UT54ACTS245E Octal Bus Transceiver with Three-State Outputs July 20013 www.aeroflex.com/Logic Datasheet FEATURES PINOUTS Three-state outputs drive bus line directly m CRH CMOS process - Latchup immune High speed Low power consumption Wide power supply operating range of 3.0V to 5.5V Available QML Q or V processes Flexible package - 20-lead flatpack UT54ACTS245E-SMD-5962-96573 20-Lead Flatpack Top View DESCRIPTION The UT54ACTS245E is a non-inverting octal bus transceiver designed for asynchronous two-way communication between data buses. The control function implementation minimizes external timing requirements. The device allows data transmission from the A bus to the B bus or from the B bus to the A bus depending upon the logic level at the direction control (DIR) input. The enable input (G) disables the device so that the buses are effectively isolated. 20 VDD 2 19 G A2 3 18 B1 A3 A4 4 5 17 16 B2 B3 A5 6 15 B4 A6 7 14 B5 A7 A8 VSS 8 9 10 13 12 11 B6 B7 B8 G DIR A1 FUNCTION TABLE ENABLE G DIRECTION CONTROL DIR OPERATION L L B Data To A Bus L H A Data To B Bus X 1 A1 LOGIC SYMBOL The device is characterized over full HiRel temperature range of -55C to +125C. H DIR A2 A3 A4 A5 A6 A7 Isolation A8 (19) (1) (2) (3) G3 3 EN1 (BA) 3 EN2 (AB) (18) 1 B1 2 (17) (4) (16) (5) (6) (15) (7) (8) (9) (14) B2 B3 B4 B5 (13) B6 (12) B7 (11) B8 Note: 1. Logic symbol in accordance with ANSI/IEEE Std 91-1984 and IEC Publication 617-12. 1 LOGIC DIAGRAM DIR (1) (19) A1 (18) A2 B6 (8) (12) A8 B5 (7) (13) A7 B4 (6) (14) A6 B3 (5) (15) A5 B2 (4) (16) A4 B1 (3) (17) A3 G (2) B7 (9) (11) 2 B8 OPERATIONAL ENVIRONMENT1 PARAMETER LIMIT UNITS Total Dose 1.0E6 rads(Si) SEU Threshold 2 108 MeV-cm2/mg SEL Threshold 120 MeV-cm2/mg Neutron Fluence 1.0E14 n/cm2 Notes: 1. Logic will not latchup during radiation exposure within the limits defined in the table. 2. Device storage elements are immune to SEU affects. ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER LIMIT UNITS VDD Supply voltage -0.3 to 7.0 V VI/O Voltage any pin -.3 to VDD +.3 V TSTG Storage Temperature range -65 to +150 C TJ Maximum junction temperature +175 C TLS Lead temperature (soldering 5 seconds) +300 C JC Thermal resistance junction to case 15 C/W II DC input current 10 mA PD2 Maximum package power dissipation 3.3 W o permitted @ Tc = +125 C Note: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Per MIL-STD-883, method 1012.1, section 3.4.1, PD=(Tj(max) - Tc(max)) / jc RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMIT UNITS VDD Supply voltage 3.0 to 5.5 V VIN Input voltage any pin 0 to VDD V TC Temperature range -55 to +125 C 3 DC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS245E7 ( VDD = 3.0V to 5.5V; VSS = 0V6; -55C < TC < +125C) SYMBOL DESCRIPTION CONDITION MIN MAX UNIT VIL1 Low-level input voltage 1 VDD from 4.5V to 5.5V 0.8 V VIL2 Low-level input voltage 1 VDD from 3.0V to 3.6V 0.8 V VIH1 High-level input voltage 1 VDD from 4.5V to 5.5V 0.5 VDD V VIH2 High-level input voltage 1 VDD from 3.0V to 3.6V 2.0 V Input leakage current VIN = VDD or VSS -1 Low-level output voltage 3 IOL = 12mA IIN VOL1 1 A 0.4 V 0.4 V VDD = 4.5V to 5.5V VOL2 Low-level output voltage 3 IOL = 8mA VDD = 3.0V to 3.6V VOH1 High-level output voltage 3 IOH = -12mA 0.7 VDD V 2.4 V VDD from 4.5V to 5.5V VOH2 High-level output voltage 3 IOH = -8mA VDD from 3.0V to 3.6V IOS1 Short-circuit output current 2 ,4 VO = VDD and VSS -300 300 mA -200 200 mA VDD from 4.5V to 5.5V IOS2 Short-circuit output current 2 ,4 VO = VDD and VSS VDD from 3.0V to 3.6V IOL1 Low level output current 9 VIN = VDD or VSS 12 mA 8 mA -12 mA -8 mA VOL = 0.4V VDD from 4.5V to 5.5V IOL2 Low level output current 9 VIN = VDD or VSS VOL = 0.4V VDD from 3.0V to 3.6V IOH1 High level output current 9 VIN = VDD or VSS VOH = VDD-0.4V VDD from 4.5V to 5.5V IOH2 High level output current 9 VIN = VDD or VSS VOH = VDD-0.4V VDD from 3.0V to 3.6V 4 IOZH Three-state output leakage current, high G = 5.5V; for all other inputs 30 A -30 A 1.5 mW/ MHZ .75 mW/ MHZ 10 A 1.6 mA VIN = VDD or VSS; VOUT = VDD VDD = 5.5V IOZL Three-state output leakage current, low G = 5.5V; for all other inputs VIN = VDD or VSS; VOUT = VSS VDD = 5.5V Ptotal1 Power dissipation 2, 8 CL = 50pF VDD = 4.5V to 5.5V Ptotal2 Power dissipation 2, 8 CL = 50pF VDD = 3.0V to 3.6V IDDQ Quiescent Supply Current VIN = VDD or VSS VDD from 3.0V to 5.5V IDDQ Quiescent Supply Current For input under test Delta VIN = VDD -2.1V For all other inputs VIN = VDD or VSS VDD = 5.5V CIN COUT Input capacitance 5 = 1MHz, VDD = 0V 15 pF Output capacitance 5 = 1MHz, VDD = 0V 15 pF Notes: 1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%, - 50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed to VIH(min) and VIL(max). 2. Supplied as a design limit but not guaranteed or tested. 3. Per MIL-PRF-38535, for current density 5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765 pF/MHz. 4. Not more than one output may be shorted at a time for maximum duration of one second. 5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS at frequency of 1MHz and a signal amplitude of 50mV rms maximum. 6. Maximum allowable relative shift equals 50mV. 7. All specifications valid for the maximum radiation dose available for the respective device types. 8. Power does not include power contribution of any TTL output sink current. 9. Guaranteed by characterization, but not tested. 5 AC ELECTRICAL CHARACTERISTICS FOR UT54ACTS2452 (VDD = 3.0V to 5.5V; VSS = 0V 1, -55C < TC < +125C) SYMBOL tPHL1 tPLH2 tPZH1 tPZL2 tPHZ3 tPLZ3 PARAMETER Data to bus Data to bus G low to bus active G low to bus active G high to bus three-state G high to bus three-state CONDITION VDD CL = 50pF 3.0V to 3.6V CL = 50pF CL = 50pF CL = 50pF CL = 50pF CL = 50pF MAXIMUM UNIT 3 23 ns 4.5V to 5.5V 2 13 3.0V to 3.6V 2 18 4.5V to 5.5V 1 11 3.0V to 3.6V 2 15 4.5V to 5.5V 2 10 3.0V to 3.6V 2 14 4.5V to 5.5V 2 9 3.0V to 3.6V 3 16 4.5V to 5.5V 3 12 3.0V to 3.6V 2 10 4.5V to 5.5V 2 9 Notes: 1. Maximum allowable relative shift equals 50mV. 2. All specifications valid for the maximum radiation dose available for the respective device types. 6 MINIMUM ns ns ns ns ns Packaging 1. All exposed metallized areas are gold plated over electroplated nickel per MIL-PRF-38535. 2. The lid is electrically connected to VSS. 3. Lead finishes are in accordance with MIL-PRF38535. 4. Dimension symbol is in accordance with MILPRF-38533. 5. Lead position and colanarity are not measured. Figure 1. 20-lead Flatpack 7 Ordering Information: UT54ACTS245E: SMD 5962 * ***** ** * * * Lead Finish: (Notes 1 & 2) A = Solder C = Gold X = Optional Package Type: X = 20-lead ceramic bottom-brazed dual-in-line Flatpack Class Designator: Q = QML Class Q V = QML Class V Device Type: 02 = 1 rad(Si)/sec 03 = 50 to 300 rads(Si)/sec Drawing Number: 96573 = UT54ACTS245E Total Dose: (Note 3 and 4) R = 1E5 rads(Si) F = 3E5 rads(Si) G = 5E5 rads(Si) H = 1E6 rads(Si) Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3. Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening. For prototype inquiries, contact factory. 4. Device type 02 is only offered with a TID tolerance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test Method 1019 Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E5 rads(Si), 3E5 rads(Si), and 5E5 rads(Si), and is tested in accordance with MIL-STD-883 Test Method 1019 Condition A. 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