UT54ACTS20E Dual 4-Input NAND Gates December 2014 www.aeroflex.com/Logic Advanced Datasheet FEATURES . • 0.6μm CRH CMOS Process • • • • • • - Latchup immune High speed PINOUT 14-Lead Flatpack Top View Low power consumption Wide power supply operating range of 3.0V to 5.5V Available QML Q or V processes A1 1 14 14-lead flatpack B1 VDD 2 13 D2 UT54ACTS20E - SMD 5962-96527 NC 3 12 C2 C1 4 11 D1 5 10 NC B2 Y1 6 9 A2 VSS 7 8 Y2 DESCRIPTION The UT54ACTS20E are dual 4-input NAND gates. The circuits perform the Boolean functions Y = A⋅B⋅C⋅D or Y = A+B+C+D in positive logic. The device is characterized over full military temperature range of -55°C to +125°C. LOGIC DIAGRAM FUNCTION TABLE OUTPUT INPUTS A B C D Y H H H H L L X X X H X L X X H X X L X H X X X L H LOGIC SYMBOL A1 B1 C1 D1 A2 B2 C2 D2 (1) (2) (4) A1 B1 C1 D1 Y1 A2 B2 C2 D2 Y2 & (6) (5) Y1 (9) (10) (12) (13) (8) Y2 Note: 1. Logic symbol in accordance with ANSI/IEEE standard 91-1984 and IEC Publication 617-12. 36-00-04-003 Ver. 1.0.0 1 Aeroflex Microelectronics Solutions - HiRel OPERATIONAL ENVIRONMENT 1 PARAMETER LIMIT UNITS Total Dose 1.0E6 rads(Si) SEU Threshold 2 108 MeV-cm2/mg SEL Threshold 120 MeV-cm2/mg Neutron Fluence 1.0E14 n/cm2 Notes: 1. Logic will not latchup during radiation exposure within the limits defined in the table. 2. Device storage elements are immune to SEU affects. ABSOLUTE MAXIMUM RATINGS SYMBOL PARAMETER LIMIT UNITS VDD Supply voltage -0.3 to 7.0 V VI/O Voltage any pin -0.3 to VDD + 0.3 V TSTG Storage Temperature range -65 to +150 °C TJ Maximum junction temperature +175 °C TLS Lead temperature (soldering 5 seconds) +300 °C ΘJC Thermal resistance junction to case 15.5 °C/W II DC input current ±10 mA PD2 Maximum package power dissipation 3.2 W o permitted @ Tc = +125 C Note: 1. Stresses outside the listed absolute maximum ratings may cause permanent damage to the device. This is a stress rating only, functional operation of the device at these or any other conditions beyond limits indicated in the operational sections is not recommended. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. 2. Per MIL-STD-883, method 1012.1, Section 3.4.1, PD = (Tj(max) - Tc(max) ) / Θjc RECOMMENDED OPERATING CONDITIONS SYMBOL PARAMETER LIMIT UNITS VDD Supply voltage 3.0 to 5.5 V VIN Input voltage any pin 0 to VDD V TC Temperature range -55 to +125 °C 36-00-04-003 Ver. 1.0.0 2 Aeroflex Microelectronics Solutions - HiRel DC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS20E7 ( VDD = 3.0V to 5.5V; VSS = 0V6; -55°C < TC < +125°C) SYMBOL DESCRIPTION CONDITION MIN MAX UNIT VIL1 Low-level input voltage 1 VDD from 4.5V to 5.5V 0.8 V VIL2 Low-level input voltage 1 VDD from 3.0V to 3.6V 0.8 V VIH1 High-level input voltage 1 VDD from 4.5V to 5.5V 0.5 VDD V VIH2 High-level input voltage 1 VDD from 3.0V to 3.6V 2.0 V Input leakage current VIN = VDD or VSS -1 Low-level output voltage 3 IOL = 8mA IIN VOL1 1 μA 0.4 V 0.4 V VDD = 4.5V to 5.5V VOL2 Low-level output voltage 3 IOL = 6mA VDD = 3.0V to 3.6V VOH1 High-level output voltage 3 IOH = -8mA 0.7 VDD V 2.4 V VDD from 4.5V to 5.5V VOH2 High-level output voltage 3 IOH = -6mA VDD from 3.0V to 3.6V IOS1 Short-circuit output current 2 ,4 VO = VDD and VSS -200 +200 mA -100 +100 mA VDD from 4.5V to 5.5V IOS2 Short-circuit output current 2 ,4 VO = VDD and VSS VDD from 3.0V to 3.6V IOL1 Low level output current 10 VIN = VDD or VSS +8 mA +6 mA -8 mA VOL = 0.4V VDD from 4.5V to 5.5V IOL2 Low level output current 10 VIN = VDD or VSS VOL = 0.4V VDD from 3.0V to 3.6V IOH1 High level output current 10 VIN = VDD or VSS VOH = VDD-0.4V VDD from 4.5V to 5.5V 36-00-04-003 Ver. 1.0.0 3 Aeroflex Microelectronics Solutions - HiRel IOH2 High level output current10 VIN = VDD or VSS -6 mA VOH = VDD-0.4V VDD from 3.0V to 3.6V Ptotal1 Power dissipation 2, 8, 9 CL = 50pF 1.1 mW/ MHz 0.5 mW/ MHz 25 μA 1.6 mA 15 pF 15 pF VDD = 4.5V to 5.5V Ptotal2 Power dissipation 2, 8, 9 CL = 50pF VDD = 3.0V to 3.6V IDDQ Quiescent Supply Current VIN = VDD or VSS VDD from 3.6V to 5.5V ΔIDDQ Quiescent Supply Current Delta For input under test VIN = VDD - 2.1V For all other inputs VIN = VDD or VSS VDD = 5.5V CIN Input capacitance 5 ƒ = 1MHz VDD = 0V COUT Output capacitance 5 ƒ = 1MHz VDD = 0V Notes: 1. Functional tests are conducted in accordance with MIL-STD-883 with the following input test conditions: VIH = VIH(min) + 20%, - 0%; VIL = VIL(max) + 0%, 50%, as specified herein, for TTL, CMOS, or Schmitt compatible inputs. Devices may be tested using any input voltage within the above specified range, but are guaranteed to VIH(min) and VIL(max). 2. Supplied as a design limit but not guaranteed or tested. 3. Per MIL-PRF-38535, for current density ≤5.0E5 amps/cm2, the maximum product of load capacitance (per output buffer) times frequency should not exceed 3,765pF/ MHz. 4. Not more than one output may be shorted at a time for maximum duration of one second. 5. Capacitance measured for initial qualification and when design changes may affect the value. Capacitance is measured between the designated terminal and VSS at frequency of 1MHz and a signal amplitude of 50mV rms maximum. 6. Maximum allowable relative shift equals 50mV. 7.For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883, method 1019, condition A up to the maximum TID level producred. 8. Power dissipation specified per switching output. 9. Power does not include power contribution of any TTL output sink current. 10. Guaranteed by characterization, but is not tested. 36-00-04-003 Ver. 1.0.0 4 Aeroflex Microelectronics Solutions - HiRel AC ELECTRICAL CHARACTERISTICS FOR THE UT54ACTS20E2 (VDD = 3.0V to 5.5V; VSS = 0V 1, -55°C < TC < +125°C); SYMBOL PARAMETER CONDITION VDD tPLH Input to Yn CL = 50pF 4.5V to 5.5V tPHL Input to Yn CL = 50pF MINIMUM MAXIMUM UNIT 1 6 ns 3.0V to 3.6V 1 9.5 4.5V to 5.5V 1 7.5 3.0V to 3.6V 1 10.5 ns Notes: 1. Maximum allowable relative shift equals 50mV. 2. For devices procured with a total ionizing dose tolerance guarantee, the post-irradiation performance is guaranteed at 25°C per MIL-STD-883, method 1019, condition A up to the maximum TID level producred. 36-00-04-003 Ver. 1.0.0 5 Aeroflex Microelectronics Solutions - HiRel Packaging 1. All exposed metallized areas are gold plated over electroplated nickel per MIL-PRF-38535. 2. The lid is electrically connected to VSS. 3. Lead finishes are in accordance with MIL-PRF38535. 4. Dimension symbol is in accordance with MILPRF-38533. 5. Lead position and colanarity are not measured. Figure 1. 14-lead Flatpack 36-00-04-003 Ver. 1.0.0 6 Aeroflex Microelectronics Solutions - HiRel Ordering Information: UT54ACTS20E: SMD 5962 * ***** ** * * * Lead Finish: (Notes 1 & 2) A = Solder C = Gold X = Optional Package Type: X = 14-lead ceramic bottom-brazed dual-in-line Flatpack Class Designator: Q = QML Class Q V = QML Class V Device Type: 02 = 1 rad(Si)/sec 03 = 50 to 300 rads(Si)/sec Drawing Number: 96527 = UT54ACTS20E Total Dose: (Notes 3 & 4) R = 1E5 rads(Si) F = 3E5 rads(Si) G = 5E5 rads(Si) H = 1E6 rads(Si) Notes: 1. Lead finish (A,C, or X) must be specified. 2. If an “X” is specified when ordering, part marking will match the lead finish and will be either “A” (solder) or “C” (gold). 3. Total dose radiation must be specified when ordering. QML Q and QML V not available without radiation hardening. For prototype inquiries, contact factory. 4. Device type 02 is only offered with a TID tolerance guarantee of 3E5 rads(Si) or 1E6 rads(Si) and is tested in accordance with MIL-STD-883 Test Method 1019 Condition A and section 3.11.2. Device type 03 is only offered with a TID tolerance guarantee of 1E5 rads(Si), 3E5 rads(Si), and 5E5 rads(Si), and is tested in accordance with MIL-STD-883 Test Method 1019 Condition A. 7 Aeroflex Colorado Springs - Datasheet Definition Advanced Datasheet - Product In Development Preliminary Datasheet - Shipping Prototype Datasheet - Shipping QML & Reduced HiRel This product is controlled for export under the U.S. Department of Commerce (DoC). A license may be required prior to the export of this product from the United States. www.aeroflex.com [email protected] Aeroflex Colorado Springs (Aeroflex) reserves the right to make changes to any products and services herein at any time without notice. Consult Aeroflex or an authorized sales representative to verify that the information in this data sheet is current before using this product. Aeroflex does not assume any responsibility or liability arising out of the application or use of any product or service described herein, except as expressly agreed to in writing by Aeroflex; nor does the purchase, lease, or use of a product or service from Aeroflex convey a license under any patent rights, copyrights, trademark rights, or any other of the intellectual rights of Aeroflex or of third parties. Our passion for performance is defined by three attributes represented by these three icons: solution-minded, performance-driven and customer-focused 8 Datasheet Revision History Revision Date December 2014 Version 1.0.0 36-00-04-003 Ver. 1.0.0 Description of Change Initial Release of Data Sheet 9 Aeroflex Microelectronics Solutions - HiRel