NUP4016P5T5G, SZNUP4016P5T5G Ultra-Low Capacitance Diode-TVS Array for High Speed Data Line Protection http://onsemi.com The NUP4016P5 transient voltage suppressor is designed to protect high speed data lines from ESD. Ultra−low capacitance and high level of ESD protection makes this device well suited for use in USB 2.0 applications. Features SOT−953 CASE 527AE Ultra−Low Capacitance (0.5 pF Typical Between I/O Lines and Ground) ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model and Class C (Exceeding 400 V) per Machine Model Protection for the Following IEC Standards: IEC 61000−4−2 15 kV (contact) UL Flammability Rating of 94 V−0 SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable This is a Pb−Free Device* 1 5 2 3 4 MARKING DIAGRAM Typical Applications 4M High Speed Communication Line Protection USB 2.0 High Speed Data Line and Power Line Protection Monitors and Flat Panel Displays MP3 Gigabit Ethernet 1 4 = Specific Device Code M = Date Code ORDERING INFORMATION MAXIMUM RATINGS (TJ = 25C unless otherwise noted) Rating Symbol Value Unit Operating Junction Temperature Range TJ −40 to +125 C Storage Temperature Range Tstg −55 to +150 C Lead Solder Temperature − Maximum (10 Seconds) TL 260 C ESD 16000 400 15000 V Human Body Model (HBM) Machine Model (MM) IEC 61000−4−2 Contact (ESD) Package Shipping† NUP4016P5T5G SOT−953 (Pb−Free) 4,000 / Tape & Reel SZNUP4016P5T5G SOT−953 (Pb−Free) 4,000 / Tape & Reel Device †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D. Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. Semiconductor Components Industries, LLC, 2012 February, 2012 − Rev. 4 1 Publication Order Number: NUP4016P5/D NUP4016P5T5G, SZNUP4016P5T5G ELECTRICAL CHARACTERISTICS (TJ = 25C unless otherwise specified) Parameter Reverse Working Voltage Breakdown Voltage Symbol VRWM VBR Conditions Min Typ (Note 1) IT = 1 mA, (Note 2) Max Unit 5.0 V 5.5 Reverse Leakage Current IR VRWM = 5 V Junction Capacitance CJ VR = 0 V, f = 1 MHz between I/O Pins and GND Junction Capacitance CJ VR = 0 V, f = 1 MHz between I/O Pins V 1.0 mA 0.5 0.8 pF 0.3 0.5 pF 1. TVS devices are normally selected according to the working peak reverse voltage (VRWM), which should be equal or greater than the DC or continuous peak operating voltage level. 2. VBR is measured at pulse test current IT. 3. Include SZ-prefix devices where applicable. TYPICAL PERFORMANCE CURVES (TJ = 25C unless otherwise noted) Figure 1. ESD Clamping Voltage Screenshot (8 kV Contact per IEC610000−4−2) http://onsemi.com 2 NUP4016P5T5G, SZNUP4016P5T5G PACKAGE DIMENSIONS SOT−953 CASE 527AE ISSUE E X D Y PIN ONE INDICATOR 5 NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994. 2. CONTROLLING DIMENSION: MILLIMETERS 3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF THE BASE MATERIAL. 4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PROTRUSIONS, OR GATE BURRS. A 4 HE E 1 2 3 DIM A b C D E e HE L L2 L3 C TOP VIEW SIDE VIEW e L 5X 5X L3 5X L2 5X BOTTOM VIEW MILLIMETERS MIN NOM MAX 0.34 0.37 0.40 0.10 0.15 0.20 0.07 0.12 0.17 0.95 1.00 1.05 0.75 0.80 0.85 0.35 BSC 0.95 1.00 1.05 0.175 REF 0.05 0.10 0.15 −−− −−− 0.15 b 0.08 X Y SOLDERING FOOTPRINT* 5X 0.35 5X 0.20 PACKAGE OUTLINE 1.20 1 0.35 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. 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