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by PPXV5025G/D
SEMICONDUCTOR TECHNICAL DATA
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
ARCHIVED BY FREESCALE SEMICONDUCTOR, INC. 2005
Freescale Semiconductor, Inc...
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Motorola’s PPXV5025G series sensor integrates on–chip, bipolar op amp circuitry and
thin film resistor networks to provide a high output signal and temperature compensation.
The small form factor and high reliability of on–chip integration make the Motorola pressure
sensor a logical and economical choice for the system designer.
The PPXV5025G series piezoresistive transducer is a state–of–the–art, monolithic,
signal conditioned, silicon pressure sensor. This sensor combines advanced
micromachining techniques, thin film metallization, and bipolar semiconductor processing to
provide an accurate, high level analog output signal that is proportional to applied pressure.
Figure 1 shows a block diagram of the internal circuitry integrated on a pressure
sensor chip.
INTEGRATED
PRESSURE SENSOR
0 to 25 kPa (0 to 3.6 psi)
0.2 to 4.7 Volts Output
SMALL OUTLINE PACKAGE
SURFACE MOUNT
Features
• 2.5% Maximum Error over 0° to 85°C
• Ideally suited for Microprocessor or Microcontroller–Based Systems
• Temperature Compensated from –40° to +125°C
• Durable Thermoplastic (PPS) Surface Mount Package
PPXV5025G6U
CASE 482
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Figure 1. Fully Integrated Pressure Sensor
Schematic
PPXV5025G7U
CASE 482B
PPXV5025GP
CASE 1369
PPXV5025GC7U
CASE 482C
PPXV5025DP
CASE 1351
PIN NUMBER
1
N/C
2
VS
3
Gnd
5
N/C
7
N/C
4
Vout
6
N/C
8
N/C
NOTE: Pins 1, 5, 6, 7, and 8 are internal device connections. Do not
connect to external circuitry or ground. Pin 1 is denoted by the notch in the
lead.
REV 0
Motorola Sensor Device Data
Motorola, Inc. 2002
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MAXIMUM RATINGS(1)
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Symbol
Value
Units
Maximum Pressure (P1 P2)
Parametrics
Pmax
100
kPa
Storage Temperature
Tstg
–40° to +125°
°C
TA
–40° to +125°
°C
Io+
0.5
mAdc
Io–
–0.5
mAdc
Operating Temperature
Output Source Current @ Full Scale
Output(2)
Output Sink Current @ Minimum Pressure
Offset(2)
NOTES:
1. Exposure beyond the specified limits may cause permanent damage or degradation to the device.
2. Maximum Output Current is controlled by effective impedance from Vout to Gnd or Vout to VS in the application circuit.
OPERATING CHARACTERISTICS (VS = 5.0 Vdc, TA = 25°C unless otherwise noted, P1 P2.)
Symbol
Min
Typ
Max
Unit
POP
0
—
25
kPa
Supply Voltage(1)
VS
4.75
5.0
5.25
Vdc
Supply Current
Io
—
6.0
10
mAdc
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Characteristic
Pressure Range
Output(2)
Full Scale
@ VS = 5.0 Volts
(0 to 85°C)
(Pdiff = 0 kPa)
VFSO
4.588
4.7
4.813
Vdc
Full Scale Span(3)
@ VS = 5.0 Volts
(0 to 85°C)
VFSS
—
4.5
—
Vdc
Accuracy(4)
(0 to 85°C)
—
—
—
±2.5
%VFSS
Sensitivity
V/P
—
0.18
—
V/kPa
Time(5)
tR
—
1.0
—
ms
Warm–Up Time(6)
—
—
20
—
ms
Offset Stability(7)
—
—
±0.5
—
%VFSS
Response
NOTES:
1. Device is ratiometric within this specified excitation range.
2. Full Scale Output (VFSO) is defined as the output voltage at the maximum or full rated pressure.
3. Full Scale Span (VFSS) is defined as the algebraic difference between the output voltage at full rated pressure and the output voltage at the
minimum rated pressure.
4. Accuracy is the deviation in actual output from nominal output over the entire pressure range and temperature range as a percent of span
at 25°C due to all sources of error including the following:
• Linearity:
Output deviation from a straight line relationship with pressure over the specified pressure range.
• Temperature Hysteresis: Output deviation at any temperature within the operating temperature range, after the temperature is
cycled to and from the minimum or maximum operating temperature points, with zero differential
pressure applied.
• Pressure Hysteresis:
Output deviation at any pressure within the specified range, when this pressure is cycled to and from
minimum or maximum rated pressure at 25°C.
• TcSpan:
Output deviation over the temperature range of 0° to 85°C, relative to 25°C.
• TcOffset:
Output deviation with minimum pressure applied, over the temperature range of 0° to 85°C, relative
to 25°C.
5. Response Time is defined as the time for the incremental change in the output to go from 10% to 90% of its final value when subjected to
a specified step change in pressure.
6. Warm–up Time is defined as the time required for the product to meet the specified output voltage after the pressure has been stabilized.
7. Offset Stability is the product’s output deviation when subjected to 1000 cycles of Pulsed Pressure, Temperature Cycling with Bias Test.
2
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Figure 3. Typical Application Circuit
(Output Source Current Operation)
Figure 2 illustrates the absolute sensing chip in the basic
Small Outline chip carrier (Case 482).
Figure 3 shows a typical application circuit (output source
current operation).
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Figure 2. Cross Sectional Diagram SOP
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Figure 4. Output versus Pressure Differential
Figure 4 shows the sensor output signal relative to pressure input. Typical minimum and maximum output curves
are shown for operation over 0 to 85°C temperature range.
The output will saturate outside of the rated pressure range.
A fluorosilicone gel isolates the die surface and wire
bonds from the environment, while allowing the pressure
signal to be transmitted to the silicon diaphragm. The
Motorola Sensor Device Data
PPXV5025G series pressure sensor operating characteristics, internal reliability and qualification tests are based on
use of dry air as the pressure media. Media other than dry
air may have adverse effects on sensor performance and
long–term reliability. Contact the factory for information regarding media compatibility in your application.
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Transfer Function
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Nominal Transfer Value: Vout = VS (P x 0.036 + 0.04)
+/– (Pressure Error x Temp. Factor x 0.036 x VS)
VS = 5.0 V ± 0.25 Vdc
Temperature Error Band
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NOTE: The Temperature Multiplier is a linear response from 0° to –40°C and from 85° to 125°C.
Pressure Error Band
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Motorola Sensor Device Data
Freescale Semiconductor, Inc.
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PRESSURE (P1)/VACUUM (P2) SIDE IDENTIFICATION TABLE
Motorola designates the two sides of the pressure sensor
as the Pressure (P1) side and the Vacuum (P2) side. The
Pressure (P1) side is the side containing silicone gel which
isolates the die from the environment. The Motorola pressure
Part Number
Case Type
PPXV5025GC6U/T1
Pressure (P1) Side Identifier
482A
PPXV5025G6U/T1
Side with Port Attached
482
Stainless Steel Cap
PPXV5025GC7U
482C
Side with Port Attached
PPXV5025G7U
482B
Stainless Steel Cap
PPXV5025GP
1369
Side with Port Attached
PPXV5025DP
1351
Side with Port Marking
ORDERING INFORMATION
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sensor is designed to operate with positive differential pressure applied, P1 > P2.
The Pressure (P1) side may be identified by using the table
below:
PPXV5025G series pressure sensors are available in the basic element package or with pressure ports. Two packing options
are offered for Case 482 and 482A configurations.
Device Type / Order No
No.
Case No.
No
PPXV5025G6U
Packing Options
Device Marking
482
Rails
PPXV5025G
PPXV5025G6T1
482
Tape and Reel
PPXV5025G
PPXV5025GC6U
482A
Rails
PPXV5025G
PPXV5025GC6T1
482A
Tape and Reel
PPXV5025G
PPXV5025GC7U
482C
Rails
PPXV5025G
PPXV5025G7U
482B
Rails
PPXV5025G
PPXV5025GP
1369
Trays
PPXV5025G
PPXV5025DP
1351
Trays
PPXV5025G
INFORMATION FOR USING THE SMALL OUTLINE PACKAGES
MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS
Surface mount board layout is a critical portion of the total
design. The footprint for the surface mount packages must
be the correct size to ensure proper solder connection interface between the board and the package. With the correct
fottprint, the packages will self align when subjected to a
solder reflow process. It is always recommended to design
boards with a solder mask layer to avoid bridging and shorting between solder pads.
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Motorola Sensor Device Data
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SMALL OUTLINE PACKAGE DIMENSIONS
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SMALL OUTLINE PACKAGE DIMENSIONS
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SMALL OUTLINE PACKAGE DIMENSIONS
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8
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Motorola Sensor Device Data
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NOTES
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NOTES
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Motorola reserves the right to make changes without further notice to any products herein. Motorola makes no warranty, representation or guarantee regarding
the suitability of its products for any particular purpose, nor does Motorola assume any liability arising out of the application or use of any product or circuit, and
specifically disclaims any and all liability, including without limitation consequential or incidental damages. “Typical” parameters which may be provided in Motorola
data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals”
must be validated for each customer application by customer’s technical experts. Motorola does not convey any license under its patent rights nor the rights of
others. Motorola products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other
applications intended to support or sustain life, or for any other application in which the failure of the Motorola product could create a situation where personal injury
or death may occur. Should Buyer purchase or use Motorola products for any such unintended or unauthorized application, Buyer shall indemnify and hold Motorola
and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees
arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that
Motorola was negligent regarding the design or manufacture of the part. Motorola, Inc. Motorola, Inc. is an Equal Opportunity/Affirmative Action Employer.
MOTOROLA and the
logo are registered in the US Patent & Trademark Office. All other product or service names are the property of their respective owners.
Motorola, Inc. 2001.
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Motorola Sensor Device Data
PPXV5025G/D