ISM36 Series 2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS Applications: Product Features: Very Low Current Consumption CMOS Logic Levels Compatible with Leadfree Processing Small Footprint Package AT Cut Temperature Stability Charactertics Real Time Clocks Metering Industrial Control Time Reference System Clock Frequency 32.768 kHz Output Level CMOS ‘0’ = 0.1 VDD Max., ‘1’ = 0.9 VDD Min. Duty Cycle 50% ±5% Rise / Fall Time 50 nSec Max. 1.8V (20% to 80% VDD Level) 40 nSec Max. 2.5V (20% to 80% VDD Level) 30 nSec Max. 3.3V (20% to 80% VDD Level) 15pF Max. Output Load Frequency Tolerance (at 25°C) See Part Number Guide Below Frequency Stability See Part Number Guide Below Enable / Disable Time Start Up Time 200 nS Max. Supply Voltage See Input Voltage Table, tolerance ±10% Current Operating 40 µA Max. (F=32.768kHz, VDD = 3.3V, 15 pF load) Current Standby 3 µA Max. Stand-by Function Output Enable (High) = 0.7 VDD Min, Output Disable (Low/High Impedance) = 0.3 VDD Max. Operating See Operating Temperature Table in Part Number Guide Storage -40° C to +105° C Standard 7.0 mS Max. (VDD = 3.3V) 10.0 mS Max. (VDD = 1.8V) Part Number Guide Package ISM36 - Input Voltage Sample Part Number: ISM36 -32ZBH – 32.768 kHz Operating Temperature Frequency Tolerance 25°C (in ppm) Stability (in ppm) Enable / Disable 3 = 3.3 V 1 = 0 C to +70 C D= 10 E= 10* H = Stand-by 6 = 2.5 V 3 = -20 C to +70 C D= 15 D= 15 1 = 1.8 V 5 = -30 C to +85 C F= 20 F= 20 2 = -40 C to +85 C Z = 30 Z = 30 B = 50 B = 50 Frequency - 32.768 kHz NOTE: A 0.01 µF bypass capacitor is recommended between Vdd (pin 4) and GND (pin 2) to minimize power supply noise. * Not available at all operating temperature options. ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 01/19/16_A Page 1 of 2 2.0 mm x 1.6 mm Ceramic Package SMD Oscillator, CMOS ISM36 Series Pb Free Solder Reflow Profile: Typical Application: *Units are backward compatible with 240C reflow processes Package Information: MSL = N.A. (package does not contain plastic, storage life is unlimited under normal room conditions). Termination = e4 (Au over Ni over W base metalization). Tape and Reel Information: Quantity per Reel A B C D E F 3000 8.0 +/-.3 4.0 +/-.2 7.5 +/-.2 17.5 +/-1 50 / 60 / 80 180 Environmental Specifications Thermal Shock Moisture Resistance Mechanical Shock Mechanical Vibration Resistance to Soldering Heat Hazardous Substance Solderability Terminal Strength Gross Leak Fine Leak Solvent Resistance MIL-STD-883, Method 1011, Condition A MIL-STD-883, Method 1004 MIL-STD-883, Method 2002, Condition B MIL-STD-883, Method 2007, Condition A J-STD-020C, Table 5-2 Pb-free devices (except 2 cycles max) Pb-Free / RoHS / Green Compliant JESD22-B102-D Method 2 (Preconditioning E) MIL-STD-883, Method 2004, Test Condition D MIL-STD-883, Method 1014, Condition C MIL-STD-883, Method 1014, Condition A2, R1=2x10-8 atm cc/s MIL-STD-202, Method 215 Marking Line 1: I-Date Code (YWW) Line 2: Frequency ILSI America Phone 775-851-8880 ● Fax 775-851-8882 ●email: [email protected] ● www.ilsiamerica.com Specifications subject to change without notice Rev: 01/19/16_A Page 2 of 2