SAK-TC1796-256F150E BE Data Sheet (4 MB, EN)

D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8
TC1796
3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r
TriCore
M i c r o c o n t r o l l e rs
Edition 2008-04
Published by
Infineon Technologies AG
81726 Munich, Germany
© 2008 Infineon Technologies AG
All Rights Reserved.
Legal Disclaimer
The information given in this document shall in no event be regarded as a guarantee of conditions or
characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any
information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties
and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights
of any third party.
Information
For further information on technology, delivery terms and conditions and prices, please contact the nearest
Infineon Technologies Office (www.infineon.com).
Warnings
Due to technical requirements, components may contain dangerous substances. For information on the types in
question, please contact the nearest Infineon Technologies Office.
Infineon Technologies components may be used in life-support devices or systems only with the express written
approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure
of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support
devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain
and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may
be endangered.
D a ta S he e t , V 1 .0 , Ap r . 2 0 0 8
TC1796
3 2 - B i t S i n g l e - C h i p M i c ro c o n t r o ll e r
TriCore
M i c r o c o n t r o l l e rs
TC1796
TC1796 Data Sheet
Revision History: V1.0, 2008-04
Previous Version: V1.0, 2008-04 “Preliminary”
Page
Subjects (major changes since last revision)
“Preliminary” status removed. No changes in content.
Changes from V0.7, 2006-03 to V1.0, 2008-04 Preliminary
32
The list of not connected pins (N.C.) improved by adding several
formerly as VSS labeled pins.
69
Watchdog timer, double reset detection, description corrected.
80
RTID register updated for the design step BE.
85
The description of the inactive device current improved.
96
ADC parameters sample and conversion time moved to a dedicated
table.
107
The description of the power supply sequence improved..
115
BFCLKO clock, duty cycle description extended.
126
MLI timing, maximum operating frequency limit extended, t31 added.
131
The drawing of the package updated.
Green package variant included.
133
Example of a temperature profile corrected.
Trademarks
TriCore® is a trademark of Infineon Technologies AG.
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Your feedback will help us to continuously improve the quality of this document.
Please send your proposal (including a reference to this document) to:
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Data Sheet
V1.0, 2008-04
TC1796
Table of Contents
Table of Contents
1
Summary of Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
2
2.1
2.2
2.3
2.4
2.5
2.5.1
General Device Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
TC1796 Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Logic Symbol . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pad Driver and Input Classes Overview . . . . . . . . . . . . . . . . . . . . . . . . . .
Pin Definitions and Functions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Pull-Up/Pull-Down Behavior of the Pins . . . . . . . . . . . . . . . . . . . . . . . .
10
10
11
12
13
13
35
3
3.1
3.2
3.3
3.4
3.5
3.6
3.7
3.8
3.9
3.10
3.11
3.12
3.13
3.14
3.14.1
3.14.2
3.15
3.16
3.17
3.18
3.19
3.20
3.21
3.22
3.23
3.24
3.25
Functional Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Architecture and On-Chip Bus Systems . . . . . . . . . . . . . . . . . . . .
On-Chip Memories . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Architectural Address Map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Memory Protection System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
External Bus Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Peripheral Control Processor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
DMA Controller and Memory Checker . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Interrupt System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1) . . . . . . . . . .
High-Speed Synchronous Serial Interfaces (SSC0, SSC1) . . . . . . . . . . . .
Micro Second Bus Interfaces (MSC0, MSC1) . . . . . . . . . . . . . . . . . . . . . .
MultiCAN Controller (CAN) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Micro Link Serial Bus Interface (MLI0, MLI1) . . . . . . . . . . . . . . . . . . . . . . .
General Purpose Timer Array . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functionality of GPTA0/GPTA1 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Functionality of LTCA2 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Analog-to-Digital Converter (ADC0, ADC1) . . . . . . . . . . . . . . . . . . . . . . . .
Fast Analog-to-Digital Converter Unit (FADC) . . . . . . . . . . . . . . . . . . . . . .
System Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Watchdog Timer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
System Control Unit . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Boot Options . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Management System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
On-Chip Debug Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Clock Generation and PLL . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Power Supply . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Identification Register Values . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
36
36
37
39
40
41
42
44
46
48
50
52
54
57
59
60
62
63
65
67
69
70
70
73
74
76
79
80
4
4.1
4.1.1
Electrical Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
General Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Parameter Interpretation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 82
Data Sheet
5
V1.0, 2008-04
TC1796
Table of Contents
4.1.2
Pad Driver and Pad Classes Summary . . . . . . . . . . . . . . . . . . . . . . . . . 83
4.1.3
Absolute Maximum Ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 84
4.1.4
Operating Conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 85
4.2
DC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
4.2.1
Input/Output Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 88
4.2.2
Analog to Digital Converters (ADC0/ADC1) . . . . . . . . . . . . . . . . . . . . . 92
4.2.3
Fast Analog to Digital Converter (FADC) . . . . . . . . . . . . . . . . . . . . . . . . 99
4.2.4
Oscillator Pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 102
4.2.5
Temperature Sensor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 103
4.2.6
Power Supply Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 104
4.3
AC Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
4.3.1
Testing Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 105
4.3.2
Output Rise/Fall Times . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 106
4.3.3
Power Sequencing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 107
4.3.4
Power, Pad and Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 109
4.3.5
Phase Locked Loop (PLL) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 112
4.3.6
BFCLKO Output Clock Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 115
4.3.7
Debug Trace Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 117
4.3.8
JTAG Interface Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 118
4.3.9
EBU Demultiplexed Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
4.3.9.1
Demultiplexed Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 121
4.3.9.2
Demultiplexed Write Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 122
4.3.10
EBU Burst Mode Read Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 123
4.3.11
EBU Arbitration Signal Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
4.3.12
Peripheral Timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 126
4.3.12.1
Micro Link Interface (MLI) Timing . . . . . . . . . . . . . . . . . . . . . . . . . . 126
4.3.12.2
Micro Second Channel (MSC) Interface Timing . . . . . . . . . . . . . . . 128
4.3.12.3
Synchronous Serial Channel (SSC) Master Mode Timing . . . . . . . . 129
5
5.1
5.2
5.3
5.4
Data Sheet
Package and Reliability . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Package Parameters (P/PG-BGA-416-4) . . . . . . . . . . . . . . . . . . . . . . . .
Package Outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Flash Memory Parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Quality Declarations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6
130
130
131
132
133
V1.0, 2008-04
TC1796
Summary of Features
1
•
•
•
•
•
•
•
•
•
Summary of Features
High-performance 32-bit super-scalar TriCore V1.3 CPU with 4-stage pipeline
– Superior real-time performance
– Strong bit handling
– Fully integrated DSP capabilities
– Single precision Floating Point Unit (FPU)
– 150 MHz operation at full temperature range
32-bit Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
Multiple on-chip memories
– 2 Mbyte Program Flash Memory (PFLASH) with ECC
– 128 Kbyte Data Flash Memory (DFLASH) usable for EEPROM emulation
– 136 Kbyte Data Memory (LDRAM, SRAM, SBRAM)
– 8 Kbyte Dual-Ported Memory (DPRAM)
– 48 Kbyte Code Scratchpad Memory (SPRAM)
– 16 Kbyte Instruction Cache (ICACHE)
– 16 Kbyte BootROM (BROM)
16-Channel DMA Controller
32-bit External Bus Interface Unit (EBU) with
– 75 dedicated address/data bus, clock, and control lines
– Synchronous burst Flash access capability
Sophisticated interrupt system with 2 × 255 hardware priority arbitration levels
serviced by CPU or PCP2
High performing on-chip bus structure
– Two 64-bit Local Memory Buses between EBU, Flash and Data Memory
– 32-bit System Peripheral Bus (SPB) for on-chip peripheral and functional units
– 32-bit Remote Peripheral Bus (RPB) for high-speed on-chip peripheral units
– Two bus bridges (LFI Bridge, DMA Controller)
Peripheral Control Processor with single cycle instruction (PCP2)
– 16 Kbyte Parameter Memory (PRAM)
– 32 Kbyte Code Memory (CMEM)
Versatile On-chip Peripheral Units
– Two Asynchronous/Synchronous Serial Channels (ASC) with baud rate generator,
parity, framing and overrun error detection
– Two High-Speed Synchronous Serial Channels (SSC) with programmable data
length and shift direction
– Two serial Micro Second Bus interfaces (MSC) for serial port expansion to external
power devices
– Two High-Speed Micro Link interfaces (MLI) for serial inter-processor
communication
Data Sheet
7
V1.0, 2008-04
TC1796
Summary of Features
•
•
•
•
•
•
•
•
•
•
•
– One MultiCAN Module with four CAN nodes and 128 free assignable message
objects for high efficiency data handling via FIFO buffering and gateway data
transfer (one CAN node supports TTCAN functionality)
– Two General Purpose Timer Array Modules (GPTA) with additional Local Timer
Cell Array (LTCA2) providing a powerful set of digital signal filtering and timer
functionality to realize autonomous and complex Input/Output management
– Two 16-channel Analog-to-Digital Converter units (ADC) with selectable 8-bit, 10bit, or 12-bit resolution
– One 4-channel Fast Analog-to-Digital Converter unit (FADC) with concatenated
comb filters for hardware data reduction: supporting 10-bit resolution, min.
conversion time of 280ns
44 analog input lines for ADC and FADC
123 digital general purpose I/O lines, 4 input lines
Digital I/O ports with 3.3 V capability
On-chip debug support for OCDS Level 1 and 2 (CPU, PCP3, DMA)
Dedicated Emulation Device chip for multi-core debugging, tracing, and calibration
via USB V1.1 interface available (TC1796ED)
Power Management System
Clock Generation Unit with PLL
Core supply voltage of 1.5 V
I/O voltage of 3.3 V
Full automotive temperature range: -40° to +125°C
P/PG-BGA-416-4 package
Data Sheet
8
V1.0, 2008-04
TC1796
Summary of Features
Ordering Information
The ordering code for Infineon microcontrollers provides an exact reference to the
required product. This ordering code identifies:
•
•
The derivative itself, i.e. its function set, the temperature range, and the supply
voltage
The package and the type of delivery.
For the available ordering codes for the TC1796 please refer to the “Product Catalog
Microcontrollers”, which summarizes all available microcontroller variants.
This document describes the derivatives of the device.The Table 1 enumerates these
derivatives and summarizes the differences.
Table 1
TC1796 Derivative Synopsis
Derivative
Ambient Temperature Range
SAK-TC1796-256F150E
TA = -40oC to +125oC
Data Sheet
9
V1.0, 2008-04
TC1796
General Device Information
2
General Device Information
2.1
TC1796 Block Diagram
FPU
DMI
TriCore
(TC1M)
56 KB LDRAM
48 KB SPRAM
16 KB ICACHE
SPRAM:
ICACHE:
LDRAM
DPRAM:
BROM:
PFLASH:
DFLASH:
SBRAM:
SRAM:
PRAM:
CMEM:
PLMB:
DLMB:
RPB:
SPB:
shaded:
8 KB DPRAM
CPS
Program Local Memory Bus
Data Local Memory Bus
P LMB
DBCU
DLMB
PMU
LMI
Emulation Memory
Interface
OCDS Debug
Interface
/JTAG
32 KB CMEM
SCU
PLL
SSC1
SBCU
ADC0
S PB
fCPU
SSC0
RP B
STM
Ports
fFPI
LTCA2
DMA
ADC1
BI1
F PI-Bus Interface
PCP2
Core
BI0
GPTA1
System Peripheral Bus
GPTA0
LFI Bridge
16 KB PRAM
ASC0
ASC1
64 KB SRAM
16 KB SBRAM
Interrupts
EBU
DMU
16 KB BROM
2 MB PFLASH
128 KB DFLASH
Remote Peripheral Bus
PBCU
Scratch-Pad RAM
Instruction cache
Local data RAM
Dual-port RAM
Boot ROM
Program Flash Memory
Data Flash Memory
Stand-by Data Memory
Data Memory
PCP Parameter Memory
PCP Code Memory
Program Local Memory Bus
Data Local Memory Bus
Remote Peripheral Bus
System Peripheral Bus
only available in TC1796ED
FADC
Analog Input Assignment
PMI
SMIF
RBCU
MultiCAN
(with 4
CAN
Nodes)
MSC
0
MSC
1
MLI
0
MLI
1
MEM
CHK
MCB05573_mod
Figure 1
Data Sheet
TC1796 Block Diagram
10
V1.0, 2008-04
TC1796
General Device Information
2.2
Logic Symbol
TSTRES
D[31:0]
TESTMODE
General
Control
A[23:0]
HDRST
5
PORST
NMI
13
BYPASS
BFLCKO
XTAL2
16
VD D OSC
VD DOSC3
VSSOSC
16
14
TRST
JTAG /
OCDS
TCK
16
TDI
TDO
16
TMS
8
BRKIN
TC1796
BRKOUT
8
TRCLK
9
VD DEBU
11
VD D P
13
VD D
2
VD D FL3
9
4
Figure 2
Data Sheet
Port 1
Port 2
2
2
10
Alternate
Functions :
MLI0 / SCU
SSC0 / SSC1 /
GPTA
Port 3
GPTA
Port 4
Port 5
Port 6
ASC0 / ASC1 /
MSC0 / MSC1 /MLI0
ASC0 / ASC1 /
SSC1 / CAN
Port 7
ADC0 / ADC1
Port 8
MLI 1 /
GPTA
MSC0 / MSC1 /
GPTA
Port 9
Port 10
HWCFG
Dedicated
SSC0 I/O Lines
8
V FAR EF
VFAGN D
VD D MF
VSSMF
VDD AF
VSSAF
N.C.
Port 0
6
VD D SBRAM
62
VSS
FADC Analog
Power Supply
12
8
TR[15:0]
Digital Circuitry
Power Supply
External Bus
Unit Interface
BFCLKI
XTAL1
Oscillator
Chip
Select
Control
LVDS MSC Outputs
AN[43:0]
ADC
Analog Inputs
VAR EFx
VAGND x
VD D M
VSSM
ADC0 /ADC1
Analog
Power Supply
MCA05583_mod
TC1796 Logic Symbol
11
V1.0, 2008-04
TC1796
General Device Information
2.3
Pin Configuration
1
A
B
C
D
E
F
N.C.
P2.6
P2.5
P2.4
2
3
4
5
6
P2.9 P2.13 P2.15 P0.14 P0.5
P2.7 P2.10 P2.14 P0.9
P0.6
7
P0.2
P0.4
P2.8 P2.11 P2.12 P0.12 P0.10 P0.8
P2.3
P2.2 P0.15 P0.13 P0.11 VDDP
P6.12 P6.11 P6.6
P6.14 P6.10 P6.4
8
P0.1
9
10
P0.0 P3.14 P3.5
P0.3 P3.15 P3.6
P0.7
VSS
11
P3.3
P3.7 P3.10 P3.9
VDD
12
P3.1
P3.0
P3.4
13
P5.1
P5.0
P3.2
14
P5.2
P5.3
P5.5
P3.8 P3.12 P3.13 P3.11 VDDP
15
16
P5.7
SO
N1
FCL V
DDFL3 P9.0
P1A
P9.3 P10.0
P5.6
SO
P1A
FCL V
DDFL3 P9.1
N1
PO TEST V
P9.2 P10.1
RST MODE DDP
P5.4
SO
P0A
FCL
N0
VDD
SO
N0
VSS
17
18
FCL
P0A
P9.4
19
P9.6
P9.5
20
21
22
NMI
P9.8 P10.2 N.C.
P9.7 P10.3 VDDP
P6.8
P6.15 P6.13 P6.7
P6.5
H
P8.1
P8.0
N.C.
VDD
J
P8.4
P8.3
P8.2
VSS
K
P8.7
P8.5
P8.6
VDDP
L
24
25
26
VSS
A
VSS
VDD
B
VDD
BRK
IN
C
TDO
BRK
OUT
D
TCK
TDI
VDD
E
TRST TMS
VSS
VDD
OSC
OSC
VDDP
VSS
VDD
P6.9
G
23
HD
BY
VDDP
RST PASS
VSS
VDD
OSC3
F
TST XTAL XTAL
RES
2
1
G
VDDEBU VDDEBU VDDEBU VDDEBU
H
N.C.
A5
A0
A1
A2
J
TR12 TR13 TR15
VSS
VSS
VSS
VSS
VSS
A9
A6
A3
A4
K
P1.15 P1.14 P1.13 P1.11
TR11 TR10 TR14
VSS
VSS
VSS
VSS
VSS
VSS
A13
A7
A8
L
M
P1.10 P1.9
P1.8
P1.5
TR9
TR8
VSS
VSS
VSS
VSS
VSS
VSS
VDDEBU A12
A11
A10
M
N
P1.3
P1.7
P1.6
P1.4
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
A15
A16
A17
A14
N
P
P1.2
P1.1
P1.0 P1.12
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VSS
VDD
A19
A20
A18
P
R
VDD
P7.1
P7.0
VDD
TR6
TR7
TR5
VSS
VSS
VSS
VSS
VSS
VSS
A21
A23
A22
R
SBRAM
T
P7.6
P7.5
P7.4
VSS
TR
CLK
TR3
TR1
VSS
VSS
VSS
VSS
VSS
VDDEBU
D1
D3
D0
T
U
AN23 P7.7
P7.3
P7.2
TR4
TR2
TR0
VSS
VSS
VSS
VSS
VSS
D6
D9
D5
D2
U
V
AN22 AN21 AN19 AN16
VDD
D13
D8
D4
V
W
AN20 AN17 AN13 VDDM
VSS
D16
D12
D7
W
Y
AN18 AN14 AN10 VSSM
VDDEBU D18
D14
D10
Y
AA
AN15 AN11
AN5
AN2
AB
AN12
AN3
AN7
AN9
SLSO
VDDP
P4.8 P4.12
1
AC
AN8
AN4
AN32 AN38 AN42 VAGND1 AN26 AN24 VDDAF
VSS
VDD
P4.4
AD
AN6
AN1
AN34 AN40 AN35 VAREF1 AN27 AN25 VSSAF
P4.0
P4.2
P4.5 P4.11 P4.15 SLSI0 VDDP
AN33 AN36 AN41 VAREF0 AN28 AN30 VFAGND VDDMF P4.1
P4.3
SLSO MRST
VDDP
P4.7 P4.13
0
0
AN37 AN39 AN43 VAGND0 AN29 AN31 VFAREF VSSMF
SCLK MTSR
VDDP HOLD BC2 MR/W
P4.9 P4.10 P4.14
0
0
AE
AF
AN0
N.C.
1
2
3
4
5
6
7
8
9
P4.6
10
11
12
13
14
15
16
VSS
D19
D22
D17
D11
AA
VDD
D21
D20
D15
AB
VDDEBU VSS
VDD
N.C. VDDEBU
VSS
D28
D25
D23
AC
BC1 HLDA CS3
CS2
CS1 BREQ N.C.
D31
D27
D24
AD
CS0
N.C.
D30
D29
D26
AE
BF
BF
CLKI CLKO N.C.
AF
BC0
17
CS
BC3
WAIT
COMB
18
19
N.C.
RD
RD/
WR
ADV
BAA
20
21
22
23
24
25
26
MCA05584
Figure 3
Data Sheet
TC1796 Pinning for P/PG-BGA-416-4 Package (Top view)
12
V1.0, 2008-04
TC1796
General Device Information
2.4
Pad Driver and Input Classes Overview
The TC1796 provides different types and classes of input and output lines. For
understanding of the abbreviations in Table 2 starting at the next page, Table 4 gives an
overview on the pad type and class types.
2.5
Data Sheet
Pin Definitions and Functions
13
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions
Pins
I/O Pad
Class
Power Functions
Supply
External Bus Interface Lines (EBU)
D[31:0]
D0
D1
D2
D3
D4
D5
D6
D7
D8
D9
D10
D11
D12
D13
D14
D15
D16
D17
D18
D19
D20
D21
D22
D23
D24
D25
D26
D27
D28
D29
D30
D31
Data Sheet
I/O B1
T26
T24
U26
T25
V26
U25
U23
W26
V25
U24
Y26
AA26
W25
V24
Y25
AB26
W24
AA25
Y24
AA23
AB25
AB24
AA24
AC26
AD26
AC25
AE26
AD25
AC24
AE25
AE24
AD24
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
VDDEBU
EBU Data Bus Lines
The EBU Data Bus Lines D[31:0] serve as
external data bus.
Data bus line 0
Data bus line 1
Data bus line 2
Data bus line 3
Data bus line 4
Data bus line 5
Data bus line 6
Data bus line 7
Data bus line 8
Data bus line 9
Data bus line 10
Data bus line 11
Data bus line 12
Data bus line 13
Data bus line 14
Data bus line 15
Data bus line 16
Data bus line 17
Data bus line 18
Data bus line 19
Data bus line 20
Data bus line 21
Data bus line 22
Data bus line 23
Data bus line 24
Data bus line 25
Data bus line 26
Data bus line 27
Data bus line 28
Data bus line 29
Data bus line 30
Data bus line 31
14
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
A[23:0]
A0
A1
A2
A3
A4
A5
A6
A7
A8
A9
A10
A11
A12
A13
A14
A15
A16
A17
A18
A19
A20
A21
A22
A23
J24
J25
J26
K25
K26
J23
K24
L25
L26
K23
M26
M25
M24
L24
N26
N23
N24
N25
P26
P24
P25
R24
R26
R25
I/O Pad
Class
Power Functions
Supply
O
B1
VDDEBU
EBU Address Bus Lines A[23:0]
The EBU Address Bus Lines serve as
external address bus.
Address bus line 0
Address bus line 1
Address bus line 2
Address bus line 3
Address bus line 4
Address bus line 5
Address bus line 6
Address bus line 7
Address bus line 8
Address bus line 9
Address bus line 10
Address bus line 11
Address bus line 12
Address bus line 13
Address bus line 14
Address bus line 15
Address bus line 16
Address bus line 17
Address bus line 18
Address bus line 19
Address bus line 20
Address bus line 21
Address bus line 22
Address bus line 23
B1
VDDEBU
Chip Select Output Lines
Chip select output line 0
Chip select output line 1
Chip select output line 2
Chip select output line 3
B1
VDDEBU
Combined Chip Select Output for Global
Select / Emulator Memory
Region/Emulator Overlay Memory
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
CS0
CS1
CS2
CS3
AE21
AD21
AD20
AD19
O
O
O
O
CS
COMB
AE19
O
Data Sheet
15
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
I/O Pad
Class
Power Functions
Supply
BFCLKO AF25
O
B2
VDDEBU
BFCLKI
AF24
I
B1
Burst Mode Flash Clock Input
(feedback clock)
RD
AF20
O
B1
Read Control Line
RD/WR
AF21
O
B1
Write Control Line
ADV
AF22
O
B1
Address Valid Output
MR/W
AF19
O
B1
Motorola-style Read/Write Control
Signal
B1
Byte Control Lines
Byte control line 0
Byte control line 1
Byte control line 2
Byte control line 3
Burst Mode Flash Clock Output (nondifferential)
BC0
BC1
BC2
BC3
AE17
AD17
AF18
AE18
O
O
O
O
WAIT
AE20
I
B1
Wait Input for inserting Wait-States
BAA
AF23
O
B1
Burst Address Advance Output
HOLD
AF17
I
B1
Hold Request Input
HLDA
AD18
O
B1
Hold Acknowledge Output
BREQ
AD22
O
B1
Bus Request Output
Data Sheet
16
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
I/O Pad
Class
Power Functions
Supply
I/O A1
VDDP
Parallel Ports
P0
P0.0
P0.1
P0.2
P0.3
P0.4
P0.5
P0.6
P0.7
P0.8
P0.9
P0.10
P0.11
P0.12
P0.13
P0.14
P0.15
Data Sheet
A9
A8
A7
B8
B7
A6
B6
C8
C7
B5
C6
D6
C5
D5
A5
D4
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
Port 0
Port 0 is a 16-bit bidirectional generalpurpose I/O port.
Port 0 I/O line 0
Port 0 I/O line 1
Port 0 I/O line 2
Port 0 I/O line 3
Port 0 I/O line 4
Port 0 I/O line 5
Port 0 I/O line 6
Port 0 I/O line 7
Port 0 I/O line 8
Port 0 I/O line 9
Port 0 I/O line 10
Port 0 I/O line 11
Port 0 I/O line 12
Port 0 I/O line 13
Port 0 I/O line 14
Port 0 I/O line 15
The states of the Port 0 pins are latched into
the software configuration input register
SCU_SCILR at the rising edge of HDRST.
Therefore, Port 0 pins can be used for
operating mode selections by software.
17
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P1
I/O Pad
Class
Power Functions
Supply
I/O A1/A2
VDDP
Port 1
Port 1 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively
used for the MLI0 interface or as external
trigger input lines.
P1.0
P1.1
P1.2
P1.3
P3
P2
P1
N1
I
I
I
I
I
A1
A1
A1
A1
A1
REQ0
REQ1
REQ2
REQ3
TREADY0B
P1.4
N4
O
A2
TCLK0
P1.5
M4
I
A1
TREADY0A
P1.6
N3
O
A2
TVALID0A
P1.7
N2
O
A2
TDATA0
P1.8
M3
I
A1
RCLK0A
P1.9
M2
O
A2
RREADY0A
P1.10
M1
I
A1
RVALID0A
P1.11
L4
I
A1
RDATA0A
P1.12
P1.13
P4
L3
O
I
A2
A1
SYSCLK
RCLK0B
P1.14
L2
I
A1
RVALID0B
P1.15
L1
I
A1
RDATA0B
Data Sheet
18
External trigger input 0
External trigger input 1
External trigger input 3
External trigger input 2
MLI0 transmit channel
ready input B
MLI0 transmit channel clock
output
MLI0 transmit channel
ready input A
MLI0 transmit channel valid
output A
MLI0 transmit channel data
output
MLI0 receive channel clock
input A
MLI0 receive channel ready
output A
MLI0 receive channel valid
input A
MLI0 receive channel data
input A
System clock output
MLI0 receive channel clock
input B
MLI0 receive channel valid
input B
MLI0 receive channel data
input B
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P2
I/O Pad
Class
Power Functions
Supply
I/O A1/A2
VDDP
Port 2
Port 2 is a 14-bit bi-directional generalpurpose I/O port which can be used
alternatively for the six upper SSC slave
select outputs or for GPTA I/O lines.
P2.2
P2.3
P2.4
P2.5
P2.6
P2.7
D3
D2
D1
C1
B1
B2
O
O
O
O
O
O
A2
A2
A2
A2
A2
A2
SLSO2
SLSO3
SLSO4
SLSO5
SLSO6
SLSO7
P2.8
P2.9
P2.10
P2.11
P2.12
P2.13
P2.14
P2.15
C2
A2
B3
C3
C4
A3
B4
A4
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
A1
A1
A1
A1
A1
A1
A1
A1
IN0 / OUT0 line of GPTA
IN1 / OUT1 line of GPTA
IN2 / OUT2 line of GPTA
IN3 / OUT3 line of GPTA
IN4 / OUT4 line of GPTA
IN5 / OUT5 line of GPTA
IN6 / OUT6 line of GPTA
IN7 / OUT7 line of GPTA
Data Sheet
19
Slave select output line 2
Slave select output line 3
Slave select output line 4
Slave select output line 5
Slave select output line 6
Slave select output line 7
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P3
P3.0
P3.1
P3.2
P3.3
P3.4
P3.5
P3.6
P3.7
P3.9
P3.8
P3.10
P3.11
P3.12
P3.13
P3.14
P3.15.
Data Sheet
B12
A12
C13
B11
C12
A11
B10
C9
D10
C11
C10
D13
D11
D12
A10
B9
I/O Pad
Class
Power Functions
Supply
I/O A1
VDDP
Port 3
Port 3 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively
used for GPTA I/O lines.
IN8 / OUT8 line of GPTA
IN9 / OUT9 line of GPTA
IN10 / OUT10 line of GPTA
IN11 / OUT11 line of GPTA
IN12 / OUT12 line of GPTA
IN13 / OUT13 line of GPTA
IN14 / OUT14 line of GPTA
IN15 / OUT15 line of GPTA
IN16 / OUT16 line of GPTA
IN17 / OUT17 line of GPTA
IN18 / OUT18 line of GPTA
IN19 / OUT19 line of GPTA
IN20 / OUT20 line of GPTA
IN21 / OUT21 line of GPTA
IN22 / OUT22 line of GPTA
IN23 / OUT23 line of GPTA
20
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P4
P4.0
P4.1
P4.2
P4.3
P4.4
P4.5
P4.6
P4.7
P4.8
P4.9
P4.10
P4.11
P4.12
P4.13
P4.14
P4.15
Data Sheet
AD10
AE10
AD11
AE11
AC12
AD12
AF10
AE12
AC13
AF11
AF12
AD13
AC14
AE13
AF13
AD14
I/O Pad
Class
Power Functions
Supply
I/O A1/A2
VDDP
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
I/O
A21)
A21)
A21)
A21)
A21)
A21)
A21)
A21)
A1
A1
A1
A1
A1
A1
A1
A1
Port 4
Port 4 is a 16-bit bi-directional generalpurpose I/O port which can be alternatively
used for GPTA I/O lines.
IN24 / OUT24 line of GPTA
IN25 / OUT25 line of GPTA
IN26 / OUT26 line of GPTA
IN27 / OUT27 line of GPTA
IN28 / OUT28 line of GPTA
IN29 / OUT29 line of GPTA
IN30 / OUT30 line of GPTA
IN31 / OUT31 line of GPTA
IN32 / OUT32 line of GPTA
IN33 / OUT33 line of GPTA
IN34 / OUT34 line of GPTA
IN35 / OUT35 line of GPTA
IN36 / OUT36 line of GPTA
IN37 / OUT37 line of GPTA
IN38 / OUT38 line of GPTA
IN39 / OUT39 line of GPTA
21
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P5
I/O Pad
Class
Power Functions
Supply
I/O A2
VDDP
Port 5
Port 5 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively
used for ASC0/1 or MSC0/1 lines.
P5.0
B13
I/O
RXD0A
P5.1
P5.2
A13
A14
O
I/O
TXD0A
RXD1A
P5.3
B14
O
TXD1A
P5.4
C15
O
EN00
O
RREADY0B
I
O
SDI0
EN10
O
TVALID0B
I
SDI1
P5.5
P5.6
P5.7
Data Sheet
C14
B15
A15
22
ASC0 receiver input /
output A
ASC0 transmitter output A
ASC1 receiver input /
output A
ASC1 transmitter output A
P5.3 is latched with the
rising edge of PORST if
BYPASS = 1 and stored in
inverted state as bit
OSC_CON.MOSC.
MSC0 device select
output 0
MLI0 receive channel ready
output B
MSC0 serial data input
MSC1 device select
output 0
MLI0 transmit channel valid
output B
MSC1 serial data input
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P6
I/O Pad
Class
Power Functions
Supply
I/O A2
VDDP
Port 6
Port 6 is a 12-bit bi-directional generalpurpose I/O port which can be alternatively
used for SSC1, ASC0/1, and CAN I/O lines.
P6.4
F3
O
I
MTSR1
P6.5
G4
MRST1
P6.6
P6.7
P6.8
E3
G3
F4
I
O
I/O
I
I
I/O
P6.9
E4
O
TXDCAN0
P6.10
F2
O
I
I/O
TXD0B
RXDCAN1
RXD1B
P6.11
E2
O
TXDCAN1
P6.12
P6.13
E1
G2
O
I
O
TXD1B
RXDCAN2
TXDCAN2
P6.14
P6.15
F1
G1
I
O
RXDCAN3
TXDCAN3
Data Sheet
SCLK1
SLSI1
RXDCAN0
RXD0B
23
SSC1 master transmit
output / SSC1 slave receive
input
SSC1 master receive input /
SSC1 slave transmit output
SSC1 clock input / output
SSC1 slave select input
CAN node 0 receiver input
ASC0 receiver input /
output B
CAN node 0 transmitter
output
ASC0 transmitter output B
CAN node 1 receiver input
ASC1 receiver input /
output B
CAN node 1 transmitter
output
ASC1 transmitter output B
CAN node 2 receiver input
CAN node 2 transmitter
output
CAN node 3 receiver input
CAN node 3 transmitter
output
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P7
I/O Pad
Class
Power Functions
Supply
I/O A1
VDDP
Port 7
Port 7 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively
used as external trigger input lines and for
ADC0/1 external multiplexer control.
P7.0
P7.1
R3
R2
I
I
O
REQ4
REQ5
AD0EMUX2
P7.2
U4
O
AD0EMUX0
P7.3
U3
O
AD0EMUX2
P7.4
P7.5
P7.6
T3
T2
T1
I
I
O
REQ6
REQ7
AD1EMUX0
P7.7
U2
O
AD1EMUX1
Data Sheet
24
External trigger input 4
External trigger input 5
ADC0 external multiplexer
control output 2
ADC0 external multiplexer
control output 0
ADC0 external multiplexer
control output 1
External trigger input 6
External trigger input 7
ADC1 external multiplexer
control output 0
ADC1 external multiplexer
control output 1
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P8
P8.0
I/O Pad
Class
Power Functions
Supply
I/O A1/A2
VDDP
H2
O
H1
I/O A2
I
A1
IN40/OUT40
TREADY1A
J3
I/O A1
O
A2
IN41/OUT41
TVALID1A
J2
I/O A2
O
A2
IN42/OUT42
TDATA1
J1
I/O A2
I
A1
IN43/OUT43
RCLK1A
K2
I/O A1
O
A2
IN44/OUT44
RREADY1A
P8.6
K3
I/O A2
I
A1
IN45/OUT45
RVALID1A
P8.7
K1
I/O A1
I
A1
IN46/OUT46
RDATA1A
I/O A1
IN47/OUT47
P8.1
P8.2
P8.3
P8.4
P8.5
Data Sheet
A2
Port 8
Port 8 is an 8-bit bi-directional generalpurpose I/O port which can be alternatively
used for the MLI1 interface or as GPTA I/O
lines.
TCLK1
25
MLI1 transmit channel clock
output
I/O line of GPTA
MLI1 transmit channel
ready input A
I/O line of GPTA
MLI1 transmit channel valid
output A
I/O line of GPTA
MLI1 transmit channel data
output
I/O line of GPTA
MLI1 receive channel clock
input A
I/O line of GPTA
MLI1 receive channel ready
output A
I/O line of GPTA
MLI1 receive channel
validinput A
I/O line of GPTA
MLI1 receive channel data
input A
I/O line of GPTA
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P9
I/O Pad
Class
Power Functions
Supply
I/O A2
VDDP
Port 9
Port 9 is a 9-bit bi-directional generalpurpose I/O port which can be alternatively
used as GPTA or MSC0/1 I/O lines.
P9.0
A19
I/O
O
IN48/OUT48
EN12
P9.1
B19
I/O
O
IN49/OUT49
EN11
P9.2
B20
P9.3
A20
P9.4
D18
I/O
O
I/O
O
I/O
O
IN50/OUT50
SOP1B
IN51/OUT51
FCLP1
IN52/OUT52
EN03
P9.5
D19
I/O
O
IN53/OUT53
EN02
P9.6
C19
I/O
O
IN54/OUT54
EN01
P9.7
D20
P9.8
C20
I/O
O
O
IN55/OUT55
SOP0B
FCLP0B
Data Sheet
26
I/O line of GPTA
MSC1 device select
output 2
I/O line of GPTA
MSC1 device select
output 1
I/O line of GPTA
MSC1 serial data output
I/O line of GPTA
MSC1 clock output
I/O line of GPTA
MSC0 device select
output 3
I/O line of GPTA
MSC0 device select
output 2
I/O line of GPTA
MSC0 device select
output 1
I/O line of GPTA
MSC0 serial data output
MSC0 clock output
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
P10
P10.0
P10.1
P10.2
P10.3
A21
B21
C21
D21
I/O Pad
Class
Power Functions
Supply
I
VDDP
Hardware Configuration Inputs / Port 10
These inputs are boot mode (hardware
configuration) control inputs. They are
latched with the rising edge of HDRST.
Port 10 input line 0 / HWCFG0
Port 10 input line 1 / HWCFG1
Port 10 input line 2 / HWCFG2
Port 10 input line 3 / HWCFG3
After reset (HDRST = 1) the state of the
Port 10 input pins may be modified from the
reset configuration state. There actual state
can be read via software (P10_IN register).
During normal operation input HWCFG1
serves as emergency shut-off control input
for certain I/O lines (e.g. GPTA related
outputs).
VDDP
SSC0 Slave Select Output Line 0
A1
I
I
I
I
Dedicated Peripheral I/Os
SLSO0
AE14
O
SLSO1
AC15
O
SSC0 Slave Select Output Line 1
MTSR0
AF15
O
I
SSC0 Master Transmit Output /
SSC0 Slave Receive Input
MRST0
AE15
I
O
SSC0 Master Receive Input /
SSC0 Slave Transmit Output
SCLK0
AF14
I/O
SSC0 Clock Input/Output
SLSI0
AD15
I
SSC0 Slave Select Input
Data Sheet
A2
27
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
I/O Pad
Class
Power Functions
Supply
MSC Outputs
C
FCLP0A
C18
O
FCLN0
C17
O
SOP0A
C16
O
SON0
D17
O
FCLP1A
A17
O
FCLN1
B17
O
SOP1A
B16
O
SON1
A16
O
Data Sheet
VDDP
LVDS MSC Clock and Data Outputs2)
MSC0 differential driver clock output
positive A
MSC0 differential driver clock output
negative
MSC0 differential driver serial data output
positive A
MSC0 differential driver serial data output
negative
MSC1 differential driver clock output
positive A
MSC1 differential driver clock output
negative
MSC1 differential driver serial data output
positive A
MSC1 differential driver serial data output
negative
28
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
I/O Pad
Class
Power Functions
Supply
I
–
Analog Inputs
AN[43:0]
AN0
AN1
AN2
AN3
AN4
AN5
AN6
AN7
AN8
AN9
AN10
AN11
AN12
AN13
AN14
AN15
AN16
AN17
AN18
AN19
AN20
AN21
AN22
AN23
AN24
AN25
AN26
AN27
AN28
AN29
AN30
AN31
Data Sheet
AE1
AD2
AA4
AB3
AC2
AA3
AD1
AB4
AC1
AB2
Y3
AA2
AB1
W3
Y2
AA1
V4
W2
Y1
V3
W1
V2
V1
U1
AC8
AD8
AC7
AD7
AE6
AF6
AE7
AF7
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
I
D
ADC Analog Input Port
The ADC Analog Input Port provides 44
analog input lines for the A/D converters
ADC0, ADC1, and FADC.
Analog input 0
Analog input 1
Analog input 2
Analog input 3
Analog input 4
Analog input 5
Analog input 6
Analog input 7
Analog input 8
Analog input 9
Analog input 10
Analog input 11
Analog input 12
Analog input 13
Analog input 14
Analog input 15
Analog input 16
Analog input 17
Analog input 18
Analog input 19
Analog input 20
Analog input 21
Analog input 22
Analog input 23
Analog input 24
Analog input 25
Analog input 26
Analog input 27
Analog input 28
Analog input 29
Analog input 30
Analog input 31
29
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
AN32
AN33
AN34
AN35
AN36
AN37
AN38
AN39
AN40
AN41
AN42
AN43
Pin Definitions and Functions (cont’d)
Pins
AC3
AE2
AD3
AD5
AE3
AF2
AC4
AF3
AD4
AE4
AC5
AF4
TR[15:0]
I/O Pad
Class
D
–
ADC Analog Input Port (cont’d)
Analog input 32
Analog input 33
Analog input 34
Analog input 35
Analog input 36
Analog input 37
Analog input 38
Analog input 39
Analog input 40
Analog input 41
Analog input 42
Analog input 43
A3
VDDP
OCDS Level 2 Debug Trace Lines2)
(located on center balls)
Trace output line 0
Trace output line 1
Trace output line 2
Trace output line 3
Trace output line 4
Trace output line 5
Trace output line 4
Trace output line 7
Trace output line 8
Trace output line 9
Trace output line 10
Trace output line 11
Trace output line 12
Trace output line 13
Trace output line 14
Trace output line 15
I
I
I
I
I
I
I
I
I
I
I
I
O
TR0
TR1
TR2
TR3
TR4
TR5
TR6
TR7
TR8
TR9
TR10
TR11
TR12
TR13
TR14
TR15
U12
T12
U11
T11
U10
R12
R10
R11
M11
M10
L11
L10
K10
K11
L12
K12
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
O
TRCLK
T10
O
Data Sheet
Power Functions
Supply
A4
Trace Clock for OCDS Level 2 Debug
Trace Lines1)
(located on a center ball)
30
V1.0, 2008-04
TC1796
General Device Information
Table 2
Symbol
Pin Definitions and Functions (cont’d)
Pins
I/O Pad
Class
Power Functions
Supply
VDDP
System I/O
JTAG Module Reset/Enable Input2)
TRST
F23
I
A2
TCK
E24
I
A2
JTAG Module Clock Input2)
TDI
E25
I
A1
JTAG Module Serial Data Input
TDO
D25
O
A2
JTAG Module Serial Data Output
TMS
F24
I
A1
JTAG Module State Machine Control
Input
BRKIN
C26
I/O A3
OCDS Break Input (Alternate Output)2)
BRK
OUT
D26
I/O A3
OCDS Break Output (Alternate Input)2)
NMI
A22
I
Non-Maskable Interrupt Input
(input pad with input spike-filter.)
HDRST
A23
I/O A2
Hardware Reset Input / Reset Indication
Output
(open drain pad with input spike-filter.)
PORST
B22
I
–
Power-on Reset Input
(input pad with input spike-filter.)
BYPASS A24
I
A1
PLL Bypass Select Input
This input has to be held stable between to
power-on resets. With BYPASS = 1 the
spike filters in the HDRST, PORST, and
NMI inputs are switched off.
TEST
MODE
B23
I
–
Test Mode Select Input
For normal operation of the TC1796, this
pin should be connected to high level.
(input pad, test function only, without input
spike-filter.)
TSTRES G24
I
–
Test Reset Input
For normal operation of the TC1796, this
pin should be connected to low level.
Otherwise an unpredictable reset behavior
may occur.
(input pad, test function only, without input
spike-filter.)
Data Sheet
–
31
V1.0, 2008-04
TC1796
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pins
I/O Pad
Class
Power Functions
Supply
XTAL1
XTAL2
G26
G25
I
O
n.a.
VDD
Oscillator / PLL / Clock Generator
Input / Output Pins2)
N.C.
A1
C22
G23
H3
AF1
AF26
AC21
AD23
AE22
AE23
–
–
–
Not Connected
These pins are reserved for future
extension and should not be connected
externally.
W4
–
–
–
ADC0/1 Analog Part Power Supply (3.3V)
Y4
–
–
–
ADC0/1 Analog Part Ground for VDDM
AE9
–
–
–
FADC Analog Part Power Supply (3.3V)
AF9
–
–
–
VFADC Analog Part Ground for VDDAF
AC9
–
–
–
FADC Analog Part Log. Pow. Sup. (1.5V)
AD9
–
–
–
FADC Analog Part Log Ground for VDDAF
AE5
–
–
–
ADC0 Reference Voltage
AF5
–
–
–
ADC0 Reference Ground
AD6
–
–
–
ADC1 Reference Voltage
AC6
–
–
–
ADC1 Reference Ground
AF8
–
–
–
FADC Reference Voltage
AE8
–
–
–
FADC Reference Ground
F26
–
–
–
Main Oscillator Power Supply (1.5V)
E26
–
–
–
Main Oscillator Power Supply (3.3V)
F25
–
–
–
Main Oscillator Ground
A18
B18
–
–
–
Power Supply for Flash (3.3V)
–
–
–
Power Supply for Stand-by SRAM (1.5V)
Power Supplies
VDDM
VSSM
VDDMF
VSSMF
VDDAF
VSSAF
VAREF0
VAGND0
VAREF1
VAGND1
VFAREF
VFAGND
VDDOSC3)
VDDOSC3
VSSOSC3)
VDDFL3
VDDSBRAM R1
Data Sheet
32
V1.0, 2008-04
TC1796
General Device Information
Table 2
Pin Definitions and Functions (cont’d)
Symbol
Pins
I/O Pad
Class
Power Functions
Supply
VDDEBU
H23
H24
H25
H26
M23
T23
Y23
AC18
AC22
–
–
–
EBU Power Supply (2.3 - 3.3V)
VDD
B26
C25
D9
D16
D24
E23
H4
P23
R4
V23
AB23
AC11
AC20
–
–
–
Core Power Supply (1.5V)
VDDP
A25
B24
C23
D7
D14
D22
K4
AC16
AD16
AE16
AF16
–
–
–
Port Power Supply (3.3V)
(also for OCDS)
VSS
See
–
Table
3
–
–
Ground
15 VSS lines are located at outer balls.
47 VSS lines are located at center balls.
1) In order to minimize noise coupling to the on-chip A/D converters, it is recommended to use these pins as less
as possible in strong driver mode.
Data Sheet
33
V1.0, 2008-04
TC1796
General Device Information
2) In case of a power-fail condition (one or more power supply voltages drop below the specified voltage range),
an undefined output driving level may occur at these pins.
3) Not bonded externally in the BC and BD steps of TC1796. An option for bonding them in future steps and
products is kept open.
Table 3
VSS Balls
VSS Outer Balls
VSS Center Balls
A26, B25, C24, D8, D15, D23, J4, L23,
R23, T4, W23, AC10, AC17, AC19, AC23
K[17:13], L[17:13], M[17:12],
N[17:10], P[17:10],
R[17:13], T[17:13], U[17:13]
Data Sheet
34
V1.0, 2008-04
TC1796
General Device Information
2.5.1
Pull-Up/Pull-Down Behavior of the Pins
Table 4
List of Pull-Up/Pull-Down Reset Behavior of the Pins
Pins
PORST = 0
PORST = 1
TSTRES,
Weak pull-up device active
TDI, TMS,
TESTMODE,
BRKOUT, BRKIN,
all GPIOs,
RD, RD/WR,
ADV, BC[3:0], MR/W,
WAIT, BAA, HOLD,
HLDA, BREQ,
D[31:0], A[23,0],
CS[3:0], CSCOMB
NMI, PORST
Weak pull-down device active
BYPASS,
SLSO0, SLSO1,
MTSR0, MRST0,
SCLK0, SLSI0,
TDO,
BFCLKI
Weak pull-up device active
High-impedance
BFCLKO
Weak pull-up device active
Push-pull driver active
HDRST
Open-drain device drives 0
(strong pull-down)
Weak pull-up device active
Open-drain device active
TRST, TCK
High-impedance
Weak pull-down device active
Data Sheet
35
V1.0, 2008-04
TC1796
Functional Description
3
Functional Description
The following section gives an overview of the sub systems and the modules of the
TC1796 and their connectivity.
3.1
System Architecture and On-Chip Bus Systems
The TC1796 has four independent on-chip buses (see also TC1796 block diagram in
Figure 1):
•
•
•
•
Program Local Memory Bus (PLMB)
Data Local Memory Bus (DLMB)
System Peripheral Bus (SPB)
Remote Peripheral Bus (RPB)
The two LMB Buses (Program Local Memory Bus PLMB and Data Local Memory Bus
DLMB) connect the TriCore CPU to its local resources for data and instruction fetches.
The PLMB/DLMB Buses are synchronous and pipelined buses with variable block size
transfer support. The protocol supports 8-, 16-, 32-, and 64-bit single transactions and
variable length 64-bit block transfers.
The System Peripheral Bus (SPB) is accessible by the CPU via the LFI Bridge. The
LFI Bridge is a bi-directional bus bridge between the DLMB and the SPB. It supports all
transactions types of both buses, DLMB Bus and FPI Bus. It handles address translation
and transaction type translation between the two buses. The LFI Bridge further supports
the pipelining of both connected buses. Therefore, no additional delay is created except
for bus protocol conversions.
The Remote Peripheral Bus (RPB) connects the peripherals with high data rates (SSC,
ADC, FADC) with the Dual-port memory (DPRAM) in the DMI, relieving the SPB and the
PLMB/DLMB Buses from these data transfers. The RPB is controlled by a bus switch
which is located in the DMA controller.
The two LMB Buses are running at CPU clock speed (clock rate of fCPU) while SPB and
RPB are running at system clock speed (clock rate of fSYS). Note that fSYS can be equal
to fCPU or half the fCPU frequency.
Data Sheet
36
V1.0, 2008-04
TC1796
Functional Description
3.2
On-Chip Memories
As shown in the TC1796 block diagram on Page 10, some of the TC1796 units provide
on-chip memories that are used as program or data memory.
•
•
•
•
Program memory in PMU and PMI
– 2 Mbyte on-chip Program Flash (PFLASH)
– 16 Kbyte Boot ROM (BROM)
– 48 Kbyte Scratch-Pad RAM (SPRAM)
– 16 Kbyte Instruction Cache (ICACHE)
Data memory in DMU, PMU and DMI
– 56 Kbyte Local Data RAM (LDRAM)
– 8 Kbyte Dual-port RAM (DPRAM)
– 64 Kbyte Data Memory (SRAM)
– 16 Kbyte data memory (SBRAM) for standby operation during power-down
– 128 Kbyte on-chip Data Flash (DFLASH)
Memory of the PCP2
– 32 Kbyte Code Memory (CMEM)
– 16 Kbyte Parameter Memory (PRAM)
On-chip SRAMs with parity error detection
Features of the Program Flash
•
•
•
•
•
•
•
•
•
•
•
•
2 Mbyte on-chip program Flash memory
Usable for instruction code execution or constant data storage
256-byte wide program interface
– 256 bytes are programmed into PFLASH page in one step/command
256-bit read interface
– Transfer from PFLASH to CPU/PMI by four 64-bit single-cycle burst transfers
Dynamic correction of single-bit errors during read access
Detection of double bit errors
Fixed sector architecture
– Eight 16 Kbyte, one 128 Kbyte, one 256 Kbyte, and three 512 Kbyte sectors
– Each sector separately erasable
– Each sector separately write-protectable
Configurable read protection for complete PFLASH with sophisticated read access
supervision, combined with write protection for complete PFLASH (protection against
“Trojan horse” software)
Configurable write protection for each sector
– Each sector separately write-protectable
– With capability to be re-programmed
– With capability to be locked forever (OTP)
Password mechanism for temporarily disable write or read protection
On-chip programming voltage generation
PFLASH is delivered in erased state (read all zeros)
Data Sheet
37
V1.0, 2008-04
TC1796
Functional Description
•
•
JEDEC standard based command sequences for PFLASH control
– Write state machine controls programming and erase operations
– Status and error reporting by status flags and interrupt
Margin check for detection of problematic PFLASH bits
Features of the Data Flash
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
128 Kbyte on-chip data Flash memory, organized in two 64 Kbyte banks
Usable for data storage with EEPROM functionality
128 Byte program interface
– 128 bytes are programmed into one DFLASH page by one step/command
64-bit read interface (no burst transfers)
Dynamic correction of single-bit errors during read access
Detection of double bit errors
Fixed sector architecture
– Two 64 Kbyte banks/sectors
– Each sector separately erasable
Configurable read protection (combined with write protection) for complete DFLASH
together with PFLASH read protection
Password mechanism to temporarily disable write and read protection
Erasing/programming of one bank possible while reading data from the other bank
Programming of one bank possible while erasing the other bank
On-chip generation of programming voltage
DFLASH is delivered in erased state (read all zeros)
JEDEC-standard based command sequences for DFLASH control
– Write state machine controls programming and erase operations
– Status and error reporting by status flags and interrupt
Margin check for detection of problematic DFLASH bits
Data Sheet
38
V1.0, 2008-04
TC1796
Functional Description
3.3
Architectural Address Map
Table 5 shows the overall architectural address map as defined for the TriCore and
implemented in TC1796.
Table 5
TC1796 Architectural Address Map
Seg- Contents
ment
Size
Description
0-7
Global
8 × 256
Mbyte
Reserved (MMU space), cached
8
Global
Memory
256 Mbyte
EBU (246 Mbyte), PMU with PFLASH, DFLASH,
BROM, memory reserved for Emulation, cached
9
Global
Memory
256 Mbyte
FPI space; cached
10
Global
Memory
256 Mbyte
EBU (246 Mbyte), PMU with PFLASH, DFLASH,
BROM, memory reserved for Emulation, noncached
11
Global
Memory
256 Mbyte
FPI space; non-cached
12
Local LMB
Memory
256 Mbyte
DMU, bottom 4 Mbyte visible from FPI Bus in
segment 14, cached
13
DMI
64 Mbyte
Local Data Memory RAM, non-cached
PMI
64 Mbyte
Local Code Memory RAM, non-cached
EXTPER
96 Mbyte
External Peripheral Space, non-cached
EXTEMU
16 Mbyte
External Emulator Range, non-cached
BOOTROM
16 Mbyte
Boot ROM space, BROM mirror; non-cached
EXTPER
128 Mbyte
External Peripheral Space non-speculative, no
execution, non-cached
14
CPU[0 ..15] 16 × 8
image region Mbyte
15
LMBPER
CSFRs
INTPER
Data Sheet
256
Mbyte
Non-speculative, no execution, non-cached
CSFRs of CPUs[0 ..15];
LMB & Internal Peripheral Space; non-speculative,
no execution, non-cached
39
V1.0, 2008-04
TC1796
Functional Description
3.4
Memory Protection System
The TC1796 memory protection system specifies the addressable range and read/write
permissions of memory segments available to the currently executing task. The memory
protection system controls the position and range of addressable segments in memory.
It also controls the kinds of read and write operations allowed within addressable
memory segments. Any illegal memory access is detected by the memory protection
hardware, which then invokes the appropriate Trap Service Routine (TSR) to handle the
error. Thus, the memory protection system protects critical system functions against both
software and hardware errors. The memory protection hardware can also generate
signals to the Debug Unit to facilitate tracing illegal memory accesses.
There are two Memory Protection Register Sets in the TC1796, numbered 0 and 1,
which specify memory protection ranges and permissions for code and data. The
PSW.PRS bit field determines which of these is the set currently in use by the CPU.
Because the TC1796 uses a Harvard-style memory architecture, each Memory
Protection Register Set is broken down into a Data Protection Register Set and a Code
Protection Register Set. Each Data Protection Register Set can specify up to four
address ranges to receive particular protection modes. Each Code Protection Register
Set can specify up to two address ranges to receive particular protection modes.
Each of the Data Protection Register Sets and Code Protection Register Sets
determines the range and protection modes for a separate memory area. Each contains
register pairs which determine the address range (the Data Segment Protection
Registers and Code Segment Protection Registers) and one register (Data Protection
Mode Register) which determines the memory access modes which apply to the
specified range.
Data Sheet
40
V1.0, 2008-04
TC1796
Functional Description
3.5
External Bus Unit
The External Bus Unit (EBU) of the TC1796 is the units that controls the transactions
between external memories or peripheral units with the internal memories and peripheral
units. The EBU is a part of the PMU and communicates with CPU and PMI via the
Program Local Memory Bus. This configuration allows to get fast access times especially
when using external burst FLASH memory devices.
32
Data
Bus
Data Path
Control
Control
Lines
64
Burst Access
State Machine
Arbitration
Signals
Address
Bus
External Bus
Arbitration
24
PLMB
Data
Region
Selection
32
PLMB
Address
PLMB Interface
Slave
Master
Asynchronous
Access
State Machine
64
Program
Local
Memory
Bus
Address Path
Control
External Bus Unit EBU
MCB05713
Figure 4
EBU Block Diagram
The following features are supported by the EBU:
•
•
•
64-bit internal Program Local Memory Bus (PLMB) interface
32-bit external demultiplexed bus interface
– Asynchronous read/write accesses support Intel-style and Motorola-style interface
signals
– Synchronous burst FLASH memory read
– Five programmable regions associated each to one chip select output
– Flexibly programmable access parameters for each chip select region
– Little-endian and Big-endian support
– Programmable wait state control
Scalable external bus frequency
– Derived from PLMB frequency (fCPU) divided by 1, 2, 3, or 4
– Max. 75 MHz
Data Sheet
41
V1.0, 2008-04
TC1796
Functional Description
•
•
•
Data buffering supported
– Code prefetch buffer
– Read/write buffer
External bus arbitration control capability for the EBU bus
Automatic self-configuration on boot from external memory
3.6
Peripheral Control Processor
The Peripheral Control Processor (PCP2) in the TC1796 performs tasks that would
normally be performed by the combination of a DMA controller and its supporting CPU
interrupt service routines in a traditional computer system. It could easily be considered
as the host processor’s first line of defence as an interrupt-handling engine. The PCP2
can off-load the CPU from having to service time-critical interrupts. This provides many
benefits, including:
•
•
•
•
Avoiding large interrupt-driven task context-switching latencies in the host processor
Reducing the cost of interrupts in terms of processor register and memory overhead
Improving the responsiveness of interrupt service routines to data-capture and datatransfer operations
Easing the implementation of multitasking operating systems.
The PCP2 has an architecture that efficiently supports DMA-type transactions to and
from arbitrary devices and memory addresses within the TC1796 and also has
reasonable stand-alone computational capabilities.
The PCP2 in the TC1796 contains an improved version of the TC1775’s PCP with the
following enhancements:
•
•
•
•
•
Optimized context switching
Support for nested interrupts
Enhanced instruction set
Enhanced instruction execution speed
Enhanced interrupt queueing
The PCP2 is made up of several modular blocks as follows (see Figure 5):
•
•
•
•
•
•
PCP2 Processor Core
Code Memory (CMEM)
Parameter Memory (PRAM)
PCP2 Interrupt Control Unit (PICU)
PCP2 Service Request Nodes (PSRN)
System bus interface to the Flexible Peripheral Interface (FPI Bus)
Data Sheet
42
V1.0, 2008-04
TC1796
Functional Description
Code
Memory
CMEM
Parameter
Memory
PRAM
PCP2
Processor
Core
PCP2 Service
Req. Nodes
PSRNs
FPI-Interface
FPI Bus
PCP2 Interrupt
Control Unit
PICU
PCP2 Interrupt
Arbitration Bus
CPU Interrupt
Arbitration Bus
Figure 5
PCP2 Block Diagram
Table 6
PCP2 Instruction Set Overview
MCB05666a
Instruction Group
Description
DMA primitives
Efficient DMA channel implementation
Load/Store
Transfer data between PRAM or FPI memory and the general
purpose registers, as well as move or exchange values
between registers
Arithmetic
Add, subtract, compare and complement
Divide/Multiply
Divide and multiply
Logical
And, Or, Exclusive Or, Negate
Shift
Shift right or left, rotate right or left, prioritize
Bit Manipulation
Set, clear, insert and test bits
Flow Control
Jump conditionally, jump long, exit
Miscellaneous
No operation, Debug
Data Sheet
43
V1.0, 2008-04
TC1796
Functional Description
3.7
DMA Controller and Memory Checker
The Direct Memory Access (DMA) Controller of the TC1796 transfers data from data
source locations to data destination locations without intervention of the CPU or other
on-chip devices. One data move operation is controlled by one DMA channel. Sixteen
DMA channels are provided in two independent DMA Sub-Blocks with eight DMA
channels each. The Bus Switch provides the connection of two DMA Sub-Blocks to the
two FPI Bus interfaces and an MLI bus interface. In the TC1796, the FPI Bus interfaces
are connected to System Peripheral Bus and the Remote Peripheral Bus. The third
specific bus interface provides a connection to Micro Link Interface modules (two MLI
modules in the TC1796) and other DMA-related devices (Memory Checker module in the
TC1796). Figure 6 shows the implementation details and interconnections of the DMA
module.
fDMA
DMA Sub-Block 0
Request
Selection/
Arbitration
DMA
Channels
00-07
Transaction
Control Unitl
DMA
Requests of
On-chip
Periph.
Units
CH0n_OUT
Bus
Switch
DMA Sub-Block 1
Address
Decoder
DMA
Channels
10-17
Remote
Peripheral
Bus
MLI0
Transaction
Control Unit
MLI1
Memory
Checker
CH1n_OUT
Interrupt
Request
Nodes
System
Peripheral
Bus
MLI
Interface
Request
Selection/
Arbitration
FPI Bus
Interface 0
DMA Controller
FPI Bus
Interface 1
Clock
Control
SR[15:0]
DMA Interrupt Control
Arbiter/
Switch
Control
MCB05680
Figure 6
Data Sheet
DMA Controller Block Diagram
44
V1.0, 2008-04
TC1796
Functional Description
Features
•
•
•
•
•
•
•
•
•
•
•
16 independent DMA channels
– 8 DMA channels in each DMA Sub-Block
– Up to 8 selectable request inputs per DMA channel
– 2-level programmable priority of DMA channels within a DMA Sub-Block
– Software and hardware DMA request
– Hardware requests by selected on-chip peripherals and external inputs
Programmable priority of the DMA Sub-Blocks on the bus interfaces
Buffer capability for move actions on the buses (at least 1 move per bus is buffered).
Individually programmable operation modes for each DMA channel
– Single mode: stops and disables DMA channel after a predefined number of DMA
transfers
– Continuous mode: DMA channel remains enabled after a predefined number of
DMA transfers; DMA transaction can be repeated.
– Programmable address modification
Full 32-bit addressing capability of each DMA channel
– 4 GByte address range
– Support of circular buffer addressing mode
Programmable data width of DMA transfer/transaction: 8-bit, 16-bit, or 32-bit
Micro Link bus interface support
Register set for each DMA channel
– Source and destination address register
– Channel control and status register
– Transfer count register
Flexible interrupt generation (the service request node logic for the MLI channels is
also implemented in the DMA module)
All buses connected to the DMA module must work at the same frequency.
Read/write requests of the System Bus Side to the Remote Peripherals are bridged
to the Remote Peripheral Bus (only the DMA is master on the RPB)
Memory Checker
The Memory Checker Module (MEMCHK) makes it possible to check the data
consistency of memories. Any SPB bus master may access the memory checker.
Preferable the DMA controller does it as described hereafter. It uses 8-bit, 16-bit, or 32bit DMA moves to read from the selected address area and to write the value read in a
memory checker input register. With each write operation to the memory checker input
register, a polynomial checksum calculation is triggered and the result of the calculation
is stored in the memory checker result register.
The memory checker uses the standard Ethernet polynomial, which is given by:
G32 = x32+ x26+ x23+ x22+ x16+ x12+ x11+ x10+ x8+ x7+ x5+ x4+ x2+ x +1
Data Sheet
45
V1.0, 2008-04
TC1796
Functional Description
Note: Although the polynomial above is used for generation, the generation algorithm
differs from the one that is used by the Ethernet protocol.
3.8
Interrupt System
The TC1796 interrupt system provides a flexible and time-efficient means for processing
interrupts. An interrupt request can be serviced either by the CPU or by the Peripheral
Control Processor (PCP). These units are called “Service Providers”. Interrupt requests
are called “Service Requests” rather than “Interrupt Requests” in this document because
they can be serviced by either of the Service Providers.
Each peripheral in the TC1796 can generate service requests. Additionally, the Bus
Control Units, the Debug Unit, the PCP, and even the CPU itself can generate service
requests to either of the two Service Providers.
As shown in Figure 7, each TC1796 unit that can generate service requests is
connected to one or more Service Request Nodes (SRN). Each SRN contains a Service
Request Control Register. Two arbitration buses connect the SRNs with two Interrupt
Control Units, which handle interrupt arbitration among competing interrupt service
requests, as follows:
•
•
The Interrupt Control Unit (ICU) arbitrates service requests for the CPU and
administers the CPU Interrupt Arbitration Bus.
The Peripheral Interrupt Control Unit (PICU) arbitrates service requests for the PCP2
and administers the PCP2 Interrupt Arbitration Bus.
The PCP2 can make service requests directly to itself (via the PICU), or it can make
service requests to the CPU. The Debug Unit can generate service requests to the PCP2
or the CPU. The CPU can make service requests directly to itself (via the ICU), or it can
make service requests to the PCP. The CPU Service Request Nodes are activated
through software.
Depending on the selected system clock frequency fSYS, the number of fSYS clock cycles
per arbitration cycle must be selected as follows:
•
•
fSYS < 60MHz: ICR.CONECYC = 1 and PCP_ICR.CONECYC = 1
fSYS > 60MHz: ICR.CONECYC = 0 and PCP_ICR.CONECYC = 0
Data Sheet
46
V1.0, 2008-04
TC1796
Functional Description
PCP
Interrupt
Arbitration Bus
Service
Requestors
MSC0
MSC1
MLI0
MLI1
SSC0
SSC1
ASC0
ASC1
MultiCAN
ADC0
ADC1
FADC
GPTA0
GPTA1
LTCA2
STM
FPU
Flash
Ext. Int.
CPU
Interrupt
Arbitration Bus
Service Req.
Nodes
2
2
4
2
3
3
4
4
16
4
4
4
38
38
16
2
1
1
2
PCP Interrupt
Control Unit
2
2 SRNs
PICU
Int.
Req.
2
2
2 SRNs
Interrupt
Service
Providers
Int. Ack.
PIPN
2
CCPN
4
4 SRNs
4
Service Req.
Nodes
2
2 SRNs
2
5
3
3 SRNs
3
5
5
3
3 SRNs
3
2
4
4 SRNs
4 SRNs
4
5
4
5
2 SRNs
5 SRNs
5
2
5
CPU Interrupt
Control Unit
16
4
4
4 SRNs
4
4 SRNs
4
Software
& Breakpoint
Interrupts
CPU
ICU
Int.
Req.
PIPN
4
4 SRNs
5 SRNs
5
4
16
16 SRNs
5 SRNs
PCP2
Int. Ack.
CCPN
4
38 SRNs
38 SRNs
16 SRNs
2 SRNs
38
1
38
1
38
1
38
1
16
1
16
1
2
1
2
1
1
8
1 SRN
1
8
1
1
1 SRN
1
1
2
1
2
1
2 SRNs
Service Req.
Nodes
1 SRN
1 SRN
1 SRN
1 SRN
8 SRNs
1 SRN
1 SRN
Service
Requestors
1
1
1
1
8
1
1
DBCU
PBCU
SBCU
RBCU
DMA
Cerberus
Software
MCB05742
Figure 7
Data Sheet
Block Diagram of the TC1796 Interrupt System
47
V1.0, 2008-04
TC1796
Functional Description
3.9
Asynchronous/Synchronous Serial Interfaces (ASC0, ASC1)
Figure 8 shows a global view of the functional blocks and interfaces of the two
Asynchronous/Synchronous Serial Interfaces ASC0 and ASC1.
Clock
Control
fASC
P5.0 /
A2 RXD0A
RXD_I0
Address
Decoder
Interrupt
Control
To
DMA
A2
RXD_I1
ASC0
Module
(Kernel)
P5.1 /
TXD0A
RXD_O
P6.8 /
A2 RXD0B
TXD_O
EIR
TBIR
TIR
RIR
A2
P6.9 /
TXD0B
Port 5
&
Port 6
Control
ASC0_RDR
ASC0_TDR
P5.2 /
A2 RXD1A
RXD_I0
RXD_I1
ASC1
Module
(Kernel)
Interrupt
Control
To
DMA
Figure 8
A2
P5.3 /
TXD1A
RXD_O
TXD_O
EIR
TBIR
TIR
RIR
P6.10 /
A2 RXD1B
A2
P6.11 /
TXD1B
ASC1_RDR
ASC1_TDR
MCB05773
Block Diagram of the ASC Interfaces
The Asynchronous/Synchronous Serial Interfaces provide serial communication
between the TC1796 and other microcontrollers, microprocessors, or external
peripherals.
The ASC supports full-duplex asynchronous communication and half-duplex
synchronous communication. In Synchronous Mode, data is transmitted or received
synchronous to a shift clock which is generated by the ASC internally. In Asynchronous
Data Sheet
48
V1.0, 2008-04
TC1796
Functional Description
Mode, 8-bit or 9-bit data transfer, parity generation, and the number of stop bits can be
selected. Parity, framing, and overrun error detection are provided to increase the
reliability of data transfers. Transmission and reception of data are double-buffered. For
multiprocessor communication, a mechanism is included to distinguish address bytes
from data bytes. Testing is supported by a loop-back option. A 13-bit baud rate generator
provides the ASC with a separate serial clock signal which can be very accurately
adjusted by a prescaler implemented as a fractional divider.
Each ASC module, ASC0 and ASC1, communicates with the external world via two I/O
lines. The RXD line is the receive data input signal (in Synchronous Mode also output).
TXD is the transmit output signal. In the TC1796, the two I/O lines of each ASC can be
alternatively switched to different pairs of GPIO lines.
Clock control, address decoding, and interrupt service request control are managed
outside the ASC module kernel.
Features
•
•
•
•
Full-duplex asynchronous operating modes
– 8-bit or 9-bit data frames, LSB first
– Parity bit generation/checking
– One or two stop bits
– Baud rate from 4.69 Mbit/s to 1.12 Bit/s (@ 75 MHz clock)
– Multiprocessor mode for automatic address/data byte detection
– Loop-back capability
Half-duplex 8-bit synchronous operating mode
– Baud rate from 9.38 Mbit/s to 763 Bit/s (@ 75 MHz clock)
Double buffered transmitter/receiver
Interrupt generation
– On a transmit buffer empty condition
– On a transmit last bit of a frame condition
– On a receive buffer full condition
– On an error condition (frame, parity, overrun error)
Data Sheet
49
V1.0, 2008-04
TC1796
Functional Description
3.10
High-Speed Synchronous Serial Interfaces (SSC0, SSC1)
Figure 9 shows a global view of the functional blocks and interfaces of the two HighSpeed Synchronous Serial interfaces SSC0 and SSC1.
fSSC0
Clock
Control
Master
fCLC0
Slave
SSC0
Module
(Kernel)
Address
Decoder
Interrupt
Control
EIR
TIR
RIR
8-Stage RXFIFO
8-Stage TXFIFO
Slave
Master
A2 MTSR0
MTSRA
MTSRB
MRST
A2 SCLK0
SCLKA
SCLKB
SCLK
A2 SLSI0
SLSI[7:2] 1)
M/S Selected
SSC Enabled
SSC0_TDR
A2 MRST0
SLSI1
Slave
SSC0_RDR
To
DMA
MRSTA
MRSTB
MTSR
Master
SLSO0
A2 SLSO0
SLSO1
A2 SLSO1
SLSO[7:2]
Clock
Control
Master
fCLC1
Master
Address
Decoder
Interrupt
Control
EIR
TIR
RIR
SSC1_RDR
To
DMA
SSC1_TDR
SSC1
Module
(Kernel)
Slave
Slave
Master
Slave
SLSO[7:2]
MRSTA
MRSTB
MTSR
MTSRA
MTSRB
MRST
SCLKA
SCLKB
SCLK
SLSI1
A2
P2.7 /
SLSO7
P6.4 /
MTSR1
P6.5 /
A2
MRST1
P6.6 /
A2
SCLK1
P6.7 /
A2
SLSI1
A2
Port 6
Control
SLSI[7:2] 1)
1) These lines are not connected
Figure 9
Port 2
Control
P2.2 /
SLSO2
...
fSSC1
A2
MCA05791
Block Diagram of the SSC Interfaces
The SSC allows full-duplex and half-duplex serial synchronous communication up to
37.5 Mbit/s (@ 75 MHz module clock) with Receive and Transmit FIFO support. (FIFO
only in SSC0). The serial clock signal can be generated by the SSC itself (Master Mode)
Data Sheet
50
V1.0, 2008-04
TC1796
Functional Description
or can be received from an external master (Slave Mode). Data width, shift direction,
clock polarity and phase are programmable. This allows communication with SPIcompatible devices. Transmission and reception of data is double-buffered. A shift clock
generator provides the SSC with a separate serial clock signal. One slave select input is
available for Slave Mode operation. Eight programmable slave select outputs (chip
selects) are supported in Master Mode. The I/O lines of the SSC0 module are connected
to dedicated device pins while the SSC1 module I/O lines are wired with general purpose
I/O port lines.
Features
•
•
•
•
•
•
•
•
Master and Slave Mode operation
– Full-duplex or half-duplex operation
– Automatic pad control possible
Flexible data format
– Programmable number of data bits: 2 to 16 bits
– Programmable shift direction: LSB or MSB shift first
– Programmable clock polarity: Idle low or high state for the shift clock
– Programmable clock/data phase: data shift with leading or trailing edge of the shift
clock
Baud rate generation from 37.5 Mbit/s to 572.2 Bit/s (@ 75 MHz module clock)
Interrupt generation
– On a transmitter empty condition
– On a receiver full condition
– On an error condition (receive, phase, baud rate, transmit error)
Flexible SSC pin configuration
One slave select input SLSI in slave mode
Eight programmable slave select outputs SLSO in Master Mode
– Automatic SLSO generation with programmable timing
– Programmable active level and enable control
SSC0 with 8-stage receive FIFO (RXFIFO) and 8-stage transmit FIFO (TXFIFO)
– Independent control of RXFIFO and TXFIFO
– 2- to 16-bit FIFO data width
– Programmable receive/transmit interrupt trigger level
– Receive and Transmit FIFO filling level indication
– Overrun error generation
– Underflow error generation
Data Sheet
51
V1.0, 2008-04
TC1796
Functional Description
3.11
Micro Second Bus Interfaces (MSC0, MSC1)
The Micro Second Channel (MSC) interfaces provides a serial communication link
typically used to connect power switches or other peripheral devices. The serial
communication link is build up by a fast synchronous downstream channel and a slow
asynchronous upstream channel. Figure 10 shows a global view the interface signals of
the MSC interface.
Clock
Control
fMSC0
FCLP
fCLC0
FCLN
SOP
SR[1:0]
Interrupt
Control
SR[3:2]
Port 5
&
Port 9
Control
EN3
16
EMGSTOPMSC
(from SCU)
C
FCLN0
C
SOP0A
C
SON0
A2 P9.7 / SOP0B
EN0
EN2
16
ALTINL[15:0]
(from GPTA)
ALTINH[15:0]
FCLP0A
A2 P9.8 / FCLP0B
EN1
Upstr.
Channel
To DMA
MSC0
Module
(Kernel)
Downstream
Channel
SON
Address
Decoder
C
A2 P5.4 / EN00
A2 P9.6 / EN01
A2 P9.5 / EN02
A2 P9.4 / EN03
SDI[0]1)
A2
P5.5 /
SDI0
C
FCLP1A
C
FCLN1
C
SOP1A
C
SON1
SR15 (from CAN)
FCLP
Clock
Control
fMSC1
FCLN
fCLC1
SOP
Address
Decoder
SR[1:0]
Interrupt
Control
A2 P9.3 / FCLP1B
A2 P9.2 / SOP1B
EN0
Port 5
&
Port 9
Control
EN1
EN2
SR[3:2]
ALTINL[15:0]
(from GPTA)
ALTINH[15:0]
EN3
16
16
Upstr.
Channel
To DMA
MSC1
Module
(Kernel)
Downstream
Channel
SON
SDI[0]
Data Sheet
A2 P9.1 / EN11
A2 P9.0 / EN12
N.C.
1)
1) SDI[7:1] are connected to high level.
Figure 10
A2 P5.6 / EN10
A2
P5.7 /
SDI1
MCA05823
Block Diagram of the MSC Interfaces
52
V1.0, 2008-04
TC1796
Functional Description
The downstream and upstream channels of the MSC module communicate with the
external world via nine I/O lines. Eight output lines are required for the serial
communication of the downstream channel (clock, data, and enable signals). One out of
eight input lines SDI[7:0] is used as serial data input signal for the upstream channel. The
source of the serial data to be transmitted by the downstream channel can be MSC
register contents or data that is provided at the ALTINL/ALTINH input lines. These input
lines are typically connected to other on-chip peripheral units (for example with a timer
unit like the GPTA). An emergency stop input signal allows to set bits of the serial data
stream to dedicated values in emergency case.
Clock control, address decoding, and interrupt service request control are managed
outside the MSC module kernel. Service request outputs are able to trigger an interrupt
or a DMA request.
Features
•
•
•
Fast synchronous serial interface to connect power switches in particular, or other
peripheral devices via serial buses
High-speed synchronous serial transmission on downstream channel
– Maximum serial output clock frequency: fFCL = fMSC/2
(= 37.5 Mbit/s @ 75 MHz module clock)
– Fractional clock divider for precise frequency control of serial clock fMSC
– Command, data, and passive frame types
– Start of serial frame: Software-controlled, timer-controlled, or free-running
– Programmable upstream data frame length (16 or 12 bits)
– Transmission with or without SEL bit
– Flexible chip select generation indicates status during serial frame transmission
– Emergency stop without CPU intervention
Low-speed asynchronous serial reception on upstream channel
– Baud rate: fMSC divided by 8, 16, 32, 64, 128, 256, or 512
– Standard asynchronous serial frames
– Parity error checker
– 8-to-1 input multiplexer for SDI lines
– Built-in spike filter on SDI lines
Data Sheet
53
V1.0, 2008-04
TC1796
Functional Description
3.12
MultiCAN Controller (CAN)
Figure 11 shows a global view of the MultiCAN module with its functional blocks and
interfaces.
fCAN
Clock
Control
Address
Decoder
Message
Object
Buffer
DMA
Interrupt
Control
LTCA2
MultiCAN Module Kernel
fCLC
INT_O
[3:0]
128
Objects
Linked
List
Control
INT_O
[15:4]
INT_
O15
A2
CAN
Node 3
TXDC3
RXDC3
CAN
Node 2
TXDC2
RXDC2
CAN
Node 1
TXDC1
RXDC1
CAN
Node 0
TXDC0
RXDC0
A2
A2
Port 6
Control
A2
A2
A2
A2
A2
CAN Control
P6.15 /
TXDCAN3
P6.14 /
RXDCAN3
P6.13 /
TXDCAN2
P6.12 /
RXDCAN2
P6.11 /
TXDCAN1
P6.10 /
RXDCAN1
P6.9 /
TXDCAN0
P6.8 /
RXDCAN0
GPTA1
Timing Control and Synchronization
GPTA0
ECTT1
ECTT3
Scheduler
SCU
Ext.Req.
Unit
ECTT4
ECTT5
ECTT2
ScheduleTiming DataMemory
A1
A1
P1.3 /
REQ3
P7.5 /
REQ7
Time-Triggered Extension TTCAN
MCA05864
Figure 11
Block Diagram of MultiCAN Module with Time-Triggered Extension
The MultiCAN module contains four independently operating CAN nodes with Full-CAN
functionality that are able to exchange Data and Remote Frames via a gateway function.
Transmission and reception of CAN frames is handled in accordance with CAN
specification V2.0 B (active). Each CAN node can receive and transmit standard frames
with 11-bit identifiers as well as extended frames with 29-bit identifiers.
All four CAN nodes share a common set of message objects. Each message object can
be individually allocated to one of the CAN nodes. Besides serving as a storage
container for incoming and outgoing frames, message objects can be combined to build
gateways between the CAN nodes or to setup a FIFO buffer.
The message objects are organized in double-chained linked lists, where each CAN
node has it’s own list of message objects. A CAN node stores frames only into message
Data Sheet
54
V1.0, 2008-04
TC1796
Functional Description
objects that are allocated to the message object list of the CAN node, and it transmits
only messages belonging to this message object list. A powerful, command-driven list
controller performs all message object list operations.
MultiCAN Features
•
•
•
•
•
•
•
•
•
•
CAN functionality conforms to CAN specification V2.0 B active for each CAN node
(compliant to ISO 11898)
Four independent CAN nodes
128 independent message objects (shared by the CAN nodes)
Dedicated control registers for each CAN node
Data transfer rate up to 1Mbit/s, individually programmable for each node
Flexible and powerful message transfer control and error handling capabilities
Full-CAN functionality: message objects can be individually
– Assigned to one of the four CAN nodes
– Configured as transmit or receive object
– Configured as message buffer with FIFO algorithm
– Configured to handle frames with 11-bit or 29-bit identifiers
– Provided with programmable acceptance mask register for filtering
– Monitored via a frame counter
– Configured for Remote Monitoring Mode
Automatic Gateway Mode support
16 individually programmable interrupt nodes
Analyzer mode for CAN bus monitoring
Data Sheet
55
V1.0, 2008-04
TC1796
Functional Description
Time-Triggered Extension (TTCAN)
In addition to the event-driven CAN functionality, a deterministic behavior can be
achieved for CAN node 0 by an extension module that supports time-triggered CAN
(TTCAN) functionality. The TTCAN protocol is compliant with the confirmed
standardization proposal for ISO 11898-4 and fully conforms to the existing CAN
protocol.
The time-triggered functionality is added as higher-layer extension (session layer) to the
CAN protocol in order to be able to operate in safety critical applications. The new
features allow a deterministic behavior of a CAN network and the synchronization of
networks. A global time information is available. The time-triggered extension is based
on a scheduler mechanism with a timing control unit and a dedicated timing data part.
TTCAN Features
•
•
•
•
•
•
•
•
•
•
•
Full support of basic cycle and system matrix functionality
Support of reference messages level 1 and level 2
Usable as time master
Arbitration windows supported in time-triggered mode
Global time information available
CAN node 0 can be configured either for event-driven or for time-triggered mode
Built-in scheduler mechanism and a timing synchronization unit
Write protection for scheduler timing data memory
Module-external CAN time trigger inputs (ECTTx lines) can be used as transmit
trigger for a reference message
Timing-related interrupt functionality
Parity protection for scheduler memory
Data Sheet
56
V1.0, 2008-04
TC1796
Functional Description
3.13
Micro Link Serial Bus Interface (MLI0, MLI1)
The Micro Link Interface (MLI) is a fast synchronous serial interface that allows to
exchange data between microcontrollers of the 32-bit AUDO microcontroller family
without intervention of a CPU or other bus masters. Figure 12 shows how two
microcontrollers are typically connected together via their MLI interfaces. The MLI
operates in both microcontrollers as a bus master on the system bus.
Controller 1
Controller 2
CPU
CPU
Peripheral
A
Peripheral
B
Peripheral
C
Peripheral
D
Memory
MLI
MLI
Memory
System Bus
System Bus
MCA05869
Figure 12
Typical Micro Link Interface Connection
Features
•
•
•
•
•
•
•
•
•
Synchronous serial communication between MLI transmitters and MLI receivers
located on the same or on different microcontroller devices
Automatic data transfer/request transactions between local/remote controller
Fully transparent read/write access supported (= remote programming)
Complete address range of remote controller available
Specific frame protocol to transfer commands, addresses and data
Error control by parity bit
32-bit, 16-bit, and 8-bit data transfers
Programmable baud rate:
– MLI transmitter baud rate: max. fMLI/2 (= 37.5 Mbit/s @ 75 MHz module clock)
– MLI receiver baud rate: max. fMLI
Multiple remote (slave) controllers supported
MLI transmitter and MLI receiver communicate with other off-chip MLI receivers and MLI
transmitters via a 4-line serial I/O bus each. Several I/O lines of these I/O buses are
available outside the MLI module kernel as four-line output or input buses.
Figure 13 shows the functional blocks of the two MLI modules with its interfaces.
Data Sheet
57
V1.0, 2008-04
TC1796
Functional Description
TCLK
A1 P1.3 / TREADY0B
Transmitter
TREADYA
fMLI0
Clock
Control
fDMA
Address
Decoder
TREADYD
A2 P1.6 / TVALID0A
A2 P1.7 / TDATA0
Port 1
Control
RCLKB
Interrupt
Control
SR[3:0]
A1 P1.5 / TREADY0A
TVALIDA
TVALIDB
TVALIDD
TDATA
RCLKA
MLI0
Module
(Kernel)
A2 P1.4 / TCLK0
TREADYB
A2 P1.9 / RREADY0A
RCLKD
RREADYA
A1 P1.10 / RVALID0A
Receiver
RREADYB
SR[7:4]
To DMA
Cerberus
BRKOUT
A1 P1.8 / RCLK0A
A1 P1.11 / RDATA0A
RREADYD
RVALIDA
A1 P1.13 / RCLK0B
RVALIDB
A1 P1.14 / RVALID0B
RVALIDD
RDATAA
A1 P1.15 / RDATA0B
RDATAB
RDATAD
Port 5
Control
A2 P5.4 / RREADY0B
A2 P5.6 / TVALID0B
MCA05906
TCLK
fDMA
TREADYA
Transmitter
fMLI1
Address
Decoder
Interrupt
Control
SR[1:0]
Not
Connected
SR[3:2]
A1 P8.1 / TREADY1A
TVALIDA
TVALIDD
A2 P8.2 / TVALID1A
A2 P8.3 / TDATA1
RCLKA
MLI1
Module
(Kernel)
Port 8
Control
RCLKD
RREADYA
SR[7:4]
To DMA
RREADYD
BRKOUT
A1 P8.4 / RCLK1A
A2 P8.5 / RREADY1A
RVALIDA
A1 P8.6 / RVALID1A
RVALIDD
RDATAA
Cerberus
A2 P8.0 / TCLK1
TREADYD
TDATA
Receiver
Clock
Control
A1 P8.7 / RDATA1A
RDATAD
MCA05907
Figure 13
Data Sheet
Block Diagram of the MLI Modules
58
V1.0, 2008-04
TC1796
Functional Description
3.14
General Purpose Timer Array
The GPTA provides a set of timer, compare and capture functionalities that can be
flexibly combined to form signal measurement and signal generation units. They are
optimized for tasks typical of engine, gearbox, and electrical motor control applications,
but can also be used to generate simple and complex signal waveforms needed in other
industrial applications.
The TC1796 contains two General Purpose Timer Arrays (GPTA0 and GPTA1) with
identical functionality, plus an additional Local Timer Cell Array (LTCA2). Figure 14
shows a global view of the GPTA modules.
GPTA0
GPTA1
Clock Generation Unit
FPC0
FPC1
FPC0
DCM0
PDL0
FPC3
DCM2
PDL0
DCM1
FPC2
DIGITAL
PLL
FPC3
PDL1
DCM2
FPC4
DCM3
FPC5
DCM0
FPC1
DCM1
FPC2
FPC4
Clock Generation Unit
PDL1
DCM3
FPC5
fGPTA
fGPTA Clock Distribution Unit
DIGITAL
PLL
Clock Distribution Unit
GT1
Signal
Generation Unit
GT0
GT1
Clock Bus
GT0
Clock Bus
Clock
Conn.
Signal
Generation Unit
LTCA2
GTC00
GTC01
GTC02
GTC03
LTC00
LTC01
LTC02
LTC03
GTC00
GTC01
GTC02
GTC03
LTC00
LTC01
LTC02
LTC03
LTC00
LTC01
LTC02
LTC03
Global
Timer
Cell Array
Local
Timer
Cell Array
Global
Timer
Cell Array
Local
Timer
Cell Array
Local
Timer
Cell Array
GTC30
GTC31
LTC62
LTC63
GTC30
GTC31
LTC62
LTC63
LTC62
LTC63
I/O Line Sharing Unit
I/O Line Sharing Unit
I/O Line
Sharing Unit
Interrupt Sharing Unit
Interrupt Sharing Unit
Interrupt
Sharing Unit
MCB05910
Figure 14
Data Sheet
Block Diagram of the GPTA Modules
59
V1.0, 2008-04
TC1796
Functional Description
3.14.1
Functionality of GPTA0/GPTA1
Each of the General Purpose Timer Arrays (GPTA0 and GPTA1) provides a set of
hardware modules required for high speed digital signal processing:
•
•
•
•
•
•
•
Filter and Prescaler Cells (FPC) support input noise filtering and prescaler operation.
Phase Discrimination Logic units (PDL) decode the direction information output by a
rotation tracking system.
Duty Cycle Measurement Cells (DCM) provide pulse-width measurement
capabilities.
A Digital Phase Locked Loop unit (PLL) generates a programmable number of GPTA
module clock ticks during an input signal’s period.
Global Timer units (GT) driven by various clock sources are implemented to operate
as a time base for the associated Global Timer Cells.
Global Timer Cells (GTC) can be programmed to capture the contents of a Global
Timer on an external or internal event. A GTC may be also used to control an external
port pin depending on the result of an internal compare operation. GTCs can be
logically concatenated to provide a common external port pin with a complex signal
waveform.
Local Timer Cells (LTC) operating in Timer, Capture, or Compare Mode may be also
logically tied together to drive a common external port pin with a complex signal
waveform. LTCs — enabled in Timer Mode or Capture Mode — can be clocked or
triggered by various external or internal events.
Input lines can be shared by an LTC and a GTC to trigger their programmed operation
simultaneously.
The following sections summarize the specific features of the GPTA units. The clock
signal fGPTA is the input clock of the GPTA modules (max. 75 MHz in TC1796).
Clock Generation Unit
•
•
Filter and Prescaler Cell (FPC)
– Six independent units
– Three basic operating modes:
Prescaler, Delayed Debounce Filter, Immediate Debounce Filter
– Selectable input sources:
Port lines, GPTA module clock, FPC output of preceding FPC cell
– Selectable input clocks:
GPTA module clock, prescaled GPTA module clock, DCM clock, compensated or
uncompensated PLL clock.
– fGPTA/2 maximum input signal frequency in Filter Modes
Phase Discriminator Logic (PDL)
– Two independent units
– Two operating modes (2 and 3 sensor signals)
Data Sheet
60
V1.0, 2008-04
TC1796
Functional Description
•
•
•
– fGPTA/4 maximum input signal frequency in 2-sensor Mode, fGPTA/6 maximum input
signal frequency in 3-sensor Mode.
Duty Cycle Measurement (DCM)
– Four independent units
– 0 - 100% margin and time-out handling
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Digital Phase Locked Loop (PLL)
– One unit
– Arbitrary multiplication factor between 1 and 65535
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Clock Distribution Unit (CDU)
– One unit
– Provides nine clock output signals:
fGPTA, divided fGPTA clocks, FPC1/FPC4 outputs, DCM clock, LTC prescaler clock
Signal Generation Unit
•
•
•
Global Timers (GT)
– Two independent units
– Two operating modes (Free Running Timer and Reload Timer)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Global Timer Cell (GTC)
– 32 units related to the Global Timers
– Two operating modes (Capture, Compare and Capture after Compare)
– 24-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Local Timer Cell (LTC)
– 64 independent units
– Three basic operating modes (Timer, Capture and Compare) for 63 units
– Special compare modes for one unit
– 16-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Interrupt Sharing Unit
•
286 interrupt sources, generating up to 92 service requests
Data Sheet
61
V1.0, 2008-04
TC1796
Functional Description
I/O Sharing Unit
•
Interconnecting inputs and outputs from internal clocks, FPC, GTC, LTC, ports, and
MSC interface.
3.14.2
Functionality of LTCA2
One Local Timer Cells Area provides a set of Local Timer Cells.
•
64 Local Timer Cells (LTCs)
– Three basic operating modes (Timer, Capture and Compare) for 63 units.
– Special compare modes for one unit
– 16-bit data width
– fGPTA maximum resolution
– fGPTA/2 maximum input signal frequency
Data Sheet
62
V1.0, 2008-04
TC1796
Functional Description
3.15
Analog-to-Digital Converter (ADC0, ADC1)
The two ADC modules of the TC1796 are analog to digital converters with 8-bit, 10-bit,
or 12-bit resolution including sample & hold functionality.
VDD
VDDM
VAGND0 VSS VSSM VAREF0
EMUX0
fCLC
ASGT
SW0TR, SW0GT External
ETR, EGT
Request
Unit
QTR, QGT
(SCU)
TTR, TGT
Address
Decoder
Interrupt
Control
To DMA
ADC0
Module
Kernel
Analog Multiplexer
SR
[3:0]
Port 7
Control
EMUX1
SR[7:4]
Group 0
Analog Multiplexer
Address
Decoder
Interrupt
Control
SR[3:0]
AIN15
AIN16
Not
Used
VAGND1 VSS VSSM VAREF1
VDD
VDDM
Figure 15
Data Sheet
D AN41
D AN42
ASGT
SW0TR, SW0GT External
ETR, EGT
Request
Unit
QTR, QGT
(SCU)
TTR, TGT
EMUX1
To DMA
From GPTA
D AN2
Die Temp.
Sensor
EMUX0
SR[7:4]
9
D AN1
AIN0
ADC1
Module
Kernel
From MSC0/1
AIN15
Synchronization Bridge
AIN30
AIN31
2
D AN0
AIN31
Group 0
From Ports
AIN0
AIN16
Group 1
8
Analog Input Sharing Crossbar
Clock
Control
P7.1 /
A1 AD0EMUX2
P7.2 /
A1 AD0EMUX0
P7.3 /
A1 AD0EMUX1
GRPS
fADC
Port 7
Control
D AN43
8
From Ports
2
From MSC0/1
9
From GPTA
P7.6 /
AD1EMUX0
P7.7 /
A1
AD1EMUX1
A1
MCA06033
Block Diagram of the ADC Module
63
V1.0, 2008-04
TC1796
Functional Description
The A/D converters operate by the method of the successive approximation. A
multiplexer selects between up to 32 analog inputs that can be connected with the 16
conversion channels in each ADC module. An automatic self-calibration adjusts the ADC
modules to changing temperatures or process variations.
External Clock control, address decoding, and service request (interrupt) control is
managed outside the ADC module kernel. A synchronization bridge is used for
synchronization of two ADC modules. External trigger conditions are controlled by an
External Request Unit. This unit generates the control signals for auto-scan control
(ASGT), software trigger control (SW0TR, SW0GT), the event trigger control (ETR,
EGT), queue control (QTR, QGT), and timer trigger control (TTR, TGT).
Features
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
8-bit, 10-bit, 12-bit A/D conversion
Minimum conversion times (without sample time, @ 75 MHz module clock):
– 1.05 µs @ 8-bit resolution
– 1.25 µs @ 10-bit resolution
– 1.45 µs @ 12-bit resolution
Extended channel status information on request source
Successive approximation conversion method
Total Unadjusted Error (TUE) of ±2 LSB @ 10-bit resolution
Integrated sample & hold functionality
Direct control of up to 16(32) analog input channels per ADC
Dedicated control and status registers for each analog channel
Powerful conversion request sources
Selectable reference voltages for each channel
Programmable sample and conversion timing schemes
Limit checking
Flexible ADC module service request control unit
Synchronization of the two on-chip A/D converters
Automatic control of external analog multiplexers
Equidistant samples initiated by timer
External trigger and gating inputs for conversion requests
Power reduction and clock control feature
On-chip die temperature sensor output voltage measurement via ADC1
Data Sheet
64
V1.0, 2008-04
TC1796
Functional Description
3.16
Fast Analog-to-Digital Converter Unit (FADC)
The FADC module of the TC1796 basically is a 4-channel A/D converter with 10-bit
resolution that operates by the method of the successive approximation.
The main FADC functional blocks shown in Figure 16 are:
•
•
•
•
•
•
The Input Stage contains the differential inputs and the programmable amplifier.
The A/D Converter is responsible for the analog-to-digital conversion.
The Data Reduction Unit contains programmable anti aliasing and data reduction
filters.
The Channel Trigger Control block defines the trigger and gating conditions for the
four FADC channels. The gating source inputs GS[7:0] and trigger source inputs
TS[7:0] are connected with GPTA0 module outputs, with GPIO port lines, and
external request unit outputs.
The Channel Timers can independently trigger the conversion of each FADC
channel.
The A/D control block is responsible for the overall FADC functionality.
The FADC module is supplied by the following power supply and reference voltage lines:
•
•
•
VDDMF/VDDMF: FADC Analog Part Power Supply (3.3V)
VDDAF/VDDAF: FADC Analog Part Logic Power Supply (1.5V)
VFAREF/VFAGND: FADC Reference Voltage/FADC Reference Ground
Data Sheet
65
V1.0, 2008-04
TC1796
Functional Description
VFAREF VDDAF VDDMF
VFAGND VSSAF
VSSMF
fFADC
Clock
Control
fCLC
FAIN0P
FAIN0N
Address
Decoder
Interrupt
Control
FAIN1P
FADC
Module
Kernel
SR[3:0]
FAIN1N
FAIN2P
FAIN2N
To DMA
GPTA0
FAIN3P
OUT1
OUT9
OUT18
OUT26
OUT2
OUT10
OUT19
OUT27
FAIN3N
D AN24
D AN25
D AN26
D AN27
D AN28
D AN29
D AN30
D AN31
A1 P1.0 / REQ0
A1 P1.1 / REQ1
GS[7:0]
A1 P7.0 / REQ4
TS[7:0]
A1 P7.1 / REQ5
PDOUT2
External Request Unit
(SCU)
PDOUT3
MCA06053
Figure 16
Block Diagram of the FADC Module
Features
•
•
•
•
•
•
•
•
•
•
•
Extreme fast conversion: 21 cycles of fFADC (= 280ns @ fFADC = 75 MHz)
10-bit A/D conversion
– Higher resolution by averaging of consecutive conversions is supported
Successive approximation conversion method
Four differential input channels
Offset and gain calibration support for each channel
Differential input amplifier with programmable gain of 1, 2, 4 and 8 for each channel
Free-running (Channel Timers) or triggered conversion modes
Trigger and gating control for external signals
Built-in Channel Timers for internal triggering
Channel timer request periods independently selectable for each channel
Selectable, programmable anti aliasing and data reduction filter block
Data Sheet
66
V1.0, 2008-04
TC1796
Functional Description
3.17
System Timer
The TC1796’s STM is designed for global system timing applications requiring both high
precision and long range.
Features
•
•
•
•
•
•
•
•
•
Free-running 56-bit counter
All 56 bits can be read synchronously
Different 32-bit portions of the 56-bit counter can be read synchronously
Flexible interrupt generation based on compare match with partial STM content
Driven by max. 75 MHz (= fSYS, default after reset = fSYS/2)
Counting starts automatically after a reset operation
STM is reset by:
– Watchdog reset
– Software reset (RST_REQ.RRSTM must be set)
– Power-on reset
STM is not reset at a hardware reset
STM can be halted in debug/suspend mode
The STM is an upward counter, running either at the system clock frequency fSYS or at a
fraction of it. In case of a power-on reset, a watchdog reset, or a software reset, the STM
is reset. After one of these reset conditions, the STM is enabled and immediately starts
counting up. It is not possible to affect the contents of the timer during normal operation
of the TC1796. The timer registers can only be read but not written to. The STM can be
optionally disabled or suspended for power-saving and debugging purposes via its clock
control register. In suspend mode of the TC1796, the STM clock is stopped but all
registers are still readable.
The System Timer can be read in sections from seven registers, STM_TIM0 through
STM_TIM6, which select increasingly higher-order 32-bit ranges of the System Timer.
These can be viewed as individual 32-bit timers, each with a different resolution and
timing range. For getting a synchronous and consistent reading of the complete STM
contents, a capture register (STM_CAP), is implemented. It latches the contents of the
high part of the STM each time when one of the registers STM_TIM0 to STM_TIM5 is
read. Thus, it holds the upper value of the timer at exactly the same time when the lower
part is read. The second read operation would then read the contents of the STM_CAP
to get the complete timer value.
The content of the 56-bit System Timer can be compared against the content of two
compare values stored in the compare registers. Interrupts can be generated on a
compare match of the STM with the STM_CMP0 or STM_CMP1 registers.
The maximum clock period is 256 × fSTM. At fSTM = 75 MHz, for example, the STM counts
30.47 years before overflowing. Thus, it is capable of continuously timing the entire
expected product life-time of a system without overflowing.
Data Sheet
67
V1.0, 2008-04
TC1796
Functional Description
Figure 17 shows an overview on the System Timer with the options for reading parts of
STM contents.
STM Module
31
23
15
0
7
Compare Register 0
STM_CMP0
31
23
15
7
0
Compare Register1
STM_CMP1
STMIR1
Interrupt
Control
Clock
Control
55
47
39
31
23
15
7
0
56-Bit System Timer
STMIR0
Enable /
Disable
00H
STM_CAP
fSTM
00H
STM_TIM6
STM_TIM5
Address
Decoder
STM_TIM4
STM_TIM3
PORST
STM_TIM2
STM_TIM1
STM_TIM0
MCB05746
Figure 17
Data Sheet
General Block Diagram of the STM Module Registers
68
V1.0, 2008-04
TC1796
Functional Description
3.18
Watchdog Timer
The Watchdog Timer (WDT) provides a highly reliable and secure way to detect and
recover from software or hardware failure. The WDT helps to abort an accidental
malfunction of the TC1796 in a user-specified time period. When enabled, the WDT will
cause the TC1796 system to be reset if the WDT is not serviced within a userprogrammable time period. The CPU must service the WDT within this time interval to
prevent the WDT from causing a TC1796 system reset. Hence, routine service of the
WDT confirms that the system is functioning properly.
In addition to this standard “Watchdog” function, the WDT incorporates the EndInit
feature and monitors its modifications. A system-wide line is connected to the End-ofInitialization (Endinit) feature and monitors its modifications. A system-wide line is
connected to the WDT_CON0.ENDINIT bit, serving as an additional write-protection for
critical registers (besides Supervisor Mode protection)
A further enhancement in the TC1796’s WDT is its reset pre-warning operation. Instead
of immediately resetting the device on the detection of an error (the way that standard
Watchdogs do), the WDT first issues an Non-Maskable Interrupt (NMI) to the CPU
before finally resetting the device at a specified time period later. This gives the CPU a
chance to save system state to memory for later examination of the cause of the
malfunction, an important aid in debugging.
Features
•
•
•
•
•
•
•
•
•
•
16-bit Watchdog counter
Selectable input frequency: fSYS/256 or fSYS/16384
16-bit user-definable reload value for normal Watchdog operation, fixed reload value
for Time-Out and Pre-warning Modes
Incorporation of the ENDINIT bit and monitoring of its modifications
Sophisticated password access mechanism with fixed and user-definable password
fields
Proper access always requires two write accesses. The time between the two
accesses is monitored by the WDT and limited.
Access Error Detection: Invalid password (during first access) or invalid guard bits
(during second access) trigger the Watchdog reset generation.
Overflow Error Detection: An overflow of the counter triggers the Watchdog reset
generation.
Watchdog function can be disabled; access protection and ENDINIT monitor function
remain enabled.
Double Reset Detection: If a Watchdog induced reset occurs twice, a severe system
malfunction is assumed and the TC1796 is held in reset until a power-on reset. This
prevents the device from being periodically reset if, for instance, connection to the
external memory has been lost such that even system initialization could not be
performed
Data Sheet
69
V1.0, 2008-04
TC1796
Functional Description
•
Important debugging support is provided through the reset pre-warning operation by
first issuing an NMI to the CPU before finally resetting the device after a certain
period of time.
3.19
System Control Unit
The System Control Unit (SCU) of the TC1796 handles several system control tasks.
These system control tasks of the SCU are:
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
•
Clock system selection and control
Reset and boot operation control
Power management control
Configuration input sampling
External Request Unit
System clock output control
Chip select generation for EBU
EBU pull devices control
On-chip SRAM Parity Control
Pad driver temperature compensation control
Emergency stop input control for GPTA outputs
Die Temperature Sensor
GPTA1 input IN0 control
Pad Test Mode control for dedicated pins
ODCS level 2 trace control
NMI control
Miscellaneous SCU control
3.20
Boot Options
The TC1796 booting schemes provide a number of different boot options for the start of
code execution. Table 7 shows the boot options available in the TC1796.
Data Sheet
70
V1.0, 2008-04
TC1796
Functional Description
Table 7
BRKIN
TC1796 Boot Selections
HWCFG Type of Boot
[3:0]
Boot ROM Exit
Jump Address
Normal Boot Options
1
Data Sheet
0000B
Enter bootstrap loader mode 1:
Serial ASC0 boot via ASC0 pins
0001B
Enter bootstrap loader mode 2:
Serial CAN boot via CAN pins
0010B
Start from internal PFLASH
0011B
Alternate boot mode (ABM): start from internal As defined in
PFLASH after CRC check is correctly executed; ABM header or
enter a serial bootstrap loader mode1) if CRC
D400 0000H
check fails.
0100B
Start from external memory with EBU as master, A100 0000H
using CS0; automatic EBU configuration2);
0101B
Alternate boot mode (ABM): start from external As defined in
memory with CRC check and EBU as master, ABM header or
using CS0; enter a serial bootstrap loader
D400 0000H
2)
mode if CRC checks fails;
automatic EBU configuration2);
0110B
Start from external memory with EBU as
participant, using CS0;
automatic EBU configuration2);
0111B
Alternate boot mode (ABM): start from external As defined in
memory with CRC check and EBU as
ABM header or
participant, using CS0; enter a serial bootstrap D400 0000H
loader mode2) if CRC checks fails;
automatic EBU configuration2);
1000B
Start from emulation memory if emulation
device TC1796ED is available; in case of
TC1796: Execute stop loop;
If TC1796ED:
AFF0 0000H
1111B
Enter bootstrap loader mode 3:
Serial ASC0 boot via CAN pins
D400 0000H
Others
Reserved; execute stop loop;
–
71
D400 0000H
A000 0000H
A100 0000H
V1.0, 2008-04
TC1796
Functional Description
Table 7
TC1796 Boot Selections (cont’d)
BRKIN
HWCFG Type of Boot
[3:0]
Boot ROM Exit
Jump Address
Debug Boot Options
0
0000B
Tri-state chip
–
1000B
Go to external emulator space with EBU as
master, using CSEMU/CSCOMB
DE00 0000H
Others
Reserved; execute stop loop;
–
1) The type of the alternate bootstrap loader mode is selected by the value of the SCU_SCLIR.SWOPT[2:0] bit
field, which contains the levels of the P0.[2:0] latched in with the rising edge of the HDRST. For more details
on ABM, see the User’s Manual.
2) The EBU fetches the boot configuration from address offset 4 using CS0.
Data Sheet
72
V1.0, 2008-04
TC1796
Functional Description
3.21
Power Management System
The TC1796 power management system allows software to configure the various
processing units so that they automatically adjust to draw the minimum necessary power
for the application. There are three power management modes:
•
•
•
Run Mode
Idle Mode
Sleep Mode
The operation of each system component in each of these states can be configured by
software. The power-management modes provide flexible reduction of power
consumption through a combination of techniques, including stopping the CPU clock,
stopping the clocks of other system components individually, and individually clockspeed reduction of some peripheral components.
Besides these explicit software-controlled power-saving modes, in the TC1796 special
attention has been paid for automatic power-saving in those operating units which are
currently not required or idle. In that case they are shut off automatically until their
operation is required again.
Table 8 describes the features of the power management modes.
Table 8
Power Management Mode Summary
Mode
Description
Run
The system is fully operational. All clocks and peripherals are enabled,
as determined by software.
Idle
The CPU clock is disabled, waiting for a condition to return it to Run
Mode. Idle Mode can be entered by software when the processor has no
active tasks to perform. All peripherals remain powered and clocked.
Processor memory is accessible to peripherals. A reset, Watchdog Timer
event, a falling edge on the NMI pin, or any enabled interrupt event will
return the system to Run Mode.
Sleep
The system clock signal is distributed only to those peripherals
programmed to operate in Sleep Mode. The other peripheral module will
be shut down by the suspend signal. Interrupts from operating
peripherals, the Watchdog Timer, a falling edge on the NMI pin, or a reset
event will return the system to Run Mode. Entering this state requires an
orderly shut-down controlled by the Power Management State Machine.
In typical operation, Idle Mode and Sleep Mode may be entered and exited frequently
during the run time of an application. For example, system software will typically cause
the CPU to enter Idle Mode each time it has to wait for an interrupt before continuing its
tasks. In Sleep Mode and Idle Mode, wake-up is performed automatically when any
enabled interrupt signal is detected, or if the Watchdog Timer signals the CPU with an
NMI trap.
Data Sheet
73
V1.0, 2008-04
TC1796
Functional Description
3.22
On-Chip Debug Support
Figure 18 shows a block diagram of the TC1796 OCDS system.
TriCore
CPU
SBCU
RBCU
Watchdog
Timer
(WDT)
PCP2
M
U
X
TRCLK
OCDS
System
Control Unit
(OSCU)
TDI
TDO
TMS
JTAG
Controller
TCK
JTAG
Debug
Interface
(JDI)
(Bus Bridge)
System
Peripheral
Bus
TRST
Multi Core
Break
Switch
(MCBS)
BRKIN
BRKOUT
SPB
Peripheral
Unit 1
SPB
Peripheral
Unit m
Remote Peripheral Bus
Cerberus
Break & Suspend Signals
DMA
Controller
Enable, Control,
R eset Signals
TR[15:0]
RPB
Peripheral
Unit 1
RPB
Peripheral
Unit n
MCB05756_mod
Figure 18
OCDS System Block Diagram
The TC1796 basically supports three levels of debug operation:
•
•
•
OCDS Level 1 debug support
OCDS Level 2 debug support
OCDS Level 3 debug support
Data Sheet
74
V1.0, 2008-04
TC1796
Functional Description
OCDS Level 1 Debug Support
The OCDS Level 1 debug support is mainly assigned for real-time software debugging
purposes which have a demand for low-cost standard debugger hardware.
The OCDS Level 1 debug support is based on a JTAG interface which can be used by
the external debug hardware to communicate with the system. The on-chip Cerberus
module controls the interactions between the JTAG interface and the on-chip modules.
The external debug hardware may become master of the internal buses and read or
write the on-chip register/memory resources. The Cerberus also allows to define
breakpoint and trigger conditions as well as to control user program execution (run/stop,
break, single-step).
OCDS Level 2 Debug Support
The OCDS Level 2 debug support allows to implement program tracing capabilities for
enhanced debuggers by extending the OCDS Level 1 debug functionality with an
additional 16-bit wide trace port with trace clock. With the trace extension the following
four trace capabilities are provided (only one of the four trace capabilities can be
selected at a time):
•
•
•
•
Trace capability of the CPU program flow
Trace capability of the PCP2 program flow
Trace capability of the DMA Controller transaction requests
Trace capability of the DMA Controller move engine status information
OCDS Level 3 Debug Support
The OCDS Level 3 debug support is based on a special emulation device, the
TC1796ED, which provides additional features required for high-end emulation
purposes. The TC1796ED is a device which includes the TC1796 product chip and
additional emulation extension hardware in a package with the same footprint as the
TC1796.
Data Sheet
75
V1.0, 2008-04
TC1796
Functional Description
3.23
Clock Generation and PLL
The TC1796 clock system performs the following functions:
•
•
•
•
•
•
Acquires and buffers incoming clock signals to create a master clock frequency
Distributes in-phase synchronized clock signals throughout the TC1796’s entire clock
tree
Divides a system master clock frequency into lower frequencies required by the
different modules for operation.
Dynamically reduces power consumption during operation of functional units
Statically reduces power consumption through programmable power-saving modes
Reduces electromagnetic interference (EMI) by switching off unused modules
The clock system must be operational before the TC1796 is able to run. Therefore, it also
contains special logic to handle power-up and reset operations. Its services are
fundamental to the operation of the entire system, so it contains special fail-safe logic.
Features
•
•
•
•
PLL operation for multiplying clock source by different factors
Direct drive capability for direct clocking
Comfortable state machine for secure switching between basic PLL, direct or
prescaler operation
Sleep and Power-Down Mode support
The TC1796 Clock Generation Unit (CGU) as shown in Figure 19 allows a very flexible
clock generation. It basically consists of an main oscillator circuit and a Phase- Locked
Loop (PLL). The PLL can converts a low-frequency external clock signal from the
oscillator circuit to a high-speed internal clock for maximum performance.
The system clock fSYS is generated from an oscillator clock fOSC in either of four
hardware/software selectable ways:
•
•
•
•
Direct Drive Mode (PLL Bypass):
In Direct Drive Mode, the PLL is bypassed and the CGU clock outputs are directly fed
from the clock signal fOSC, i.e. fCPU = fOSC and fSYS = fOSC/2 or fOSC. This allows
operation of the TC1796 with a reasonably small fundamental mode crystal.
VCO Bypass Mode (Prescaler Mode):
In VCO Bypass Mode, fCPU and fSYS are derived from fOSC by the two divider stages,
P-Divider and K-Divider. The system clock fSYS can be equal to fCPU or fCPU/2.
PLL Mode:
In PLL Mode, the PLL is running. The VCO clock fVCO is derived from fOSC, divided by
the P factor, multiplied by the PLL (N-Divider). The clock signals fCPU and fSYS are
derived from fVCO by the K-Divider. The system clock fSYS can be equal to fCPU or
fCPU/2.
PLL Base Mode:
In PLL Base Mode, the PLL is running at its VCO base frequency and fCPU and fSYS
Data Sheet
76
V1.0, 2008-04
TC1796
Functional Description
are derived from fVCO only by the K-Divider. In this mode, the system clock fSYS can
be equal to fCPU or fCPU/2.
XTAL1
Main
Osc.
Circuit
XTAL2
fCPU
Clock Generation Unit (CGU)
fOSC
Clock
Output
Control
PDivider
≥1
fP
fVCO
Phase
Detect.
fN
VCO
M
U
X
fSYS
KDivider
NDivider
SYSFS
KDIV
BYPPIN
VCOBYP
VCOSEL
NDIV
OSCDSIC
PDIV
ORDRES
OSCR
MOSC
OGC
PLL
LOCK
PLL
Lock
Detect.
Osc.
Run
Detect.
BYPASS
Oscillator Control Register
OSC_CON
P5.3 /
TXD1A
Figure 19
PLL Clock Control and Status Register
PLL_CLC
System Control Unit (SCU)
MCB05600
Clock Generation Unit
Recommended Oscillator Circuits
The oscillator circuit, a Pierce oscillator, is designed to work with both, an external crystal
oscillator or an external stable clock source. It basically consists of an inverting amplifier
and a feedback element with XTAL1 as input, and XTAL2 as output.
When using a crystal, a proper external oscillator circuitry must be connected to both
pins, XTAL1 and XTAL2. The crystal frequency can be within the range of 4 MHz
to 25 MHz. Additionally are necessary, two load capacitances CX1 and CX2, and
depending on the crystal type a series resistor RX2 to limit the current. A test resistor RQ
may be temporarily inserted to measure the oscillation allowance (negative resistance)
of the oscillator circuitry. RQ values are typically specified by the crystal vendor. The CX1
and CX2 values shown in Figure 20 can be used as starting points for the negative
resistance evaluation and for non-productive systems. The exact values and related
operating range are dependent on the crystal frequency and have to be determined and
Data Sheet
77
V1.0, 2008-04
TC1796
Functional Description
optimized together with the crystal vendor using the negative resistance method.
Oscillation measurement with the final target system is strongly recommended to verify
the input amplitude at XTAL1 and to determine the actual oscillation allowance (margin
negative resistance) for the oscillator-crystal system.
When using an external clock signal, it must be connected to XTAL1. XTAL2 is left open
(unconnected). The external clock frequency can be in the range of 0 - 40 MHz if the PLL
is bypassed and 4 - 40 MHz if the PLL is used.
The oscillator can also be used in combination with a ceramic resonator. The final
circuitry must be also verified by the resonator vendor.
Figure 20 shows the recommended external oscillator circuitries for both operating
modes, external crystal mode and external input clock mode.
VDDOSC
VDDOSC3
fOSC
XTAL1
4 - 25
MHz
RQ
VDDOSC
External Clock
Signal 41) - 40
MHz
TC1796
Oscillator
fOSC
XTAL1
TC1796
Oscillator
RX2
XTAL2
CX1
VDDOSC3
XTAL2
CX2
Fundamental
Mode Crystal
VSSOSC
VSSOSC
1) in case of PLL bypass 0 MHz
Crystal Frequency CX1, CX2
4 MHz
8 MHz
12 MHz
16 - 25 MHz
1)
33 pF
18 pF
12 pF
10 pF
RX2
1)
0
0
0
0
1) Note that these are evaluation start values!
Figure 20
MCS05601
Oscillator Circuitries
A block capacitor between VDDOSC1)/VDDOSC3 and VSSOSC is recommended, too.
Note: For crystal operation, it is strongly recommended to measure the negative
resistance in the final target system (layout) to determine the optimum parameters
1) VDDOSC and VSSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them
in future steps and products is kept open.
Data Sheet
78
V1.0, 2008-04
TC1796
Functional Description
for the oscillator operation. Please refer to the minimum and maximum values of
the negative resistance specified by the crystal supplier.
3.24
Power Supply
The TC1796 has several power supply lines for different voltage classes:
•
•
•
1.5 V: Core logic and memory, oscillator, and A/D converter supply
3.3 V: I/O ports, Flash memories, oscillator, and A/D converter supply with reference
voltages
2.3 V to 3.3 V: External bus interface supply
Figure 21 shows the power supply concept of the TC1796 with the power supply pins
and its connections to the functional units.
VAREF0
VSS
62
(3.3 V)
(3.3 V)
(3.3 V)
(1.5 V)
VDDAF
VFAREF
VAGND0
VSSM
VAGND1
VSSAF
VFAGND VSSMF
2
VDDM
VAREF1
2
2
2
(3.3 V)
VDDMF
(3.3 V)
2
2
TC1796
ADC0
Ports
EBU
11
VDDP
(3.3 V)
9
VDDEBU
(2.3 - 3.3 V)
ADC1
FADC
Core
PMI/PMU
DMI/DMU
Memories
Stand-by
SBRAM
13
VDD
(1.5 V)
1
VDDSBRAM
(1.5 V)
PLL
FLASH
Memories
2
VDDFL3
(3.3 V)
OSC
3
VDDOSC (1.5 V)
VDDOSC3 (3.3 V)
VSSOSC
tc1 7 9 6 _ Pw rSu p p ly
Figure 21
Data Sheet
Power Supply Concept of TC1796
79
V1.0, 2008-04
TC1796
Functional Description
3.25
Identification Register Values
The Identification Registers uniquely identify a module or the whole device.
Table 9
TC1796 Identification Registers
Short Name
Address
Value
Stepping
SCU_ID
F000 0008H
002C C002H
–
MANID
F000 0070H
0000 1820H
–
CHIPID
F000 0074H
0000 8A02H
–
RTID
F000 0078H
0000 0000H
BA-Step
0000 0001H
BB-Step
0000 0100H
BC-Step
0000 0101H
BD-Step
0000 0300H
BE-Step
SBCU_ID
F000 0108H
0000 6A0AH
–
STM_ID
F000 0208H
0000 C006H
–
CBS_JPDID
F000 0408H
0000 6307H
–
MSC0_ID
F000 0808H
0028 C002H
–
MSC1_ID
F000 0908H
0028 C002H
–
ASC0_ID
F000 0A08H
0000 4402H
–
ASC1_ID
F000 0B08H
0000 4402H
–
GPTA0_ID
F000 1808H
0029 C003H
BA-, BB-Step
0029 C004H
BC-, BD-, BE-Step
0029 C003H
BA-, BB-Step
0029 C004H
BC-, BD-, BE-Step
002A C003H
BA-, BB-Step
002A C004H
BC-, BD-, BE-Step
GPTA1_ID
LTCA2_ID
F000 2008H
F000 2808H
DMA_ID
F000 3C08H
001A C002H
–
CAN_ID
F000 4008H
002B C002H
–
PCP_ID
F004 3F08H
0020 C003H
–
RBCU_ID
F010 0008H
0000 6A0AH
–
SSC0_ID
F010 0108H
0000 4530H
–
SSC1_ID
F010 0208H
0000 4510H
–
FADC_ID
F010 0308H
0027 C002H
–
Data Sheet
80
V1.0, 2008-04
TC1796
Functional Description
Table 9
TC1796 Identification Registers (cont’d)
Short Name
Address
Value
Stepping
ADC0_ID
F010 0408H
0030 C002H
–
MLI0_ID
F010 C008H
0025 C005H
–
MLI1_ID
F010 C108H
0025 C005H
–
MCHK_ID
F010 C208H
001B C001H
–
CPS_ID
F7E0 FF08H
0015 C006H
–
CPU_ID
F7E1 FE18H
000A C005H
–
EBU_ID
F800 0008H
0014 C005H
–
PMU_ID
F800 0508H
002E C002H
–
FLASH_ID
F800 2008H
0031 C002H
–
DMU_ID
F801 0108H
002D C002H
–
DBCU_ID
F87F FA08H
000F C005H
–
DMI_ID
F87F FC08H
0008 C004H
–
PMI_ID
F87F FD08H
000B C004H
–
LFI_ID
F87F FF08H
000C C005H
–
PBCU_ID
F87F FE08H
000F C005H
–
Data Sheet
81
V1.0, 2008-04
TC1796
Electrical Parameters
4
Electrical Parameters
4.1
General Parameters
4.1.1
Parameter Interpretation
The parameters listed in this section partly represent the characteristics of the TC1796
and partly its requirements on the system. To aid interpreting the parameters easily
when evaluating them for a design, they are marked with an two-letter abbreviation in
column “Symbol”:
•
•
CC
Such parameters indicate Controller Characteristics which are a distinctive feature of
the TC1796 and must be regarded for a system design.
SR
Such parameters indicate System Requirements which must provided by the
microcontroller system in which the TC1796 designed in.
Data Sheet
82
V1.0, 2008-04
TC1796
Electrical Parameters
4.1.2
Pad Driver and Pad Classes Summary
This section gives an overview on the different pad driver classes and its basic
characteristics. More details (mainly DC parameters) are defined in the Section 4.2.1.
Table 10
Pad Driver and Pad Classes Overview
Class Power Type
Supply
Sub Class
A
A1
(e.g. GPIO)
6 MHz 100 pF 500 nA
A2
(e.g.
serial I/Os)
40
MHz
50 pF
6 µA
Series
termination
recommended
A3
75
MHz
(e.g.
Trace Outputs,
serial I/Os)
50 pF
6 µA
Series
termination
recommended
(for f > 25 MHz)
A4
(e.g.
Trace Clock)
150
MHz
25 pF
6 µA
Series
termination
recommended
LVTTL B1
I/O
(e.g.
External Bus
Interface)
40
MHz
50 pF
6 µA
No
B2
(e.g.
Bus Clock)
75
MHz
35 pF
–
50
MHz
B
3.3V
2.375 3.6V2)
LVTTL
I/O,
LVTTL
output
Speed Load
Grade
C
3.3V
LVDS
D
–
Analog inputs, reference voltage inputs
Leakage Termination
1)
No
Series
termination
recommended
(for f > 25 MHz)
–
Parallel
termination3),
100 Ω ± 10%
1) Values are for TJmax = 150 °C.
2) AC characteristics for EBU pins are valid for 2.5 V ± 5% and 3.3 V ± 5%.
3) In applications where the LVDS pins are not used (disabled), these pins must be either left unconnected, or
properly terminated with the differential parallel termination of 100 Ω ± 10%.
Data Sheet
83
V1.0, 2008-04
TC1796
Electrical Parameters
4.1.3
Absolute Maximum Ratings
Stresses above those listed under “Absolute Maximum Ratings” may cause permanent
damage to the device. This is a stress rating only and functional operation of the device
at these or any other conditions above those indicated in the operational sections of this
specification is not implied. Exposure to absolute maximum rating conditions for
extended periods may affect device reliability.
During absolute maximum rating overload conditions (VIN > related VDD or VIN < VSS) the
voltage on the related VDD pins with respect to ground (VSS) must not exceed the values
defined by the absolute maximum ratings.
Table 11
Absolute Maximum Rating Parameters
Parameter
Symbol
TA
SR
Storage temperature
TST
SR
Junction temperature
TJ
SR
Voltage at 1.5 V power supply VDD
pins with respect to VSS1)
SR
Voltage at 3.3 V power supply VDDEBU
pins with respect to VSS2)
VDDP SR
Voltage on any Class A input VIN
SR
Ambient temperature
Values
Min. Typ. Max.
Unit Note /
Test Con
dition
-40
–
125
°C
Under bias
-65
–
150
°C
–
-40
–
150
°C
Under bias
–
–
2.25
V
–
–
–
3.75
V
–
VDDP + 0.5
V
Whatever
is lower
VDDEBU + 0.5 V
Whatever
is lower
VDDM + 0.5
V
Whatever
is lower
VDDMF + 0.5 V
Whatever
is lower
-0.5 –
pin and dedicated input pins
with respect to VSS
Voltage on any Class B input VIN
pin with respect to VSS
Voltage on any Class D
analog input pin with respect
to VAGND
VAIN
VAREFx
Voltage on any Class D
analog input pin with respect
to VSSAF
VAINF
VFAREF
CPU & LMB Bus Frequency
fCPU
fSYS
FPI Bus Frequency
or max. 3.7
SR -0.5 –
or max. 3.7
-0.5 –
or
max. 3.7
SR
-0.5 –
or
max. 3.7
SR
SR –
SR –
–
–
1503)
3)
75
MHz –
MHz –
1) Applicable for VDD, VDDSBRAM, VDDOSC, VDDPLL, and VDDAF.
2) Applicable for VDDP, VDDEBU, VDDFL3, VDDM, and VDDMF.
3) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
Data Sheet
84
V1.0, 2008-04
TC1796
Electrical Parameters
4.1.4
Operating Conditions
The following operating conditions must not be exceeded in order to ensure correct
operation of the TC1796. All parameters specified in the following table refer to these
operating conditions, unless otherwise noticed.
The following operating conditions must not be exceeded in order to ensure correct
operation of the TC1796. All parameters specified in the following table refer to these
operating conditions, unless otherwise noted.
Table 12
Operating Condition Parameters
Parameter
Symbol
Values
Min.
Digital supply voltage1)
Typ. Max.
Unit Note /
Test Condition
VDD
SR 1.42
–
2)
VDDOSC SR
VDDP
SR 3.13
–
VDDOSC3 SR
VDDEBU SR 2.375 –
1.583) V
–
3.474) V
For Class A pins
(3.3V ± 5%)
3.474) V
For Class B (EBU)
pins
VDDFL3 SR 3.13
VDDSBRAM5) 1.42
–
3.474) V
–
–
3)
1.58
V
–
Voltage on VDDSBRAM
power supply pin to
ensure data retention
VDR
SR 1.0
–
–
V
6)
Digital ground voltage
VSS
TA
SR 0
–
–
V
–
SR –
-40
+125
°C
–
–
–
–
See separate
specification
Page 92, Page 99
SR
Ambient temperature
under bias
Analog supply voltages –
CPU clock
Short circuit current
Absolute sum of short
circuit currents of a pin
group (see Table 13)
Inactive device pin
current
Data Sheet
–
fCPU
ISC
Σ|ISC|
SR –7)
–
1508)
MHz –
SR -5
–
+5
mA
9)
SR –
–
20
mA
See note10)
IID
SR -1
–
1
mA
Voltage on all
power supply pins
VDDx = 0
85
V1.0, 2008-04
TC1796
Electrical Parameters
Table 12
Operating Condition Parameters
Parameter
Symbol
Values
Min.
Typ. Max.
Unit Note /
Test Condition
Absolute sum of short
circuit currents of the
device
Σ|ISC|
SR –
–
100
mA
See note10)
External load
capacitance
CL
SR
–
–
pF
Depending on pin
class. See DC
characteristics
–
1) Digital supply voltages applied to the TC1796 must be static regulated voltages which allow a typical voltage
swing of ±5%.
2) VDDOSC and VSSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them
in future steps and products is kept open.
3) Voltage overshoot up to 1.7 V is permissible at Power-Up and PORST low, provided the pulse duration is less
than 100 µs and the cumulated summary of the pulses does not exceed 1 h.
4) Voltage overshoot to 4 V is permissible at Power-Up and PORST low, provided the pulse duration is less than
100 µs and the cumulated summary of the pulses does not exceed 1 h
5) The VDDSB must be properly connected and supplied with power. If not, the TC1796 will not operate. In case
of a stand-by operation, the core voltage must not float, but must be pulled low, in order to avoid internal crosscurrents.
6) This applies only during power down state. During normal SRAM operation regular VDD has to be applied.
7) The TC1796 uses a static design, so the minimum operation frequency is 0 MHz. Due to test time restriction
no lower frequency boundary is tested, however.
8) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
9) Applicable for digital outputs.
10) See additional document “TC1796 Pin Reliability in Overload“ for overload current definitions.
Table 13
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Group
Pins
1
P4.[7:0]
2
P4.[14:8]
3
P4.15, SLSO[1:0], SCLK0, MTSR0, MRST0, SLSI0
4
WAIT, HOLD, BC[3:0], HLDA, MR/W, BAA, CSCOMB
5
CS[3:0], RD, RD/WR, BREQ, ADV, BFCLKO
6
BFCLKI, D[31:24]
7
D[23:16]
8
D[15:8]
Data Sheet
86
V1.0, 2008-04
TC1796
Electrical Parameters
Table 13
Pin Groups for Overload/Short-Circuit Current Sum Parameter
Group
Pins
9
D[7:0]
10
A[23:16]
11
A[15:8]
12
A[7:0]
13
TSTRES, TDI, TMS, TCK, TRST, TDO, BRKOUT, BRKIN, TESTMODE
14
P10.[3:0], BYPASS, NMI, PORST, HDRST
15
P9.[8:0]
16
FCLP[1:0]A, FCLN[1:0], SOP[1:0]A, SON[1:0]
17
P5.[7:0]
18
P3.[7:0]
19
P3.[15:8]
20
P0.[7:0]
21
P0.[15:8]
22
P2.[15:7]
23
P2.[6:2], P6.9, P6.8, P6.6, P6.11
24
P6.[15:12], P6.10, P6.7, P6.[5:4]
25
P8.[7:0]
26
P1.[15:13], P1.[11:8], P1.5
27
P1.12, P1.[7:6], P1.[4:0]
28
TR[15:8]
29
TR[7:1], TRCLK
30
TR0, P7.[7:0]
Data Sheet
87
V1.0, 2008-04
TC1796
Electrical Parameters
4.2
DC Parameters
4.2.1
Input/Output Pins
Table 14
Input/Output DC-Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Typ. Max.
10
–
Unit Note / Test Condition
General Parameters
Pull-up current1)
|IPUH|
100
µA
CC
VIN < VIHAmin;
class A1/A2/Input pads.
20
–
200
µA
VIN <VIHAmin;
class A3/A4 pads.
5
–
85
µA
VIN < VIHBmin;
class B1/B2 pads.
|IPDL|
Pull-down
current1)
10
–
150
µA
CC
VIN >VILAmax;
class A1/A2/Input pads.
VIN > VILBmax;
class B1/B2 pads
20
–
200
µA
VIN > VILAmax;
class A3/A4 pads.
Pin capacitance
(Digital I/O)
1)
CIO
–
–
10
pF
f = 1 MHzTA = 25 °C
CC
Input only Pads (VDDP = 3.13 to 3.47 V = 3.3 V ± 5%)
–
0.34 ×
V
–
Input high voltage VIHA
0.64 ×
Class A1/A2 pins
SR VDDP
–
VDDP
VDDP+
V
Whatever is lower
Ratio VIL/VIH
CC 0.53
–
–
–
–
Input hysteresis
HYSA
0.1 ×
CC VDDP
–
–
V
5)2)
Input leakage
current
IOZI
–
±3000
±6000
nA
VDDP/2-1 < VIN < VDDP/2+1
Input low voltage
Class A1/A2 pins
Data Sheet
VILA
-0.3
SR
–
0.3 or
max.
3.6
CC
88
Otherwise3)
V1.0, 2008-04
TC1796
Electrical Parameters
Table 14
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Values
Min.
Unit Note / Test Condition
Typ. Max.
Class A Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Output low
voltage4)
VOLA
Output high
voltage3)
VOHA
–
–
0.4
V
CC
IOL = 2 mA for strong
driver mode,
IOL = 1.8 mA for medium
driver mode, A2 pads
IOL = 1.4 mA for medium
driver mode, A1 pads
IOL = 370 µA for weak
driver mode
2.4
–
–
V
CC
IOH = -2 mA for strong
driver mode,
IOH = -1.8 mA for medium
driver mode, A1/A2 pads
IOH = -370 µA for weak
driver mode
VDDP - –
–
-0.3
–
0.34 ×
V
–
Input high voltage VIHA
0.64 ×
Class A1/2 pins
SR VDDP
–
VDDP
VDDP +
V
Whatever is lower
Ratio VIL/VIH
CC 0.53
–
–
–
–
Input hysteresis
HYSA
0.1 ×
CC VDDP
–
–
V
5)2)
Input leakage
current Class
A2/3/4 pins
IOZA24
–
–
±3000
±6000
nA
VDDP/2-1 < VIN < VDDP/2+1
Input leakage
current
Class A1 pins
IOZA1
–
±500
nA
V
0.4
Input low voltage
Class A1/2 pins
Data Sheet
VILA
IOH = -1.4 mA for strong
driver mode,
IOH = -1 mA for medium
driver mode, A1/A2 pads
IOH = -280 µA for weak
driver mode
SR
0.3 or
3.6
–
CC
89
Otherwise3)
0 V < VIN < VDDP
V1.0, 2008-04
TC1796
Electrical Parameters
Table 14
Input/Output DC-Characteristics (cont’d)(Operating Conditions apply)
Parameter
Symbol
Values
Min.
Unit Note / Test Condition
Typ. Max.
Class B Pads (VDDEBU = 2.375 to 3.47 V)
Output low voltage VOLB CC –
0.4
V
VDDEBU –
–
V
IOL = 2 mA
IOL = 2 mA
–
-0.3
0.34 ×
V
–
–
VDDEBU
VDDEBU
V
Whatever is lower
–
–
–
–
Input hysteresis
HYSB
0.1 ×
–
CC VDDEBU
–
V
5)
Input leakage
current
Class B pins
IOZB
±3000
nA
VDDEBU/2-0.6 < VIN <
VDDEBU/2+0.66)
Output high
voltage
VOHB
Input low voltage
VILB
Input high voltage VIHB
Ratio VIL/VIH
–
CC - 0.4
SR
0.64 ×
SR VDDEBU
CC 0.53
–
+0.3 or
3.6
–
CC
Otherwise3)
±6000
Class C Pads (VDDP = 3.13 to 3.47 V = 3.3V ± 5%)
Output low voltage VOL CC 815
Output high
voltage
VOH CC
Output differential VOD CC 150
voltage
Output offset
voltage
VOS CC 1075
Output impedance R0
CC 40
–
mV
Parallel termination
100 Ω ± 1%
–
1545
mV
Parallel termination
100 Ω ± 1%
–
600
mV
Parallel termination
100 Ω ± 1%
–
1325
mV
Parallel termination
100 Ω ± 1%
–
140
Ω
–
–
–
–
–
Class D Pads
See ADC Characteristics
–
1) Not subject to production test, verified by design / characterization.
2) The pads that have spike-filter function in the input path: PORST, HDRST, NMI, do not have hysteresis.
3) Only one of these parameters is tested, the other is verified by design characterization
4) Max. resistance between pin and next power supply pin 25 Ω for strong driver mode
(verified by design characterization).
Data Sheet
90
V1.0, 2008-04
TC1796
Electrical Parameters
5) Function verified by design, value verified by design characterization.
Hysteresis is implemented to avoid metastable states and switching due to internal ground bounce.
It cannot be guaranteed that it suppresses switching due to external system noise.
6) VDDEBU = 2.5 V ± 5%. For VDDEBU = 3.3 ± 5% see class A2 pads.
Data Sheet
91
V1.0, 2008-04
TC1796
Electrical Parameters
4.2.2
Analog to Digital Converters (ADC0/ADC1)
Table 15
ADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Unit
Note /
Test Condition
Typ.
Max.
3.3
3.471)
V
–
2)
Analog supply
voltage
VDDM
VDD
SR 1.42
1.5
1.58
V
Power supply for
ADC digital part,
internal supply
Analog ground
voltage
VSSM
SR -0.1
–
0.1
V
–
Analog reference
voltage17)
VAREFx SR VAGNDx VDDM
VDDM+
V
–
Analog reference
ground17)
VAGNDx SR VSSMx - 0
VAREF - V
–
Analog input
voltage range
VAIN
VAREFx
V
–
Analog reference
voltage range5)17)
VAREFxVDDM/2 –
VAGNDx SR
IDDM
SR –
2.5
VDDM +
0.05
V
–
4
mA
rms
For each module6)
Power-up
calibration time
tPUC
CC –
3840
fADC
–
Internal ADC
clocks
fBC
fANA
CC 2
–
40
MHz fBC = fANA × 4
CC 0.5
–
10
MHz fANA = fBC / 4
Total unadjusted
error5)
TUE7) CC –
–
±1
LSB
8-bit conversion.
–
–
±2
LSB
10-bit conversion
–
–
±4
LSB
12-bit conversion
–
±8
LSB
12-bit conversion
VDDM
supply current
SR 3.13
+1V
0.05V
SR VAGNDx
0.05
1)3)4)
–
–
1V
CLK
–
8)9)
10)9)
DNL error11) 5)
TUEDNL
–
CC
±1.5
±3.0
LSB
12-bit conversion
INL error11)5)
TUEINL
±1.5
±3.0
LSB
12-bit conversion
Data Sheet
–
CC
92
12)9)
12)9)
V1.0, 2008-04
TC1796
Electrical Parameters
Table 15
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Values
Min.
11)5)
Gain error
Offset error11)5)
Input leakage
current at analog
inputs AN0, AN1,
AN4 to AN7,
AN24 to AN31.
see Figure 24
Unit
Note /
Test Condition
12-bit conversion
Typ.
Max.
TUEGAIN
–
CC
±0.5
±3.5
LSB
TUEOFF
–
CC
±1.0
±4.0
LSB
IOZ1
–
300
nA
(0% VDDM) < VIN <
(2% VDDM)
-200
–
400
nA
(2% VDDM) < VIN <
(95% VDDM)
-200
–
1000
nA
(95% VDDM) < VIN <
(98% VDDM)
-200
–
3000
nA
(98% VDDM) < VIN <
(100% VDDM)
–
200
nA
(0% VDDM) < VIN <
(2% VDDM)
-200
–
300
nA
(2% VDDM) < VIN <
(95% VDDM)
-200
–
1000
nA
(95% VDDM) < VIN <
(98% VDDM)
-200
–
3000
nA
(98% VDDM) < VIN <
(100% VDDM)
CC -1000
12)9)
12)9)
13) 14)
Input leakage
current at the
other analog
inputs, that is
AN2, AN3,
AN8 to AN23,
AN32 to AN43
see Figure 24
IOZ1
CC -1000
12-bit conversion
14)
Input leakage
current at VAREF
IOZ2
CC –
–
±1
µA
0 V < VAREF <
VDDM, no
conversion
running
Input current at
IAREF
CC –
35
75
µA
rms
0 V < VAREF <
VAREF0/1
17)
VDDM15)
–
25
pF
9)
Switched
CAREFSW
–
capacitance at the
CC
positive reference
voltage input17)
15
20
pF
9)18)
Data Sheet
93
Total capacitance
of the voltage
reference
inputs16)17)
CAREFTOT
–
CC
V1.0, 2008-04
TC1796
Electrical Parameters
Table 15
ADC Characteristics (cont’d) (Operating Conditions apply)
Parameter
Symbol
Values
Unit
Note /
Test Condition
Min.
Typ.
Max.
–
1
1.5
kΩ
500 Ohm
increased for
AN[1:0] used as
reference input9)
–
–
25
pF
6)9)
Switched
CAINSW
–
capacitance at the
CC
analog voltage
inputs
–
7
pF
9)19)
1
1.5
kΩ
9)
300
1000
Ω
Test feature
available only for
AIN79)
15 rms
30 peak mA
Resistance of the
reference voltage
input path16)
RAREF
Total capacitance
of the analog
inputs16)
CAINTOT
ON resistance of
the transmission
gates in the
analog voltage
path
RAIN
CC
CC
CC –
ON resistance for RAIN7T CC 200
the ADC test (pulldown for AIN7)
Current through
resistance for the
ADC test (pulldown for AIN7)
IAIN7T
CC –
Test feature
available only for
AIN79)
1) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
2) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
3) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoot).
the
reference
voltage
VAREF
increases
or
the
VDDM
decreases,
so
that
VAREF = (VDDM + 0.05V to VDDM + 0.07V), then the accuracy of the ADC decreases by 4LSB12.
5) If a reduced reference voltage in a range of VDDM/2 to VDDM is used, then the ADC converter errors increase.
4) If
If the reference voltage is reduced with the factor k (k<1), then TUE, DNL, INL Gain and Offset errors increase
with the factor 1/k.
If a reduced reference voltage in a range of 1 V to VDDM/2 is used, then there are additional decrease in the
ADC speed and accuracy.
6) Current peaks of up to 6 mA with a duration of max. 2 ns may occur
7) TUE is tested at VAREF = 3.3 V, VAGND = 0 V and VDDM = 3.3 V
Data Sheet
94
V1.0, 2008-04
TC1796
Electrical Parameters
8) ADC module capability.
9) Not subject to production test, verified by design / characterization.
10) Value under typical application conditions due to integration (switching noise, etc.).
11) The sum of DNL/INL/Gain/Offset errors does not exceed the related TUE total unadjusted error.
12) For 10-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with factor 0.25.
For 8-bit conversions the DNL/INL/Gain/Offset error values must be multiplied with 0.0625.
13) The leakage current definition is a continuous function, as shown in Figure 24. The numerical values defined
determine the characteristic points of the given continuous linear approximation - they do not define step
function.
14) Only one of these parameters is tested, the other is verified by design characterization.
15) IAREF_MAX is valid for the minimum specified conversion time. The current flowing during an ADC conversion
with a duration of up to tC = 25µs can be calculated with the formula IAREF_MAX = QCONV/tC. Every conversion
needs a total charge of QCONV = 150pC from VAREF.
All ADC conversions with a duration longer than tC = 25µs consume an IAREF_MAX = 6µA.
16) For the definition of the parameters see also Figure 23.
17) Applies to AIN0 and AIN1, when used as auxiliary reference inputs.
18) This represents an equivalent switched capacitance. This capacitance is not switched to the reference voltage
at once. Instead of this smaller capacitances are successively switched to the reference voltage.
19) The sampling capacity of the conversion C-Network is pre-charged to VAREF/2 before the sampling moment.
Because of the parasitic elements the voltage measured at AINx is lower then VAREF/2, typically 0.85V.
Data Sheet
95
V1.0, 2008-04
TC1796
Electrical Parameters
Table 16
Sample and Conversion Time (Operating Conditions apply)
Parameter
Symbol
Values
Min.
tS
Sample
time
Unit Note
Typ.
Max.
4 × (CHCONn.STC + 2) × tBC
CC
8 × tBC –
Conversion tC
time
–
tS + 40 × tBC + 2 × tDIV
tS + 48 × tBC + 2 × tDIV
tS + 56 × tBC + 2 × tDIV
CC
µs
–
µs
–
µs
8-bit conversion
µs
10-bit conversion
µs
12-bit conversion
A/D Converter Module
fCLC
Fractional
Divider
fDIV
Programmable fBC
Clock Divider
(1:1) to (1:256)
CON.CTC
Arbiter
(1:20)
fTIMER
Control Unit
(Timer)
1:4
Sample
f ANA Programmable Time tS
Counter
CHCONn.STC
Control/Status Logic
Interrupt Logic
External Trigger Logic
External Multiplexer Logic
Request Generation Logic
MCA04657_mod
Figure 22
Data Sheet
ADC0/ADC1 Clock Circuit
96
V1.0, 2008-04
TC1796
Electrical Parameters
REXT
VAIN =
Analog Input Circuitry
RAIN, On
ANx
CEXT
CAINTOT - CAINSW
VAGNDx
CAINSW
RAIN7T
Reference Voltage Input Circuitry
RAREF, On
VAREFx
VAREF
CAREFTOT - CAREFSW
CAREFSW
VAGNDx
Analog_InpRefDiag
Figure 23
Data Sheet
ADC0/ADC1 Input Circuits
97
V1.0, 2008-04
TC1796
Electrical Parameters
IO Z1
3uA
AN0, AN1,
AN4 - AN7,
AN24 - AN31
1uA
400nA
300nA
-200nA
VIN[VDDM %]
95% 98% 100%
2%
-1uA
IOZ1
3uA
Others
1uA
300nA
200nA
-200nA
V IN[VDDM%]
2%
95% 98% 100%
-1uA
ADC Leakage 7.vsd
Figure 24
Data Sheet
ADC0/ADC1Analog Inputs Leakage
98
V1.0, 2008-04
TC1796
Electrical Parameters
4.2.3
Fast Analog to Digital Converter (FADC)
Table 17
FADC Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
DNL error
INL error
Gradient error1)10)
Unit
Note /
Test Condition
Typ. Max.
EDNL CC –
EINL CC –
EGRAD
–
–
±1
LSB
10)
–
±4
LSB
10)
–
±3
%
With calibration,
gain 1, 22)
EGRAD
–
–
±5
%
Without calibration
gain 1, 2, 4
–
–
±6
%
Without calibration
gain 8
–
–
±204)
mV
With calibration2)
CC –
–
±604)
mV
Without calibration
–
–
±60
mV
–
CC
EGRAD
Offset error10)
EOFF3)
CC
CC
Reference error of
internal VFAREF/2
EREF
Analog supply
voltages
VDDMF SR 3.13
VDDAF SR 1.42
VSSAF
-0.1
–
3.475)
V
–
–
1.586)
V
–
–
0.1
V
–
Analog reference
voltage
VFAREF
–
3.475)7) V
Nominal 3.3 V
Analog reference
ground
VFAGND
VSSAF - –
VSSAF
V
–
VFAGND –
VDDMF
V
–
–
9
mA
–
–
17
mA
8)
–
150
µA
rms
Independent of
conversion
–
±500
nA
0 V < VIN < VDDMF
–
±8
µA
0 V < VIN < VDDMF
Analog ground
voltage
CC
SR
Analog input voltage VAINF
range
3.13
SR
SR 0.05V
SR
IDDMF SR –
IDDAF SR –
Input current at each IFAREF
–
VFAREF
CC
Input leakage current IFOZ2
–
at VFAREF 9)
CC
Input leakage current IFOZ3
–
at VFAGND
CC
Analog supply
currents
Data Sheet
99
+0.05V
V1.0, 2008-04
TC1796
Electrical Parameters
Table 17
FADC Characteristics (Operating Conditions apply) (cont’d)
Parameter
Symbol
Values
Min.
Conversion time
tC
CC –
Unit
Typ. Max.
–
21
Note /
Test Condition
CLK of 10-bit conversion
fADC
fADC CC –
RFAIN
100
–
75
MHz
–
–
200
kΩ
10)
Channel Amplifier
Cutoff Frequency
fCOFF
2
–
–
MHz
–
Settling Time of a
Channel Amplifier
after changing ENN
or ENP
tSET
CC –
–
5
µsec
–
Converter Clock
Input resistance of
the analog voltage
path (Rn, Rp)
CC
CC
1) Calibration of the gain is possible for the gain of 1 and 2, and not possible for the gain of 4 and 8.
2) Calibration should be performed at each power-up. In case of continuous operation, calibration should be
performed minimum once per week.
3) The offset error voltage drifts over the whole temperature range maximum ±3 LSB.
4) Applies when the gain of the channel equals one. For the other gain settings, the offset error increases; it must
be multiplied with the applied gain.
5) Voltage overshoot to 4 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
summary of the pulses does not exceed 1 h.
6) Voltage overshoot to 1.7 V are permissible, provided the pulse duration is less than 100 µs and the cumulated
sum of the pulses does not exceed 1 h.
7) A running conversion may become inexact in case of violating the normal operating conditions (voltage
overshoots).
8) Current peaks of up to 40 mA with a duration of max. 2 ns may occur
9) This value applies in power-down mode.
10) Not subject to production test, verified by design / characterization.
The calibration procedure should run after each power-up, when all power supply
voltages and the reference voltage have stabilized. The offset calibration must run first,
followed by the gain calibration.
Data Sheet
100
V1.0, 2008-04
TC1796
Electrical Parameters
FADC Analog Input Stage
FAINxN
-
=
VFAGN D
RN
VFAR EF/2
+
+
FAINxP
RP
-
FADC Reference Voltage
Input Circuitry
VFAR EF
IFAR EF
VFAR EF
VFAGN D
FAD C _ In p R e fD ia g
Figure 25
Data Sheet
FADC Input Circuits
101
V1.0, 2008-04
TC1796
Electrical Parameters
4.2.4
Table 18
Oscillator Pins
Oscillator Pins Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Frequency Range
Input low voltage at
XTAL11)
Input high voltage at
XTAL11)
Input current at
XTAL1
fOSC CC 4
VILX SR -0.2
Typ. Max.
Unit Note /
Test Condition
–
25
MHz –
–
0.3 ×
VIHX SR 0.7 ×
–
VDDOSC3
IIX1 CC –
–
V
–
VDDOSC3
VDDOSC3 V
–
±25
0 V < VIN < VDDOSC3
+ 0.2
µA
1) If the XTAL1 pin is driven by a crystal, reaching a minimum amplitude (peak-to-peak) of 0.3 × VDDOSC3 is
necessary.
Note: It is strongly recommended to measure the oscillation allowance (negative
resistance) in the final target system (layout) to determine the optimal parameters
for the oscillator operation. Please refer to the limits specified by the crystal
supplier.
Data Sheet
102
V1.0, 2008-04
TC1796
Electrical Parameters
4.2.5
Table 19
Temperature Sensor
Temperature Sensor Characteristics (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Cond
ition
150
°C
–
Temperature
Sensor Range
TSR
SR -40
Start-up time after
resets inactive
tTSST
SR –
–
10
µs
–
TTSA
A/D Converter clock fANA
CC –
–
±10
°C
–
SR –
–
10
MHz conversion
with ADC1
Sensor Inaccuracy
for DTS signal
Table 20
Temperature Sensor Characteristics (Operating Conditions apply)
Parameter
Symbol Typical Value
Unit Note
Temperature of
the die at the
sensor location
TTS CC TTS× = (ADC_Code - 487) 0.396 - 40
°C
10-bit ADC
result
TTS× = (ADC_Code - 1948) 0.099 - 40
°C
12-Bit ADC
result
Data Sheet
103
V1.0, 2008-04
TC1796
Electrical Parameters
4.2.6
Power Supply Current
???
Table 21
Power Supply Currents (Operating Conditions apply)
Parameter
Min. Typ. Max.
Unit Note /
Test Condition
–
–
300
mA
The PLL running at
the base frequency
PORST low current at IDDP_PORST
–
VDDP, and PORST high
CC
current without any port
activity
–
25
mA
The PLL running at
the base frequency
–
700
mA
fCPU=150MHzfCPU/f
PORST low current at
VDD
Symbol
IDD_PORST
Active mode core
supply current1)2)
IDD
Active mode analog
supply current
IDDAx;
IDDMx
ISBSB
Stand-by RAM supply
current in stand-by
Oscillator and PLL core IDDOSC3)
power supply
Oscillator and PLL pads IDDOSC3
power supply
LVDS port supply
(via VDDP)4)
ILVDS
Flash power supply
current
IDDFL3
Maximum Allowed
Power Dissipation5)
PD
Values
CC
10
CC
SYS
= 2:1
–
–
–
mA
See ADC0/1
FADC
–
–
9
mA
VDDSB = 1V,
Tj = 150oC
–
–
5
mA
–
–
–
3.6
mA
–
–
–
50
mA
LVDS pads active
–
–
80
mA
–
–
–
PD ×
RTJA
–
worst case
TA = 125oC
CC
CC
CC
CC
CC
CC
SR
<
25oC
1) Infineon Power Loop: CPU and PCP running, all peripherals active. The power consumption of each custom
application will most probably be lower than this value, but must be evaluated separately.
2) The IDD decreases for typically 120 mA if the fCPU is decreased for 50 MHz, at constant TJ = 150C, for the
Infineon Max Power Loop.
The dependency in this range is, at constant junction temperature, linear.
3) VDDOSC and VSSOSC are not bonded externally in the BC and BD steps of TC1796. An option for bonding them
in future steps and products is kept open.
4) In case the LVDS pads are disabled, the power consumption pro pair is negligible (less than 1µA).
5) For the calculation of junction to ambient thermal resistance RTJA, see Page 130.
Data Sheet
104
V1.0, 2008-04
TC1796
Electrical Parameters
4.3
AC Parameters
All AC parameters are defined with the temperature compensation disabled. That
means, keeping the pads constantly at maximum strength.
4.3.1
Testing Waveforms
VDDP
VDDEBU
90%
90%
10%
10%
VSS
tR
tF
rise_fall
Figure 26
Rise/Fall Time Parameters
VDDP
VDDEBU
VDDE / 2
Test Points
VDDE / 2
VSS
mct04881_a.vsd
Figure 27
Testing Waveform, Output Delay
VLoad+ 0.1 V
VLoad- 0.1 V
Timing
Reference
Points
VOH - 0.1 V
VOL - 0.1 V
MCT04880_new
Figure 28
Data Sheet
Testing Waveform, Output High Impedance
105
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.2
Table 22
Output Rise/Fall Times
Output Rise/Fall Times (Operating Conditions apply)
Parameter
Symbol
Values
Unit Note / Test Condition
Min. Typ. Max.
Class A1 Pads
Rise/fall
times 1)
tRA1, tFA1 –
–
50
ns
140
18000
150
550
65000
Regular (medium) driver, 50 pF
Regular (medium) driver, 150 pF
Regular (medium) driver, 20 nF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
–
3.3
ns
6
5.5
16
50
140
18000
150
550
65000
Strong driver, sharp edge, 50 pF
Strong driver, sharp edge, 100pF
Strong driver, medium edge, 50 pF
Strong driver, soft edge, 50 pF
Medium driver, 50 pF
Medium driver, 150 pF
Medium driver, 20 000 pF
Weak driver, 20 pF
Weak driver, 150 pF
Weak driver, 20 000 pF
–
2.5
ns
50 pF
tRA3, tFA3 –
–
2.0
ns
25 pF
tRB, tFB
–
–
3.0
4.0
7.0
ns
35 pF
50 pF
100 pF
tRC, tFC
–
–
2
ns
–
Class A2 Pads
Rise/fall
times 1)
tRA2, tFA2 –
Class A3 Pads
Rise/fall
times 1)
tRA3, tFA3 –
Class A4 Pads
Rise/fall
times 1)
Class B Pads
Rise/fall
times 1)2)
Class C Pads
Rise/fall
times
1) Not all parameters are subject to production test, but verified by design/characterization and test correlation.
Data Sheet
106
V1.0, 2008-04
TC1796
Electrical Parameters
2) Parameter test correlation for VDDEBU = 2.5 V ± 5%
4.3.3
Power Sequencing
There is a restriction for the power sequencing of the 3.3 V domain including VDDEBU as
shown in Figure 29: it must always be higher than 1.5 V domain - 0.5 V. The grey area
shows the valid range for V3.3V and VDDEBU relative to an exemplary 1.5 V ramp.
VDDP, VDDOSC3, VDDFL3, VDDM, VDDMF belong to the 3.3 V power supply domain, that is
referenced in Figure 29 as V3.3. The VDDM and VDDMF sub domains are connected with
anti parallel ESD protection diodes in TC1796 design steps BC and BD. The VDDM,
VDDMF, VDDP, VDDOSC3 sub domains are connected with anti parallel ESD protection
diodes in TC1796 design step BE.
VDD, VDDOSC and VDDAF belong to the 1.5 V power supply domain, referenced as V1.5.
VDDEBU belongs to its own 2.5V to 3.3V domain.
Val
V DDEB
id a
and
rea
V 3.3
for
V
fo r
3.3
rea
and
V
id a
1.5V
V3.3, VDDEBU
V1.5
Va l
DD
EB
U
3.3V
U
V3.3, VDDEBU > V1.5 - 0.5V
Time
VDDP
(3.3V)
PORST
Time
PowerSeq 2
Figure 29
VDDP / VDDEBU / VDD Power Up Sequence
All ground pins VSS must be externally connected to one single star point in the system.
The difference voltage between the ground pins must not exceed 200 mV.
The PORST signal must be activated at latest before any power supply voltage falls
below the levels shown on the figure below. In this case, only the memory row of a Flash
memory that was a target of a write at the moment of the power loss will contain
unreliable content. Additionally, the PORST signal should be activated as soon as
possible. The sooner the PORST signal is activated, the less time the system operates
outside of the normal operating power supply range.
Data Sheet
107
V1.0, 2008-04
TC1796
Electrical Parameters
VDDP, VDDEBU,
VDDFL3
Power Supply Voltage
3.3V
3.13V
VDDPmin
VDDP
-5%
-12%
2.9V
VPORST3.3
t
PORST
t
1.5V
VDD
1.42V
VDDmin
VDD
1.32V
VPORST1.5min
-5%
-12%
t
PORST
t
PowerDown3.3_1.5_reset_only.vsd
Figure 30
Data Sheet
Power Down / Power Loss Sequence
108
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.4
Table 23
Power, Pad and Reset Timing
Power, Pad and Reset Timing Parameters
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Con
dition
Min. VDDP voltage to ensure
defined pad states1)
VDDPPA CC 0.6
–
–
V
–
Oscillator start-up time2)
tOSCS
tPOA
CC –
–
10
ms
–
SR 10
–
–
ms
–
HDRST pulse width
tHD
CC 1024
–
clock
cycles3)6)
–
fSYS
–
PORST rise time
tPOR
tPOS
SR –
–
50
ms
–
SR 0
–
–
ns
–
Hold time from PORST rising
edge4)
tPOH
SR 100
–
–
ns
–
Setup time to HDRST rising
edge5)
tHDS
SR 0
–
–
ns
–
Hold time from HDRST rising
edge5)
tHDH
SR 100 +
(2 × 1/
fSYS)6)
–
–
ns
–
Ports inactive after PORST
reset active7)8)
tPIP
CC –
–
150
ns
–
Ports inactive after HDRST
reset active
tPI
CC –
–
150 + ns
5 × 1/
–
Minimum PORST active time
after power supplies are stable
at operating levels
Setup time to PORST rising
edge4)
fSYS
Minimum VDDP PORST
activation threshold9)
VPORST3.3
–
–
2.9
V
–
Minimum VDD PORST
activation threshold9)
VPORST1.5
–
–
1.32
V
–
Power on Reset Boot Time9)
tBP
tB
CC –
–
2
ms
–
CC 150
–
350
µs
–
Hardware/Software Reset
Boot Time at fCPU=150MHz10)
Data Sheet
SR
SR
109
V1.0, 2008-04
TC1796
Electrical Parameters
1) This parameter is valid under assumption that PORST signal is constantly at low level during the powerup/power-down of the VDDP.
2) tOSCS is defined from the moment when VDDOSC3 = 3.13V until the oscillations reach an amplitude at XTAL1 of
0,3*VDDOSC3. This parameter is verified by device characterization. The external oscillator circuitry must be
optimized by the customer and checked for negative resistance as recommended and specified by crystal
suppliers.
3) Any HDRST activation is internally prolonged to 1024 FPI bus clock (fSYS) cycles.
4) Applicable for input pins TESTMODE, TRST, BRKIN, and TXD1A with noise suppression filter of PORST
switched-on (BYPASS = 0).
5) The setup/hold values are applicable for Port 0 and Port 10 input pins with noise suppression filter of HDRST
switched-on (BYPASS = 0), independently whether HDRST is used as input or output.
6) fSYS = fCPU/2
7) Not subject to production test, verified by design / characterization.
8) This parameter includes the delay of the analog spike filter in the PORST pad.
9) The duration of the boot-time is defined between the rising edge of the PORST and the moment when the first
user instruction has entered the CPU and its processing starts.
10) The duration of the boot time is defined between the following events:
1. Hardware reset: the falling edge of a short HDRST pulse and the moment when the first user instruction
has entered the CPU and its processing starts, if the HDRST pulse is shorter than 1024 × TSYS.
If the HDRST pulse is longer than 1024 × TSYS, only the time beyond the 1024 × TSYS should be added to the
boot time (HDRST falling edge to first user instruction).
2. Software reset: the moment of starting the software reset and the moment when the first user instruction
has entered the CPU and its processing starts
Data Sheet
110
V1.0, 2008-04
TC1796
Electrical Parameters
V DDPPA
VDDPPA
VDDP
VDD
V DDPR
toscs
OSC
tPOA
tPOA
PORST
thd
thd
HDRST
1)
2)
Pads
Padstate
undefined
2)
tpi
1) as programmed
1)
2)
Padstate
undefined
2) Tri-state, pull device active
re se t_ b e h 1
Figure 31
Data Sheet
Power, Pad and Reset Timing
111
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.5
Phase Locked Loop (PLL)
Note: All PLL characteristics defined on this and the next page are verified by design
characterization.
Table 24
PLL Parameters (Operating Conditions apply)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Con
dition
Accumulated jitter
DP
See
–
Figure 3
2
–
–
VCO frequency range
fVCO
400
–
500
MHz –
600
–
700
MHz –
500
–
600
MHz –
140
–
320
MHz –
150
–
400
MHz –
200
–
480
MHz –
–
–
200
µs
PLL base frequency1)
PLL lock-in time
fPLLBASE
tL
–
–
1) The CPU base frequency which is selected after reset is calculated by dividing the limit values by 16 (this is
the K factor after reset).
Phase Locked Loop Operation
When PLL operation is enabled and configured, the PLL clock fVCO (and with it the CPU
clock fCPU) is constantly adjusted to the selected frequency. The relation between fVCO
and fSYS is defined by: fVCO = K × fCPU. The PLL causes a jitter of fCPU and affects the
clock outputs BFCLKO, TRCLK, and SYSCLK (P1.12) which are derived from the PLL
clock fVCO.
There will be defined two formulas that define the (absolute) approximate maximum
value of jitter DP in ns dependent on the K-factor, the CPU clock frequency fCPU in MHz,
and the number P of consecutive fCPU clock periods.
Data Sheet
7000 × P
P × K < 385
- + 0, 535
D p [ ns ] = -----------------------------------------2
f cpu [ MHz ] × K
P × K ≥ 385
D p [ ns ] = -------------------------------------------- + 0, 535
2
f cpu [ MHz ] × K 2
2700000
112
(1)
(2)
V1.0, 2008-04
TC1796
Electrical Parameters
Note: The frequency of system clock fSYS can be selected to be either fCPU or fCPU/2.
With rising number P of clock cycles the maximum jitter increases linearly up to a value
of P that is defined by the K-factor of the PLL. Beyond this value of P the maximum
accumulated jitter remains at a constant value. Further, a lower CPU clock frequency
fCPU results in a higher absolute maximum jitter value.
Figure 32 gives the jitter curves for several K/fCPU combinations.
±20.0
DP ns
fCPU = 50 MHz (K = 8)
fCPU = 100 MHz (K = 4)
±16.0
fCPU = 120 MHz (K = 4)
±12.0
fCPU = 150 MHz (K = 4)
±8.0
±4.0
fCPU = 100 MHz (K = 7)
±0.0
fCPU = 50 MHz (K = 14)
0
20
40
60
DP = Max. jitter
P = Number of consecutive fCPU periods
K = K-divider of PLL
Figure 32
Data Sheet
80
100
120
oo
P
TC1976_PLL_JITT
Approximated Maximum Accumulated PLL Jitter for Typical CPU
Clock Frequencies fCPU (overview)
113
V1.0, 2008-04
TC1796
Electrical Parameters
DP
±4.0
ns
±3.5
fCPU = 50 MHz (K = 14)
fCPU = 50 MHz (K = 8)
±3.0
fCPU = 100 MHz (K = 4)
±2.5
fCPU = 100 MHz (K = 7)
±2.0
±1.5
fCPU = 150 MHz (K = 4)
±1.0
±0.5
±0.0
0
2
4
6
8
10
DP = Max. jitter
P = Number of consecutive fCPU periods
K = K-divider of PLL
Figure 33
12
14
16
18
20
P
TC1976_PLL_DETAIL
Approximated Maximum Accumulated PLL Jitter for Typical CPU
Clock Frequencies fCPU (detail)
Note: The specified PLL jitter values are valid if the capacitive load at the External Bus
Unit (EBU) is limited to CL=20pF.
Note: The maximum peak-to-peak noise on the Core Supply Voltage (measured
between VDD at pin E23 and VSS at pin D23, or adjacent supply pairs) is limited to
a peak-to-peak voltage of VPP = 30mV. This condition can be achieved by
appropriate blocking of the Core Supply Voltage as near as possible to the supply
pins and using PCB supply and ground planes.=20pF.
Data Sheet
114
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.6
BFCLKO Output Clock Timing
VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%;
TA = -40 °C to +125 °C; CL = 35 pF
BFCLK0 Output Clock Timing Parameters1)
Table 25
Parameter
Symbol
Values
Max.
Unit Note /
Test Con
dition
13.332) –
–
ns
–
3
–
–
ns
–
3
–
–
ns
–
–
–
3
ns
–
–
–
3
ns
–
45
50
55
%
divider of
2, 4, ...4)
Min.
BFCLKO clock period
BFCLKO high time
BFCLKO low time
BFCLKO rise time
BFCLKO fall time
BFCLKO duty cycle t5/(t5 + t6)3)
tBFCLKO CC
t5
CC
t6
CC
t7
CC
t8
CC
DC24 CC
Typ.
BFCLKO duty cycle t5/(t5 + t6)3) DC3
CC 30
33.33 36
%
divider of
3 4)
BFCLKO high time reduction5) dt5
CC –
–
ns
CL = 20pF
1.1
1) Not subject to production test, verified by design/characterization.
2) The PLL jitter characteristics add to this value according to the application settings. See the PLL jitter
parameters.
3) The PLL jitter is not included in this parameter. If the BFCLKO frequency is equal to fCPU, the K-divider setting
determines the duty cycle.
4) The division ratio between LMB and BFCLKO frequency is set by EBU_BFCON.EXTCLOCK.
5) Due to asymmetry of the delays and slopes of the rising and falling edge of the pad. The influence of the PLL
jitter is included in this parameter. This parameter should be applied taking the typical value of the duty cycle
in the account, not the minimum or maximum value.
tBFCLKO
BFCLKO
0.5 VDDP05
t5
t6
t8
t7
0.9 VDD
0.1 VDD
MCT04883_mod
Figure 34
Data Sheet
BFCLKO Output Clock Timing
115
V1.0, 2008-04
TC1796
Electrical Parameters
BFCLK Timing and PLL Jitter
The BFCLK timing is important for calculating the timing of an external flash memory. In
principle BFCLK timing can be derived from the PLL jitter formulas. In case of only EBU
synchronous read access to the flash device the worst case jitter is partially lower.
For one BFCLK with a cycle time of 13,33 ns the maximum jitter is
tJPP = |+/-620 ps|
For two BFCLKs with an accumulated cycle time of 26,66 ns the maximum jitter is
tJPACC = |+/- 660 ps|
Data Sheet
116
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.7
Debug Trace Timing
VSS = 0 V; VDDP = 3.13 to 3.47 V (Class A); TA = -40 °C to +125 °C;
CL (TRCLK) = 25 pF; CL (TR[15:0]) = 50 pF;
Table 26
Debug Trace Timing Parameter1)
Parameter
Symbol
Values
Min.
TR[15:0] new state from
TRCLK rising edge
t9
CC -1
Typ.
Max.
Unit Note /
Test Con
dition
–
4
ns
–
1) Not subject to production test, verified by design/characterization.
TRCLK
t9
TR[15:0]
Old State
New State
Trace_Tmg
Figure 35
Data Sheet
Debug Trace Timing
117
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.8
JTAG Interface Timing
Operating Conditions apply, CL = 50 pF
Table 27
TCK Clock Timing Parameter
Parameter
Symbol
Values
Typ.
Max.
Unit Note /
Test Con
dition
SR 25
–
–
ns
–
SR 10
–
–
ns
–
SR 10
–
–
ns
–
SR –
–
4
ns
–
SR –
–
4
ns
–
Min.
TCK clock period1)
tTCK
t1
t2
t3
t4
TCK high time
TCK low time
TCK clock rise time
TCK clock fall time
1) fTCK should be lower or equal to fSYS.
tTCK
TCK
0.5 VDDP
t1
t2
t4
t3
0.9 VDD
0.1 VDD
JTAG_TCK
Figure 36
Data Sheet
TCK Clock Timing
118
V1.0, 2008-04
TC1796
Electrical Parameters
Table 28
JTAG Timing Parameters1)
Parameter
Symbol
Values
Min.
TMS setup to TCK rising edge
TMS hold to TCK rising edge
TDI setup to TCK rising edge
TDI hold to TCK rising edge
TDO valid output from TCK
falling edge2)
TDO high impedance to valid
output from TCK falling edge2)
TDO valid output to high
impedance from TCK falling
edge2)
Typ.
Max.
Unit
Note /
Test Con
dition
t1
t2
t1
t2
t3
t3
t4
SR 6.0
–
–
ns
–
SR 6.0
–
–
ns
–
SR 6.0
–
–
ns
–
SR 6.0
–
–
ns
–
CC –
–
13
ns
CL = 50 pF
CC 3.0
–
–
ns
CL = 20 pF
CC –
–
14
ns
CL = 50 pF
t5
CC –
–
13.5
ns
CL = 50 pF
1) fTCK should be lower or equal to fSYS.
2) The falling edge on TCK is used to capture the TDO timing.
TCK
t1
t2
t1
t2
TMS
TDI
t4
t3
t5
TDO
Jtag
Figure 37
JTAG Timing
Note: The JTAG module is fully compliant with IEEE1149.1-2000 with JTAG clock at
20 MHz. The JTAG clock at 40MHz is possible with the modified timing diagram
shown in Figure 37.
Data Sheet
119
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.9
EBU Demultiplexed Timing
VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
TA = -40 °C to +125 °C; CL = 35 pF;
Table 29
EBU Demultiplexed Timing Parameters1)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Con
dition
Output delay from BFCLKO
rising edge2)
t10
CC 0
–
5
ns
–
RD active/inactive after
BFCLKO rising edge2)
t12
CC 0
–
3
ns
–
Data setup to BFCLKO rising
edge2)
t13
SR 8.5
–
–
ns
–
Data hold from BFCLKO rising t14
edge2)
SR 0
–
–
ns
–
WAIT setup (low or high) to
BFCLKO rising edge2)
t15
SR 3
–
–
ns
–
WAIT hold (low or high) from
BFCLKO rising edge2)
t16
SR 2
–
–
ns
–
Data hold after RD/WR rising
edge
t17
SR 0
–
–
ns
–
1) Not subject to production test, verified by design/characterization.
2) Valid for BFCON.EXTCLOCK = 00B.
Data Sheet
120
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.9.1
Demultiplexed Read Timing
Address
Phase
Command Del.
Phase (opt.)
Command
Phase
Recovery New Addr.
Phase (opt.)
Phase
BFCLKO
t10
t10
A[23:0]
Valid Address
t10
t10
Inval. Address
t10
Next
Addr.
t10
ADV
t10
t10
t10
CS[3:0]
CSCOMB
t12
t12
RD
RD/WR
MR/W
t13
D[31:0]
t14
Valid Data
t10
t10
t10
BC[3:0]
t15
t16
WAIT
DemuxRD_1.vsd
Figure 38
Data Sheet
EBU Demultiplexed Read Timing
121
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.9.2
Demultiplexed Write Timing
Address
Phase
Command Del.
Phase (opt.)
Command
Phase
Data Hold
Phase
Recovery New Addr.
Phase (opt.)
Phase
BFCLKO
t10
t10
A[23:0]
Valid Address
t10
t10
Inval. Address
t10
Next
Addr.
t10
ADV
t10
t10
t10
CS[3:0]
CSCOMB
RD
t10
t10
RD/WR
t17
t10
t10
MR/W
t10
t10
Data Out
D[31:0]
t10
t10
t10
t10
BC[3:0]
t15
t16
WAIT
DemuxWR_1.vsd
Figure 39
Data Sheet
EBU Demultiplexed Write Timing
122
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.10
EBU Burst Mode Read Timing
VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
TA = -40 °C to +125 °C; CL = 35 pF;
Table 30
EBU Burst Mode Read Timing Parameters1)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit
Note /
Test Con
dition
Output delay from BFCLKO
rising edge
t10
CC 0
–
5
ns
–
RD active/inactive after
BFCLKO rising edge
t12
CC 0
–
5
ns
–
CSx output delay from
BFCLKO rising edge
t21
CC 0
–
4
ns
–
ADV/BAA active/inactive after t22
BFCLKO rising edge2)
CC 0
–
4
ns
–
Data setup to BFCLKI rising
edge
t23
SR 3
–
–
ns
–
Data hold from BFCLKI rising
edge
t24
SR 0
–
–
ns
–
WAIT setup (low or high) to
BFCLKI rising edge
t25
SR 3
–
–
ns
–
WAIT hold (low or high) from
BFCLKI rising edge
t26
SR 2
–
–
ns
–
1) Not subject to production test, verified by design/characterization.
2) This parameter is valid for BFCON.EBSE0 = 1 (or BFCON.EBSE1 = 1). Note that t22 is increased by:
1/2 of the LMB bus clock period TCPU = 1/fCPU when BFCON.EBSE0 = 0 (or BFCON.EBSE1 = 0).
Data Sheet
123
V1.0, 2008-04
TC1796
Electrical Parameters
Address
Phase(s)
BFCLKI
BFCLKO
Command
Phase(s)
Burst
Phase(s)
Burst
Phase(s)
Recovery
Phase(s)
Next Addr.
Phase(s)
1)
t10
t10
A[23:0]
Next
Addr.
Burst Start Address
t22
t22
t22
ADV
t10
t10
t10
CS[3:0]
CSCOMB
t12
t12
RD
t22
t22
BAA
t23
t24
t23
t24
D[31:0]
(32-Bit)
Data (Addr+0)
Data (Addr+4)
D[15:0]
(16-Bit)
Data (Addr+0)
Data (Addr+2)
t25
t26
WAIT
1)
Figure 40
Data Sheet
Output delays are always referenced to BCLKO. The reference clock for input
characteristics depends on bit EBU_BFCON.FDBKEN.
EBU_BFCON.FDBKEN = 0:BFCLKO is the input reference clock.
EBU_BFCON.FDBKEN = 1:BFCLKI is the input reference clock (EBU clock
feedback enabled).
BurstRD_4.vsd
EBU Burst Mode Read Timing
124
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.11
EBU Arbitration Signal Timing
VSS = 0 V;VDD = 1.5 V ± 5%; VDDEBU = 2.5 V ± 5% and 3.3 V ± 5%, Class B pins;
TA = -40°C to +125 °C; CL = 35 pF;
Table 31
EBU Arbitration Signal Timing Parameters1)
Parameter
Symbol
Values
Min.
Typ.
Max.
Unit Note /
Test Con
dition
Output delay from CLKOUT
rising edge
t27
CC –
–
3
ns
–
Data setup to CLKOUT
falling edge
t28
SR 8
–
–
ns
–
Data hold from CLKOUT
falling edge
t29
SR 2
–
–
ns
–
1) Not subject to production test, verified by design/characterization.
BFCLKO
t27
t27
HLDA Output
t27
t27
BREQ Output
BFCLKO
t28
t28
t29
t29
HOLD Input
HLDA Input
Figure 41
Data Sheet
EBUArb_1
EBU Arbitration Signal Timing
125
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.12
Peripheral Timings
Note: Peripheral timing parameters are not subject to production test. They are verified
by design/characterization.
4.3.12.1 Micro Link Interface (MLI) Timing
Table 32
MLI Timing Parameters (Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
TCLK clock period1)2)
Typ.
Max.
Unit
Note /
Test Con
dition
t30
t31
t35
CC 23)
–
–
1 / fSYS
–
SR 1
–
–
1 / fSYS
–
CC 0
–
8
ns
–
MLI inputs setup to RCLK
falling edge
t36
SR 4
–
–
ns
–
MLI inputs hold to RCLK
falling edge
t37
SR 4
–
–
ns
–
RREADY output delay from t38
RCLK falling edge
CC 0
–
8
ns
–
RCLK clock period
MLI outputs delay from
TCLK rising edge
1) TCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) TCLK high and low times can be minimum 1 × TMLI.
3) When fSYS = 75 MHz, t30 = 26,67ns
Data Sheet
126
V1.0, 2008-04
TC1796
Electrical Parameters
t30
0.9 VDDP
0.1 VDDP
TCLKx
t35
t35
TDATAx
TVALIDx
TREADYx
t31
RCLKx
t36
t37
RDATAx
RVALIDx
t38
t38
RREADYx
MLI_Tmg_2.vsd
Figure 42
MLI Interface Timing
Note: The generation of RREADYx is in the input clock domain of the receiver. The
reception of TREADYx is asynchronous to TCLKx.
Data Sheet
127
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.12.2 Micro Second Channel (MSC) Interface Timing
Table 33
MSC Interface Timing (Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
FCLP clock period1)2)
SOP/ENx outputs delay
from FCLP rising edge
SDI bit time
SDI rise time
SDI fall time
Typ.
Unit
Note /
Test Con
dition
Max.
t40
t45
CC 2 × TMSC3) –
–
ns
–
CC -10
10
ns
–
t46
t48
t49
CC 8 × TMSC
–
ns
–
SR
100
ns
–
SR
100
ns
–
1) FCLP signal rise/fall times are the same as the A2 Pads rise/fall times.
2) FCLP signal high and low can be minimum 1 × TMSC.
3) TMSCmin = TSYS = 1/fSYS. When fSYS = 75 MHz, t40 = 26,67ns
t40
0.9 VDDP
0.1 VDDP
FCLP
t45
t45
SOP
EN
t48
t49
0.9 VDDP
0.1 VDDP
SDI
t46
Figure 43
t46
MSC_Tmg_1.vsd
MSC Interface Timing
Note: The data at SOP should be sampled with the falling edge of FCLP in the target
device.
Data Sheet
128
V1.0, 2008-04
TC1796
Electrical Parameters
4.3.12.3 Synchronous Serial Channel (SSC) Master Mode Timing
Table 34
SSC Master Mode Timing (Operating Conditions apply), CL = 50 pF
Parameter
Symbol
Values
Min.
SCLK clock period1)2)
Typ.
Unit
Note /
Test Con
dition
Max.
t50
t51
CC 2 × TSSC3) –
–
ns
–
CC 0
–
8
ns
–
MRST setup to SCLK
falling edge
t52
SR 10
–
–
ns
–
MRST hold from SCLK
falling edge
t53
SR 5
–
–
ns
–
MTSR/SLSOx delay from
SCLK rising edge
1) SCLK signal rise/fall times are the same as the A2 Pads rise/fall times.
2) SCLK signal high and low times can be minimum 1 × TSSC.
3) TSSCmin = TSYS = 1/fSYS. When fSYS = 75 MHz, t50 = 26,67ns
t50
SCLK1)2)
t51
t51
MTSR1)
t52
t53
Data
valid
MRST1)
t51
SLSOx2)
1) This timing is based on the following setup: CON.PH = CON.PO = 0.
2) The transition at SLSOx is based on the following setup: SSOTC.TRAIL = 0
and the first SCLK high pulse is in the first one of a transmission.
SSC_Tmg_1.vsd
Figure 44
Data Sheet
SSC Master Mode Timing
129
V1.0, 2008-04
TC1796
Package and Reliability
5
Package and Reliability
5.1
Package Parameters (P/PG-BGA-416-4)
Table 35
Parameter
Thermal Characteristics of the Package
Symbol
Values
Max.
Unit Note /
Test Condi
tion
Thermal resistance junction RTJCT CC –
case top1)
8
K/W –
Thermal resistance junction RTJCB CC –
case bottom1)
15
K/W –
Min.
Typ.
1) The top and bottom thermal resistances between the case and the ambient (RTCAT, RTCAB) are to be combined
with the thermal resistances between the junction and the case given above (RTJCT, RTJCB), in order to calculate
the total thermal resistance between the junction and the ambient (RTJA). The thermal resistances between the
case and the ambient (RTCAT, RTCAB) depend on the external system (PCB, case) characteristics, and are under
user responsibility.
The junction temperature can be calculated using the following equation: TJ = TA + RTJA × PD, where the RTJA
is the total thermal resistance between the junction and the ambient. This total junction ambient resistance RTJA
can be obtained from the upper four partial thermal resistances.
Data Sheet
130
V1.0, 2008-04
TC1796
Package and Reliability
5.2
Package Outline
25 x 1 = 25
A26
1
25 x 1 = 25
A1
AF1
0.5 ±0.1
(0.56)
(1.17)
2.5 MAX.
1
ø0.63 +0.07
-0.13
416x
ø0.25 M A B C
ø0.1 M C
0.15
C
27 ±0.2
24 ±0.5
20 ±0.2
A
Index Marking
20 ±0.2
24 ±0.5
27 ±0.2
Index Marking
(sharp edge)
B
GPA09537
Figure 45
P/PG-BGA-416-4, Plastic Low Profile Pitch Ball Grid Array
You can find our packages, sorts of packing and others in our Infineon Internet Web Site.
Data Sheet
131
V1.0, 2008-04
TC1796
Package and Reliability
5.3
Flash Memory Parameters
The data retention time of the TC1796’s Flash memory (i.e. the time after which stored
data can still be retrieved) depends on the number of times the Flash memory has been
erased and programmed.
Table 36
Flash Parameters
Parameter
Symbol
Values
Min.
Unit
Note /
Test Condition
Typ.
Max.
Program / Data Flash tRET CC 20
Retention Time,
Physical Sector1)2)
–
–
years Max. 1000
erase/program
cycles
Program / Data Flash tRETL CC 20
Retention Time
Logical Sector1)2)
–
–
years Max. 100
erase/program
cycles
Data Flash
Endurance
(128 KB)
NE
–
–
–
Max. data retention
time 5 years
Data Flash
Endurance,
EEPROM Emulation
(8 × 16 KB)
NE8 CC 120 000 –
–
–
Max. data retention
time 5 years
Programming Time
per Page3)
tPR CC –
–
5
ms
–
Program Flash
Erase Time
per 256-KB Sector
tERP CC –
–
5
s
fCPU = 150 MHz
Data Flash
Erase Time
per 64-KB Sector
tERD CC –
–
2.5
s
fCPU = 150 MHz
Wake-up time
tWU CC 4300 ×
1/fCPU
–
–
–
–
CC 15 000
+ 40µs
1) Storage and inactive time included.
2) At average weighted junction temperature Tj = 100oC, or
the retention time at average weighted temperature of Tj = 110oC is minimum 10 years, or
the retention time at average weighted temperature of Tj = 150oC is minimum 0.7 years.
3) In case the Program Verify feature detects weak bits, these bits will be programmed once more. The
reprogramming takes additional 5 ms.
Data Sheet
132
V1.0, 2008-04
TC1796
Package and Reliability
5.4
Table 37
Quality Declarations
Quality Parameters
Parameter
Symbol
Values
Unit
Note / Test Condition
Min. Typ. Max.
Operation
Lifetime1)2)
tOP
–
–
24000 hours at average weighted junction
temperature Tj = 127oC
–
–
66000 hours at average weighted junction
temperature Tj = 100oC
–
–
20
years at average weighted junction
temperature Tj = 85oC
ESD susceptibility VHBM
according to
Human Body
Model (HBM)
–
–
2000
V
Conforming to
EIA/JESD22-A114-B
ESD susceptibility VHBM1
of the LVDS pins
–
–
500
V
–
ESD susceptibility VCDM
according to
Charged Device
Model (CDM)
–
–
500
V
Conforming to
JESD22-C101-C
Moisture
Sensitivity Level
–
–
3
–
Conforming to Jedec
J-STD-020C for 240°C
MSL
1) This lifetime refers only to the time when the device is powered on.
2) One example of a detailed temperature profile is:
2000 hours at Tj = 150oC
16000 hours at Tj = 125oC
6000 hours at Tj = 110oC
This example is equivalent to the operation lifetime and average temperatures given in the table.
Data Sheet
133
V1.0, 2008-04
w w w . i n f i n e o n . c o m
Published by Infineon Technologies AG