INFINEON SPP80N06S2L-H5

SPP80N06S2L-H5
SPB80N06S2L-H5
OptiMOS Power-Transistor
Product Summary
Feature
• N-Channel
VDS
• Enhancement mode
R DS(on)
55
ID
• 175°C operating temperature
• dv/dt rated
Package
Ordering Code
Marking
SPP80N06S2L-H5
P- TO220 -3-1
Q67060-S6054
2N06LH5
SPB80N06S2L-H5
P- TO263 -3-2
Q67060-S6055
2N06LH5
Maximum Ratings, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current1)
5
mΩ
80
P- TO263 -3-2
Type
V
A
P- TO220 -3-1
Value
Unit
A
ID
80
TC=25°C
80
ID puls
320
EAS
700
dv/dt
6
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
300
W
-55... +175
°C
Pulsed drain current
TC=25°C
Avalanche energy, single pulse
mJ
ID=80 A , V DD=25V, RGS=25Ω
Reverse diode dv/dt
kV/µs
IS=80A, VDS=44V, di/dt=200A/µs, T jmax=175°C
TC=25°C
Operating and storage temperature
T j , Tstg
IEC climatic category; DIN IEC 68-1
55/175/56
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SPP80N06S2L-H5
SPB80N06S2L-H5
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
0.34
0.5
Thermal resistance, junction - ambient, leaded
RthJA
-
-
62
SMD version, device on PCB:
RthJA
-
-
62
-
-
40
@ min. footprint
@ 6 cm2 cooling area
2)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
55
-
-
VGS(th)
1.2
1.6
2
Static Characteristics
Drain-source breakdown voltage
V
V GS=0V, ID=1mA
Gate threshold voltage, VGS = V DS
ID=230µA
Zero gate voltage drain current
µA
IDSS
V DS=55V, VGS=0V, Tj=25°C
-
0.01
1
V DS=55V, VGS=0V, Tj=125°C
-
1
100
IGSS
-
1
100
nA
RDS(on)
-
5
6.5
mΩ
RDS(on)
-
4
5
Gate-source leakage current
V GS=20V, VDS=0V
Drain-source on-state resistance
V GS=4.5V, I D=80A
Drain-source on-state resistance
V GS=10V, I D=80A
1Current limited by bondwire ; with an RthJC = 0.5K/W the chip is able to carry ID= 170A at 25°C, for detailed
information see app.-note ANPS071E available at www.infineon.com/optimos
2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
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2003-05-09
SPP80N06S2L-H5
SPB80N06S2L-H5
Electrical Characteristics
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
79
157
-
Dynamic Characteristics
Transconductance
gfs
VDS ≥2*ID *RDS(on)max,
S
ID =80A
Input capacitance
Ciss
VGS =0V, VDS =25V,
-
4996
6640 pF
Output capacitance
Coss
f=1MHz
-
1063
1410
Reverse transfer capacitance
Crss
-
276
410
Turn-on delay time
td(on)
VDD =30V, VGS =10V,
-
19
28
Rise time
tr
ID =80A,
-
23
35
Turn-off delay time
td(off)
RG =1.2Ω
-
75
110
Fall time
tf
-
22
33
-
14
18
-
53
80
-
145
190
V(plateau) VDD =44V, ID =80A
-
3
-
V
IS
-
-
80
A
-
-
320
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =44V, ID =80A
VDD =44V, ID =80A,
nC
VGS =0 to 10V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TC=25°C
forward current
Inv. diode direct current, pulsed
ISM
Inverse diode forward voltage
VSD
VGS =0V, IF =80A
-
0.9
1.3
V
Reverse recovery time
trr
VR =30V, IF =lS ,
-
76
95
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
169
210
nC
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2003-05-09
SPP80N06S2L-H5
SPB80N06S2L-H5
1 Power dissipation
2 Drain current
Ptot = f (TC)
ID = f (T C)
parameter: VGS≥ 4 V
parameter: VGS≥ 10 V
SPP80N06S2L-H5
320
SPP80N06S2L-H5
90
A
W
70
60
ID
P tot
240
200
50
160
40
120
30
80
20
40
10
0
0
20
40
60
80
0
100 120 140 160 °C 190
0
20
40
60
80
100 120 140 160 °C 190
TC
TC
3 Safe operating area
4 Max. transient thermal impedance
ID = f ( VDS )
Z thJC = f (t p)
parameter : D = 0 , TC = 25 °C
parameter : D = t p/T
10
3 SPP80N06S2L-H5
10
1 SPP80N06S2L-H5
K/W
A
t = 10.0µs
p
0
2
DS
(on
)
100 µs
R
ID
10
Z thJC
=
V
DS
/I
D
10
10
-1
10
-2
1 ms
10
D = 0.50
0.20
1
0.10
0.05
10
-3
0.02
single pulse
0.01
10
0
10
-1
10
0
10
1
V
10
2
10
-4
10
-7
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
tp
VDS
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2003-05-09
0
SPP80N06S2L-H5
SPB80N06S2L-H5
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (V DS); T j=25°C
RDS(on) = f (I D)
parameter: tp = 80 µs
parameter: VGS
SPP80N06S2L-H5
190
d
h
g
i
f
VGS [V]
ID
160
e
a
3.0
b
3.2
140
c
3.5
d
3.8
120
d e
4.0
f
4.2
g
5.0
h
6.0
i
7.0
100
80
e
mΩ
R DS(on)
A
SPP80N06S2L-H5
16
Ptot = 300W
f
12
10
8
g
6
c
h
60
i
4
40
b
2 VGS [V] =
20
d
3.8
a
0
0
1
2
3
4
V
e
4.0
f
4.2
g
5.0
h
6.0
40
60
i
7.0
0
5.5
0
20
80
100 120 140
A
180
ID
VDS
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( V GS ); V DS≥ 2 x ID x RDS(on)max
g fs = f(I D); T j=25°C
parameter: tp = 80 µs
parameter: g fs
200
160
S
A
160
120
gfs
ID
140
100
120
100
80
80
60
60
40
40
20
20
0
0
1
2
0
V
4
VGS
Page 5
0
20
40
60
80
100
120
A
ID
160
2003-05-09
SPP80N06S2L-H5
SPB80N06S2L-H5
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
RDS(on) = f (Tj)
VGS(th) = f (T j)
parameter : ID = 80 A, VGS = 10 V
parameter: VGS = VDS
SPP80N06S2L-H5
17
3
mΩ
V
V GS(th)
R DS(on)
14
12
10
2
1.15mA
1.5
8
230µA
98%
6
1
typ
4
0.5
2
0
-60
-20
20
60
140 °C
100
0
-60
200
-20
20
60
°C
100
180
Tj
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (V DS)
IF = f (V SD)
parameter: VGS=0V, f=1 MHz
parameter: T j , tp = 80 µs
10
5
10
pF
10
3 SPP80N06S2L-H5
A
4
10
2
10
1
IF
C
Ciss
Coss
10
3
T j = 25 °C typ
Crss
T j = 175 °C typ
T j = 25 °C (98%)
T j = 175 °C (98%)
10
2
0
10
5
10
15
20
V
30
VDS
0
0
0.4
0.8
1.2
1.6
2
2.4 V
3
VSD
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SPP80N06S2L-H5
SPB80N06S2L-H5
13 Typ. avalanche energy
14 Typ. gate charge
E AS = f (T j)
VGS = f (QGate)
par.: I D = 80 A , V DD = 25 V, R GS = 25 Ω
parameter: ID = 80 A pulsed
700
SPP80N06S2L-H5
16
V
mJ
12
EAS
VGS
500
10
0,2 VDS max
400
0,8 VDS max
8
300
6
200
4
100
2
0
25
50
75
100
125
0
°C
175
Tj
0
20
40 60
80 100 120 140 160 180nC 210
QGate
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj)
parameter: ID=10 mA
66
SPP80N06S2L-H5
V(BR)DSS
V
62
60
58
56
54
52
50
-60
-20
20
60
100
140 °C
200
Tj
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2003-05-09
SPP80N06S2L-H5
SPB80N06S2L-H5
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Further information
Please notice that the part number is BSPP80N06S2L-H5 and BSPB80N06S2L-H5, for simplicity the device is referred
to by the term SPP80N06S2L-H5 and SPB80N06S2L-H5 throughout this documentation.
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2003-05-09