MMBT3904N3T5(SOT-883)2015.01 L01

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PRIMARY CHARACTERISTICS
PD
SOT-883
250mW
Marking Code: 1A
VCEO
40Vdc
IC
200mAdc
VCE(sat)
0.2Vdc
hFE
100~300
TJ Max
150℃
MARKING DIAGRAM
3
1A
M
1A M
2
1
= Device Code
= Date Code
PACKAGE
3
Date Code List
Month Odd Year Even Year
Jan
1
E
Feb
2
F
Mar
3
H
Apr
4
J
May
5
K
Jun
6
L
Jul
7
N
Aug
8
P
Sep
9
U
Oct
T
X
Nov
V
Y
Dec
C
Z
2
1
3
COLLECTOR
1
BASE
2
EMITTER
FEATURES


MECHANICAL DATA
We declare that the material of

CASE:Molded Glass SOT-883
product requirements.

POLARITY:See diagram above
Moisture Sensitivity Level 1

TERMINALS:Solderable per
MIL-STD-750, Method 2026

MOUNTING POSITION : Any
MAXIMUM RATINGS
Rating
Symbol
Value
Unit
Collector–Emitter Voltage
V
CEO
40
Vdc
Collector–Base Voltage
V
CBO
60
Vdc
Emitter–Base Voltage
V
EBO
6.0
Vdc
200
mAdc
Collector Current — Continuous
IC
THERMAL CHARACTERISTICS
Characteristic
Total Device Dissipation FR– 5 Board, (1)
TA = 25°C
Derate above 25°C
Thermal Resistance, Junction to Ambient
Junction and Storage Temperature
Symbol
Max
Unit
PD
250
mW
RθJA
2
500
mW/°C
°C/W
TJ , Tstg
–55 to +150
°C
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted.)
Characteristic
Symbol
Min
Max
Unit
V (BR)CEO
40
—
Vdc
V (BR)CBO
60
—
Vdc
V (BR)EBO
6.0
—
Vdc
Base Cutoff Current
I BL
—
50
nAdc
( V CE= 30 Vdc, V EB = 3.0 Vdc, )
Collector Cutoff Current
I CEX
—
50
nAdc
OFF CHARACTERISTICS
Collector–Emitter Breakdown Voltage(2)
(I C = 1.0 mAdc)
Collector–Base Breakdown Voltage
(I C = 10 µAdc)
Emitter–Base Breakdown Voltage
(I E = 10 µAdc)
( V CE = 30Vdc, V EB = 3.0Vdc )
1. FR–5 = 1.0 x 0.75 x 0.062 in.
2. Pulse Test: Pulse Width <300 µs, Duty Cycle <2.0%.
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ELECTRICAL CHARACTERISTICS (T A = 25°C unless otherwise noted) (Continued)
Characteristic
Symbol
Min
Max
Unit
40
70
100
60
30
––
––
300
––
––
––
––
0.2
0.3
0.65
––
0.85
0.95
fT
300
––
MHz
C obo
––
4.0
pF
C ibo
––
8.0
pF
h ie
1.0
10
kW
h re
0.5
8.0
X10 –4
h fe
100
400
—
h oe
1.0
40
NF
—
5.0
td
tr
ts
tf
—
—
—
—
35
35
200
50
ON CHARACTERISTICS (3)
DC Current Gain(1)
(I C =0.1 mAdc, V CE =1.0 Vdc)
(I C = 1.0 mAdc, V CE = 1.0 Vdc)
(I C = 10 mAdc, V CE = 1.0 Vdc)
(I C = 50mAdc, V CE = 1.0Vdc)
(I C = 100mAdc, V CE =1.0 Vdc)
Collector–Emitter Saturation Voltage
(I C = 10 mAdc, I B = 1.0 mAdc)(3)
(I C = 50 mAdc, I B = 5.0mAdc)
Base–Emitter Saturation Voltage(3)
(I C = 10 mAdc, I B = 1.0mAdc)
(I C = 50mAdc, I B = 5.0mAdc )
hFE
VCE(sat)
V BE(sat)
––
Vdc
Vdc
SMALL–SIGNAL CHARACTERISTICS
Current–Gain — Bandwidth Product
(I C = 10mAdc, V CE= 20Vdc, f = 100MHz)
Output Capacitance
(V CB = 5.0Vdc, I E = 0, f = 1.0 MHz)
Input Capacitance
(VEB = 0.5Vdc, I C = 0, f = 1.0 MHz)
Input Impedancen
(V CE = 10Vdc, I C = 1.0mAdc, f = 1.0 kHz)
Voltage Feedback Ratio
(V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz)
Small–Signal Current Gain
(V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz)
Output Admittance
(V CE = 10 Vdc, I C = 1.0 mAdc, f = 1.0 kHz)
Noise Figure
(V CE = 5.0 Vdc, I C = 100µAdc, R S = 1.0 k Ω, f = 1.0 kHz)
mmhos
dB
SWITCHING CHARACTERISTICS
Delay Time
Rise Time
Storage Time
Fall Time
(V CC = 3.0 Vdc,V BE = –0.5Vdc
I C = 10 mAdc, I B1 = 1.0mAdc)
(V CC = 3.0Vdc,
I C = 10 mAdc,I B1 = I B2 = 1.0 mAdc)
ns
ns
3. Pulse Test: Pulse Width <300 µs, Duty Cycle <2.0%.
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DUTY CYCLE = 2%
300 ns
+3 V
+10.9 V
10 < t1 < 500 ms
DUTY CYCLE = 2%
275
t1
+3 V
+10.9 V
275
10 k
10 k
0
-0.5 V
CS < 4 pF*
< 1 ns
CS < 4 pF*
1N916
-9.1 V′
< 1 ns
* Total shunt capacitance of test jig and connectors
Figure 1. Delay and Rise Time
Equivalent Test Circuit
Figure 2. Storage and Fall Time
Equivalent Test Circuit
ELECTRICAL CHARACTERISTIC CURVES
(Ta = 25°C)
1000
hFE, DC CURRENT GAIN
600
td@Vob=1V,
IC/IB=10
500
TIME (ns)
400
300
VCE=1V
100
200
100
10
0
0
50
100
150
200
250
1
10
IC, COLLECTOR CURRENT (mA)
Vcc=0V
Vcc=2V
Vcc=3V
Vcc=15V
Vcc=40V
1000
-55℃
25℃
75℃
100℃
125℃
Fig.4 DC CURRENT GAIN
Fig.3 TURN-ON TIME
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100
IC, COLLECTOR CURRENT (mA)
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ELECTRICAL CHARACTERISTIC CURVES
(Ta = 25°C)
0.3
600
VCE(sat), COLLECTOR-EMITTER
SATURATION VOLTAGE(V)
t r, RISE TIME (ns)
IC/IB=10
Vcc=40V ,
IC/IB=10
500
400
300
200
100
0
0
50
100
150
200
0.25
0.2
0.15
0.1
0.05
0
0.001
250
0.01
1
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (mA)
25℃
0.1
125℃
-55℃
25℃
75℃
100℃
125℃
Fig.6 COLLECTOR EMITTER SATURATION
Fig.5 RISE TIME
VOLTAGE VS. COLLECTOR CURRENT
1000
1.4
IC/IB=10
100
10
1
0
50
100
150
200
250
1.2
1
VOLTAGE(V)
VBE(sat), BASE-EMITTER SATURATION
t s, STORAGE TIME (ns)
ts'=ts-1/8tf
IB1=IB2
0.8
0.6
0.4
0.2
0
0.0001
IC/IB=10 125℃
IC/IB=20 25℃
IC/IB=10 25℃
Fig.7 STORAGE TIME
0.01
0.1
1
IC, COLLECTOR CURRENT (A)
IC, COLLECTOR CURRENT (mA)
IC/IB=20 125℃
0.001
-55℃
25℃
75℃
100℃
125℃
Fig.8 BASE EMITTER SATURATION VOLTAGE
VS. COLLECTOR CURRENT
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ELECTRICAL CHARACTERISTIC CURVES
(Ta = 25°C)
1000
1.4
VBE(on), BASE-EMITTER VOLTAGE(V)
Vcc=40V,
IB1=IB2
t f , FALL TIME (ns)
100
10
1
0
50
100
150
200
VCE=1V
1.2
1
0.8
0.6
0.4
0.2
0
0.0001
250
0.001
IC, COLLECTOR CURRENT (mA)
IC/IB=20 125℃
IC/IB=10 125℃
IC/IB=20 25℃
IC/IB=10 25℃
0.01
0.1
1
IC, COLLECTOR CURRENT (A)
-55℃
25℃
75℃
100℃
125℃
Fig.10 BASE EMITTER VOLTAGE VS.
Fig.9 FALL TIME
COLLECTOR CURRENT
1000
4.5
VCE=1V
CAPACITANCE (pF)
3.5
3
2.5
2
1.5
1
100
PRODUCT (MHz)
fT,CURRENT-GAIN-BANDWIDTH
4
10
0.5
0
1
0
10
20
30
40
50
0.1
REVERSE BIAS VOLTAGE (V)
Cib(pF)
1
10
100
1000
IC, COLLECTOR CURRENT (mA)
Cob(pF)
Fig.11 CAPACITANCE
Fig.12 CURRENT GAIN BANDWIDTH PRODUCT
VS.COLLECTOR CURRENT
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Outline Drawing
DIMENSION OUTLINE:
SOT-3
Unit:mm
Dimensions in inches and (millimeters)
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Ordering Information: Device PN DDdϯϵϬϰEϯdϱ ‐T(1) ,(2)‐WS Note: (1) Packing code, Tape & Reel Packing
Packing Tape&Reel: ϭϬ Kpcs/Reel
(2) Halogen free product for packing code suffix “H” ***Disclaimer***
WILLAS reserves the right to make changes without notice to any product
specification herein, to make corrections, modifications, enhancements or other
changes. WILLAS or anyone on its behalf assumes no responsibility or liability
for any errors or inaccuracies. Data sheet specifications and its information
contained are intended to provide a product description only. "Typical" parameters
which may be included on WILLAS data sheets and/ or specifications can
and do vary in different applications and actual performance may vary over time.
WILLAS does not assume any liability arising out of the application or
use of any product or circuit.
This is the preliminary specification. WILLAS products are not designed, intended or
authorized for use in medical, life-saving implant or other applications intended for
life-sustaining or other related applications where a failure or malfunction of component
or circuitry may directly or indirectly cause injury or threaten a life without expressed
written approval of WILLAS. Customers using or selling WILLAS components for use in
such applications do so at their own risk and shall agree to fully indemnify WILLAS Inc
and its subsidiaries harmless against all claims, damages and expenditures.
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