AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM www.vishay.com Vishay General Semiconductor High Current Density Standard Avalanche Surface Mount Rectifiers FEATURES ® eSMP Series • Very low profile - typical height of 1.1 mm Available • Ideal for automated placement • Glass passivated pallet chip junction K • Controlled avalanche characteristics • Low leakage current 1 • High forward surge capability • Meets MSL level 1, per J-STD-020, LF maximum peak of 260 °C 2 TO-277A (SMPC) K Cathode • AEC-Q101 qualified available - Automotive ordering code: base P/NHM3 Anode 1 Anode 2 • Material categorization: for definitions of compliance please see www.vishay.com/doc?99912 PRIMARY CHARACTERISTICS MECHANICAL DATA IF(AV) 3.0 A VRRM 200 V, 400 V, 600 V, 800 V, 1000 V IFSM 70 A EAS 20 mJ VF at IF = 3 A 0.90 V TJ max. 175 °C Package TO-277A (SMPC) Diode variations Single die Case: TO-277A (SMPC) Molding compound meets UL 94 V-0 flammability rating Base P/N-M3 - halogen-free, RoHS-compliant, and commercial grade Base P/NHM3 - halogen-free, RoHS-compliant and AEC-Q101 qualified Base P/NHM3_X - halogen-free, RoHS-compliant and AEC-Q101 qualified (“_X” denotes revision code e.g. A, B,.....) Terminals: Matte tin plated leads, solderable per J-STD-002 and JESD 22-B102 M3 suffix meets JESD 201 class 1A whisker test, HM3 suffix meets JESD 201 class 2 whisker test TYPICAL APPLICATIONS For use in general purpose rectification of power supplies, inverters, converters and freewheeling diodes for consumer, automotive and telecommunication. MAXIMUM RATINGS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL Device marking code Max. repetitive peak reverse voltage VRRM Max. DC forward current (fig. 1) Peak forward surge current 10 ms single half sine-wave superimposed on rated load Non-repetitive avalanche energy at TJ = 25 °C IAS = 2.5 A max. IAS = 1.0 A typical Operating junction and storage temperature range AS3PD AS3PG AS3PJ AS3PK AS3PM AS3D AS3G AS3J AS3K AS3M 200 400 600 800 1000 IF (1) 3.0 IF (2) 2.1 IFSM 70 EAS TJ, TSTG 20 30 -55 to +175 UNIT V A A mJ °C Notes (1) Mounted on 10 mm x 10 mm pad areas, 1 oz. FR4 PCB (2) Free air, mounted on recommended copper pad area Revision: 27-Jul-15 Document Number: 88837 1 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM www.vishay.com Vishay General Semiconductor ELECTRICAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER TEST CONDITIONS IF = 1.5 A IF = 3.0 A Instantaneous forward voltage IF = 1.5 A IF = 3.0 A Reverse current rated VR Typical reverse recovery time Typical junction capacitance per diode SYMBOL TA = 25 °C VF (1) TA = 125 °C TA = 25 °C TA = 125 °C IR (2) TYP. MAX. 0.92 - 1.00 1.10 0.81 - 0.90 0.95 0.28 10 62 150 UNIT V μA IF = 0.5 A, IR = 1.0 A, Irr = 0.25 A trr 1.2 - μs 4.0 V, 1 MHz CJ 37 - pF AS3PM UNIT Notes (1) Pulse test: 300 μs pulse width, 1 % duty cycle (2) Pulse test: Pulse width 40 ms THERMAL CHARACTERISTICS (TA = 25 °C unless otherwise noted) PARAMETER SYMBOL AS3PD AS3PG RJA (1) Typical thermal resistance RJM AS3PJ AS3PK 80 (2) °C/W 5 Notes (1) Free air, mounted on recommended PCB 1 oz. pad area; thermal resistance R JA - junction to ambient (2) Units mounted on PCB with 10 mm x 10 mm copper pad areas, 1 oz. FR4 PCB; R JM - junction to mount ORDERING INFORMATION (Example) PREFERRED P/N UNIT WEIGHT (g) PREFERRED PACKAGE CODE BASE QUANTITY AS3PJ-M3/86A 0.10 86A 1500 7" diameter plastic tape and reel AS3PJ-M3/87A 0.10 87A 6500 13" diameter plastic tape and reel AS3PJHM3/86A (1) 0.10 86A 1500 7" diameter plastic tape and reel AS3PJHM3/87A (1) 0.10 87A 6500 13" diameter plastic tape and reel AS3PJHM3_A/H (1) 0.10 H 1500 7" diameter plastic tape and reel 0.10 I 6500 13" diameter plastic tape and reel AS3PJHM3_A/I (1) DELIVERY MODE Note (1) AEC-Q101 qualified Revision: 27-Jul-15 Document Number: 88837 2 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM www.vishay.com Vishay General Semiconductor RATINGS AND CHARACTERISTICS CURVES (TA = 25 °C unless otherwise noted) 1000 3.5 Instantaneous Reverse Current (μA) TM = 160 °C DC Forward Current (A) 3.0 2.5 TA = 25 °C 2.0 1.5 1.0 TM Measured at the Cathode Band Terminal 0.5 0 TA = 175 °C 100 TA = 125 °C 10 TA = 75 °C 1 TA = 25 °C 0.1 0.01 0 25 50 75 100 125 150 10 175 20 Fig. 1 - Maximum Forward Current Derating Curve 60 70 80 90 100 1000 3.2 Junction Capacitance (pF) D = 0.3 D = 0.2 D = 0.1 2.8 D = 1.0 2.4 2.0 1.6 T 1.2 0.8 D = tp/T 0.4 TJ = 25 °C f = 1.0 MHz Vsig = 50 mVp-p 100 10 tp 1 0 0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 0.1 1 10 100 Reverse Voltage (V) Average Forward Current (A) Fig. 2 - Forward Power Loss Characteristics Fig. 5 - Typical Junction Capacitance 100 100 TA = 175 °C 10 TA = 125 °C TA = 75 °C TA = 25 °C 0.1 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 Instantaneous Forward Voltage (V) Fig. 3 - Typical Instantaneous Forward Characteristics Transient Thermal Impedance (°C/W) Instantaneous Forward Current (A) 50 D = 0.8 D = 0.5 3.6 1 40 Fig. 4 - Typical Reverse Leakage Characteristics 4.0 Average Power Loss (W) 30 Percent of Rated Peak Reverse Voltage (%) Mount Temperature (°C) Junction to Ambient 10 1 0.01 0.1 1 10 100 t - Pulse Duration (s) Fig. 6 - Typical Transient Thermal Impedance Revision: 27-Jul-15 Document Number: 88837 3 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 AS3PD, AS3PG, AS3PJ, AS3PK, AS3PM www.vishay.com Vishay General Semiconductor PACKAGE OUTLINE DIMENSIONS in inches (millimeters) TO-277A (SMPC) 0.187 (4.75) 0.175 (4.45) 0.016 (0.40) 0.006 (0.15) K 0.262 (6.65) 0.250 (6.35) 0.242 (6.15) 0.238 (6.05) 2 1 0.047 (1.20) 0.039 (1.00) 0.171 (4.35) 0.167 (4.25) 0.146 (3.70) 0.134 (3.40) Mounting Pad Layout 0.087 (2.20) 0.075 (1.90) 0.189 (4.80) MIN. 0.189 (4.80) 0.173 (4.40) 0.186 (4.72) MIN. 0.268 (6.80) 0.155 (3.94) NOM. 0.030 (0.75) NOM. 0.049 (1.24) 0.037 (0.94) 0.050 (1.27) MIN. 0.084 (2.13) NOM. 0.053 (1.35) 0.041 (1.05) 0.041 (1.04) 0.055 (1.40) MIN. Conform to JEDEC® TO-277A Revision: 27-Jul-15 Document Number: 88837 4 For technical questions within your region: [email protected], [email protected], [email protected] THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. 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