GM5F22BH20A

LEDs for LCD Backlights
July 24, 2015
SPECIFICATIONS
Surface Mount LED
GM5F22BH20A
Notice
Contents in this technical document be changed without any notice due to the product modification.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any
defects that may occur in wquipment using any SHARP devices shown in catalogs, data books, etc.
Development DepartmentⅡ
Lighting Device Division
http://www.sharp-world.com/products/device/
Electronic Components And Devices Group
SHARP CORPORATION
sharp LD-E14-2-15-A
Model No. GM5F2xBH20A
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
●Handle this document carefully it contains material protected by international
copyright law. Any reproduction, full or in part, of this material is prohibited
without the express written permission of the company.
●When using the products covered herein,please observe the conditions written herein
and the precautions outlined in the following paragraphs. In no event shall the
company be liable for any damages resulting from failure to strictly adhere to these conditions and precautions.
(1) Please do verify the validity of this part after assembling it in customerʼs products,when
customer wants to make catalogue and instruction manual based on the specification sheet of this part.
(2) The products covered herein are desigd and manufactured for the following application areas.
When using the products covered herein for the equipment listed in paragraph(3),even for the following
application areas, be sure to observe the precautions given in Paragraph(3).
Never use the products for the equipment listed in Paragraph(4).
・Office electronics
・Instrumentation and measuring equipment
・Machine tools
・Audiovisual equipment
・Home appliances
・Communication equipment other than for trunk lines
(3) These contemplating using the products covered herein for the following equipment which demands
high reliability, should first contact a sales representative of the company and then accept responsibility
for incorporating into the design fail-safe operation,redundansy, and other appropriate measures for
ensuring reliability and safety of the equipment and the overall system.
・Control and safety devices for airplanes, trains,automobiles, and other transportation equipment
・Mainframe computers
・Traffic control systems
・Gas leak detectors and automatic cutoff devices
・Rescue and security equipment
・Other safety devices and safety equipment, etc.
(4) Do not use the products covered herein for the followin equipment which demands extremely
high performance in terms of functionality, reliability, or accuracy.
・Aerospace equipment
・Communications equipment for trunk lines
・Control equipment for the nuclear power industry
・Medical equipment related to life support, etc.
(5) Please direct all queries and comments regarding the interpretation of the above four Paragraphs to
a sales representative of the company.
sharp LD-E14-2-15-A
Model No. GM5F2xBH20A
“Contents in this technical document be changed without any notice due to the product modification.”
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GM5F2xBH20A　Specifications
1. Application
These specifications apply to the light emitting di
[ LED module (InGaN Blue LED chip + Phosphor) ]
2. External dimensions and equivalent circuit
Refer to Page 2.
3. Ratings and characteristics
Refer to Page 3-6.
3-1. Absolute maximum ratings
3-2. Electro-optical characteristics
3-3. Derating curve
3-4. Characteristics diagram (TYP.)
4. Reliability
Refer to Page 7-8.
4-1. Test items and test conditions
4-2. Failure criteria
5. Quality level
Refer to Page 9.
5-1. Applied standard
5-2. Sampling inspection
5-3. Inspection items and defect criteria
6. Supplements
Refer to Page 10-14.
6-1. Taping
6-2. Packing
6-3. Information on environmental impact substances
7. Precautions
Refer to Page 15-18.
7-1. General handling
7-2. Soldering
7-3. Cleaning
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2．External dimensions and equivalent circuit
3.5
3.7
TOP VIEW
①
(2.58)
0.8
②
0.8
Tc
SIDE VIEW
Equivalent circuit
(0.93) (0.74)
①Anode
(2.03)
②Cathode
BOTTOM VIEW
①
Sectional view
Wire
Phosphor LED chip
②
Seal resin
(Notes)
Reflector
1. Unspecified tolerance to be ±0.1
2.　Values inside parentheses are reference values.
3. Tc: Measurement point of case temperature
Die attachment
Unit
ｍｍ
Lead frame
Material
Drawing No.
Reflector : Heat resistant polymer
Lighting part : Silicone resin
2
Terminal︓Ag plating
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3．Ratings and characteristics
3-1. Absolute maximum ratings
Parameter
Symbol
Applied temperature
Rating
Unit
Operating temperature（Note１）
Tc
-
-30 to +85
℃
Junction temperature
Tj
-
Storage temperature（Note 2）
Tstg
-
Power dissipation（Note 3）
P
-30℃　≦ Tc ≦　85℃
1222
mW
-
-
-
mW/℃
IF
-30℃　≦ Tc ≦　85℃
175
mA
-
-
-
mA/℃
Reverse voltage
VR
Tc ＝　25℃
5
V
Soldering temperature（Note 4）
Tsol
-
260
℃
Derating factor
Forward current（Note ３）
Derating factor
110
℃
-40 to +100
℃
(Note 1) The range of operating temperature is prescribed by solder temperature,
Case temperature (Refer to Page 2 External dimensions and equivalent circuit)
(Note 2) Do not exceed specified temperature range under any pavking condition. (Except when baking and soldering)
(Note 3) The operating current value follows the derating curve. (Refer to page 5)
(Note 4) As for the reflow soldering profile, please refer to Page 17
3-2. Electro-optical characteristics
Parameter
(Tc=25 ℃)
Symbol Applied temperature MIN.
TYP.
MAX.
Unit
Forward voltage（Note 5）
VF
I F = 160 mA
6.11
6.51
6.91
V
Luminous flux（Note 6）
ΦV
I F = 160 mA
73.7
85.7
97.7
lm
-
0.251
-
-
-
0.210
-
-
-
-
10
μA
x
Chromaticity coordinates（Note 7）
Reverse current
I F = 160mA
y
IR
VR = 5 V
（Note 5）After 50 ms drive (Tolerance:±3％）
（Note 6）Monitored by 8 inch integrating sphere of Sharp Standard. After 50 ms drive (Tolerance:±10％）
（Note 7）Measured by 8 inch integrating sphere of Sharp Standard. After 50ms drive (Tolerance:x,y:±0.007）
3
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3-3. Rank table
3-3-1. Luminous flux rank table
Tc = 25℃　I F = 160 mA 50ms
Luminous Flux
Rank
MIN.
MAX.
A
73.7
85.7
B
79.7
91.7
C
85.7
97.7
Unit
lm
(Tolerance︓±10%)
3-3-2. Chromaticity rank table
Point 1
Point 2
Point 3
Point 4
rank
x
y
x
y
x
y
x
y
d
0.2503
0.1985
0.2406
0.1812
0.2319
0.1861
0.2416
0.2036
e
0.2600
0.2162
0.2503
0.1987
0.2416
0.2036
0.2513
0.2211
f
0.2697
0.2337
0.2600
0.2162
0.2513
0.2211
0.2610
0.2386
Chromaticity coordinate
0.24
0.23
f
y
0.22
e
0.21
0.20
0.19
0.18
0.23
d
0.24
0.25
x
(Note1) Let the delivery rate of each rank be unspecified.
4
0.26
0.27
(Tolerance︓±0.007)
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1-3-3. Forward voltage rank table　Tc = 25℃　I F = 160 mA 50ms
Forward voltage
Rank
MIN.
MAX.
1
6.11
6.31
2
6.31
6.51
3
6.51
6.71
4
6.71
6.91
Unit
V
(Tolerance︓±2%)
Forward Current（mA）
3-4．Derating Curve
Forward Current Derating Curve
200
180
160
140
120
100
80
60
40
20
0
-30
(85℃,175mA)
-20
-10
0
10
20
30
40
50
60
70
80
90
100
110 120
Power Disspat ion（mW）
Soldering point Temperture Tc（℃）
Power Disspation Derating Curve
1400
1200
(85℃,122.2mA)
1000
800
600
400
200
0
-30
-20
-10
0
10
20
30
40
50
60
70
80
90
100
110
120
Soldering point Temperture Tc（℃）
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3-5．Characteristics Diagram（TYP.）
Forward Current vs. Forward Voltage
（Tc = 25℃）
Forward voltage　VF (V)
140
120
100
80
60
40
20
0
0
40
80
120
160
200
240
280
（Tc = 25℃）
7.0
after 50ms from driving
6.5
6.0
5.5
5.0
0
40
80
120
160
200
240
Forward Current　I F (mA)
Forward Current　I F (mA)
Relative total Luminous Flux vs. Temperature
Chromaticity vs. Temperature
（I F = 160 mA）
150
140
130
after 50ms from driving
0.005
120
110
100
280
（I F = 160 mA）
0.010
Δｙ
Relative Total Luminous Flux（％）
Total Luminous Flux　Φv（lm）
Total Luminous Flux vs. Forward Current
-40℃
0℃
85℃
120℃
0.000
90
80
60
50
-40
25℃
-0.005
70
-20
0
20
40
60
80
-0.010
-0.010
100 120
-0.005
0.000
0.005
Terminal temperature Tc（℃）
Δx
Forward Current vs. Chromaticity
Directional Characteristics
（Tc = 25℃）
（I F = 160 mA）
0.004
0.010
SCANNING ANGLE[deg]
0°
Δｙ
0.002
0.000
200mA
160mA
100mA
30°
30°
60°
60°
-0.002
-0.004
-0.004
90°
-0.002
0.000
0.002
-100
0.004
Δx
90°
-50
0
50
100
RELATIVE INTENSITY（％）
Characteristic data shown here is for reference purpose only. (Not guaranteed data)
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4．Reliability
4-1. Test items and test conditions
（Confidence level︓90％）
No.
Test items
1
Temperature cycle
2
Temperature humidity
storage
Test conditions
Samples Defective LTPD
(n)
(c)
(%)
-40℃（30min）to +125℃
（30min）,200 cycles
22
0
10
Tstg = +60℃,RH = 90%,Time = 1 000 h
22
0
10
3
High temperature storage
Tstg = +100℃,Time = 1 000 h
22
0
10
4
Low temperature storage
Tstg = -40℃,Time = 1 000 h
22
0
10
5
Steady stage operating life
22
0
10
22
0
10
11
0
20
11
0
20
11
0
20
Tc = +85℃, I F = 160 mA,Time = 1 000 h
2
Acceleration︓15 000 m/s,Pulse width:0.5ms,
Shock
6
Tc = +25℃
Direction︓X ・ Y and Z,　3 trials in each direction
2
Acceleration︓200 m/s,Frequency:100 ～ 2000 Hz
7
Vibration
(round-trip) 4 min Tc = +25℃
Direction:x,y and Z 4 trials in each direction
Solderability
8
9
Resistance to soldering
heat
EIAJ ED-4701
Material︓（１）Solder︓Sn/3.0Ag/0.5Cu (wt ％)
( 2 ) Flux︓Rosin 25%, IPA 75%（vol ％）
Pre Aging︓（１）Baking︓150℃ 1hour、or
（２）PCT︓105℃ 100% 1.22×105 Pa 4hours
After aging, the specimen is left under normal
conditions for 2 hours or more.
Prior to dipping the specimen in solder, it should
be dipped in flux for 3～5 sec.
Moisture soaking specified in 5-2 of this
specifications shall be performed.
(１)Method A( Not applied wave soldering)
(２)Method B(Solder Iron) 350℃ 3sec.
(３)Mrthod C (Reflow soldering)
Peak temperature ︓240±3℃ 5sec. Max. 220℃,
40sec. MAX.
Reflow times : 2 times. MAX.
When second solder heating is performed,
the specimen shall be cooled down.
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4-2. Failure criteria
4-2-1. Solderability failure criterion
Solder should be applied at 90% or more of solderability judgment area.
4-2-2. Failure criteria for the other reliability tests
No.
Parameter
Symbol
Failure criteria
1
Forward Voltage
VF
V F > U.S.L. × 1.2
2
Luminous intensity
ΦF
Φ　<
Initial value × 0.5, Φ　>
Initial value × 2.0
V
V
3
Reverse current
IR
I R > U.S.L. × 2.0
（Note 1）Measuring conditions shall accord with the paragraph mentioned about the
electro-optical characteristics.
（Note 2）U.S.L stands for Upper Specification Limit
4-3. Estimated Life Time
4-3-1. Estimated Mean Life Time
Condition︓Tc = 85℃, I F = 160 mA
Estimated Mean Life Time︓30 000h
4-3-2. Estimation method of Mean Life Time
Variation of luminous intensity for 3 000 hours is acquired by acceleration test
under the following conditions;
Tc = 70 to 100 ℃
I F = 150 to 180 mA
Using data of from 1 000 to 3 000 hours, value (τ) , time to be decreased to 50% of
initial luminous intensity is calculated based on the linear regression showing relationship
between maintenance ratio of luminous intensity and square root of the time.
Arrhenius plot of Mean Life Time is obtained by plotting case temperature and value (τ) .
Our estimated life time of this product is “decrease to 50% of initial luminous intensity
at Tc = 85℃” .
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5．Quality level
5-1. Applied standard　ISO 2859-1
5-2. Sampling inspection　A single normal sampling plan level S-4
5-3. Inspection items and defect criteria
No.
Inspection itens
Defect criteria
1
No radiation
No light emitting
2
Radiation color
Different from the specified color
3
Taping
4
5
Electro-optical
charactristics
External
dimensions
Claddification
AQL
Major defect
0.1
Minor defect
0.4
Not conforming to the inserted direction
shown in the specifications
Not satisfied with spesified values
V　、Φ　、
and I R mentioned in page 3
F
Not satisfied with specified dimensions
in Page 2 Resin surface is rising than
the product surface.
Foreign substances and scratches of
6
Appearance
light emitting face, which are, obstructed
light emitting condition.
(Except removable foreign substance)
9
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6．Supplements
6-1. Taping
6-1-1. Shape and dimensions of tape (Ref.)
2.00 ±0.05
8.00 ±0.10
Φ 1.50 ±0.10
4.00 ±0.10
1.75 ±0.10
8.00
＋0.30
3.50 ±0.05
－0.10
Φ 1.00 ±0.25
.20 ±0.02
8°　MAX
・ 3.75 ±0.05
0
5°
・ 1.00 ±0.05
0
10
MAX
・ 3.83 ±0.05
0
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6-1-2. Shape and dimensions of reel (Ref.)
W3
B
W2
5.0
6.0
C
A N
56.0
D
4.0
A
N
W1
178±1.0
60±0.5
13.5±0.5
Parameter
Flange
W2
16.0
-0.5
-0.0
W3
D
>12.0
21.3±0.2
Dimension[mm]
Diameter
A
178
Thickness
(W1-W2) /2
1.25
W3
>12
External diameter
N
60
Spindle hole diameter
C
13.2
Width
E
2.3
Depth
(D-C) /2
4.05
the flanges
Key slit
Indication of Model No.etc.
Label
W1
Symbol
Clearance between
Hub
2.0
B
C
2.3±0.2 13.2±0.2
Remarks
Dimension measured close to the core
Label attached on flange(Model No.,quantity,Lot No.etc.)
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6-1-2. Taping specification
Feeding direction
Emptv
MIN.40mm
Leader(Empty)
MIN.400mm
LEDs inside
Cover tape separation
F = 0.1N ～ 1.0N（Θ = 10° or less）
Cover Tape
F
0 ～ 10°
Forward
Tape speed︓5 mm/s
Carrier Tape
（１）Tape strength against bending:The radius of curvature should be more than 30min.
If bent at less than 30 min,the cover may peel off.
（２）Quantity:1 500pcs. Per reel (standard)
（３）Product mass:Approx. 12mg(One piece of LED/Reference value)
（４）Others:
①There is no continuous empty pocket except leader and trailer part.
②The quantity of the products lacking should be less than 0.5% of total product quantity
③Products should not be attached to the cover tape when it peeled off.
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6-2. Packing
6-2-1. Moisture proof packing
In order to avoid the absorption of humidity while transport and storage, the devices are packed in　moisture proof aluminum bags.
Alminum bag
Label
Silica gel
Reel
Label (EIAJ C-3 compliant)
6-2-2. Recommended storage conditions
Temperature: 5 ℃ to 30 ℃ Relative humidity: 60 % or less
6-2-3. Precautions after opening aluminum bags
① Please be sure to give them the soldering within 3 days under the following conditions.
Temperature: 5 ℃ to 30 ℃ Relative humidity: 60 % or less
② Storage in a dry box is recommended in case that the products not used for
a long time after opened. or repack the reels with a desiccative by the sealer and store
them under the same conditions mentioned in 6. 2. 2
③ Please perform the baking treatment under the recommended conditions in the following
cases;
・The blue indicator of silica gel changes its color or fades.
・3days passed after opened under the specified storage conditions.
・Products were stored out of storage condition.
(Recommended baking conditions):
・Products with taping
Temperature:60℃, Time:12 to 24 hours
・Single piece of the products
Temperature:100℃,Time:45 min to 2 hours.
Avoid piling up the reels or applying stress to them during baking to protect from deformation.
Please be sure to cool then to room temperature after baking.
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6-3. Information on environmental impact substances
6-3-1. RoHS compliant product
6-3-2. Information relating to China RoHS
Product Information Notification based on Chinese law, Management Methods for Controlling
Pollution by Electronic Information Products.
Names and Contents of the Toxic and Hazardous Substances or Elements in the Products.
Toxic and Hazardous Substances or Elements.
Lead
(Pb)
Mercury
(Hg)
Cadmium
(Cd)
Hexavalent
Chromium
(Cr(VI))
Polybrominated
Biphenyls
(PBB)
Polybrominated Diphenyl
Ethers
(PBDE)
○
○
○
○
○
○
○︓Indicates that the content of the toxic and hazardous substance in all the
homogeneous materials of the part is below the concentration limit requirement
as described in SJ/T 11363-2006.
×︓Indicates that the content of the toxic and hazardous substance in at least one
homogeneous material of the part exceeds theconcentration limit requirement
as described in SJ/T 11363-2006 standard.
6-3-3. Ozone Depleting Substances
・This product does not contain the following Ozone Depleting Substances.
・This product does not have a production line whose process requires the following
Ozone Depleting Substances.
・Restricted substances:CFCs Halones, CCl4, and 1,1.1-Trichloroethane(Methyl chloroform)
6-3-3. Use regulation of Bromine-based incombustibility material
Nonuse of following bromine-based incombustibility materials for the products/
PBBO:Poly Bromo Bi-phenyl Oxide
PBDPO:Poly Bromo Di-phenyl Oxide
PBDE(PBDPE):Poly Bromo Di-phenyl Ether
PBB:Poly Bromo Bi-phenyl
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7．Precautions
7-1.General handling
①This device adopts the silicone reflector designed aiming at the operation lifetime for a long
time. Therefore, it is a weak structure against the external stress.
Please take care that the external stress is not added to the product.
②The voltage must be applied to LED only as a forward direction.Moreover,please design
circuit diagram considering no voltage gap between Anode and Cathode during off state.
If the reverse voltage is applied to LED for a long term, the electro-migration is generated
and there is a possibility of the short-circuit of the circuit.
③This product is sensitive for electrostatic voltage and suge voltage. Static electrocity or surge
voltage can deteriorate product and its reliability. Please make sure that all devices and
equipments must be grounded. We recommend to built in zener diode or TVS(Transient
Voltage Suppression)as protection circuit against static electricity.
④This product is composed of blue LED chip and special phosphor. Color tone is possible to
vary in some degree,depending on the operating conditions such as ambient temperature
or current amount. Also it is So please verify the performance before use.
⑤Do not look directly at LEDs with unshielded eyes, or damage to your eyes may result.
⑥Materials with high thermal conductivity are used in this product in order to allow generated
heat to escape effectively out of the product. Avoid locating other heat sources(ex.resistance,
etc.)near the products on circuit board to protect the devices from the heatedamage.
Please make sure thatcasa temperture is always under 85℃ during operation, include the
self-heat.
⑦Since dust on the surface of the radiation part is hard to remove and may decrease the
luminous intensity, please handle the products in a clean, non-dusty condition.
⑧The luminous area of this product is formed with silicone resin. In the case of handling this
device, please do not push the luminous area by the sharp tools. The crack and peel off of
the emitting area, and the wire deformation are generated and it causes not lighting.
It pressurizes by the head of the width of the point 1mm referring and the load where not
lighting is generated is as follows.
SIDE : 40N
TOP : 40N
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⑨This product is the small size and the luminous area portion is formed by silicone resin,
there is a possibility to have a damage by the external stress.
・ In the case of the handling with the tweezers
In the case of the handling with the tweezers, please pick up the products with the sides
of the case and do not touch the luminous area.
・ In the case of the mount of the product
Please use this product after confirming the mouting condition, because there is a possibility
to have a damage by the external stress when the load is applied by the nozzle of the mouter..
⑩Please make sure not to apply any external stress to resin after mounted as well. When the
substrate bends after mounted, the product might be applied by an external stress, and the
crack will be generated in the soldering part. Please arrange the product in the direction not
stressed for the warp of the substrate after mounted.
⑪Please do not pile the substrate after this product is mounted. This product will be damaged
by the substrate, and it causes the crack of the lens and not lighting by the inner-wire
deformation or wiring disconnection.
⑫The products are not designed for the use under any of the following conditions. Please verify
their performance and reliability well enough if you use under any of the following conditions;
（１）In a place with a lot of moisture, dew condensation, briny air, and corrosive gas
(Cl,H2S,NH3,SO2,NOX,etc)
（２）Under the direct sunlight, outdoor exposure, and in a dusty place
（３）In water, oil, medical fluid, and organic solvents
⑬The silicone resin using for LED device is affected for strong acid, strong alkalinity.
Under influence by heat or the light from LED device, halogen gas is generated from
neighboring materials and may adversely affect LEDs.
Please use that you do not have any problem enough after confirmation.
⑭Guarantee covers the compliance to the quality standards mentioned in the Specifications;
however it does not cover the compatibility with application in the end-use, including
assembly and usage environment. In case any quality problems occurred in the application
of end-use, details will be separately discussed and determined between the parties hereto.
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sharp LD-E14-2-15-A
Model No. GM5F2xBH20A
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
7-2. Soldering
This product is reflow ready model(within 2 itemes), but it not ready for solder dipping.
7-2-1. Reflow
①Package temperature at reflow soldering is defined in the Fig. below. However, even
when it is under the profile condition, external stress can damage the internal packages.
Please test your reflow method and verify the solderability before use.
②Giving the soldering process promptly after opened aluminum package is recommended.
Soldering process must be completed including 2nd reflow as repairing within 3days
(Temperature:5℃ to 30℃ Relative humidity:60% or less) after opend.
(Storage in a dry box after the first reflow is recommended.)
Temperature [℃]
③Recommended Temperature Profile
260℃ MAX
1.5℃/sec.
10sec. MAX
Pre-heating
1.5℃/sec.
180 ～ 200℃
60sec. MAX
Abobe 220℃
6℃/sec.
120sec. MAX
Time [sec]
Since the thermal conduction to the products depends on the specification of the reflow
machine, and the size and layout of the PCBs please test your solder conditions carefully.
Moreover, after the reflow process, If the activator remains in the flux between anode
and cathode, the remaining activator might react during high temperature operation,
and the electro-migration is generated and there will be a possibility of a short-circuit.
Please use it after confirming the electro-migration is not generated while mounted actual
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sharp LD-E14-2-15-A
Model No. GM5F2xBH20A
“Contents in this technical document be changed without any notice due to the product modification.”
http://www.sharp-world.com/products/device/
④Recommended metal mask design
Solderability depends on the reflow conditions, solder past, and materials of the PCBs etc.
Please test and verify the solderability under the actual solder method.
Moreover, it might have a risk of short-circuit(leakage)with the electro-migration by the
remining activator in the flux. Please make a suitable section and test of the metal mask
in terms of pitch size and thickness before mass production.
0.95
0.74
2.05
Recommended
2.65
Solder pad design
⑤Precautions for PCB backside dip process
Please verify your conditions carefully in giving the dip process on the backside of the PCBs,
since the warped boards caused by heat and heat itself affect the inside of the package.
It is recommended to give the reflow process after dip process.
Though it is also available to give the reflow process before the dip process, the interval of
the two processes should be as short as possible.
7-3.Cleaning
・ Avoid cleaning the PCBs, since packages and resin are eroded by cleaning.
Please use the soldering paste without need of cleaning.
・ Avoid ultrasonic cleaning
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sharp LD-E14-2-15-A
http://www.sharp-world.com/products/device/