REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED REV SHEET REV SHEET REV STATUS OF SHEETS PMIC N/A STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A REV SHEET 1 2 3 4 5 PREPARED BY Steve L. Duncan DRAWING APPROVAL DATE 15-11-02 REVISION LEVEL 8 9 10 11 12 13 http://www.landandmaritime.dla.mil/ MICROCIRCUIT, HYBRID, VOLTAGE REGULATOR, 2.5 AMP, ULTRA LOW DROPOUT, POSITIVE, ADJUSTABLE SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 7 DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 CHECKED BY Greg Cecil APPROVED BY Charles F. Saffle 6 1 OF 5962-14201 13 5962-E043-16 1. SCOPE 1.1 Scope. This drawing documents five product assurance classes as defined in paragraph 1.2.3 and MIL-PRF-38534. A choice of case outlines and lead finishes which are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of radiation hardness assurance levels are reflected in the PIN. 1.2 PIN. The PIN is as shown in the following example: 5962 Federal stock class designator \ R RHA designator (see 1.2.1) 14201 01 Device type (see 1.2.2) / K Device class designator (see 1.2.3) Y Case outline (see 1.2.4) C Lead finish (see 1.2.5) \/ Drawing number 1.2.1 Radiation hardness assurance (RHA) designator. RHA marked devices meet the MIL-PRF-38534 specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type 01 Generic number 8669 Circuit function Voltage regulator, 2.5 amp, positive , low dropout, adjustable 1.2.3 Device class designator. This device class designator is a single letter identifying the product assurance level. All levels are defined by the requirements of MIL-PRF-38534 and require QML Certification as well as qualification (Class H, K, and E) or QML Listing (Class G and D). The product assurance levels are as follows: Device class Device performance documentation K Highest reliability class available. This level is intended for use in space applications. H Standard military quality class level. This level is intended for use in applications where non-space high reliability devices are required. G Reduced testing version of the standard military quality class. This level uses the Class H screening and In-Process Inspections with a possible limited temperature range, manufacturer specified incoming flow, and the manufacturer guarantees (but may not test) periodic and conformance inspections (Group A, B, C and D). E Designates devices which are based upon one of the other classes (K, H, or G) with exception(s) taken to the requirements of that class. These exception(s) must be specified in the device acquisition document; therefore the acquisition document should be reviewed to ensure that the exception(s) taken will not adversely affect system performance. D Manufacturer specified quality class. Quality level is defined by the manufacturers internal, QML certified flow. This product may have a limited temperature range. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 2 1.2.4 Case outline(s). The case outline(s) are as designated in MIL-STD-1835 and as follows: Outline letter Y Descriptive designator See figure 1 Terminals Package style 5 Bottom terminal chip carrier, ceramic 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38534. 1.3 Absolute maximum ratings. 1/ 2/ IInput voltage range, (No overload or short circuit) .................... VCONTROL..................................................................................... Output short circuit duration ....................................................... Input-Output differential voltage ................................................. Operating junction temperature range ....................................... Thermal Resistance, Junction temperature (ӨJC) ...................... Lead temperature (soldering, 10 seconds) ................................ Storage temperature range ........................................................ +23 V dc +28 V dc, -0.3 V dc Indefinite 18 V dc -55°C to +150°C 2.5°C/W +300°C -65°C to +150°C 1.4 Recommended operating conditions. 1/ Input voltage range...................................................................... VCONTROL range ........................................................................... Output voltage range .................................................................. Input-Output differential voltage range ........................................ Case operating temperature range (TC) ...................................... 1 V to 23V +1.6 V to +28 V 0 V to +22 V dc 0.5 V to 18 V dc -55°C to +125°C 1.5 Radiation features. 3/ 4/ Maximum total dose available (Dose rate = 50 - 300 rad(Si)/s) ............................................................................................... Enhanced Low Dose Rate Sensitvity (ELDRS): (dose rate ≤ 10 mrad(Si)/s) ....................................................... 100 krad(Si) 5/ 6/ 50 krad(Si) 6/ ________ 1/ Voltages are relative to VOUT. 2/ Stresses above the absolute maximum ratings may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 3/ See section 4.3.5 for the manufacturer's radiation hardness assurance analysis and testing. 4/ Bipolar devices may degrade from displacement damage from radiation which could affect RHA levels. This device has not been characterized for displacement damage. 5/ The active element that makes up this device on this drawing has been tested for Total Ionizing Dose (TID) in accordance with MIL-STD-883 test method 1019 condition A. RHA testing of the active element covered on this SMD was tested in alternate packages (TO3) and (TO39), not the package as specified in paragraph 1.2.4. 6/ The active element that makes up this device on this drawing has been tested for Enhanced Low Dose Rate Sensitivity (ELDRS) in accordance with MIL-STD-883, Method 1019 condition D and paragraph 3.13.1 for initial qualification. No ELDRS effect was observed. The active element will be re-tested after design or process changes that can affect RHA response of this element. RHA testing of the active element covered on this SMD was done in alternate packages (TO3) and (TO39), not the packages as specified in paragraph 1.2.4. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATIONS MIL-PRF-38534 - Hybrid Microcircuits, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 - Test Method Standard Microcircuits. MIL-STD-1835 - Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 - List of Standard Microcircuit Drawings. MIL-HDBK-780 - Standard Microcircuit Drawings. (Copies of these documents are available online at http://quicksearch.dla.mil/ or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item performance requirements for device classes D, E, G, H, and K shall be in accordance with MIL-PRF-38534. Compliance with MIL-PRF-38534 shall include the performance of all tests herein or as designated in the device manufacturer's Quality Management (QM) plan or as designated for the applicable device class. The manufacturer may eliminate, modify or optimize the tests and inspections herein, however the performance requirements as defined in MIL-PRF-38534 shall be met for the applicable device class. In addition, the modification in the QM plan shall not affect the form, fit, or function of the device for the applicable device class. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38534 and herein. 3.2.1 Case outline(s). The case outline(s) shall be in accordance with 1.2.4 herein and figure 1. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 2. 3.2.3 Block diagram. The block diagram shall be as specified on figure 3. 3.2.4 Maximum power dissipation verses case temperature chart. The maximum power dissipation verses case temperature is specified on figure 4. 3.2.5 Radiation exposure circuit. The radiation exposure circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing and acquiring activity upon request. 3.3 Electrical performance characteristics. Unless otherwise specified herein, the electrical performance characteristics are as specified in table I and shall apply over the full specified operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table II. The electrical tests for each subgroup are defined in table I. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 4 3.5 Marking of device(s). Marking of device(s) shall be in accordance with MIL-PRF-38534. The device shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's vendor similar PIN may also be marked. 3.6 Data. In addition to the general performance requirements of MIL-PRF-38534, the manufacturer of the device described herein shall maintain the electrical test data (variables format) from the initial quality conformance inspection group A lot sample, for each device type listed herein. Also, the data should include a summary of all parameters manually tested, and for those which, if any, are guaranteed. This data shall be maintained under document revision level control by the manufacturer and be made available to the preparing activity (DLA Land and Maritime -VA) upon request. 3.7 Certificate of compliance. A certificate of compliance shall be required from a manufacturer in order to supply to this drawing. The certificate of compliance (original copy) submitted to DLA Land and Maritime -VA shall affirm that the manufacturer's product meets the performance requirements of MIL-PRF-38534 and herein. 3.8 Certificate of conformance. A certificate of conformance as required in MIL-PRF-38534 shall be provided with each lot of microcircuits delivered to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 5 TABLE I. Electrical performance characteristics. Test Symbol Conditions -55°C ≤ TC ≤+125°C VCONTROL = 2.0 V, P ≤ PMAX, unless otherwise specified IREF1 5.0 mA ≤ ILOAD ≤ 2.5 A, VIN ≥ 2.0 V, VCONTROL ≥ 3.0 V IREF2 VIN = 2.0 V, VCONTROL = 3.0 V, 1/ ILOAD = 1 mA, TC = +25°C Output offset voltage (VOUT - VSET) 1/ VOS Line regulation 1/ Set pin current Group A subgroups Device types Limits Unit Min Max 1,2,3 01 49 51.5 1 01 49 51 VIN = 2.0 V, ILOAD = 1.0 mA, VCONTROL = 3.0 V 1,2,3 01 -6.0 +6.0 mV ∆VOS 1.0 V ≤ VIN ≤ 23 V, 2.0 V ≤ VCONTROL ≤ 25 V, ILOAD = 1.0 mA, TC = +25°C 1 01 -0.07 0.07 mV/V Load regulation 1/ ∆VOS (VIN - VOUT) = 3.0 V, ILOAD = 5.0 mA to 2.5 A, TC = +25°C 1 01 -10.0 +10.0 mV VCONTROL dropout voltage VCDROP ILOAD = 2.5 A 1,2,3 01 1.65 V ILOAD = 1.0 A 1/ VIN dropout voltage VINDROP 1.6 ILOAD = 2.5 A 01 0.75 ILOAD = 1.0 A 1/ 0.28 Current limit 1/ IMAX VIN = VCONTROL = +5.0 V, VSET = 0 V, VOUT = +0.4 V, Pulsed at < 10 percent duty cycle, TC = +25°C Minimum load current 1/ 2/ IMIN Ripple rejection 1/ 2/ µA 1 01 VCONTROL = 25 V, VIN = 23 V 1,2,3 01 ILOAD = 0.2 A, (VIN - VOUT) = 3.0 V, f = 120 Hz, COUT = 2.2 µF, CSET = 0.1 µf 1,2,3 01 2.8 A 1.0 mA 60 dB The active elment that makes up this device has been tested to 200 krad(Si)) to assure RHA designator level "R" (100 krad(Si)) of Method 1019, condition A of MIL-STD-883 and low dose rate tested to the requirements of Method 1019, condition D and paragraph 3.13.1 of MIL-STD-883 to 50 krad(Si) at +25°C for these parameters. No ELDRS effect was observed. The element will be re-tested after design or process changes that can affect RHA response of this element. RHA testing of the active element covered on this SMD was done in alternate packages (TO3) and (TO39), not the packages as specified in paragraph 1.2.4. Not tested. Shall be guaranteed by design, characterization, or correlation to other tested parameters. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 6 Case Y Symbol Inches Min A A1 b b1 b2 b3 D E e e1 R S .010 .281 .195 .090 .115 .030 .030 .015 Millimeters Max .127 .020 .291 .205 .100 .125 .550 .301 Min .25 7.14 4.95 2.29 2.92 Max 3.23 .51 7.39 5.21 2.54 3.18 13.97 7.65 7.62 7.62 .38 .025 .010 .64 .25 NOTE: 1. The U.S. preferred system of measurement is the metric SI. This item was designed using inch-pound units of measurement. In case of problems involving conflicts between the metric and inch-pound units, the inch-pound units shall rule. 2. The package and lid are electrically isolated. FIGURE 1. Case outline(s) - Continued. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 7 Device type Case outline Terminal number 01 Y Terminal symbol 1 2 3 4 5 VIN VSENSE RSET VCONTROL VOUT FIGURE 2. Terminal connections. FIGURE 3. Block diagram. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 8 Case Temperature (°C) 0 10 20 30 40 50 60 70 80 90 100 110 120 130 140 150 Maximum power dissipation (Watts) 60.0 56.0 52.0 48.0 44.0 40.0 36.0 32.0 28.0 24.0 20.0 16.0 12.0 8.0 4.0 0.0 FIGURE 4. Maximum power dissipation verses case temperature chart. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 9 TABLE II. Electrical test requirements. MIL-PRF-38534 test requirements Subgroups (in accordance with MIL-PRF-38534, group A test table) Interim electrical parameters 1 Final electrical parameters 1*,2,3 Group A test requirements 1,2,3 Group C end-point electrical parameters 1,2,3 End-point electrical parameters for Radiation Hardness Assurance (RHA) devices 1 * PDA applies to subgroup 1. 4. VERIFICATION 4.1 Sampling and inspection. Sampling and inspection procedures shall be in accordance with MIL-PRF-38534 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. 4.2 Screening. Screening shall be in accordance with MIL-PRF-38534. The following additional criteria shall apply: a. b. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1015 of MIL-STD-883. Interim and final electrical test parameters shall be as specified in table II herein, except interim electrical parameter tests prior to burn-in are optional at the discretion of the manufacturer. 4.3 Conformance and periodic inspections. Conformance inspection (CI) and periodic inspection (PI) shall be in accordance with MIL-PRF-38534 and as specified herein. 4.3.1 Group A inspection (CI). Group A inspection shall be in accordance with MIL-PRF-38534 and as follows: a. Tests shall be as specified in table II herein. b. Subgroups 4, 5, 6, 7, 8A, 8B, 9, 10, and 11 shall be omitted. 4.3.2 Group B inspection (PI). Group B inspection shall be in accordance with MIL-PRF-38534. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 10 4.3.3 Group C inspection (PI). Group C inspection shall be in accordance with MIL-PRF-38534 and as follows: a. End-point electrical parameters shall be as specified in table II herein. b. Steady-state life test, method 1005 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to either DLA Land and Maritime -VA or the acquiring activity upon request. Also, the test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. (2) TA as specified in accordance with table I of method 1005 of MIL-STD-883. (3) Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.3.4 Group D inspection (PI). Group D inspection shall be in accordance with MIL-PRF-38534. 4.3.5. Radiation hardness assurance (RHA). RHA qualification is required only for those devices with the RHA designator as specified herein. See table IIIA and table IIIB. Table IIIA. Radiation Hardness Assurance Method Table. RHA method Employed Total Dose Testing RHA level "R" (100 krad) Element Hybrid Level Device Level Tested at (200 krad) Tested at (200 krad) Worst Case Analysis Performed End point electricals after total dose Includes Combines Combines End-of-life temperature temperature and total dose effects radiation effects and displacement effects No No No No Element Level Hybrid Device Level TC = +25°C TC = +25°C Table IIIB. Hybrid level and element level test table. Bipolar IC, linear or mixed signal > 90 nm Low Dose Rate (LDR) Total Dose High Dose Rate (HDR) ELDRS Tested (50 krad) Tested (200 krad) Tested (50 krad) STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Radiation Test Heavy Ion Proton Neutron SEU SEL Low High SEE Displacement (upset) (latch-up) Energy Energy (upset) Damage (DD) Not tested Not tested Not tested Not Not tested tested Not tested SIZE 5962-14201 A REVISION LEVEL SHEET 11 4.3.5.1 Radiation Hardness Assurance (RHA) inspection. RHA qualification is required for those devices with the RHA designator as specified herein. End-point electrical parameters for radiation hardness assurance (RHA) devices shall be specified in table II. Radiation testing will be in accordance with the qualifying activity (DLA Land and Maritime -VQ) approved plan and with MIL-PRF-38534, Appendix G. a. The hybrid device manufacturer shall establish procedures controlling component radiation testing, and shall establish radiation test plans used to implement component lot qualification during procurement. Test plans and test reports shall be filed and controlled in accordance with the manufacturer's configuration management system. b. The hybrid device manufacturer shall designate a RHA program manager to oversee component lot qualification, and to monitor design changes for continued compliance to RHA requirements. 4.3.5.1.1 Hybrid level qualification. 4.3.5.1.1.1 Qualification by similarity. This device has not been indentified as "similar". 4.3.5.1.1.2 Total ionizing dose irradiation testing. Hybrid level and element level testing are the same for the device on this Standard Microcircuit Drawing (SMD) since the active element is accessible to the device leads for test. 4.3.5.1.2 Element level qualification. 4.3.5.1.2.1 Total Ionizing dose irradiation testing. A minimum of ten samples of each element is tested at initial qualification and after any design or process changes which may affect the RHA response of the device type. Five biased and five unbiased are tested at High Dose Rate (HDR) in accordance with condition A of method 1019 of MIL-STD-883 to 200 krad(Si). In addition another ten devices are tested at Low Dose Rate (LDR) in accordance with method 1019, condition D and paragraph 3.13.1 of MIL-STD-883 to 50 krad(Si). The resulting data is evaluated in accordance with Condition D, ELDRS characterization. 4.3.5.2 Radiation Lot Acceptance. Each wafer lot of active elements shall be evaluated for acceptance in accordance with MILPRF-38534 and herein. 4.3.5.2.1 Total Ionizing Dose. Samples from every wafer lot will be assembled into packages (TO3) or (TO39) and tested for wafer lot acceptance Radiation Lot Acceptance Testing (RLAT). Five biased and five unbiased devices are tested in accordance with condition A, of method 1019 of MIL-STD-883 to 200 krad(Si). 4.3.5.2.2 Technologies not tested. All active components in these devices are RHA tested. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 12 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38534. 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.2 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.3 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated as specified in MIL-PRF38534. 6.4 Record of users. Military and industrial users should inform DLA Land and Maritime when a system application requires configuration control and the applicable SMD. DLA Land and Maritime will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DLA Land and Maritime -VA, telephone (614) 692-8108. 6.5 Comments. Comments on this drawing should be directed to DLA Land and Maritime -VA, Columbus, Ohio 43218-3990, or telephone (614) 692-1081. 6.6 Sources of supply. Sources of supply are listed in MIL-HDBK-103 and QML-38534. The vendors listed in MIL-HDBK-103 and QML-38534 have submitted a certificate of compliance (see 3.7 herein) to DLA Land and Maritime -VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DLA LAND AND MARITIME COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-14201 A REVISION LEVEL SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 15-11-02 Approved sources of supply for SMD 5962-14201 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38534 during the next revisions. MIL-HDBK-103 and QML-38534 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DLA Land and Maritime -VA. This information bulletin is superseded by the next dated revisions of MIL-HDBK-103 and QML-38534. DLA Land and Maritime maintains an online database of all current sources of supply at http://www.landandmaritime.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962R1420101KYA 5962R1420101KYC 88379 88379 VRG8669-901-2S VRG8669-901-1S 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the Vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 88379 Vendor name and address Aeroflex Plainview Incorporated, (Aeroflex Microelectronic Solutions) 35 South Service Road Plainview, NY 11803 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.