MSK19N03 N-Channel 30-V (D-S) MOSFET Description These miniature surface mount MOSFETs utilize a high cell density trench process to provide low RDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, and PCMCIA cards, cellular and cordless telephones. Features • Low rDS(on) provides higher efficiency and extends battery life • Low thermal impedance copper lead frame DFN3x3 saves board space • Fast switching speed MILLIMETERS MIN NOM MAX A 0.700 0.800 0.900 A1 0.000 0.050 b 0.240 0.300 0.350 c 0.080 0.152 0.250 2.90 BSC DIM. 2.80 BSC E 2.30 BSC E1 0.65 BSC e L 0.200 0.375 0.450 L1 0.000 0.100 θ1 0.000 10.000 12.000 DIM. • High performance trench technology • RoHS compliant package Packing & Order Information 3,000/Reel INCHES MIN NOM MAX 0.028 0.0315 0.0354 0.000 0.002 0.009 0.012 0.014 0.003 0.006 0.010 0.114 BSC 0.110 BSC 0.091 BSC 0.026 BSC 0.008 0.0148 0.0177 0.000 0.004 0.000 10.000 12.000 Graphic symbol MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS Absolute Maximum Ratings (TA=25°C Unless Otherwise Noted) Symbol Parameter VDS Drain-Source Voltage VGS Gate-Source Voltage ID PD V V ±19 A a ±16 A ±40 A a 3.5 W a 2 W b Total Power Dissipation (TA=25°C) Total Power Dissipation (TA=70°C) Publication Order Number: [MSK19N03] 30 ±20 Drain Current -Continuous (TA =25°C) Pulsed Drain Current Unit a Drain Current -Continuous (TA =70°C) IDM Value © Bruckewell Technology Corporation Rev. A -2014 MSK19N03 N-Channel 30-V (D-S) MOSFET Absolute Maximum Ratings (TA=25°C Unless Otherwise Noted) Symbol Parameter Is Continuous Source Current (Diode Conduction) TJ,TSTG Operating and Storage Temperature Range Thermal Data Symbol RθJC RθJA a Value Unit 2 A -55 to +150 °C Parameter Max. a Maximum Junction-to-Case ( t<=5 sec ) Units 35 °C/W a Maximum Junction-to- Ambient ( t<=5 sec ) 50 Note: 1. Surface Mounted on 1“x1” FR4 Board. 2. Pulse width limited by maximum junction temperature. Static Symbol Test Conditions VSD VGS(th) IDSS Min Typ. Max. Units VGS = 0 V , IS = 2.3 A -- 0.7 -- V VDS = VGS , ID = 250μA 1 -- 3 V -- -- VDS = 24 V , VGS = 0 V VDS = 24 V , VGS = 0 V , Tj= 55°C 1 uA 25 IGSS VGS = 20 V , VDS = 0 -- -- ±100 nA ID(ON) VDS = 5 V , VGS = 10 V 20 -- -- A -- -- RDS(ON) GFS*1 VGS = 10 V,ID = 10 A VGS = 4.5 V,ID = 8 A CISS Test Conditions Input Capacitance COSS Output Capacitance CRSS Reverse Transfer Capacitance Qg Total Gate Charge mΩ 9.8 40 VDS = 15 V,ID = 10 A Dynamic Characteristics Symbol Parameter 6.9 VDS = 15 V, VGS = 0 V, f = 1.0MHz VDS = 15 V , ID = 10 A, S Min Typ. Max. Units -- 1302 -- pF -- 423 -- pF -- 171 -- pF -- 11 -- nC -- 6 -- nC Qgs Gate-Source Charge Qgd Gate-Drain Charge -- 4 -- nC td(on) Turn-On Dalay Time -- 10 -- ns tr Rise Time VDD = 25 V , ID = 1 A, -- 5 -- ns td(off) Turn-Off Dalay Time RL = 25 Ω, VGEN = 10 V -- 22 -- ns tf Fall Time -- 4 -- ns VGS = 4.5 V Notes a. Pulse test: PW <= 300us duty cycle <= 2%. b. Guaranteed by design, not subject to production testing. Publication Order Number: [MSK19N03] © Bruckewell Technology Corporation Rev. A -2014 MSK19N03 N-Channel 30-V (D-S) MOSFET ■Characteristics Curve FIG.1-ON REGION CHARACTERISTICS FIG.2-TRANSFER CHARACTERISTICS FIG.3-ON RESISTANCE VARIATION VS DRAIN FIG.4-BODY DIODE FORWARD VOLTAGE VARIATION CURRENT AND GATE VOLTAGE WITH SOURCE CURRENT AND TEMPERATURE FIG.5-CAPACITANCE CHARACTERISTICS FIG.6-GATE CHARGE CHARACTERISTICS Publication Order Number: [MSK19N03] © Bruckewell Technology Corporation Rev. A -2014 MSK19N03 N-Channel 30-V (D-S) MOSFET ■Characteristics Curve FIG.7-BREAKDOWN VOLTAGE VARIATION VS TEMPERATURE FIG.8-ON-RESISTANCE VARIATION VS TEMPERATURE FIG.9-MAXIMUM SAFE OPERATING AREA FIG.10-MAXIMUM DRAIN CURRENT VS CASE TEMPERATURE FIG.11-TRANSIENT THERMAL RESPONSE CURVE Publication Order Number: [MSK19N03] © Bruckewell Technology Corporation Rev. A -2014 MSK19N03 N-Channel 30-V (D-S) MOSFET Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. Bruckewell Technology Inc., its affiliates, agents, and employees, and all persons acting on its or their behalf (collectively, “Bruckewell”), disclaim any and all liability for any errors, inaccuracies or incompleteness contained in any datasheet or in any other disclosure relating to any product. Bruckewell makes no warranty, representation or guarantee regarding the suitability of the products for any particular purpose or the continuing production of any product. To the maximum extent permitted by applicable law, Bruckewell disclaims (i) Any and all liability arising out of the application or use of any product. (ii) Any and all liability, including without limitation special, consequential or incidental damages. (iii) Any and all implied warranties, including warranties of fitness for particular purpose, non-infringement and merchantability. Statements regarding the suitability of products for certain types of applications are based on Bruckewell’s knowledge of typical requirements that are often placed on Bruckewell products in generic applications. Such statements are not binding statements about the suitability of products for a particular application. It is the customer’s responsibility to validate that a particular product with the properties described in the product specification is suitable for use in a particular application. Parameters provided in datasheets and/or specifications may vary in different applications and performance may vary over time. Product specifications do not expand or otherwise modify Bruckewell’s terms and conditions of purchase, including but not limited to the warranty expressed therein. Publication Order Number: [MSK19N03] © Bruckewell Technology Corporation Rev. A -2014