 1 3 1.0 0.0 –40 –20 0 20 40 80 60 100 120 140 Temperature in °C NOTE: The Temperature Multiplier is a linear response from 0°C to –40°C and from 85°C to 125°C. Pressure Error Band 1.950 Pressure Error (kPa) 1.725 1.500 0 –1.500 –115 –100 –85 –60 –45 –30 –15 0 Pressure in kPa (below atmospheric) –1.725 –1.950 Pressure –115 to 0 kPa Error (Max) ±1.725 kPa MPXV4115V 6 Sensors Freescale Semiconductor PACKAGE DIMENSIONS -A- D 8 PL 0.25 (0.010) 4 5 M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S N H C J -TSEATING PLANE PIN 1 IDENTIFIER K M DIM A B C D G H J K M N S INCHES MIN MAX 0.415 0.425 0.415 0.425 0.212 0.230 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.405 0.415 0.709 0.725 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 5.38 5.84 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 10.29 10.54 18.01 18.41 CASE 482-01 ISSUE O SMALL OUTLINE PACKAGE -A- D 4 0.25 (0.010) 5 N 8 PL M T B S A S NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. DIMENSION A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006). 5. ALL VERTICAL SURFACES 5˚ TYPICAL DRAFT. -BG 8 1 S W V C H J -TK M PIN 1 IDENTIFIER DIM A B C D G H J K M N S V W INCHES MIN MAX 0.415 0.425 0.415 0.425 0.500 0.520 0.038 0.042 0.100 BSC 0.002 0.010 0.009 0.011 0.061 0.071 0˚ 7˚ 0.444 0.448 0.709 0.725 0.245 0.255 0.115 0.125 MILLIMETERS MIN MAX 10.54 10.79 10.54 10.79 12.70 13.21 0.96 1.07 2.54 BSC 0.05 0.25 0.23 0.28 1.55 1.80 0˚ 7˚ 11.28 11.38 18.01 18.41 6.22 6.48 2.92 3.17 SEATING PLANE CASE 482A-01 ISSUE A SMALL OUTLINE PACKAGE MPXV4115V Sensors Freescale Semiconductor 7 How to Reach Us: Home Page: www.freescale.com E-mail: [email protected] USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370 1300 N. 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