SiP11206 Datasheet

Product is End of Life 12/2014
SiP11206
Vishay Siliconix
Half-Bridge Controller with Primary MOSFET Drivers for
Intermediate Bus Converters
DESCRIPTION
FEATURES
SiP11206 is a controller for the primary side of a half-bridge
intermediate bus converter (IBC). It is ideally suited for
isolated applications such as telecom, data communications
and other products requiring an IBC architecture and
conversion of standard bus voltages such as 48 V to a lower
intermediate voltage, where high efficiency is required at low
output voltages (24 V, 12 V, 9 V or 5 V).
• 36 V to 75 V input voltage range
• Withstand 100 V, 100 ms transient capability
• Integrated ± 1.6 A typical high- and low-side MOSFET
drivers
• Oscillator frequency is programmable from 200 kHz to
1 MHz and can be externally synchronized
• High voltage pre-regulator operates during start-up
• Current sensing on primary low-side switch
• Hiccup mode
• System low input voltage detection
• Chip UVLO function
• Programmable soft-start function
• Over temperature protection (160 °C)
• Greater than 95 % efficiency
Designed to operate within the telecom voltage range of
36 V to 75 V and withstand 100 V transients for a period of
100 ms, the IC is designed for controlling and driving both
the low- and high-side switching devices of a half-bridge
converter.
The SiP11206 operates with a fixed duty cycle to provide the
highest efficiency over a wide input voltage range. SiP11206
has advanced current monitoring and control circuitry, which
allows the user to set the maximum current in the primary
circuit. This feature acts as protection against overcurrent,
output short circuit. Current sensing is by means of a sense
resistor connected in series with the primary low-side
MOSFET.
APPLICATIONS
•
•
•
•
•
Intermediate bus architectures
Telecom and Datacom
Routers and servers
Storage area network
Base station
• 1/8 and 1/4 bricks
TYPICAL APPLICATION CIRCUIT
Vin+
Si2303BDS
36 V to 75 V
100 V/100 ms
Vin-
4
5
6
7
8
BST
VIN
DH
VCC
LX
COMP
CS
DL
PGND
AGND
SS
VREF
RDB
ROSC
COSC
16
15
14
13
12
Si7848DP
3
VINDET
Si7848DP
2
Si7456DP
1
11
10
Vo+
Vo-
9
Si2303BDS
Si7456DP
SiP11206
RDB
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
www.vishay.com
1
SiP11206
Vishay Siliconix
TECHNICAL DESCRIPTION
SiP11206 is a switching controller on the primary side of a
half-bridge intermediate bus converter. With 100 V depletion
mode MOSFET in the chip, the SiP11206 is capable of being
powered directly from the high voltage bus to VCC through an
external PNP pass transistor, or may be powered by an
external supply directly to the VCC pin.
result in over temperature protection activating hiccup
operation whenever the pre-regulator power dissipation
becomes excessive. The external high- and low-side
N-Channel power MOSFETs are driven by a built in driver
with ± 1.6 A peak current capability.
SiP11206 is available in the MLP44-16 PowerPAK® package
and TSSOP-16 PowerPAK® package and is specified over
the ambient temperature range of - 40 °C to + 85 °C
Without the use of an external pass transistor, failure of the
converter output to power VCC above the VREG level will
SIP11206 BLOCK DIAGRAM
VIN
VCC
VREG
COMP
Pre Reg
BST
UVLO
+
VSD
Level
Shift
+
VINDET
VREF
VUV
+
-
VCC
BG
VUV
ISS
Driver
+
250 mV
SS
IDSS
EN
Control
DL
Le
SS Comp
+
4.8 V
LX
Hi-side driver
0.85 VSS
AGND
CS
DH
Low-side driver
EN
D MAX
OTP
Over Current protection
PGND
PWM Comp
Ramp
EN
0.13 V
VREF
OSC
EN
Le
EN
VREF
EN
IDSS
IBIAS
ISS
IBIAS
0.200 V
R OSC R DB C OSC
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Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
ABSOLUTE MAXIMUM RATINGS all voltages referenced to GND = 0 V
Parameter
VIN, VLX
Limit
Continuous
80
100 ms
100
VCC
VBST
14.5
Continuous
95
100 ms
112
VBST - VLX
- 0.3 to VCC + 0.3
Linear Inputs
- 0.3 to VCC + 0.3
HV Pre-Regulator Input Current (continuous)
10
Storage Temperature
- 65 to 150
Maximum Junction Temperature
150
PowerPAK MLP44-16a ,b
2564
a, c
2630
PowerPAK TSSOP-16
Thermal Impedance (ΘJA)
V
15
Logic Inputs
Power Dissipation
Unit
PowerPAK MLP44-16a ,b
39
PowerPAK TSSOP-16a, c
38
mA
°C
mW
°C/W
Notes:
a. Device mounted with all leads soldered or welded to PC board.
b. Derate 25.6 mW/°C above 25 °C.
c. Derate 26.3 mW/°C above 25 °C.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
RECOMMENDED OPERATING RANGE all voltages referenced to GND = 0 V
Parameter
VIN
VBST
Limit
Continuous
100 ms
Unit
36 to 75
100
VIN + 10.5 to VIN + 13.2
VBST - VLX
10.5 to 13.2
VCC
10.5 to 13.2
Logic Inputs
- 0.3 to VCC + 0.3
Linear Inputs
- 0.3 to VCC + 0.3
V
FOSC
200 to 1000
kHz
ROSC
40 to 200
kΩ
COSC
100 to 220
pF
CSS
10 to 100
CCOMP
VREF Capacitor to GND
2.2
1
CBOOST
0.1
VCC Capacitor to GND
4.7
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
nF
µF
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SiP11206
Vishay Siliconix
SPECIFICATIONS
Parameter
Symbol
Test Conditions
Unless Otherwise Specified
TA = - 40 °C to + 85 °C, FOSC = 800 kHz,
10.5 V ≤ VCC ≤ 13.2 V, VINDET = 4.8 V, VIN = 48 V,
RDB = 47.5 kΩ, ROSC = 47.5 kΩ, COSC = 100 pF
Limits
Min.
Typ.
36
48
Max.
Unit
75
V
Pre-Regulator
VIN Range
VIN
Pre-Reg Current (cut-off)
IVINLKG
VIN = 75 V, VCC > 10.5 V
Pre-Reg Current (standby)
IVINSD
VIN = 75 V, VINDET = 0 V
10
90
200
µA
Pre-Reg Current (switching)
IVINSW
VIN = 75 V, VINDET = 7.5 V
3.3
6.0
8.7
mA
Pre-Reg Output Voltage
VREG
VCC Voltage with VIN = 48 V
7.8
9.3
10.4
V
Pre-Reg Drive Current
20
ISTART
VCC < VREG
Pre-Reg Load Regulation
LDR
ILOAD: 0 to 20 mA
Pre-Reg Line Regulation
LNR
ISRC
Regulator Compensation
ISNK
VCC = 12 V
mA
100
mV
0.05
%/V
- 35
- 20
- 10
40
87
130
µA
VCC Supply Voltage
VCC Range
VCC
10.5
12
13.2
V
Shut Down Current
ISD
VINDET = 0 V
50
150
350
µA
Quiescent Current
IQ
VINDET < VREF
4.0
5.0
6.2
Supply Current
ICC
VINDET > VREF
5.5
7.2
9.5
UVLO Off-Threshold
UVLOH
VCC rising
7.6
9.0
10
Hysteresis
HUVLO
VCC Clamp Voltage
VCLAMP
Force 20 mA into VCC
14
15.3
16.2
Current Limit Threshold 1 (MOC)a
VMOC
ISS = 20 µA, CSS= 1 nF
105
130
160
b
VSOC
ISS = 400 nA, CSS= 1 nF
165
200
235
mA
V
1.2
Current Sense
Current Limit Threshold 2 (SOC)
CS to DL Delay
TD
Leading Edge Blanking Period
TBL
150
DL(ON) blanking time
mV
ns
20
Pulse Width Modulator
Maximum Duty Cyclec
DMAX
47
Maximum Duty Cycle Asymmetry
RDB Voltage
50
1
VRDB
3.18
%
V
Oscillator
Oscillator Frequencyd
FOSC
Oscillator Bias Voltage
VROSC
ROSC = 47 kΩ, COSC = 100 pF
680
800
920
3.24
kHz
V
Soft Start
Soft Start Charging Current
ISS
SS Ramp Completion Voltage
VSS
VSS = 0 V
- 26
- 20
- 14
5.4
µA
V
MOC Discharge Current
IDSS1
CS = VMOC
SOC Discharge Current
IDSS2
CS = VSOC
400
nA
Reset Voltage
VSSL
CS < VMOC
0.25
V
14
20
26
µA
Reference
VREF
VCC = 12 V
3.2
3.3
Short Circuit Current
IREFSC
VREF = 0 V
- 50
- 42
mA
Load Regulation
ΔVR/ΔIR
(0 mA ≤ ILOAD ≤ 2.5 mA)
- 33
- 16
mV
Output Voltage
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3.4
V
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
SPECIFICATIONS
Parameter
Symbol
Test Conditions
Unless Otherwise Specified
TA = - 40 °C to 85 °C, FOSC = 800 kHz,
10.5 V ≤ VCC ≤ 13.2 V, VINDET = 4.8 V, VIN = 48 V,
RDB = 47.5 kΩ, ROSC = 47.5 kΩ, COSC = 100 pF
Min.
30
VINDET rising
0.33
VINDET rising at ICC
3.14
Limits
Typ.
Max.
Unit
46
70
kΩ
0.58
0.76
VINDET Function
VIndet Pin Input Impedance
RINDET
VSDH
Shutdown Threshold High Voltage
Shutdown Hysteresis Voltage
HSD
Under Voltage OFF Voltage
VUVH
Under Voltage Hysteresis Voltage
HUV
0.15
3.30
3.46
V
0.26
Over Temperature Protection (OTP)
Activating Temperature
OTPON
TJ rising
160
De-activating Temperature
OTPOFF
TJ falling
145
°C
High-Side MOSFET Driver (DH Output)
Output High Voltage (differential)
VDHH
Sourcing 10 mA, VDH - VBST
Output Low Voltage (differential)
VDHL
Sinking 10 mA, VDH -VLX
Peak Output Sourcing Current
IDHH
Peak Output Sinking Current
IDHL
Driver Frequency
FDH
Rise Time
tHR
CLOAD = 3 nF
20
Fall Time
tHF
CLOAD = 3 nF
20
Boost Pin Current (switching)
IBST
LX Pin Current (switching)
ILX
LX Pin Leakage Current
ILX-LKG
- 0.3
0.3
- 2.2
VCC = 10.5 V, CLOAD = 3 nF
VLX = 75 V, VBST = VLX + VCC
A
1.6
340
400
460
kHz
ns
1.3
2.6
3.9
- 2.1
- 1.4
- 0.7
VINDET = 0 V, VLX = 40 V
V
10
mA
µA
Low-Side MOSFET Driver (DL Output)
Output High Voltage (differential)
VDLH
Sourcing 10 mA, VDL - VCC
Output Low Voltage (differential)
VDLL
Sinking 10 mA, VDL - VAGND
Peak Output Sourcing Current
IDLH
Peak Output Sinking Current
IDLL
Driver Frequency
FDL
Rise Time
tLR
CLOAD = 3 nF
20
Fall Time
tLF
CLOAD = 3 nF
20
- 0.3
0.3
- 1.6
VCC = 10.5 V, CLOAD = 3 nF
A
1.6
340
400
V
460
kHz
ns
Notes:
a. MOC stands for moderate overcurrent voltage at CS pin.
b. SOC stands for severe overcurrent voltage at CS pin.
c. RDB should be chosen for each application to provide adequate dead time. For production testing RDB is chosen to test at 47 % target duty.
d. Not tested. Guaranteed by driver frequency test. The driver frequency is half of the oscillator frequency.
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
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SiP11206
Vishay Siliconix
PACKAGE AND PIN CONFIGURATION
VCC
TSSOP-16 PowerPAK Package
DH
BST
VIN
VINDET
MLP44-16 PowerPAK Package
1
2
3
4
5
6
7
8
LX
1
COMP
DL
TOP VIEW
CS
PGND
AGND
R DB
C OSC
R OSC
VREF
SS
Top View
16
15
14
13
12
11
10
9
Notes:
For MLP44-16 package the bottom pin 1 indicator is connected to EPAD or AGND.
TSSOP-16
MLP44-16
Symbol
3
1
VCC
Description
4
2
COMP
5
3
CS
6
4
AGND
7
5
VREF
3.3 V reference output and bypass capacitor connection pin
8
6
ROSC
Oscillator resistor connection
9
7
COSC
Oscillator capacitor connection and external frequency sync. connection
10
8
RDB
Pre-regulator output and supply voltage for internal circuitry
Pre-regulator compensation pin
Current sense comparator input
Analog ground (connected to package’s exposed pad)
Dead time setting resistor connection
11
9
SS
12
10
PGND
Soft start capacitor connection
13
11
DL
Primary low-side MOSFET drive signal
14
12
LX
High-side MOSFET source and transformer connection node
15
13
DH
Primary high-side MOSFET drive signal
16
14
BST
Bootstrap voltage pin for the high-side driver
1
15
VINDET
Shut down/under voltage/enable control pin
2
16
VIN
Power ground
High voltage pre-regulator input
ORDERING INFORMATION
Part Number
Package
SiP11206DQP-T1-E3
TSSOP-16
SiP11206DLP-T1-E3
MLP44-16
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Marking
Temperature
11206
- 40 °C to + 85 °C
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
TIMING DIAGRAM AND SOFT START DUTY CYCLE CONTROL
RDB
COSC
SS
DL
DH
DMAX.
Time
HICCUP RESPONSE TO MODERATE OVERCURRENT FAULTS
SS Clamp Level
DMAX. Clamp Level
Hiccup Trigger Level
SS
DL
DH
Hiccup Triggered
CS IN
OC_DET
CLK
Over current protection operation showing reduction in duty cycle down to the hiccup trigger point. SS continues to discharge
down to 250 mV (400 nA IDISCHARGE), and then will recharge at 20 µA.
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
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SiP11206
Vishay Siliconix
CIRCUIT FOR FREQUENCY SYNCHRONIZATION
220 pF
100
2N3904
SYNC IN
Cosc
SiP11206
1k
DETAILED OPERATIONAL DESCRIPTION
Start Up
The controller supply (VCC) is linearly regulated up to its
target voltage VREG by the on chip pre-regulator circuit.
During power up with VINDET ramping up from 0, the VCC
capacitor minimum charge current is 20 mA and the
pre-regulator voltage is typically 9.3 V. As VINDET exceeds
VREF, the DL/DH outputs are capable of driving 3 nF
MOSFET gate capacitances and hence the pre-regulator
load regulation can easily handle 120 µA to 20 mA load step
with a typical load regulation of 1 %. Current into the external
VCC capacitor is limited to typically 20 mA by the internal
pre-regulator unless an external power source is connected
to VCC pin. This source may be a DC supply or from VIN by
connecting a PNP pass transistor between VIN and VCC. The
VCC pin is protected by a 20 mA clamp when this pin exceeds
14.5 V. The clamp turns on when VCC is between 14.5 V and
16 V. When VCC exceeds the UVLO voltage (UVLOH) a soft
start cycle of the switch mode supply is initiated. The VCC
supply continues to be charged by the pre-regulator until VCC
equals VREG. During this period, between UVLOH and VREG,
excessive load may result in VCC falling below UVLOH and
stopping switch mode operation. This situation is avoided by
the hysteresis between VREG and UVLO Off-Threshold level
UVLOL.
PWM Operation
During startup, DL always turns on before DH and both
switch on and off at half the oscillator frequency. The driver
duty cycle increases as SS voltage increases, since the SS
comparator sets the ON pulse width by comparing the SS
ramp voltage with the oscillator ramp voltage. When SS
ramp reaches a voltage that equals to RDB voltage, the PWM
comparator, which compares RDB voltage to the oscillator
ramp, takes over and the maximum duty cycle is now set by
the oscillator ramp and RDB voltage. Mathematically, the
total duty cycle is determined by the following formula:
formula may be slightly different. The PWM operation during
start up can be better understood by referring to "Timing
diagram and soft start duty cycle control" graph. The soft
start completion voltage at SS pin is clamped above the
internal ramp waveform's upper turning point.
Soft Start
The soft start circuit plays an important role in protecting the
controller. At startup it prevents high in-rush current. During
a normal start-up sequence (VCS < VMOC. VCS is the voltage
at CS pin), or following any event that would cause a hiccupand-soft-start sequence, CSS will be charged from about 0 V
to a final voltage of 4.8 V at a 20 µA rate. As the voltage on
the CSS rises towards the final voltage, the maximum
permitted DL and DH duty cycles will increase from 0 % to a
maximum defined by the RDB resistor.
When a mild fault condition is detected (VCS = VMOC), CSS
goes into a hiccup mode until fault condition is removed. The
hiccup is activated when CSS discharges to 0.85 VSS at
20 µA and subsequently at 0.4 µA until the fault condition is
removed. Refer to "Fault Conditions and Responses" for
details.
Fault Conditions and Responses
The faults that can cause a hiccup-and-retry cycle are
moderate over-current (MOC), severe over-current (SOC),
chip level UVLO, system level UVLO, and over temperature
protection (OTP).
Prior to detailing the various fault conditions and responses,
some definitions are given:
1. A complete switching period, T, consists of two oscillator
cycles, TDL and TDH.
2. TDL (TDH) is the oscillator cycle during which the DL (DH)
output is in the high state.
3. T is defined as starting at the beginning of TDL, and
terminating at the end of TDH.
DTOTAL = RDB/ROSC
And the duty cycle on DL or DH will be approximately half of
DTOTAL. Please note that due to oscillator comparator
overshoot the exact duty cycle calculated using above
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Response to MOC Faults (VMOC < VCS < VSOC):
Once SiP11206 has completed a normal soft-start cycle, VSS
will be clamped at 4.5 V, allowing the maximum possible duty
cycle on DL and DH.
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
If an MOC fault occurs following the start-up (due to a
condition such as an excessive load on the converter’s
output), SiP11206 will respond by gradually reducing the
available maximum duty cycle of its DL and DH outputs each
to be equal to approximately 42 % of their possible 47 %
maximum values. This is before any effects of deadtime
introduced by RDB are added in. This reduction in available
maximum duty cycle is achieved by reducing the voltage on
the SS pin to 4 V, as follows:
1. If VMOC < VCS < VSOC at any time during TDL, a current
of 20 µA will be drawn out of the SS pin until the
beginning of the next TDL.
2. If the voltage on the SS pin remains above the value that
would allow an available maximum DL and DH duty cycle
of 42 %, SiP11206 will continue operating.
3. If the voltage on the SS pin goes below the value that
would allow an available maximum DL and DH duty cycle
of 42 %, a hiccup interval is started, during which both DL
and DH are held in their low states.
4. The SS pin is discharged towards 0 V by a 400 nA sink
current.
5. The hiccup interval is terminated when the SS pin is
discharged to 0.25 V.
After the above actions have been taken switching on the DL
and DH outputs will then resume with a normal soft-start
cycle.
Response to MOC faults is enabled after the successful
completion of any normal soft-start cycle.
Response to SOC Faults (VCS > VSOC):
This is an immediate, single-cycle response over current
shutdown, followed by a hiccup delay and a normal soft-start
cycle. Since this is a gross fault protection mechanism, its
triggering mechanism is asynchronous to the timing of TDL
and TDH.
1. If VCS > VSOC, a hiccup interval is started, during which
both DL and DH are held in their low states.
2. The SS pin is discharged towards 0 V by a 400 nA sink
current.
3. The hiccup interval is terminated when the SS pin is
discharged to 0.25 V.
4. Switching on the DL and DH outputs will then resume
with a normal soft-start cycle.
Severe over current response is enabled at all times,
including the initial ramp-up period of the soft-start pin. This
allows SiP11206 to provide rapid fault protection for the
converter’s power train.
Immediate Response to UVLO Faults:
The under voltage protection conditions at converter-level
(VINDET pin UVLO) and chip-level (VCC UVLO) will
immediately trigger a shutdown-and-retry SS response, with
the restart requirements being that:
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
1. The SS pin has been discharged at a 20 µA rate to the
0.25 V level.
2. The affected supply has recovered to its turn-on
threshold.
Once these conditions are met, switching will resume with a
normal soft-start cycle. Response to UVLO faults is enabled
at all times, including the initial ramp-up period of the softstart pin.
Immediate Response to an OTP Condition:
Failure of the application circuit to provide an external
voltage to the VCC pin above the VREG level may result in an
OTP condition (TJ > OTPON). Other conditions, such as
excessive ambient temperature or, where applicable, failure
of airflow over the DC-DC converter circuit, can also trigger
an OTP condition. An OTP condition will immediately trigger
a shutdown-and-retry soft start response, with the restart
requirements being that:
1. The SS pin has been discharged at a 20 µA rate to the
0.25 V level.
2. The chip junction temperature has fallen below the lower
OTP threshold.
Once these conditions are met, switching will resume with a
normal soft-start cycle. Response to the OTP condition is
enabled at all times, including the initial ramp-up period of the
soft-start pin.
Reference
The reference voltage of SiP11206 is set at 3.3 V at VREF
pin. This pin should be decoupled externally with a 0.1 µF to
1 µF capacitor to GND. Up to 5 mA may be drawn internally
from this reference to power external circuits. Note that if the
VINDET pin is pulled below 0.55 V (typical), the reference will
be turned off, and SiP11206 will enter a low-power "standby"
mode. During startup or when VREF is accidentally shorted to
ground, this pin has internal short circuit protection limiting
the source current to 50 mA. VREF load regulation for 5 mA
step is typically 0.45 %.
Oscillator
The oscillator is designed to operate from 200 kHz to 1 MHz
with temperature stability within 15 %. This operating
frequency range allows the converter to minimize the
inductor and capacitor size, improving the power density of
the converter. The oscillator frequency, and therefore the
switching frequency, is programmable by the value of
resistor and capacitor connected to the ROSC and COSC pins
respectively. Note that the switching frequency at pins DL
and DH is half of the oscillator frequency, i.e., the DL output
will be active during one oscillator cycle, and the DH during
the next oscillator cycle.
VINDET
The VINDET pin controls several modes of operation and the
modes of operation are controlled by shutdown (VSD) and
under voltage (VUV) comparators (see block diagram). When
the IC is powered solely by VIN and VINDET is less than VSDH
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SiP11206
Vishay Siliconix
due to some external reset condition the pre-regulator is in
low power standby mode and the internal bias network is
powered down. When VINDET is greater than VSDH but less
than VREF and VCC is forced to 12 V the pre-regulator shuts
off drawing only leakage current from VIN and quiescent
current from VCC. In this mode the controller output drivers
remains static (non-switching). When VINDET is above VREF
the controller is enabled and both drivers are switching at half
the oscillator frequency. If SiP11206 is shut down via this pin,
its restart will be by means of a soft-start cycle, as described
under "Soft Start" and "Hiccup-Mode Operation" above.
The input impedance to ground of this pin is typically
46K ± 30 % and must be taken into account at application
design. An external 10:1 resistor divider ratio of supply
voltage to VINDET pin is required in a typical application.
Primary High and Low Side MOSFET Drivers
The low-side MOSFET driver is powered directly from VCC of
the chip. The high-side MOSFET however requires the gate
voltage to be higher than VIN. This is achieved with a charge
pump capacitor CBST between BST and LX, and an external
diode to charge and bootstrap the initial charge up voltage
across CBST to VCC level. On the alternate oscillator cycle
the boost diode isolates BST from VIN and hence BST and
LX steps up to VIN + VCC and VIN, respectively. This
sequencing insures that DL will always turn on before DH
during start-up. The boost capacitor value must be chosen to
meet the application droop rate requirement.
External Frequency Synchronization
The oscillator frequency of this IC can be synchronized to an
external source with a simple circuit shown in "Circuit for
Frequency Synchronization" diagram. The synchronized
frequency should not exceed 1.4 times the set frequency,
and the synchronized frequency range should not exceed
the IC frequency range.
TYPICAL CHARACTERISTICS
10.2
7.5
10.0
7.0
9.8
6.5
9.4
IVIN (mA)
VREG (V)
9.6
9.2
9.0
VIN = 75 V
6.0
5.5
8.8
8.6
5.0
8.4
8.2
- 40
- 15
10
35
60
85
110
4.5
- 40
135
60
85
Temperature (°C)
IVIN vs. Temperature
110
135
110
135
8.0
7.5
VUVH
ICC
7.0
ICC, IQ (mA)
3.25
VUV (V)
35
Temperature (°C)
3.30
3.20
3.15
3.10
6.5
VCC = 12 V
6.0
5.5
IQ
5.0
VUVL
3.05
4.5
- 15
10
35
60
85
Temperature (°C)
VUV vs. Temperature
www.vishay.com
10
10
VREG vs. Temperature
3.35
3.00
- 40
- 15
110
135
4.0
- 40
- 15
10
35
60
85
Temperature (°C)
ICC and IQ vs. Temperature
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
800
200
700
180
600
160
ISD (µA)
VSD (mV)
TYPICAL CHARACTERISTICS
VSDH
500
140
120
400
VSDL
100
300
80
- 40
200
- 40
- 15
10
35
60
85
110
135
- 15
10
Temperature (°C)
35
60
85
110
135
Temperature (°C)
ISD vs. Temperature
VSD vs. Temperature
5.1
10
5.0
9.5
4.9
9.0
VSS (V)
UVLO (V)
UVLOH
8.5
4.8
4.7
4.6
8.0
4.5
UVLOL
7.5
- 40
- 15
10
35
60
85
110
4.4
- 40
135
10
35
60
85
Temperature (°C)
UVLO vs. Temperature
VSS vs. Temperature
23
- 15
22
- 16
21
110
135
110
135
- 17
20
ISS (µA)
IDSS1 (µA)
- 15
Temperature (°C)
19
- 18
- 19
18
- 20
17
- 21
16
15
- 40
- 15
10
35
60
85
Temperature (°C)
IDSS1 vs. Temperature
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
110
135
- 22
- 40
- 15
10
35
60
85
Temperature (°C)
ISS vs. Temperature
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11
SiP11206
Vishay Siliconix
TYPICAL CHARACTERISTICS
140
0.55
120
0.50
IVINSD (µA)
IDSS2 (µA)
100
0.45
0.40
80
60
40
0.35
20
0.30
- 40
- 15
10
35
60
85
110
0
- 40
135
- 15
10
35
60
85
Temperature (°C)
Temperature (°C)
IDSS2 vs. Temperature
IVINSD vs. Temperature
430
110
135
47.4
47.2
420
47.0
DL = 44 V
46.8
DMAX (%)
FREQ (kHz)
410
FDL
400
FDH
390
46.6
46.4
46.2
DH = 40 V
46.0
380
45.8
370
- 40
- 15
10
35
60
85
110
45.6
- 40
135
- 15
10
35
60
85
Temperature (°C)
Temperature (°C)
FDL/FDH vs. Temperature
DMAX. vs. Temperature
3.304
110
135
3.20
3.302
3.19
3.300
VCC = 12 V
VRDB (V)
VREF (V)
3.298
3.296
3.294
3.18
3.17
3.292
3.16
3.290
3.288
- 40
- 15
10
35
60
Temperature (°C)
VREF vs. Temperature
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12
85
110
3.15
- 40
- 15
10
35
60
85
110
135
Temperature (°C)
VRDB vs. Temperature
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
SiP11206
Vishay Siliconix
TYPICAL CHARACTERISTICS
4.5
3.5
3.3
4.0
3.1
3.5
2.7
RDSP (Ω)
RDSN (Ω)
2.9
2.5
2.3
3.0
2.5
2.1
1.9
2.0
1.7
1.5
- 40
1.5
- 15
10
35
60
85
110
- 40
135
35
60
85
Temperature (°C)
Temperature (°C)
DL RDSP vs. Temperature
2.3
3.1
2.1
2.9
110
135
110
135
110
135
1.9
RDSP (Ω)
2.7
RDSN (Ω)
10
DL RDSN vs. Temperature
3.3
2.5
2.3
1.7
1.5
1.3
2.1
1.1
1.9
0.9
1.7
1.5
- 40
- 15
- 15
10
35
60
85
110
0.7
- 40
135
- 15
10
35
60
85
Temperature (°C)
Temperature (°C)
DH RDSN vs. Temperature
DH RDSP vs. Temperature
65
225
60
200
VSOC
RVINDET (kΩ)
VCS (mV)
55
175
150
45
VMOC
125
100
- 40
50
40
- 15
10
35
60
85
110
135
35
- 40
- 15
10
35
60
85
Temperature (°C)
Temperature (°C)
VCS vs. Temperature
RVINDET vs. Temperature
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
www.vishay.com
13
SiP11206
Vishay Siliconix
TYPICAL CHARACTERISTICS
96
14
VIN = 42 V
VIN = 55 V
VIN = 48 V
13
VIN = 55 V
Efficiency (%)
Output Voltage (V)
92
12
VIN = 48 V
11
VIN = 42 V
88
10
84
9
8
80
0
3
6
9
12
15
0
3
6
9
Load Current (A)
Load Current (A)
Line and Load Regulation
Efficiency vs. Current
12
15
TYPICAL WAVEFORMS
System Startup
Primary Driving Signals DL and DH
System Shutdown
Hiccup Mode when Output Shorted
Vishay Siliconix maintains worldwide manufacturing capability. Products may be manufactured at one of several qualified locations. Reliability data for Silicon
Technology and Package Reliability represent a composite of all qualified locations. For related documents such as package/tape drawings, part marking, and
reliability data, see http://www.vishay.com/ppg?69232.
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14
Document Number: 69232
S-81795-Rev. C, 04-Aug-08
Package Information
Vishay Siliconix
POWER IC THERMALLY ENHANCED PowerPAKR TSSOP: 14/16-LEAD
3
8
D
CL
6
N
e
−B−
7
R
4
E1
CL
8
GAUGE PLANE
−H−
0.25
E
SEATING PLANE
q1
0.7500
R1
L
L1
DETAIL A
1
0.7500
2 3
Ğ 0.07600
0.025−0.075 DP
PIN 1 INDICATOR
POLISH
e
TOP VIEW
7
−A−
CL
CL
DETAIL A
ccc S
A2
aaa C
A
−C−
B
SEATING PLANE
9
B
A1
b
bbb M C B S A S
Y
c1
CL
5
(b)
X
c
b1
DETAIL B-B
BOTTOM VIEW
EXPOSED PAD
Document Number: 72778
31-Mar-05
www.vishay.com
1 of 2
Package Information
Vishay Siliconix
POWER IC THERMALLY ENHANCED PowerPAKR TSSOP: 14/16-LEAD
MILLIMETERS
Dim
A
A1
A2
b
b1
c
c1
D
e
E
E1
L
L1
R
R1
q1
N (14)
N (16)
X
Y (14)
Y (16)
aaa
bbb
ccc
ddd
INCHES*
Min
Nom
Max
Min
Nom
Max
−
−
1.20
−
−
0.0472
0.025
−
0.100
0.001
−
0.0039
0.80
0.90
1.05
0.0315
0.0354
0.0413
0.19
−
0.30
0.0075
−
0.0118
0.19
0.22
0.25
0.0075
0.0087
0.0098
0.09
−
0.20
0.0035
−
0.0079
0.09
−
0.16
0.0035
−
0.0063
4.9
5.0
5.1
0.1929
0.1968
0.2008
0.65 BSC
0.0256 BSC
6.2
6.4
6.6
0.2441
0.2520
0.2598
4.3
4.4
4.5
0.1693
0.1732
0.1772
0.45
0.60
0.75
0.0177
0.0236
0.0295
1.0 REF
0.0394 REF
0.09
−
−
0.0035
−
−
0.09
−
−
0.0035
−
−
0
−
0
0
−
0
14
14
16
16
2.95
3.0
3.05
0.116
0.118
0.120
3.15
3.2
3.25
0.124
0.126
0.128
3.0
3.05
0.116
0.118
0.120
2.95
0.10
0.0039
0.10
0.0039
0.05
0.0020
0.20
0.0079
ECN: S-50568—Rev. B, 04-Apr-05
DWG: 5913
*Dimensions are in mm converted to inches.
NOTES:
1. All dimensions are in millimeters (angles in degrees).
2. Dimensioning and tolerancing per ANSI Y14.5M-1982.
3. Dimension “D” does not include mold flash, protrusions or gate burrs.
4. Dimension “E1” does not include internal flash or protrusion.
5. Dimension “b” does not include Dambar protrusion.
6. “N” is the maximum number of lead terminal positions for the specified package length.
7. Datums −A−
and −B− to be determined at datum plane −H− .
8. Dimensions “D” and “E1” are to be determined at datum plane −H− .
9. Cross section B-B to be determined at 0.10 to 0.25 mm from the lead tip.
10. Refer to JEDEC MO-153, Issue C., Variation ABT.
11. Exposed pad will depend on the pad size of the L/F.
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2 of 2
Document Number: 72778
31-Mar-05
Package Information
Vishay Siliconix
PowerPAKr MLP44-16 (POWER IC ONLY)
JEDEC Part Number: MO-220
D
-B-
ÉÉÉ
ÉÉÉ
ÉÉÉ
ÉÉÉ
Index Area
(Dń2 Eń2)
4
D/2
AA
E/2
BB
E
-A-
aaa C 2 X
Detail A
Top View
//
ccc C
Nx
9
CC
DD
aaa C 2 X
Seating Plane
0.08 C
-C-
Side View
A
A1
A3
D2
N L
Detail B
D2/2
Datum A or B
N r
E2/2
6
(NE-1) x e
E2
2
Terminal Tip
1
Exposed Pad
N b
N N-1
Detail A
e/2
5
Terminal Tip
5
e
Even Terminal/Side
8
e
5
bbb M C A B
(ND-1) x e
8
Odd Terminal/Side
Detail B
Bottom View
Document Number: 72802
16-May-05
www.vishay.com
1
Package Information
Vishay Siliconix
PowerPAKr MLP44-16 (Power IC Only)
JEDEC Part Number: MO-220
MILLIMETERS*
Dim
Min
Nom
A
0.80
0.90
A1
0
0.02
A3
−
0.20 Ref
AA
−
0.345
aaa
−
0.15
BB
−
0.345
b
0.25
0.30
bbb
−
0.10
CC
−
0.18
ccc
−
0.10
D
4.00 BSC
D2
2.55
2.7
DD
−
0.18
E
4.00 BSC
E2
2.55
2.7
e
0.65 BSC
L
0.3
0.4
N
16
ND
−
4
NE
−
4
r
b(min)/2
−
* Use millimeters as the primary measurement.
INCHES
Max
Min
Nom
Max
1.00
0.05
−
−
−
−
0.35
−
−
−
0.0315
0
−
−
−
−
0.0098
−
−
−
0.0394
0.0020
−
−
−
−
0.138
−
−
−
2.8
−
0.1004
−
2.8
0.1004
0.5
0.0118
−
−
−
−
−
b(min)/2
0.0354
0.0008
0.0079
0.0136
0.0059
0.0136
0.0118
0.0039
0.0071
0.0039
0.1575 BSC
0.1063
0.0071
0.1575 BSC
0.1063
0.0256 BSC
0.0157
16
4
4
−
Notes
5
0.1102
−
0.1102
0.0197
−
−
−
3, 7
6
6
ECN: S-50794—Rev. B, 16-May-05
DWG: 5905
NOTES:
1.
Dimensioning and tolerancing conform to ASME Y14.5M-1994.
2.
All dimensions are in millimeters. All angels are in degrees.
3.
N is the total number of terminals.
4.
The terminal #1 identifier and terminal numbering convention shall conform to JESD 95-1 SPP-012. Details of terminal #1 identifier are optional, but must
be located within the zone indicated. The terminal #1 identifier may be either a molded or marked feature. The X and Y dimension will vary according to
lead counts.
5.
Dimension b applies to metallized terminal and is measured between 0.25 mm and 0.30 mm from the terminal tip.
6.
ND and NE refer to the number of terminals on the D and E side respectively.
7.
Depopulation is possible in a symmetrical fashion.
8.
Variation HHD is shown for illustration only.
9.
Coplanarity applies to the exposed heat sink slug as well as the terminals.
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2
Document Number: 72802
16-May-05
Legal Disclaimer Notice
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Vishay
Disclaimer
ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE
RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE.
Vishay Intertechnology, Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively,
“Vishay”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other
disclosure relating to any product.
Vishay makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or
the continuing production of any product. To the maximum extent permitted by applicable law, Vishay disclaims (i) any and all
liability arising out of the application or use of any product, (ii) any and all liability, including without limitation special,
consequential or incidental damages, and (iii) any and all implied warranties, including warranties of fitness for particular
purpose, non-infringement and merchantability.
Statements regarding the suitability of products for certain types of applications are based on Vishay’s knowledge of typical
requirements that are often placed on Vishay products in generic applications. Such statements are not binding statements
about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular
product with the properties described in the product specification is suitable for use in a particular application. Parameters
provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
technical experts. Product specifications do not expand or otherwise modify Vishay’s terms and conditions of purchase,
including but not limited to the warranty expressed therein.
Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining
applications or for any other application in which the failure of the Vishay product could result in personal injury or death.
Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk. Please
contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications.
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Material Category Policy
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as Halogen-Free follow Halogen-Free
requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000