GP2S29SVJ00F

GP2S29SVJ00F
GP2S29SVJ00F
Phototransistor Output,
Compact, Case type,
Injection for prism system,
Reflective Photointerrupter
■Description
■Agency approvals/Compliance
GP2S29SVJ00F is a compact reflective type
photointerrupter of phototransistor output.
Emitter and detector are installed to be oriented in the
same direction in a case.
This product detects an object between this product
and a prism placed on the opposite side.
This product has mounting hole for screwing to a
substrate.
1. Compliant with RoHS directive (2002/95/EC)
■Applications
1. Detection of object presence or motion.
Example : printer, optical storage
■Features
1. Reflective with Phototransistor Output
2. Highlights :
• Injection for prism system
• Compact size
• screw mounting type
3. Key Parameters :
• Space between prism and sensor : 8mm
• Package : 5.5 × 8 × 3.5mm
4. RoHS directive compliant
Notice
The content of data sheet is subject to change without prior notice.
In the absence of confirmation by device specification sheets, SHARP takes no responsibility for any defects that may occur in equipment using any SHARP
devices shown in catalogs, data books, etc. Contact SHARP in order to obtain the latest device specification sheets before using any SHARP device.
Sheet No.: OP14032EN
1
GP2S29SVJ00F
■Internal Connection Diagram
■Outline
Drawing No. CY15090i02
Unit : mm
Note
1) Unspecified tolerance shall be ±0.15.
2) Dimensions in parenthesis are shown for reference.
3) The dimensions indicated by ※ refer to the those measured from the lead base.
4) Marking date code with silver.
Sheet No.: OP14032EN
2
GP2S29SVJ00F
■Absolute maximum ratings
Parameter
Input
Symbol
Rating
Ta=25°C
Unit
*1
Forward current
IF
50
mA
*1,2
Peak forward current
IFM
1
A
Reverse voltage
VR
6
V
P
75
mW
Collector-emitter voltage
VCEO
35
V
Emitter-collector voltage
VECO
6
V
Icp
20
mA
*1
Output
Power dissipation
Collector current
*1
Collector power dissipation
Pc
75
mW
Total power dissipation
Ptot
100
mW
*1
Operating temperature
Topr
-25 to +85
°C
Storage temperature
Tstg
-40 to +100
°C
Soldering temperature
Tsol
260
°C
*3
*1 The derating factors of absolute maximum ratings due to ambient temperature are shown in Fig.1,2,3.
*2 Pulse width ≦ 100μs, Duty ratio : 0.01
*3 For 3s
■Electro-optical Characteristics
Parameter
Forward voltage
Symbol
VF
Conditions
IF=20mA
Input
Peak forward current
VFM
IR
Output
*4
Reverse current
Collector dark current
Peak collector current
ICEO
Icp
VR=3V
VCE=20V
VCE=5V, IF=20mA
*5
Leak current
ILEAK
VCE=5V, IF=20mA
S/N
ICP/ILEAK
*4
Output ratio
Collector-emitter
saturation voltage
(Rise)
Transfer
characteristics
IFM=0.5A
VCE(sat)
tr
Ta=25°C
MAX. Unit
1.4
V
MIN.
-
TYP.
1.25
-
3
4
V
0.4
-
10
100
3.0
μA
nA
mA
-
-
10
μA
100
-
-
-
IC = 0.1mA, IF = 40mA
-
0.1
0.4
V
VCE=2V, Ic=0.5mA
-
38
90
μs
(Fall)
tf
RL=1000Ω, d=8mm
48
110
μs
*4 The conditions and arrangement of the reflective object are shown below.
(Move a prism, the maximum of collector current is ICP.)
[Test arrangement for Peak collector current]
Peak collector current position shall be less than ±1 mm
Prism (Material : BK7)
from a prism center.
Thickness 6mm
*5 The conditions and arrangement of the reflective object are
6mm
6mm
shown below.
[Test circuit for response time]
Non reflective
Thin film
Prism
8mm
Vcc
RL
Input
[Test arrangement for leak current]
Test pin
10%
Al evaporated surface
90%
Al evaporated glass
Output
□10mm
1mm
4mm
tr
tf
Sheet No.: OP14032EN
3
GP2S29SVJ00F
Fig.1
Forward current vs. ambient temperature
Forward current IF [mA]
50
40
30
20
10
0
-25
0
Power dissipation Pc, Ptot [mW]
Fig.2
25
50
Ambient temperature Ta [°C]
75
85
100
Collector power dissipation vs. ambient temperature
Total power dissipation
100
75
Collector power
dissipation
80
60
40
15
20
0
-25
0
25
50
75
85
100
Ambient temperature Ta[°C]
Fig.3
Peak forward current vs. duty ratio
(Pulse width ≦ 100μs
Peak forward current IFM [mA]
2000
Ta = 25°C)
1000
500
200
100
50
20
10-3
2
5
10-2
2
5
10-1
2
5
100
Duty ratio
Sheet No.: OP14032EN
4
GP2S29SVJ00F
■Supplements
●ODS materials
This product shall not contain the following materials.
Also, the following materials shall not be used in the production process for this product.
Materials for ODS : CFCS, Halon, Carbon tetrachloride, 1.1.1-Trichloroethane (Methylchloroform)
●Specified brominated flame retardants
Specified brominated flame retardants (PBB and PBDE) are not used in this device at all.
●Compliance with each regulation
1) The RoHS directive(2002/95/EC)
This product complies with the RoHS directive(2002/95/EC).
Object substances: mercury, lead, cadmium, hexavalent chromium, polybrominated biphenyls (PBB)
and polybrominated diphenyl ethers (PBDE)
2) Content of six substances specified in Management Methods for Control of Pollution Caused by Electronic
Information Products Regulation (Chinese : 电子信息产品污染控制管理办法).
Toxic and hazardous substances
Hexavalent
Polybrominated
Polybrominated
Category
Lead
Mercury
Cadmium
chromium
biphenyls
diphenyl ethers
(Pb)
(Hg)
(Cd)
(Cr6+)
(PBB)
(PBDE)
Photointerrupter
✓
✓
✓
✓
✓
✓
✓ : indicates that the content of the toxic and hazardous substance in all the homogeneous materials of the part is
below the concentration limit requirement as described in SJ/T 11363-2006 standard.
●Product mass : Approx. 0.28g
●Country of origin : Japan and China
Sheet No.: OP14032EN
5
GP2S29SVJ00F
■Notes
●Circuit design
In circuit designing, make allowance for the degradation of the light emitting diode output that results
from long continuous operation. (50% degradation/5 years)
●Prevention of faulty operation
To prevent photointerrupter from faulty operation caused by external light, do not set the detecting face to the
external light.
●Soldering
Mounting to PCB is as follows.
Solder in state of lead pins being
incompletely stuck to PCB
Solder in state of lead pins being
completely stuck to PCB
Connection on the FPC board for lead pins not to be pressed, or cable connection through small sub board.
Soldering GP2S29SVJ00F perpendicularly to the board is also recommended.
FPC board or
small sub board
Soldering the board perpendicularly to
GP2S29SVJ00F
●Cleaning
Cleaning shall be carried out as below to avoid remaining of solvent, solder and flux on the device.
(1) Solvent cleaning : Solvent temperature 45°C or less Immersion for 3 min or less
(2) Ultrasonic cleaning : Please don't carry out ultrasonic cleaning.
(3) Dust and stain shall clean by air blow, or shall clean by soft cloth soaked in washing materials.
(4) The cleaning shall be carried out with solvent below.
Solvent : Ethyl alcohol, Methyl alcohol
●Fixing
If a φ2.0 hole is used to fix the device, use in a tightening torque of 0.1N ・m or less.
●Characteristic of S/N is improved by shortening the detecting distance between GP2S29SVJ00F and detected object
(paper etc.) which goes through between GP2S29SVJ00F and prism, therefore, the distance between
GP2S29SVJ00F and prism, and the distance between GP2S29SVJ00F and detected object should be as short as
possible in a designing.
●GP2S29SVJ00F cannot detect paper directly, so using prism is necessary.
Sheet No.: OP14032EN
6
GP2S29SVJ00F
■Parts
This product uses the below parts.
● Light detector (Quantity: 1)
Type
Material
Maximum sensitivity
(nm)
Sensitivity
(nm)
Response time
(μs)
Phototransistor
Silicon
(Si)
930
700 to 1200
38
● Light emitter
(Quantity: 1)
Type
Material
Maximum light emitting
wavelength (nm)
I/O Frequency
(MHz)
Infrared light emitting diode
(non-coherent)
GaAs
950
0.3
● Material
Case
Lead frame
Lead frame plating
Black PBT resin
(UL94V-0)
Fe
Palladium (Au flash plating)
● Others
This product shall not be proof against radiation flux.
Sheet No.: OP14032EN
7
GP2S29SVJ00F
■Packaging
Drawing No. CY15091i09
1) Package materials
No.
Name
1
Packing case
2
Sleeve
3
Stopper A, B
4
Cellophane tape
Material
Corrugated cardboard
Transparent HIPS
Gray rubber
-
Quantity
1
40
Each 40
-
2) Packaging numbers
MAX. 50 pieces per sleeve
MAX. 2,000 pieces per case
(Total mass : Approx. 1200g)
3) Indication items
The contents of the carton indication conforms to EIAJ C-3 and the following items are indicated.
Model No., Internal production control name, Quantity, Packing date, Corporate name, Country of origin.
4) Package specifications
1. MAX. 50pcs. of products shall be packaged in sleeve. <Fig. 1>
2. MAX. 40 sleeve (10lines × 4stairs) above shall be packaged in outer case. <Fig. 2>
3. Seal device case with tape and indicates Model No., Internal production control name,
Quantity, Packing date, Corporate name, Country of origin. <Fig. 2>
Sheet No.: OP14032EN
8
GP2S29SVJ00F
■Important Notices
· The circuit application examples in this publication are
provided to explain representative applications of SHARP
devices and are not intended to guarantee any circuit design or
license any intellectual property rights. SHARP takes no
responsibility for any problems related to any intellectual
property right of a third party resulting from the use of SHARP's
devices.
with equipment that requires higher reliability such as:
--- Transportation control and safety equipment (i.e.,
aircraft, trains, automobiles, etc.)
--- Traffic signals
--- Gas leakage sensor breakers
--- Alarm equipment
--- Various safety devices, etc.
(iii) SHARP devices shall not be used for or in connection with
equipment that requires an extremely high level of reliability and
safety such as:
--- Space applications
--- Telecommunication equipment [trunk lines]
--- Nuclear power control equipment
--- Medical and other life support equipment (e.g.,
scuba).
· Contact SHARP in order to obtain the latest device specification
sheets before using any SHARP device. SHARP reserves the
right to make changes in the specifications, characteristics, data,
materials, structure, and other contents described herein at any
time without notice in order to improve design or reliability.
Manufacturing locations are also subject to change without
notice.
· Observe the following points when using any devices in this
publication. SHARP takes no responsibility for damage caused
by improper use of the devices which does not meet the
conditions and absolute maximum ratings to be used specified in
the relevant specification sheet nor meet the following
conditions:
(i) The devices in this publication are designed for use in general
electronic equipment designs such as:
--- Personal computers
--- Office automation equipment
--- Telecommunication equipment [terminal]
--- Test and measurement equipment
--- Industrial control
--- Audio visual equipment
--- Consumer electronics
(ii) Measures such as fail-safe function and redundant design
should be taken to ensure reliability and safety when SHARP
devices are used for or in connection
· If the SHARP devices listed in this publication fall within the
scope of strategic products described in the Foreign Exchange
and Foreign Trade Law of Japan, it is necessary to obtain
approval to export such SHARP devices.
· This publication is the proprietary product of SHARP and is
copyrighted, with all rights reserved. Under the copyright laws,
no part of this publication may be reproduced or transmitted in
any form or by any means, electronic or mechanical, for any
purpose, in whole or in part, without the express written
permission of SHARP. Express written permission is also
required before any use of this publication may be made by a
third party.
· Contact and consult with a SHARP representative if there are
any questions about the contents of this publication.
Sheet No.: OP14032EN
9