VRG8669 5962R1420101

REVISIONS
LTR
DESCRIPTION
DATE (YR-MO-DA)
APPROVED
REV
SHEET
REV
SHEET
REV STATUS
OF SHEETS
PMIC N/A
STANDARD
MICROCIRCUIT
DRAWING
THIS DRAWING IS
AVAILABLE
FOR USE BY ALL
DEPARTMENTS
AND AGENCIES OF THE
DEPARTMENT OF DEFENSE
AMSC N/A
REV
SHEET
1
2
3
4
5
PREPARED BY
Steve L. Duncan
DRAWING APPROVAL DATE
15-11-02
REVISION LEVEL
8
9
10
11
12
13
http://www.landandmaritime.dla.mil/
MICROCIRCUIT, HYBRID, VOLTAGE REGULATOR,
2.5 AMP, ULTRA LOW DROPOUT, POSITIVE,
ADJUSTABLE
SIZE
CAGE CODE
A
67268
SHEET
DSCC FORM 2233
APR 97
7
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
CHECKED BY
Greg Cecil
APPROVED BY
Charles F. Saffle
6
1 OF
5962-14201
13
5962-E043-16
1. SCOPE
1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A
choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When
available, a choice of radiation hardness assurance levels are reflected in the PIN.
1.2 PIN. The PIN is as shown in the following example:
5962



Federal
stock class
designator
\
R



RHA
designator
(see 1.2.1)
14201
01



Device
type
(see 1.2.2)
/
K



Device
class
designator
(see 1.2.3)
Y



Case
outline
(see 1.2.4)
C



Lead
finish
(see 1.2.5)
\/
Drawing number
1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels
and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device.
1.2.2 Device type(s). The device type(s) identify the circuit function as follows:
Device type
01
Generic number
8669
Circuit function
Voltage regulator, 2.5 amp, positive , low dropout,
adjustable
1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All levels
are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and
E) or QML Listing (Class G and D). The product assurance levels are as follows:
Device class
Device performance documentation
K
Highest reliability class available. This level is intended for use in space
applications.
H
Standard military quality class level. This level is intended for use in applications
where non-space high reliability devices are required.
G
Reduced testing version of the standard military quality class. This level uses the
Class H screening and In-Process Inspections with a possible limited temperature
range, manufacturer specified incoming flow, and the manufacturer guarantees (but
may not test) periodic and conformance inspections (Group A, B, C and D).
E
Designates devices which are based upon one of the other classes (K, H, or G)
with exception(s) taken to the requirements of that class. These exception(s) must be
specified in the device acquisition document; therefore the acquisition document
should be reviewed to ensure that the exception(s) taken will not adversely affect
system performance.
D
Manufacturer specified quality class. Quality level is defined by the manufacturers
internal, QML certified flow. This product may have a limited temperature range.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
2
1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows:
Outline letter
Y
Descriptive designator
See figure 1
Terminals
Package style
5
Bottom terminal chip carrier, ceramic
1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534.
1.3 Absolute maximum ratings. 1/ 2/
IInput voltage range, (No overload or short circuit) ....................
VCONTROL.....................................................................................
Output short circuit duration .......................................................
Input-Output differential voltage .................................................
Operating junction temperature range .......................................
Thermal Resistance, Junction temperature (ӨJC) ......................
Lead temperature (soldering, 10 seconds) ................................
Storage temperature range ........................................................
+23 V dc
+28 V dc, -0.3 V dc
Indefinite
18 V dc
-55°C to +150°C
2.5°C/W
+300°C
-65°C to +150°C
1.4 Recommended operating conditions. 1/
Input voltage range......................................................................
VCONTROL range ...........................................................................
Output voltage range ..................................................................
Input-Output differential voltage range ........................................
Case operating temperature range (TC) ......................................
1 V to 23V
+1.6 V to +28 V
0 V to +22 V dc
0.5 V to 18 V dc
-55°C to +125°C
1.5 Radiation features. 3/ 4/
Maximum total dose available (Dose rate = 50 - 300 rad(Si)/s)
...............................................................................................
Enhanced Low Dose Rate Sensitvity (ELDRS):
(dose rate ≤ 10 mrad(Si)/s) .......................................................
100 krad(Si) 5/ 6/
50 krad(Si) 6/
________
1/ Voltages are relative to VOUT.
2/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the
maximum levels may degrade performance and affect reliability.
3/ See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing.
4/ Bipolar devices may degrade from displacement damage from radiation which could affect RHA levels. This device has not
been characterized for displacement damage.
5/ The active element that makes up this device on this drawing has been tested for Total Ionizing Dose (TID) in accordance
with MIL-STD-883 test method 1019 condition A. RHA testing of the active element covered on this SMD was tested in
alternate packages (TO3) and (TO39), not the package as specified in paragraph 1.2.4.
6/ The active element that makes up this device on this drawing has been tested for Enhanced Low Dose Rate Sensitivity
(ELDRS) in accordance with MIL-STD-883, Method 1019 condition D and paragraph 3.13.1 for initial qualification. No ELDRS
effect was observed. The active element will be re-tested after design or process changes that can affect RHA response of
this element. RHA testing of the active element covered on this SMD was done in alternate packages (TO3) and (TO39), not
the packages as specified in paragraph 1.2.4.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
3
2. APPLICABLE DOCUMENTS
2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part
of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the
solicitation or contract.
DEPARTMENT OF DEFENSE SPECIFICATIONS
MIL-PRF-38534 - Hybrid Microcircuits, General Specification for.
DEPARTMENT OF DEFENSE STANDARDS
MIL-STD-883 - Test Method Standard Microcircuits.
MIL-STD-1835 - Interface Standard Electronic Component Case Outlines.
DEPARTMENT OF DEFENSE HANDBOOKS
MIL-HDBK-103 - List of Standard Microcircuit Drawings.
MIL-HDBK-780 - Standard Microcircuit Drawings.
(Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order Desk,
700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.)
2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of
this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific
exemption has been obtained.
3. REQUIREMENTS
3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in
accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as
designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The
manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as
defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not
affect the form, fit, or function of the device for the applicable device class.
3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in
MIL-PRF-38534 and herein.
3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1.
3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2.
3.2.3 Block diagram. The block diagram shall be as specified on figure 3.
3.2.4 Maximum power dissipation verses case temperature chart. The maximum power dissipation verses case temperature is
specified on figure 4.
3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document
revision level control and shall be made available to the preparing and acquiring activity upon request.
3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as
specified in table I and shall apply over the full specified operating temperature range.
3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical
tests for each subgroup are defined in table I.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
4
3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with
the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked.
3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described
herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample,
for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those
which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be
made available to the preparing activity (DLA Land and Maritime -VA) upon request.
3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this
drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturer's
product meets the performance requirements of MIL-PRF-38534 and herein.
3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of
microcircuits delivered to this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
5
TABLE I. Electrical performance characteristics.
Test
Symbol
Conditions
-55°C ≤ TC ≤+125°C
VCONTROL = 2.0 V, P ≤ PMAX,
unless otherwise specified
IREF1
5.0 mA ≤ ILOAD ≤ 2.5 A,
VIN ≥ 2.0 V, VCONTROL ≥ 3.0 V
IREF2
VIN = 2.0 V, VCONTROL = 3.0 V, 1/
ILOAD = 1 mA, TC = +25°C
Output offset voltage
(VOUT - VSET) 1/
VOS
Line regulation 1/
Set pin current
Group A
subgroups
Device
types
Limits
Unit
Min
Max
1,2,3
01
49
51.5
1
01
49
51
VIN = 2.0 V, ILOAD = 1.0 mA,
VCONTROL = 3.0 V
1,2,3
01
-6.0
+6.0
mV
∆VOS
1.0 V ≤ VIN ≤ 23 V,
2.0 V ≤ VCONTROL ≤ 25 V,
ILOAD = 1.0 mA, TC = +25°C
1
01
-0.07
0.07
mV/V
Load regulation 1/
∆VOS
(VIN - VOUT) = 3.0 V,
ILOAD = 5.0 mA to 2.5 A, TC = +25°C
1
01
-10.0
+10.0
mV
VCONTROL dropout
voltage
VCDROP
ILOAD = 2.5 A
1,2,3
01
1.65
V
ILOAD = 1.0 A 1/
VIN dropout voltage
VINDROP
1.6
ILOAD = 2.5 A
01
0.75
ILOAD = 1.0 A 1/
0.28
Current limit 1/
IMAX
VIN = VCONTROL = +5.0 V, VSET = 0 V,
VOUT = +0.4 V, Pulsed at < 10
percent duty cycle, TC = +25°C
Minimum load current
1/ 2/
IMIN
Ripple rejection
1/
2/
µA
1
01
VCONTROL = 25 V, VIN = 23 V
1,2,3
01
ILOAD = 0.2 A, (VIN - VOUT) = 3.0 V,
f = 120 Hz, COUT = 2.2 µF,
CSET = 0.1 µf
1,2,3
01
2.8
A
1.0
mA
60
dB
The active elment that makes up this device has been tested to 200 krad(Si)) to assure RHA designator level "R" (100
krad(Si)) of Method 1019, condition A of MIL-STD-883 and low dose rate tested to the requirements of Method 1019,
condition D and paragraph 3.13.1 of MIL-STD-883 to 50 krad(Si) at +25°C for these parameters. No ELDRS effect was
observed. The element will be re-tested after design or process changes that can affect RHA response of this element.
RHA testing of the active element covered on this SMD was done in alternate packages (TO3) and (TO39), not the
packages as specified in paragraph 1.2.4.
Not tested. Shall be guaranteed by design, characterization, or correlation to other tested parameters.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
6
Case Y
Symbol
Inches
Min
A
A1
b
b1
b2
b3
D
E
e
e1
R
S
.010
.281
.195
.090
.115
.030
.030
.015
Millimeters
Max
.127
.020
.291
.205
.100
.125
.550
.301
Min
.25
7.14
4.95
2.29
2.92
Max
3.23
.51
7.39
5.21
2.54
3.18
13.97
7.65
7.62
7.62
.38
.025
.010
.64
.25
NOTE:
1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of
measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound
units shall rule.
2. The package and lid are electrically isolated.
FIGURE 1. Case outline(s) - Continued.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
7
Device type
Case outline
Terminal
number
01
Y
Terminal
symbol
1
2
3
4
5
VIN
VSENSE
RSET
VCONTROL
VOUT
FIGURE 2. Terminal connections.
FIGURE 3. Block diagram.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
8
Case
Temperature
(°C)
0
10
20
30
40
50
60
70
80
90
100
110
120
130
140
150
Maximum power
dissipation
(Watts)
60.0
56.0
52.0
48.0
44.0
40.0
36.0
32.0
28.0
24.0
20.0
16.0
12.0
8.0
4.0
0.0
FIGURE 4. Maximum power dissipation verses case temperature chart.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
9
TABLE II. Electrical test requirements.
MIL-PRF-38534 test requirements
Subgroups
(in accordance with
MIL-PRF-38534, group A
test table)
Interim electrical parameters
1
Final electrical parameters
1*,2,3
Group A test requirements
1,2,3
Group C end-point electrical
parameters
1,2,3
End-point electrical parameters
for Radiation Hardness Assurance
(RHA) devices
1
* PDA applies to subgroup 1.
4. VERIFICATION
4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified
in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or
function as described herein.
4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply:
a.
b.
Burn-in test, method 1015 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also,
the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the
intent specified in method 1015 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1015 of MIL-STD-883.
Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests
prior to burn-in are optional at the discretion of the manufacturer.
4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance
with MIL-PRF-38534 and as specified herein.
4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
Tests shall be as specified in table II herein.
b.
Subgroups 4, 5, 6, 7, 8A, 8B, 9, 10, and 11 shall be omitted.
4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
10
4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows:
a.
End-point electrical parameters shall be as specified in table II herein.
b.
Steady-state life test, method 1005 of MIL-STD-883.
(1)
Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level
control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also,
the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the
intent specified in method 1005 of MIL-STD-883.
(2)
TA as specified in accordance with table I of method 1005 of MIL-STD-883.
(3)
Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883.
4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534.
4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as
specified herein. See table IIIA and table IIIB.
Table IIIA. Radiation Hardness Assurance Method Table.
RHA
method
Employed
Total Dose Testing
RHA level "R"
(100 krad)
Element
Hybrid
Level
Device
Level
Tested at
(200 krad)
Tested at
(200 krad)
Worst Case Analysis Performed
End point electricals after
total dose
Includes
Combines
Combines End-of-life
temperature temperature and total dose
effects
radiation effects
and
displacement
effects
No
No
No
No
Element
Level
Hybrid
Device
Level
TC = +25°C
TC = +25°C
Table IIIB. Hybrid level and element level test table.
Bipolar IC, linear
or mixed signal >
90 nm
Low Dose
Rate (LDR)
Total Dose
High Dose
Rate (HDR)
ELDRS
Tested
(50 krad)
Tested
(200 krad)
Tested
(50 krad)
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
Radiation Test
Heavy Ion
Proton
Neutron
SEU
SEL
Low
High
SEE Displacement
(upset) (latch-up) Energy Energy (upset) Damage (DD)
Not
tested
Not
tested
Not
tested
Not
Not
tested tested
Not
tested
SIZE
5962-14201
A
REVISION LEVEL
SHEET
11
4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA
designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be
specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved
plan and with MIL-PRF-38534, Appendix G.
a.
The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish
radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall
be filed and controlled in accordance with the manufacturer's configuration management system.
b.
The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to
monitor design changes for continued compliance to RHA requirements.
4.3.5.1.1 Hybrid level qualification.
4.3.5.1.1.1 Qualification by similarity. This device has not been indentified as "similar".
4.3.5.1.1.2 Total ionizing dose irradiation testing. Hybrid level and element level testing are the same for the device on this
Standard Microcircuit Drawing (SMD) since the active element is accessible to the device leads for test.
4.3.5.1.2 Element level qualification.
4.3.5.1.2.1 Total Ionizing dose irradiation testing. A minimum of ten samples of each element is tested at initial qualification
and after any design or process changes which may affect the RHA response of the device type. Five biased and five unbiased
are tested at High Dose Rate (HDR) in accordance with condition A of method 1019 of MIL-STD-883 to 200 krad(Si). In addition
another ten devices are tested at Low Dose Rate (LDR) in accordance with method 1019, condition D and paragraph 3.13.1 of
MIL-STD-883 to 50 krad(Si). The resulting data is evaluated in accordance with Condition D, ELDRS characterization.
4.3.5.2 Radiation Lot Acceptance. Each wafer lot of active elements shall be evaluated for acceptance in accordance with MILPRF-38534 and herein.
4.3.5.2.1 Total Ionizing Dose. Samples from every wafer lot will be assembled into packages (TO3) or (TO39) and tested for
wafer lot acceptance Radiation Lot Acceptance Testing (RLAT). Five biased and five unbiased devices are tested in accordance
with condition A, of method 1019 of MIL-STD-883 to 200 krad(Si).
4.3.5.2.2 Technologies not tested. All active components in these devices are RHA tested.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
12
5. PACKAGING
5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534.
6. NOTES
6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications
(original equipment), design applications, and logistics purposes.
6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing.
6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534.
6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires
configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for
coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should
contact DLA Land and Maritime -VA, telephone (614) 692-8108.
6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or
telephone (614) 692-1081.
6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103
and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to
this drawing.
STANDARD
MICROCIRCUIT DRAWING
DLA LAND AND MARITIME
COLUMBUS, OHIO 43218-3990
DSCC FORM 2234
APR 97
SIZE
5962-14201
A
REVISION LEVEL
SHEET
13
STANDARD MICROCIRCUIT DRAWING BULLETIN
DATE: 15-11-02
Approved sources of supply for SMD 5962-14201 are listed below for immediate acquisition information only and
shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be
revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a
certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information
bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime
maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/.
Standard
microcircuit drawing
PIN 1/
Vendor
CAGE
number
Vendor
similar
PIN 2/
5962R1420101KYA
5962R1420101KYC
88379
88379
VRG8669-901-2S
VRG8669-901-1S
1/ The lead finish shown for each PIN representing
a hermetic package is the most readily available
from the manufacturer listed for that part. If the
desired lead finish is not listed contact the Vendor
to determine its availability.
2/ Caution. Do not use this number for item
acquisition. Items acquired to this number may not
satisfy the performance requirements of this drawing.
Vendor CAGE
number
88379
Vendor name
and address
Aeroflex Plainview Incorporated,
(Aeroflex Microelectronic Solutions)
35 South Service Road
Plainview, NY 11803
The information contained herein is disseminated for convenience only and the
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